CPC Definition - Subclass H05K
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| PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01, H01L 27/13; non-printed means for electric connections to or between printed circuits, {electric connections or line connectors, apparatus or processes for manufacturing, assembling, maintaining or repairing such connections or connectors} H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes) Definition statement This place covers: Constructional features of
References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) Definition statement This place covers: Details of printed circuit boards [PCBs], use of materials for PCBs, printed elements for electrical connection to or between printed circuits, printed electric components, structural association of two or more PCBs, structural association of PCBs and non-printed electric components. H05K 1/00 covers mainly structural aspects (incl. layout) of printed circuits and materials for printed circuits. However certain sub-groups of H05K 1/00 cover also the respective manufacturing aspects (e.g. H05K 1/16, H05K 1/185). Relationships with other classification places There is no clear boundary between the field of printed circuit boards and other more specific fields, e.g. inductors (H01F), antennas (H01Q), waveguides (H01P), chip cards (G06K 19/07), thin film and thick film circuits (H01L 27/00), other packaging levels (semiconductor packages H01L 21/48, H01L 23/00, H01L 25/00), connectors (H01R) and various electronic components. The materials and methods (deposition, patterning, connection etc) used for manufacture of printed circuit boards have their general fields. References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification In this main group, both "invention information" and "additional information" are classified by the appropriate CPC group symbol. Indexing Codes are also attributed to provide additional information when no CPC sub-group exists, i.e. to subdivide subject matter belonging to a sub-group. {Cooling of mounted components (H05K 1/0272 takes precedence)} References Limiting references This place does not cover:
{using means for thermal conduction connection in the thickness direction of the substrate (H05K 1/0207 takes precedence)} References Limiting references This place does not cover:
{Electrical arrangements not otherwise provided for (screening H05K 9/00; emergency protective circuits H02H)} References Informative references {Reduction of cross-talk, and noise or electromagnetic interference (grounding H05K 1/0215)} References Limiting references This place does not cover:
{by printed shielding conductors, ground planes or power plane (H05K 1/0236 takes precedence)} References Limiting references This place does not cover:
{Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines (coaxially shielded vias H05K 1/0222)} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K 1/0245)} References Limiting references This place does not cover:
{using auxiliary mounted passive components or auxiliary substances (printed passive components H05K 1/16)} References Limiting references This place does not cover:
{Electromagnetic band-gap structures (conductive planes with an opening or a split H05K 1/0225, H05K 1/0227)} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K 1/024 and H05K 1/0243 take precedence; for semiconductor devices H01L 23/66)} References Limiting references This place does not cover:
Special rules of classification Indexing Codes are used to additionally specify how impedance is adjusted, e.g. for change in trace width of differential pair H05K 1/0245. {Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K 1/0251 takes precedence)} References Limiting references This place does not cover:
Special rules of classification The lay-out of the power plane is additionally classified with Indexing Codes, e.g. when slotted H05K 1/0236. Except for H05K 1/0224 because that is the default layout in H05K 1/0253. {High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection (electrostatic discharge protection for electric apparatus in general H05K 9/0067, H05K 9/0079); Arrangements for regulating voltages or for using plural voltages} References Limiting references This place does not cover:
{High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K 1/0293 takes precedence)} References Limiting references This place does not cover:
{Optical details, e.g. printed circuits comprising integral optical means (H05K 1/0269 takes precedence; Coupling light guides with opto-electronic components G02B 6/42)} References Limiting references This place does not cover:
{Security details, e.g. tampering prevention or detection (security details of computer components G06F 21/70)} References Informative references Attention is drawn to the following places, which may be of interest for search:
{Bendability or stretchability details (not used, see subgroups; H05K 1/038, H05K 3/4691 take precedence)} References Limiting references This place does not cover:
Special rules of classification Group H05K 1/0277 is not used, subject matter is classified in the subgroups thereof. {Details of three-dimensional rigid printed circuit boards (H05K 1/119 takes precedence; shaping of the substrate H05K 3/0014)} References Limiting references This place does not cover:
{Programmable, customizable or modifiable circuits (by programmable non-printed jumper connections H05K 3/222)} References Limiting references This place does not cover:
{Conductive pattern lay-out details not covered by sub groups H05K 1/02 - H05K 1/0295 (H05K 1/11 takes precedence; lay-out adapted to mounted component configuration H05K 1/18)} References Limiting references This place does not cover:
References out of a residual place Examples of places in relation to which this place is residual:
