New USPTO “Welcome Letter” seeks to demystify patent and trademark process early on by providing applicants helpful information on free trainings, resources

Published on: 08/10/2023 13:48 PM

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News Brief

US Patent and Trademark Office

New USPTO “Welcome Letter” seeks to demystify patent and trademark process early on by providing applicants helpful information on free trainings, resources

As part of our commitment to expand the innovation ecosystem and provide timely and valuable resources to those beginning their journey, the U.S. Patent and Trademark Office (USPTO) is now providing official “Welcome Letters” to applicants to help them more quickly and easily navigate the patent and trademark application process and connect them with relevant resources.  

The “Welcome Letter” will be sent, either electronically or by mail, with a filing receipt in newly filed patent and trademark applications. The letters, for both patent and trademark applicants, highlight free resources and timely information where they can learn more about the application process, USPTO training webinars, and how to connect with assistance centers to answer their questions.  

“Data shows¹ that applications from women are less likely to continue in the patent process after receiving an early rejection, despite there being opportunities to work with the examiner to amend and improve the application,” said Kathi Vidal, Under Secretary of Commerce for Intellectual Property and Director of the USPTO. “We want these letters to educate filers about our processes, reaching them where they are and connecting them with valuable resources to help them protect their intellectual property, start new businesses, and drive our economy forward.”  

To learn more about available patent and trademark resources, visit the USPTO’s website. 

¹Subramani, G., Aneja, A., & Reshef, O. (n.d.). Try, Try, Try, again? Persistence and the gender innovation gap. https://www.haas.berkeley.edu/wp-content/uploads/Try-try-try-again-Persistence-and-the-Gender-Innovation-Gap.pdf  

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