CPC Definition - Subclass H05K
This place covers:
Constructional features of
- electronic circuit boards such as board design, interconnection models, material
- casings / cabinets of electronic equipment having cooling and EMI shielding specifications
- machines for mounting electronic components on circuit boards
- printed circuits structurally associated with non-printed electric components
- printed connectors
Attention is drawn to the following places, which may be of interest for search:
Details of instruments or comparable details of other apparatus not otherwise provided for | |
Thin-film or thick-film circuits | |
Non-printed means for electric connections to or between printed circuits, electric connections or line connectors, apparatus or processes for manufacturing, assembling, maintaining or repairing such connections or connectors |
In this place, the following terms or expressions are used with the meaning indicated:
Printed circuits | covers all kinds of mechanical constructions of circuits that consist of an insulating base or support carrying the conductor and are combined structurally with the conductor throughout their length, especially in a two-dimensional plane, the conductors of which are secured to the base in a non-dismountable manner, and also covers the processes or apparatus for manufacturing such constructions, e.g. forming the circuit by mechanical or chemical treatment of a conductive foil, paste, or film on an insulating support. |
This place covers:
Details of printed circuit boards [PCBs], use of materials for PCBs, printed elements for electrical connection to or between printed circuits, printed electric components, structural association of two or more PCBs, structural association of PCBs and non-printed electric components.
H05K 1/00 covers mainly structural aspects (incl. layout) of printed circuits and materials for printed circuits. However certain sub-groups of H05K 1/00 cover also the respective manufacturing aspects (e.g. H05K 1/16, H05K 1/185).
There is no clear boundary between the field of printed circuit boards and other more specific fields, e.g. inductors (H01F), antennas (H01Q), waveguides (H01P), chip cards (G06K 19/07), thin film and thick film circuits (H01L 27/00), other packaging levels (semiconductor packages H01L 21/48, H01L 23/00, H01L 25/00), connectors (H01R) and various electronic components. The materials and methods (deposition, patterning, connection etc) used for manufacture of printed circuit boards have their general fields.
Attention is drawn to the following places, which may be of interest for search:
Backplanes | |
Screening against electric or magnetic fields | |
Electrostatic discharge protection for electric apparatus in general | |
Handling / Transporting | |
Cleaning | |
Casting of metals | |
Metal powder processing | |
Mechanical drilling | |
Mechanical milling | |
Metal milling | |
Slotting, etc. | |
Erosion by electric discharge | |
Soldering or welding | |
Laser ablation | |
Patterning by laser ablation | |
Details of machining apparatus | |
Grinding | |
Grinding, polishing | |
Abrasive working | |
Cutting, Punching | |
Laminating | |
Printing forms, e.g. masks | |
Printing apparatus | |
Inkjet printing | |
Printing processes | |
Selective transfer processes | |
Handling flexible substrates | |
Etching polymeric substrates | |
Coating by dipping in molten metal | |
Coating by spraying with molten metal | |
Coating by physical vapour deposition or sputtering or ion implantation | |
Coating by chemical deposition | |
Coating by decomposition of compounds | |
Coating by electroless plating | |
Conversion coating of metals | |
Coating by powder methods | |
Other coating methods | |
Coating metal with enamel (glass) | |
Corrosion protection of metal | |
Cleaning or degreasing of metal | |
Electroplating of metal | |
Electroforming of metal | |
Anodizing of metal | |
Electrophoretic coating of metal | |
Electrolytic etching of metal | |
Lighting devices | |
Drying | |
Testing, inspection of material | |
Electrical testing | |
Electro-optical devices comprising optical waveguides | |
Modules /PCBs having optical waveguides | |
Coupling light guides with opto-electronic components | |
Liquid crystal displays | |
LCD displays | |
Photolithography masks | |
Photoresists | |
Other lithography | |
Photolithography registration | |
Electrography | |
Computers | |
Touch screens | |
Designing of the conductive pattern | |
Security details of computer components | |
Chip cards | |
Circuits for displays | |
Disk drive suspensions | |
Memory modules | |
Cables | |
Flat cables | |
Printed resistors | |
Resistors | |
Printed inductors | |
Inductors | |
Printed capacitors | |
Capacitors | |
Switches, fuses | |
Plasma displays | |
Semiconductor devices | |
Inorganic semiconductor devices | |
Semiconductor packages | |
Treatment apparatus for semiconductor components | |
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance for semiconductor devices | |
Assemblies of a plurality of individual semiconductor or solid state devices | |
Devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits | |
Thick film or thin film circuits | |
Solar cells, Photovoltaic devices | |
LEDs | |
Thermoelectric devices | |
Piezoelectric devices | |
Polymeric semiconductor devices | |
Batteries, Cells | |
Waveguides | |
Printed antennas | |
Antennas | |
Non-printed means for electric connections to or between printed Circuits | |
Connectors | |
Laser devices | |
Spark gaps, Overvoltage arresters | |
Emergency protective circuits | |
Power conversion | |
Receivers / Transceivers (modules) | |
Telephones | |
Optical modules | |
Electromechanical transducers |
In this main group, both "invention information" and "additional information" are classified by the appropriate CPC group symbol.
Indexing Codes are also attributed to provide additional information when no CPC sub-group exists, i.e. to subdivide subject matter belonging to a sub-group.
This place does not cover:
Adaptations for fluid transport, e.g. channels, holes |
This place does not cover:
Using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes |
This place does not cover:
Grounding |
This place does not cover:
Electromagnetic band-gap structures |
Attention is drawn to the following places, which may be of interest for search:
Coaxially shielded vias |
This place does not cover:
Balanced signal pairs |
This place does not cover:
Incorporating printed electric components, e.g. printed resistor, capacitor, inductor |
Attention is drawn to the following places, which may be of interest for search:
Conductive planes with an opening or a split |
This place does not cover:
Dielectric details, e.g. changing the dielectric material around a transmission line | |
Printed circuits associated with mounted high frequency components | |
Impedance arrangements of semiconductor or other solid state devices | |
High frequency adaptations of semiconductor or other solid state devices |
Indexing Codes are used to additionally specify how impedance is adjusted, e.g. for change in trace width of differential pair H05K 1/0245.
This place does not cover:
Impedance arrangements related to vias or transitions between vias and transmission lines |
The lay-out of the power plane is additionally classified with Indexing Codes, e.g. when slotted H05K 1/0236. Except for H05K 1/0224 because that is the default layout in H05K 1/0253.
This place does not cover:
Devices for protecting against damage from electrostatic discharge | |
Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges |
Attention is drawn to the following places, which may be of interest for search:
Spark gaps per se |
This place does not cover:
Individual printed conductors which are adapted for modification, e.g. fusible or breakable conductors, printed switches |
This place does not cover:
Marks, test patterns, inspection means or identification means for visual or optical inspection | |
Coupling light guides with opto-electronic components |
Attention is drawn to the following places, which may be of interest for search:
Security details of computer components |
This place does not cover:
Textiles | |
Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers |
This place does not cover:
Details of rigid insulating substrates therefor, e.g. three-dimensional details | |
Shaping of the substrate |
This place does not cover:
Completing of printed circuits by adding non-printed jumper connections |
This place does not cover:
Examples of places in relation to which this place is residual:
Details |
Attention is drawn to the following places, which may be of interest for search:
Substrates for semiconductor chips |
This place covers:
Insulated electrically conductive substrates, e.g. insulated metal substrates
Attention is drawn to the following places, which may be of interest for search:
Thermal coupling of mounted components and metal substrate |
Attention is drawn to the following places, which may be of interest for search:
Conductive inks in general | |
Conductive material dispersed in non-conductive material in general |
This place does not cover:
Printed elements for providing electric connections to or between printed circuits | |
Connectors for connection to or between printed circuits |
Attention is drawn to the following places, which may be of interest for search:
Thick-film or thin-film circuits |
This place does not cover:
Thermal arrangements, e.g. for cooling, heating or preventing overheating | |
Reduction of cross-talk, and noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances | |
Printed circuits associated with mounted high frequency components | |
Incorporating printed electric components, e.g. printed resistor, capacitor, inductor |
This place covers:
General processing of printed circuit boards (PCBs) including processing of insulating substrates and layers for PCBs and processing of conductive layers for PCBs; forming printed elements for providing electric connection to or between printed circuits; manufacturing multilayer printed circuits; manufacturing metal core printed circuits; secondary treatment of PCBs; assembling PCBs with electric components and/or other PCBs.