Use of materials for the substrate {(substrates for semiconductor chips H01L 23/00)} References Informative references Attention is drawn to the following places, which may be of interest for search:
Insulated metal substrate {or other insulated electrically conductive substrate (thermal coupling of mounted components and metal substrate H05K 1/0204, H05K 1/021)} Definition statement This place covers: Insulated electrically conductive substrates, e.g. insulated metal substrates References Informative references Attention is drawn to the following places, which may be of interest for search:
Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K 1/11, H01R 9/09, H01R 23/68) References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
incorporating printed electric components, e.g. printed resistor, capacitor, inductor {(thick-film or thin-film circuits H01L 27/01, H01L 27/13)} References Informative references Attention is drawn to the following places, which may be of interest for search:
Printed circuits structurally associated with non-printed electric components ({H05K 1/0201, H05K 1/023, H05K 1/0243, } H05K 1/16 take precedence) References Limiting references This place does not cover:
Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F; involving the manufacture of semiconductor devices H01L) Definition statement This place covers: General processing of printed circuit boards (PCBs) including processing of insulating substrates and layers for PCBs and processing of conductive layers for PCBs; forming printed elements for providing electric connection to or between printed circuits; manufacturing multilayer printed circuits; manufacturing metal core printed circuits; secondary treatment of PCBs; assembling PCBs with electric components and/or other PCBs. H05K 3/00 covers mainly manufacturing (apparatuses and process) of printed circuits. However certain sub-groups of H05K 3/00 cover also the respective structural aspects (e.g. H05K 3/303, H05K 3/306) and materials (e.g. H05K 3/386). Relationships with other classification places There is no clear boundary between the field of printed circuit boards and other more specific fields, e.g. inductors (H01F), antennas (H01Q), waveguides (H01P), chip cards (G06K 19/07), thin film and thick film circuits (H01L 27/00), other packaging levels (semiconductor packages H01L 21/48, H01L 23/00, H01L 25/00), connectors (H01R) and various electronic components. The materials and methods (deposition, patterning, connection etc) used for manufacture of printed circuit boards have their general fields. References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification In this main group, both "invention information" and "additional information" are classified by the appropriate CPC group symbol. Indexing Codes are also attributed to provide additional information when no CPC sub-group exists, i.e. to subdivide subject matter belonging to a sub-group. {for aligning or positioning of tools relative to the circuit board (H05K 3/4638, H05K 3/4679 take precedence; for manufacturing assemblages of components H05K 13/0015)} References Limiting references This place does not cover:
{Working of insulating substrates or insulating layers (making copper-clad substrates H05K 3/022; surface treatment for improvement of adhesion H05K 3/381)} Definition statement This place covers:
References Informative references Attention is drawn to the following places, which may be of interest for search:
{Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K 1/0281 takes precedence)} References Limiting references This place does not cover:
{Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K 1/187, H05K 3/20 and H05K 3/4682 take precedence)} References Limiting references This place does not cover:
{Masks not provided for in groups H05K 3/02 - H05K 3/46, e.g. for photomechanical production of patterned surfaces} References Limiting references {Apparatus for treatments of printed circuits with liquids not provided for in groups H05K 3/02 - H05K 3/46; conveyors and holding means therefor (apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K 13/00)} References Limiting references This place does not cover:
References out of a residual place {Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K 3/0052 takes precedence)} References Limiting references This place does not cover:
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(Non-mechanical removal of metallic material from surfaces C23F; semi-additive methods H05K 3/108)} References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
the conductive material being removed by electric discharge, e.g. by spark erosion {(working of metal by electro-erosion per se B23H)} References Informative references Attention is drawn to the following places, which may be of interest for search:
using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns (printing techniques in general B41M, printing apparatus B41F)} References Informative references using spraying techniques to apply the conductive material {including vapour evaporation; (covering metals by metal spraying C23C 4/00; coating by vacuum evaporation C23C 14/00)} References Informative references Attention is drawn to the following places, which may be of interest for search:
by cathodic sputtering {(covering materials by cathodic sputtering C23C 14/34; discharge devices therefor H01J 37/34)} References Informative references Attention is drawn to the following places, which may be of interest for search:
using precipitation techniques to apply the conductive material {(chemical coating of a substrate by decomposition C23C 18/00)} Definition statement This place covers:
References Informative references Attention is drawn to the following places, which may be of interest for search:
by affixing prefabricated conductor pattern {(H05K 1/187, H05K 3/046, H05K 3/4658, H05K 3/4682 takes precedence)} References Limiting references This place does not cover:
