CPC Definition - Subclass H05K
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PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS Definition statement This place covers: Constructional features of
References Informative references Attention is drawn to the following places, which may be of interest for search:
Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
Printed circuits Definition statement This place covers: Details of printed circuit boards [PCBs], use of materials for PCBs, printed elements for electrical connection to or between printed circuits, printed electric components, structural association of two or more PCBs, structural association of PCBs and non-printed electric components. H05K 1/00 covers mainly structural aspects (incl. layout) of printed circuits and materials for printed circuits. However certain sub-groups of H05K 1/00 cover also the respective manufacturing aspects (e.g. H05K 1/16, H05K 1/185). Relationships with other classification places There is no clear boundary between the field of printed circuit boards and other more specific fields, e.g. inductors (H01F), antennas (H01Q), waveguides (H01P), chip cards (G06K 19/07), thin film and thick film circuits (H01L 27/00), other packaging levels (semiconductor packages H01L 21/48, H01L 23/00, H01L 25/00), connectors (H01R) and various electronic components. The materials and methods (deposition, patterning, connection etc) used for manufacture of printed circuit boards have their general fields. References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification In this main group, both "invention information" and "additional information" are classified by the appropriate CPC group symbol. Indexing Codes are also attributed to provide additional information when no CPC sub-group exists, i.e. to subdivide subject matter belonging to a sub-group. {Cooling of mounted components (H05K 1/0272 takes precedence)} References Limiting references This place does not cover:
{using means for thermal conduction connection in the thickness direction of the substrate (H05K 1/0207 takes precedence)} References Limiting references This place does not cover:
{Electrical arrangements not otherwise provided for} References Informative references {Reduction of cross-talk, noise or electromagnetic interference (grounding H05K 1/0215)} References Limiting references This place does not cover:
{by printed shielding conductors, ground planes or power plane (H05K 1/0236 takes precedence)} References Limiting references This place does not cover:
{Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K 1/0245)} References Limiting references This place does not cover:
{using auxiliary mounted passive components or auxiliary substances (printed passive components H05K 1/16)} References Limiting references This place does not cover:
{Electromagnetic band-gap structures} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K 1/024 and H05K 1/0243 take precedence; for semiconductor devices H01L 23/66)} References Limiting references This place does not cover:
Special rules of classification Indexing Codes are used to additionally specify how impedance is adjusted, e.g. for change in trace width of differential pair H05K 1/0245. {Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K 1/0251 takes precedence)} References Limiting references This place does not cover:
Special rules of classification The lay-out of the power plane is additionally classified with Indexing Codes, e.g. when slotted H05K 1/0236. Except for H05K 1/0224 because that is the default layout in H05K 1/0253. {High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection (electrostatic discharge protection for electric apparatus in general H05K 9/0067, H05K 9/0079); Arrangements for regulating voltages or for using plural voltages} References Limiting references This place does not cover:
{Spark gaps} References Informative references Attention is drawn to the following places, which may be of interest for search:
{High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K 1/0293 takes precedence)} References Limiting references This place does not cover:
{Optical details, e.g. printed circuits comprising integral optical means (H05K 1/0269 takes precedence; coupling light guides with opto-electronic components G02B 6/42)} References Limiting references This place does not cover:
{Security details, e.g. tampering prevention or detection} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Bendability or stretchability details (not used, see subgroups; H05K 1/038, H05K 3/4691 take precedence)} References Limiting references This place does not cover:
{Details of three-dimensional rigid printed circuit boards (H05K 1/119 takes precedence; shaping of the substrate H05K 3/0014)} References Limiting references This place does not cover:
{Programmable, customizable or modifiable circuits (by programmable non-printed jumper connections H05K 3/222)} References Limiting references This place does not cover:
{Conductive pattern lay-out details not covered by sub groups H05K 1/02 - H05K 1/0295 (H05K 1/11 takes precedence; lay-out adapted to mounted component configuration H05K 1/18)} References Limiting references This place does not cover:
References out of a residual place Examples of places in relation to which this place is residual:
Use of materials for the substrate References Informative references Attention is drawn to the following places, which may be of interest for search:
Insulated {conductive substrates, e.g. insulated} metal substrate Definition statement This place covers: Insulated electrically conductive substrates, e.g. insulated metal substrates References Informative references Attention is drawn to the following places, which may be of interest for search:
Use of materials for the {conductive, e.g. } metallic pattern References Informative references Attention is drawn to the following places, which may be of interest for search:
{Dispersed materials, e.g. conductive pastes or inks} References Informative references Attention is drawn to the following places, which may be of interest for search:
Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K 1/11, H01R 12/00) References Limiting references This place does not cover:
incorporating printed electric components, e.g. printed resistor, capacitor, inductor References Informative references Attention is drawn to the following places, which may be of interest for search:
Printed circuits structurally associated with non-printed electric components ({H05K 1/0201, H05K 1/023, H05K 1/0243, } H05K 1/16 take precedence) References Limiting references This place does not cover:
Apparatus or processes for manufacturing printed circuits Definition statement This place covers: General processing of printed circuit boards (PCBs) including processing of insulating substrates and layers for PCBs and processing of conductive layers for PCBs; forming printed elements for providing electric connection to or between printed circuits; manufacturing multilayer printed circuits; manufacturing metal core printed circuits; secondary treatment of PCBs; assembling PCBs with electric components and/or other PCBs. H05K 3/00 covers mainly manufacturing (apparatuses and process) of printed circuits. However certain sub-groups of H05K 3/00 cover also the respective structural aspects (e.g. H05K 3/303, H05K 3/306) and materials (e.g. H05K 3/386). Relationships with other classification places There is no clear boundary between the field of printed circuit boards and other more specific fields, e.g. inductors (H01F), antennas (H01Q), waveguides (H01P), chip cards (G06K 19/07), thin film and thick film circuits (H01L 27/00), other packaging levels (semiconductor packages H01L 21/48, H01L 23/00, H01L 25/00), connectors (H01R) and various electronic components. The materials and methods (deposition, patterning, connection etc) used for manufacture of printed circuit boards have their general fields. References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification In this main group, both "invention information" and "additional information" are classified by the appropriate CPC group symbol. Indexing Codes are also attributed to provide additional information when no CPC sub-group exists, i.e. to subdivide subject matter belonging to a sub-group. {for aligning or positioning of tools relative to the circuit board (H05K 3/4638, H05K 3/4679 take precedence; for manufacturing assemblages of components H05K 13/0015)} References Limiting references This place does not cover:
{Working of insulating substrates or insulating layers} Definition statement This place covers:
References Informative references Attention is drawn to the following places, which may be of interest for search:
{Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K 1/0281 takes precedence)} References Limiting references This place does not cover:
{Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K 1/187, H05K 3/20 and H05K 3/4682 take precedence)} References Limiting references This place does not cover:
{Masks not provided for in groups H05K 3/02 - H05K 3/46, e.g. for photomechanical production of patterned surfaces} References References out of a residual place {Apparatus for treatments of printed circuits with liquids not provided for in groups H05K 3/02 - H05K 3/46; conveyors and holding means therefor (apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K 13/00)} References Limiting references This place does not cover:
References out of a residual place {Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K 3/0052 takes precedence)} References Limiting references This place does not cover:
{Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} References Informative references Attention is drawn to the following places, which may be of interest for search:
{the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles} References Informative references Attention is drawn to the following places, which may be of interest for search:
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K 3/108)} References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
{Etching masks} References Informative references Attention is drawn to the following places, which may be of interest for search:
{applied by electrographic, electrophotographic or magnetographic methods} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Etchants} References Informative references {Apparatus for etching printed circuits} References Informative references Attention is drawn to the following places, which may be of interest for search:
the conductive material being removed by electric discharge, e.g. by spark erosion References Informative references Attention is drawn to the following places, which may be of interest for search:
{by photographic methods} References Informative references Attention is drawn to the following places, which may be of interest for search:
using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns} References Informative references {Screens or stencils; Holders therefor} References Informative references Attention is drawn to the following places, which may be of interest for search:
{by ink-jet printing} References Informative references Attention is drawn to the following places, which may be of interest for search:
{by electrographic or magnetographic printing} References Informative references Attention is drawn to the following places, which may be of interest for search:
using spraying techniques to apply the conductive material {, e.g. vapour evaporation} References Informative references Attention is drawn to the following places, which may be of interest for search:
by cathodic sputtering References Informative references Attention is drawn to the following places, which may be of interest for search:
using precipitation techniques to apply the conductive material Definition statement This place covers:
References Informative references Attention is drawn to the following places, which may be of interest for search:
{by electroless plating (adhesives therefor H05K 3/387)} References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
by affixing prefabricated conductor pattern {(H05K 1/187, H05K 3/046, H05K 3/4658, H05K 3/4682 takes precedence)} References Limiting references This place does not cover:
Secondary treatment of printed circuits {(H05K 3/1283 takes precedence; embedding circuits in grooves by pressure H05K 3/107)} Definition statement This place covers:
References Limiting references This place does not cover:
{Correcting or repairing of printed circuits (H05K 1/0292, H05K 3/222, H05K 3/288, H05K 3/4685 take precedence)} References Limiting references This place does not cover:
Reinforcing the conductive pattern {(by solder coating H05K 3/3457)} References Limiting references This place does not cover:
{characterised by the electroplating method; means therefor, e.g. baths or apparatus} References Informative references Attention is drawn to the following places, which may be of interest for search:
Applying non-metallic protective coatings {(H05K 3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K 3/4673)} References Limiting references This place does not cover:
{for encapsulating mounted components (H05K 1/185 takes precedence)} References Limiting references This place does not cover:
{by conductive adhesives} References Informative references Attention is drawn to the following places, which may be of interest for search:
by soldering References Informative references Attention is drawn to the following places, which may be of interest for search:
{Solder materials or compositions; Methods of application thereof} References Informative references Attention is drawn to the following places, which may be of interest for search:
Assembling printed circuits with other printed circuits {(H05K 7/142 takes precedence)} References Limiting references This place does not cover:
Special rules of classification H05K 3/36 relates to the method of assembling at least two printed circuits to form a single entity as a final product, whereas H05K 3/0097 relates to processing two printed circuits at the same time. This implicitly means that after processing, the printed circuits are again separated from one another. Improvement of the adhesion between the insulating substrate and the metal References Informative references Attention is drawn to the following places, which may be of interest for search:
Manufacture insulated metal core circuits {or other insulated electrically conductive core circuits (H05K 3/0058, H05K 3/4641, H05K 3/4608 take precedence)} References Limiting references This place does not cover:
Manufacturing multilayer circuits References Informative references Attention is drawn to the following places, which may be of interest for search:
Casings, cabinets or drawers for electric apparatus Definition statement This place covers: Constructional features of electronic housings when the inner electronic arrangement is not described in the document such as:
References Application-oriented references Examples of places where the subject matter of this place is covered when specially adapted, used for a particular purpose, or incorporated in a larger system:
Informative references Attention is drawn to the following places, which may be of interest for search:
Hermetically-sealed casings {(specially adapted for small components H05K 5/0095)} References Limiting references This place does not cover:
Constructional details common to different types of electric apparatus (casings, cabinets, drawers H05K 5/00) Definition statement This place covers:
References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Plug-in assemblages of components {, e.g. IC sockets} References Informative references Attention is drawn to the following places, which may be of interest for search:
Resilient or clamping means for holding component to structure References Informative references Attention is drawn to the following places, which may be of interest for search:
Mounting supporting structure in casing or on frame or rack {(H05K 7/18 takes precedence)} References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
{for programmable logic controllers [PLC] for automation or industrial process control} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Terminal blocks for connecting sensors} References Informative references Attention is drawn to the following places, which may be of interest for search:
Modifications to facilitate cooling, ventilating, or heating Definition statement This place covers: Arrangements for cooling, ventilating or heating of electric apparatus by:
References Informative references Attention is drawn to the following places, which may be of interest for search:
{Fan mounting or fan specifications} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Filters; Louvers} References Informative references Attention is drawn to the following places, which may be of interest for search:
{for display panels} References Application-oriented references Examples of places where the subject matter of this place is covered when specially adapted, used for a particular purpose, or incorporated in a larger system:
Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q 17/00) Definition statement This place covers:
References Limiting references This place does not cover:
Application-oriented references Examples of places where the subject matter of this place is covered when specially adapted, used for a particular purpose, or incorporated in a larger system:
Informative references Attention is drawn to the following places, which may be of interest for search:
{Rooms or chambers (anechoic chambers G01R 29/0821)} References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
{Shielded windows} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Constructional details of transient suppressor} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Devices for protecting against damage from electrostatic discharge} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Magnetic shielding materials} References Informative references Attention is drawn to the following places, which may be of interest for search:
{comprising superconductors} References Informative references Attention is drawn to the following places, which may be of interest for search:
{comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked} References Informative references Attention is drawn to the following places, which may be of interest for search:
Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit Special rules of classification This IPC group is not used in CPC for classification. Combinations of a radio or television receiver with apparatus having a different main function {(combined with clocks G04B 47/00; controlled by a clock G04C 21/28)} References Limiting references This place does not cover:
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components Definition statement This place covers: Apparatus and methods for placing components onto the printed circuit boards. References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification These groups only concern bare printed circuit boards and not circuit boards already fitted in an apparatus (thus no displays, no hard disks etc) Synonyms and Keywords In patent documents, the following abbreviations are often used:
{using handtools (for mounting on a circuit board H05K 13/0447)} Definition statement This place covers: Hand-tools specially adapted for adjusting assemblages of electric components References Limiting references This place does not cover:
{Orientation; Alignment; Positioning} Definition statement This place covers: orientation, alignment and positioning only of the printed circuit boards References Informative references Attention is drawn to the following places, which may be of interest for search:
{Placing of components on belts holding the terminals} Definition statement This place covers: preparing the components before delivering to mounting machines by grouping the components for batch mounting References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Only concerns filling of belts as a separate operation {placing the components in a predetermined order} Definition statement This place covers: Filling of belts according to the mounting order of different types of components. References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Must concern different type of components Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting} Definition statement This place covers: Manual mounting posts for components on PCB References Informative references Attention is drawn to the following places, which may be of interest for search:
{Tools for holding the circuit boards during processing; handling transport of printed circuit boards} Definition statement This place covers: Provision for displacing printed circuit boards [PCB] between machines or for displacing PCBs inside mounting machines Gripping PCBs for transport or conveyance References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Documents must include movement of printed circuit board {Holders for printed circuit boards} Definition statement This place covers: Fixation of printed circuit boards inside mounting machines References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Printed circuit board must be static relative to holder. Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{Straightening or aligning terminal leads of pins mounted on boards, during transport of the boards} Definition statement This place covers: Transport of boards temporary fitted with components before definitive fixation, e.g. soldering. References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Components are not definitively fixed. {Containers and magazines for components, e.g. tube-like magazines} Definition statement This place covers: Any type of container for delivering components to mounting machines and manufacture thereof Details of component tubes, trays or belts. References Informative references Attention is drawn to the following places, which may be of interest for search:
Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{Treatment of the terminal leads as a separate operation (during transport H05K 13/0076, H05K 13/023; during mounting H05K 13/04)} Definition statement This place covers: Preparing leads of components before bringing to mounting machines Special separate machines for lead treatment. References Limiting references This place does not cover:
Special rules of classification Must be a separate machine. Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
Feeding of components Definition statement This place covers: Feeding of components to containers before fitting said container to machines, e.g. filling or refilling of containers References Informative references Attention is drawn to the following places, which may be of interest for search:
{Loading or unloading of containers (H05K 13/028 takes precedence)} Definition statement This place covers: Loading or unloading containers with components, the containers not being in use by the mounting machine. References Limiting references This place does not cover:
Special rules of classification Do not classify here documents concerning pick and place in the mounting machine {with orientation of the elements} Definition statement This place covers: Giving orientation to components before feeding into containers References Informative references Attention is drawn to the following places, which may be of interest for search:
{with bending or straightening of the terminal leads} Definition statement This place covers: Feeding of components with bending or straightening of the terminal leads, e.g. in order to fit into containers References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Not during or after mounting of component. {Straightening or aligning terminal leads} Definition statement This place covers: Straightening or aligning leads during the feeding {of components having oppositely extending terminal leads} Definition statement This place covers: Straightening or aligning leads of e.g. resistors {of components having terminal leads in side by side relationship, e.g. using combing elements} Definition statement This place covers: Straightening or aligning lead of chips. Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{Fluid transport of components} Definition statement This place covers: Transport of components using fluids, e.g. jets of air, water. {Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields} Definition statement This place covers: Feeding bulk components simultaneously to containers References Informative references Attention is drawn to the following places, which may be of interest for search:
{Feeding axial lead components, e.g. using vibrating bowls, magnetic fields (H05K 13/022 takes precedence)} Definition statement This place covers: Feeding bulk axial components to containers. References Limiting references This place does not cover:
Mounting of components {, e.g. of leadless components} Definition statement This place covers: Mounting machines for components on printed circuit boards. Attaching containers to mounting machines for components delivery. References Informative references {Pick-and-place heads or apparatus, e.g. with jaws} Definition statement This place covers: Pick-and-place-heads for picking components out of a container and placing them on a printed circuit board using gripping devices. References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Orientation while holding component is not classified here Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{Incorporating a pick-up tool} Definition statement This place covers: Pick-and-place-heads for picking components out of a container and placing them on a printed circuit board by suction, e.g. using vacuum. References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Orientation while holding component is not classified here Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools} Definition statement This place covers: Orientation of component held by mounting head just before or during mounting. Mechanical and vacuum holders for components with orientation provisions. Vision devices for orientation or correct placing of components. Includes camera looking at the PC boards before mounting Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{Feeding with belts or tapes} Definition statement This place covers: Delivery of components to a mounting machine via belts or tapes; tape feeders; attachment of tape feeders to the mounting machine; details related to the picking up of components by mounting head from tapes/belts. Special rules of classification Interconnection/splicing of belts/tapes to be classified in H05K 13/021. Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
Synonyms and Keywords
{with treatment of the terminal leads} Definition statement This place covers: Treatment of leads during or after picking up. References Informative references Attention is drawn to the following places, which may be of interest for search:
{for components being oppositely extending terminal leads (H05K 13/0421 takes precedence)} Definition statement This place covers: For resistor type components. References Limiting references This place does not cover:
{Feeding one by one by other means than belts} Definition statement This place covers: Delivery of single components by other type of containers. {with containers} Definition statement This place covers: Delivery with containers, e.g. trays. References Informative references Attention is drawn to the following places, which may be of interest for search:
{incorporating means for treating the terminal leads only before insertion} Definition statement This place covers: Treatment of leads before insertion. {incorporating means for treating the terminal leads before and after insertion or only after insertion} Definition statement This place covers: Treatment of leads before and/or only after insertion. {Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place (H05K 13/0406, H05K 13/041 take precedence)} Definition statement This place covers: Mounting machine for several types of components. Mounting of different type of components to the same mounting place. Multi nozzle machines Machines with several holders for pc boards References Limiting references This place does not cover:
Special rules of classification Multiple work tables and multiple heads, e.g. revolver heads, are classified here Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{simultaneously punching the circuit board} Definition statement This place covers: Mounting machines including hole puncher References Informative references Attention is drawn to the following places, which may be of interest for search:
{Surface mounting (surface mounted components H05K 3/341)} Definition statement This place covers: Methods and apparatus for surface mounting electric components in general References Limiting references This place does not cover:
Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{by soldering (H05K 13/0469 takes precedence)} Definition statement This place covers: Soldering machines of surface mounted components References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
{by applying a glue or viscous material} Definition statement This place covers: Use of glue or viscous material with dispenser nozzles. References Informative references Attention is drawn to the following places, which may be of interest for search:
{Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board} Definition statement This place covers: Treatment of leads after insertion out of mounting process References Informative references Attention is drawn to the following places, which may be of interest for search:
{Simultaneously mounting of different components} Definition statement This place covers: simultaneous mounting of different components placed on PC board at the same moment. {using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached} Definition statement This place covers: Simultaneous mounting of different components being arranged beforehand in preset positions. Templates, trays and special multi heads. {Replacement and removal of components} Definition statement This place covers: Method and apparatus for taking off or replacing misplaced components Special rules of classification No recycling. May include a de-soldering device {Hand tools therefor} Definition statement This place covers: Hand tools for repairing printed circuit boards or exchanging components. Special rules of classification No recycling. {having a plurality of work-stations} Definition statement This place covers: Arrangements of mounting machines in clusters or lines Wiring by machine Definition statement This place covers: Placing of wires on or in printed circuit boards by machines; machines therefor. References Informative references Attention is drawn to the following places, which may be of interest for search:
{Accessories therefor, e.g. light spots} Definition statement This place covers: Accessories for wiring, e.g. special tables or light spots. Monitoring manufacture of assemblages Definition statement This place covers: Control or planning of manufacturing processes of assemblages, e.g. of processes for mounting components on printed circuit boards Control of apparatuses therefor Planning of production facility and apparatus layout Vision control after placing of components. References Informative references Attention is drawn to the following places, which may be of interest for search:
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