H05K 3/00 covers mainly manufacturing (apparatuses and process) of printed circuits. However certain sub-groups of H05K 3/00 cover also the respective structural aspects (e.g. H05K 3/303, H05K 3/306) and materials (e.g. H05K 3/386).
There is no clear boundary between the field of printed circuit boards and other more specific fields, e.g. inductors (H01F), antennas (H01Q), waveguides (H01P), chip cards (G06K 19/07), thin film and thick film circuits (H01L 27/00), other packaging levels (semiconductor packages H01L 21/48, H01L 23/00, H01L 25/00), connectors (H01R) and various electronic components. The materials and methods (deposition, patterning, connection etc) used for manufacture of printed circuit boards have their general fields.
Attention is drawn to the following places, which may be of interest for search:
Apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards | |
Mounting of components | |
Working of metal by electro-erosion per se | |
Soldering, e.g. brazing, or unsoldering in general | |
Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods | |
Machining by laser in general | |
Selection of soldering or welding materials proper, i.e. solder compositions per se | |
Laminates in general | |
Printing apparatus in general | |
Printing techniques in general | |
Screens or stencils, manufacturing thereof in general | |
Covering metals by metal spraying | |
Coating by vacuum evaporation | |
Covering materials by cathodic sputtering | |
Chemical coating of a substrate by decomposition in general | |
Electroless plating in general | |
Non-mechanical removal of metallic material from surfaces | |
Local etching in general | |
Apparatus for etching in general | |
Etchants in general | |
Electroplating in general | |
Photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general | |
Etching masks applied by electrographic, electrophotographic or magnetographic methods in general | |
Electron-beam or ion-beam tubes for localised treatment | |
Discharge devices for covering materials by cathodic sputtering | |
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof | |
Electrically-conductive connections between two or more conductive members in direct contact using electrically conductive adhesives, in general | |
Connectors for printed circuits |
In this main group, both "invention information" and "additional information" are classified by the appropriate CPC group symbol.
Indexing Codes are also attributed to provide additional information when no CPC sub-group exists, i.e. to subdivide subject matter belonging to a sub-group.