Secondary treatment of printed circuits {(H05K 3/1283 takes precedence; embedding circuits in grooves by pressure H05K 3/107)} Definition statement This place covers:
References Limiting references This place does not cover:
{Correcting or repairing of printed circuits (H05K 1/0292, H05K 3/222, H05K 3/288, H05K 3/4685 take precedence)} References Limiting references This place does not cover:
Reinforcing the conductive pattern {(by solder coating H05K 3/3457)} References Limiting references This place does not cover:
Applying non-metallic protective coatings {(H05K 3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K 3/4673)} References Limiting references This place does not cover:
{for encapsulating mounted components (H05K 1/185 takes precedence)} References Limiting references This place does not cover:
References Informative references Attention is drawn to the following places, which may be of interest for search:
Assembling printed circuits with other printed circuits {(H05K 7/142 takes precedence)} References Limiting references This place does not cover:
Special rules of classification H05K 3/36 relates to the method of assembling at least two printed circuits to form a single entity as a final product, whereas H05K 3/0097 relates to processing two printed circuits at the same time. This implicitly means that after processing, the printed circuits are again separated from one another. Manufacture insulated metal core circuits {or other insulated electrically conductive core circuits (H05K 3/0058, H05K 3/4641, H05K 3/4608 take precedence)} References Limiting references This place does not cover:
Manufacturing multilayer circuits {(incorporating non-printed electric components in internal layers H05K 1/185)} References Informative references Attention is drawn to the following places, which may be of interest for search:
Casings, cabinets or drawers for electric apparatus (in general A47B; radio receiver cabinets H04B 1/08; television receiver cabinets H04N 5/64; {constructional details or arrangements for computers G06F 1/16}) Definition statement This place covers: Constructional features of electronic housings when the inner electronic arrangement is not described in the document such as:
References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Hermetically-sealed casings {(specially adapted for small components H05K 5/0095)} References Limiting references This place does not cover:
Constructional details common to different types of electric apparatus (casings, cabinets, drawers H05K 5/00) Definition statement This place covers:
References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Plug-in assemblages of components, {e.g. IC sockets (for connection on printed circuit board H01R 23/6806)} References Informative references Attention is drawn to the following places, which may be of interest for search:
Resilient or clamping means for holding component to structure (holding two-part couplings together H01R 13/00) References Informative references Attention is drawn to the following places, which may be of interest for search:
Mounting supporting structure in casing or on frame or rack {(H05K 7/18 takes precedence; test adapters G01R 31/2808)} References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Modifications to facilitate cooling, ventilating, or heating {(of printed circuits H05K 1/0201; of resistors H01C; of capacitors H01G; of individual semiconductor components H01L 23/34, H01L 31/024; of LEDs H01L 33/64; of personal computers G06F 1/20)} Definition statement This place covers: Arrangements for cooling, ventilating or heating of electric apparatus by:
References Informative references Attention is drawn to the following places, which may be of interest for search:
Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an aerial H01Q 17/00; {screening of semiconductor devices H01L 24/00, H01L 23/58; screening structurally associated with dynamo-electric machines H02K 11/00; shielding against nuclear radiation G21F}) Definition statement This place covers:
References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit Special rules of classification This IPC group is not used in CPC for classification. Combination of a radio or television receiver with apparatus having a different main function {(combined with clocks G04B 47/00; controlled by a clock G04C 21/28)} Special rules of classification This IPC group is not used in CPC for classification Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components Definition statement This place covers: Apparatus and methods for placing components onto the printed circuit boards. References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification These groups only concern bare printed circuit boards and not circuit boards already fitted in an apparatus (thus no displays, no hard disks etc) Synonyms and Keywords In patent documents, the following abbreviations are often used:
{using handtools (for mounting on a circuit board H05K 13/0447)} Definition statement This place covers: Hand-tools specially adapted for adjusting assemblages of electric components References Limiting references This place does not cover:
{Orientation; Alignment; Positioning} Definition statement This place covers: orientation, alignment and positioning only of the printed circuit boards References Limiting references This place does not cover:
{Making assemblies of electric components, e.g. modules (H05K 13/04 take precedence)} References Limiting references This place does not cover:
{Placing of components on belts holding the terminals} Definition statement This place covers: preparing the components before delivering to mounting machines by grouping the components for batch mounting References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Only concerns filling of belts as a separate operation {placing the components in a predetermined order} Definition statement This place covers: Filling of belts according to the mounting order of different types of components. References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Must concern different type of components Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{Encapsulation of electrical assemblies in resins (hermetically-sealed casings H05K 5/06)} References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification This group is not used. {Means for helping with the manual mounting of components, e.g. special tables, light spots indicating the place for mounting (handtools H05K 13/0447)} Definition statement This place covers: Manual mounting posts for components on PCB References Informative references Attention is drawn to the following places, which may be of interest for search:
{Tools for holding the circuit boards during processing; handling transport of printed circuit boards} Definition statement This place covers: Provision for displacing printed circuit boards [PCB] between machines or for displacing PCBs inside mounting machines Gripping PCBs for transport or conveyance References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Documents must include movement of printed circuit board {Holders for printed circuit boards} Definition statement This place covers: Fixation of printed circuit boards inside mounting machines References Limiting references This place does not cover:
Special rules of classification Printed circuit board must be static relative to holder. Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{Straightening or aligning terminal leads of pins mounted on boards, during transport of the boards (during the mounting operation, after fitting components on the board H05K 13/0473)} Definition statement This place covers: Transport of boards temporary fitted with components before definitive fixation, e.g. soldering. References Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Components are not definitively fixed. {Containers and magazines for components, e.g. tube-like magazines} Definition statement This place covers: Any type of container for delivering components to mounting machines and manufacture thereof Details of component tubes, trays or belts. References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{Treatment of the terminal leads as a separate operation (during transport H05K 13/0076, H05K 13/023; during mounting H05K 13/04)} Definition statement This place covers: Preparing leads of components before bringing to mounting machines Special separate machines for lead treatment. References Limiting references This place does not cover:
Special rules of classification Must be a separate machine. Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
Feeding of components (in general B65G) Definition statement This place covers: Feeding of components to containers before fitting said container to machines, e.g. filling or refilling of containers References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
{Loading or unloading of containers (H05K 13/028 takes precedence)} Definition statement This place covers: Loading or unloading containers with components, the containers not being in use by the mounting machine. References Limiting references This place does not cover:
Special rules of classification Do not classify here documents concerning pick and place in the mounting machine {with orientation of the elements (orientation while mounting H05K 13/0413; in general B23P 19/00)} Definition statement This place covers: Giving orientation to components before feeding into containers References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
{with bending or straightening of the terminal leads (bending and cutting after the mounting on a p.c. board H05K 13/0473)} Definition statement This place covers: Feeding of components with bending or straightening of the terminal leads, e.g. in order to fit into containers References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Not during or after mounting of component. {Straightening or aligning terminal leads} Definition statement This place covers: Straightening or aligning leads during the feeding {of components having oppositely extending terminal leads} Definition statement This place covers: Straightening or aligning leads of e.g. resistors {of components having terminal leads in side by side relationship, e.g. using combing elements} Definition statement This place covers: Straightening or aligning lead of chips. Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{Fluid transport of components} Definition statement This place covers: Transport of components using fluids, e.g. jets of air, water. {Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields} Definition statement This place covers: Feeding bulk components simultaneously to containers References Informative references Attention is drawn to the following places, which may be of interest for search:
{Feeding axial lead components, e.g. using vibrating bowls, magnetic fields (H05K 13/022 takes precedence)} Definition statement This place covers: Feeding bulk axial components to containers. References Limiting references This place does not cover:
Mounting of components {, e.g. of leadless components} Definition statement This place covers: Mounting machines for components on printed circuit boards. Attaching containers to mounting machines for components delivery. References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
{pick and place heads or apparatus, e.g. with jaws} Definition statement This place covers: Pick-and-place-heads for picking components out of a container and placing them on a printed circuit board using gripping devices. References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Orientation while holding component is not classified here Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{incorporating a sucking device (H05K 13/0413 takes precedence)} Definition statement This place covers: Pick-and-place-heads for picking components out of a container and placing them on a printed circuit board by suction, e.g. using vacuum. References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