This place does not cover:
Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits | |
Aligning added circuit layers or via connections relative to previous circuit layers | |
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components |
This place covers:
- Shaping of the substrate, e.g. by moulding
- Etching of the substrate by chemical or physical means
- Mechanical working of the substrate, e.g. drilling or punching
- After-treatment, e.g. cleaning or desmearing of holes
Attention is drawn to the following places, which may be of interest for search:
Making copper-clad substrates | |
Surface treatment for improvement of adhesion |
This place does not cover:
Reinforcement details |
This place does not cover:
Patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier | |
Applying conductive material to the insulating support by affixing prefabricated conductor pattern | |
Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil |
This place does not cover:
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components |
This place does not cover:
De-panelling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards |
Attention is drawn to the following places, which may be of interest for search:
Laminates in general |
Attention is drawn to the following places, which may be of interest for search:
Machining by laser in general | |
Electron or ion beam tubes therefor |
This place does not cover:
Semi-additive methods |
Attention is drawn to the following places, which may be of interest for search:
Non-mechanical removal of metallic material from surfaces |
Attention is drawn to the following places, which may be of interest for search:
Local etching |
Attention is drawn to the following places, which may be of interest for search:
Electrography, electrophotography, magnetography in general |
Attention is drawn to the following places, which may be of interest for search:
Apparatus for etching in general |
Attention is drawn to the following places, which may be of interest for search:
Photographic processes in general |
Attention is drawn to the following places, which may be of interest for search:
Stencil holders for applying liquids | |
Manufacturing of screens or stencils | |
Screens or stencils in general |
Attention is drawn to the following places, which may be of interest for search:
Ink-jet printers in general |
Attention is drawn to the following places, which may be of interest for search:
Electrography, magnetography in general |
Attention is drawn to the following places, which may be of interest for search:
Covering metals by metal spraying | |
Coating by vacuum evaporation |
Attention is drawn to the following places, which may be of interest for search:
Covering materials by cathodic sputtering | |
Discharge devices therefor |
This place covers:
- Electroless plating
- Electroplating, e.g. electrodeposition
Attention is drawn to the following places, which may be of interest for search:
Chemical coating of a substrate by decomposition |
This place does not cover:
Adhesives therefor |
Attention is drawn to the following places, which may be of interest for search:
Electroless plating in general |
This place does not cover:
Patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier | |
Selective transfer or selective detachment of a conductive layer | |
Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern | |
Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil |
This place covers:
- Completing of printed circuits by adding non-printed jumper connections
- Correcting or repairing of printed circuits
- Drying of printed circuits
- Reinforcing the conductive pattern
- Cleaning or polishing of the conductive pattern
- Applying non-metallic protective coatings
This place does not cover:
Embedding circuits in grooves by pressure | |
After-treatment of the printed patterns, e.g. sintering or curing methods |
This place does not cover:
Programmable, customizable or modifiable circuits | |
Completing of printed circuits by adding non-printed jumper connections | |
Removal of non-metallic coatings, e.g. for repairing |
This place does not cover:
By solder coating |
Attention is drawn to the following places, which may be of interest for search:
Electroplating in general |
This place does not cover:
Apparatus for coating printed circuits using liquid non-metallic coating compositions | |
Methods for intermediate insulating layers for build-up multilayer circuits |
This place does not cover:
Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit |
Attention is drawn to the following places, which may be of interest for search:
Using electrically conductive adhesives in general |
Attention is drawn to the following places, which may be of interest for search:
Soldering or de-soldering apparatus |
Attention is drawn to the following places, which may be of interest for search:
Solder compositions per se |
This place does not cover:
Spacers not being card guides |
H05K 3/36 relates to the method of assembling at least two printed circuits to form a single entity as a final product, whereas H05K 3/0097 relates to processing two printed circuits at the same time. This implicitly means that after processing, the printed circuits are again separated from one another.
This place does not cover:
Laminating printed circuit boards onto other substrates, e.g. metallic substrates | |
Special circuit board as base or central core comprising an electrically conductive core | |
Laminating two or more circuit boards having integrally laminated metal sheets or special power cores |
Attention is drawn to the following places, which may be of interest for search:
Incorporating non-printed electric components in internal layers |
This place covers:
Constructional features of electronic housings when the inner electronic arrangement is not described in the document such as:
- assembling means of the housing parts
- association means of several housings
- venting means
- sealing means
- interlocking means
- displaying and controlling means
- mounting and fixing means
- handling means
Examples of places where the subject matter of this place is covered when specially adapted, used for a particular purpose, or incorporated in a larger system:
Attention is drawn to the following places, which may be of interest for search:
Furniture/cabinets | |
Electric distribution centers in vehicle in general | |
Electronic boxes of vehicles in general | |
Handles and grip in general | |
Locks and Latches in general | |
Hinges in general | |
Sealing in general | |
Stands and supports for apparatus in general | |
LCD display panels | |
Projectors | |
Desktop and laptop computer housings | |
Constructional details of record carriers in general | |
Casings and housings of instrument | |
Plasma display panels | |
Receptacles of batteries | |
Connectors in general | |
Mobile phone housings | |
Details for decorative purposes in mobiles phones | |
CRT Television housings |
This place does not cover:
Specially adapted for small components |
This place covers:
- constructional features of electronic housings when the inner electronic arrangement is also described,
- constructional features of standardized electronic cabinets and racks for receiving Printed Circuit Boards (PCB) such as guides, retainers, drawers, plug-in modules;
- constructional features of Servers, Data Center Rooms, 19-inch computer racks such as mounting means of blades within cabinets, cable management, power distribution, mobile data centers arranged in shipping containers;
- constructional features of industrial controllers such as PLCs;
- cooling features of electronic housings,
- cooling features of standardized electronic cabinets and racks for receiving Printed Circuit Boards (PCB);
- cooling features of Servers, Data Center Rooms, 19-inch computer racks;
- cooling features of power electronics, such as inverters;
- cooling features of vehicle control units;
- cooling features of display panels;
- cooling features of outdoor telecommunication equipments, such as base stations.
This place does not cover:
Casings, cabinets, drawers |
Attention is drawn to the following places, which may be of interest for search:
Blowers and fans in general | |
Cooling tubular elements with fins for cooling | |
Cooling element with means for increasing heat exchange area | |
Constructional details of optoelectronic equipments | |
Program control systems PLC without constructional details | |
Inner arrangements of desktop and laptop computers | |
Cooling arrangements of desktop and laptop computers | |
Bus systems and interfaces of computers | |
Constructional details of record carriers | |
Constructional details of Hard disk drives | |
CPU cooling; Cooling of electronic components not using the housing for the heat transfer | |
Stacked arrangements of semiconductor devices | |
Cooling of batteries | |
Telecommunication distribution frames and equipments |
Attention is drawn to the following places, which may be of interest for search:
IC sockets for connection on printed circuit board |
Attention is drawn to the following places, which may be of interest for search:
Holding two-part couplings together |
This place does not cover:
Construction of rack or frame |
Attention is drawn to the following places, which may be of interest for search:
Test adapters |
Attention is drawn to the following places, which may be of interest for search:
Programmable logic controllers per se |
Attention is drawn to the following places, which may be of interest for search:
Terminal blocks in general |
This place covers:
Arrangements for cooling, ventilating or heating of electric apparatus by:
- using a gaseous coolant in electronic enclosures
- using a liquid coolant without phase change in electronic enclosures
- using a liquid coolant with phase change in electronic enclosures
- heat transfer by conduction from the heat generating element to a dissipating body
Attention is drawn to the following places, which may be of interest for search:
Cooling, ventilating, or heating of printed circuits | |
Cooling, ventilating, or heating of personal computers | |
Cooling, ventilating, or heating of resistors | |
Cooling, ventilating, or heating of capacitors | |
Cooling, ventilating, or heating of individual semiconductor components | |
Cooling, ventilating, or heating of LEDs |
Attention is drawn to the following places, which may be of interest for search:
Blowers in general |
Attention is drawn to the following places, which may be of interest for search:
Filters in general |
Examples of places where the subject matter of this place is covered when specially adapted, used for a particular purpose, or incorporated in a larger system:
Heating or cooling of liquid crystal cells | |
Cooling for projectors | |
Cooling means for computer displays | |
Plasma display panels per se |
This place covers:
- screening of electronic equipments against magnetic and electromagnetic fields, transient and electrostatic discharges and shielding features applied to rooms or buildings protecting against external electromagnetic interference;
- shielded electronic casings achieving electromagnetic compatibility;
- shielding features of electronic equipments having standardized dimensions, such as 19-inch racks;
- constructional features of transient suppressors;
- protection of electronic apparatuses against Electrostatic Discharge (ESD);
- shielding materials achieving electromagnetic compatibility of electronic apparatuses.