Special rules of classification Orientation while holding component is not classified here Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{with orientation of the component while holding it (orientation while feeding H05K 13/022)} Definition statement This place covers: Orientation of component held by mounting head just before or during mounting. Mechanical and vacuum holders for components with orientation provisions. Vision devices for orientation or correct placing of components. Includes camera looking at the PC boards before mounting References Limiting references This place does not cover:
Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{Feeding with belts} Definition statement This place covers: Mounting machines with components delivery via belts. Fastening of belt containers and methods of picking up of components by mounting head. Special rules of classification Presence of belts. Control of components correctness in position or quality Synonyms and Keywords
{with treatment of the terminal leads (bending and cutting after fitting on a circuit board H05K 13/0473)} Definition statement This place covers: Treatment of leads during or after picking up. References Informative references Attention is drawn to the following places, which may be of interest for search:
{for components being oppositely extending terminal leads (H05K 13/0421 takes precedence)} Definition statement This place covers: For resistor type components. References Limiting references This place does not cover:
{Feeding one by one by other means than belts} Definition statement This place covers: Delivery of single components by other type of containers. {with containers} Definition statement This place covers: Delivery with containers, e.g. trays. References Limiting references This place does not cover:
{incorporating means for treating the terminal leads only before insertion} Definition statement This place covers: Treatment of leads before insertion. {incorporating means for treating the terminal leads before and after insertion or only after insertion} Definition statement This place covers: Treatment of leads before and/or only after insertion. {different components being guided to the same mounting place} Definition statement This place covers: Mounting machine for several types of components. Mounting of different type of components to the same mounting place. Multi nozzle machines Machines with several holders for pc boards Special rules of classification Multiple work tables and multiple heads, e.g. revolver heads, are classified here Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{simultaneously punching the circuit board} Definition statement This place covers: Mounting machines including hole puncher References Limiting references This place does not cover:
{Surface mounting (surface mounted components H05K 3/341)} Definition statement This place covers: Methods and apparatus for surface mounting electric components in general References Limiting references This place does not cover:
Glossary of terms In this place, the following terms or expressions are used with the meaning indicated:
{by soldering (H05K 13/0469 takes precedence; soldering apparatus in general B23K)} Definition statement This place covers: Soldering machines of surface mounted components References Limiting references This place does not cover:
Informative references Attention is drawn to the following places, which may be of interest for search:
{by applying a glue or viscous material} Definition statement This place covers: Use of glue or viscous material with dispenser nozzles. References Limiting references This place does not cover:
{Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board (during transport H05K 13/0076)} Definition statement This place covers: Treatment of leads after insertion out of mounting process References Limiting references This place does not cover:
{Simultaneously mounting of different components} Definition statement This place covers: simultaneous mounting of different components placed on PC board at the same moment. {using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached} Definition statement This place covers: Simultaneous mounting of different components being arranged beforehand in preset positions. Templates, trays and special multi heads. {Replacement and removal of components} Definition statement This place covers: Method and apparatus for taking off or replacing misplaced components Special rules of classification No recycling. May include a de-soldering device {Hand tools therefor} Definition statement This place covers: Hand tools for repairing printed circuit boards or exchanging components. Special rules of classification No recycling. {having a plurality of work-stations} Definition statement This place covers: Arrangements of mounting machines in clusters or lines Wiring by machine Definition statement This place covers: Placing of wires on or in printed circuit boards by machines; machines therefor. References Limiting references This place does not cover:
{Accessories therefor, e.g. light spots} Definition statement This place covers: Accessories for wiring, e.g. special tables or light spots. Monitoring manufacture of assemblages Definition statement This place covers: Control or planning of manufacturing processes of assemblages, e.g. of processes for mounting components on printed circuit boards Control of apparatuses therefor Planning of production facility and apparatus layout Vision control after placing of components. References Limiting references This place does not cover:
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