This place does not cover:
Devices for absorbing radiation from an antenna |
Examples of places where the subject matter of this place is covered when specially adapted, used for a particular purpose, or incorporated in a larger system:
Screening of human body against electromagnetic influences | |
Anechoic chambers | |
Shielding of Nuclear magnetic Resonance devices | |
Grounding and RFI shielding of Desktop and laptop computers | |
Screening against nuclear radiation | |
Magnetic shielding of transformers | |
Screening of semiconductor devices | |
Device for absorbing radiation from antenna | |
Screening of dynamo-electric machines |
Attention is drawn to the following places, which may be of interest for search:
Screening against nuclear radiation | |
Conductive materials in general | |
Magnetic materials in general | |
RFI Filter construction | |
Prevention of electrostatic charge in general |
This place does not cover:
Anechoic chambers |
Attention is drawn to the following places, which may be of interest for search:
Building construction in general | |
Nuclear magnetic resonance |
Attention is drawn to the following places, which may be of interest for search:
Windows for building construction in general |
Attention is drawn to the following places, which may be of interest for search:
Protective circuits |
Attention is drawn to the following places, which may be of interest for search:
Materials for electrostatic discharge protection |
Attention is drawn to the following places, which may be of interest for search:
Magnetic material in general | |
For transformer | |
For electrical motor |
Attention is drawn to the following places, which may be of interest for search:
Superconductors in general |
Attention is drawn to the following places, which may be of interest for search:
Screening during electrotherapy |
This place does not cover:
Combinations of a radio or television receiver with clocks | |
Radio or television receiver controlled by a clock |
This place covers:
This group only relates to bare printed circuit boards and not circuit boards already fitted in an apparatus (thus no displays, no hard disks etc).
Attention is drawn to the following places, which may be of interest for search:
In patent documents, the following abbreviations are often used:
PCB | Printed Circuit Board |
This place covers:
Hand-tools specially adapted for adjusting assemblages of electric components
This place does not cover:
Hand-tools for mounting electric components on a circuit board |
This place covers:
orientation, alignment and positioning only of the printed circuit boards
Attention is drawn to the following places, which may be of interest for search:
Orientation, alignment and positioning of the printed circuit boards for testing |
This place covers:
preparing the components before delivering to mounting machines by grouping the components for batch mounting
Attention is drawn to the following places, which may be of interest for search:
Attaching a series of articles, e.g. small electrical components, to a continuous web |
Only concerns filling of belts as a separate operation
This place covers:
Filling of belts according to the mounting order of different types of components.
Attention is drawn to the following places, which may be of interest for search:
Attaching a series of articles, e.g. small electrical components, to a continuous web |
Must concern different type of components
In this place, the following terms or expressions are used with the meaning indicated:
Belt | continuous web holding the components in order to be delivered in rolls to the mounting machines |
This place covers:
Manual mounting posts for components on PCB
Attention is drawn to the following places, which may be of interest for search:
Hand-tools for mounting electric components on a circuit board |
This place covers:
Provision for displacing printed circuit boards [PCB] between machines or for displacing PCBs inside mounting machines
Gripping PCBs for transport or conveyance
Attention is drawn to the following places, which may be of interest for search:
Transport of articles, e.g. conveyors | |
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof |
Documents must include movement of printed circuit board
This place covers:
Fixation of printed circuit boards inside mounting machines
Attention is drawn to the following places, which may be of interest for search:
Fixation of printed circuit boards in testing machines |
Printed circuit board must be static relative to holder.
In this place, the following terms or expressions are used with the meaning indicated:
Chuck | Holder, usually using vacuum |
This place covers:
Transport of boards temporary fitted with components before definitive fixation, e.g. soldering.
Attention is drawn to the following places, which may be of interest for search:
Straightening or aligning terminal leads of pins mounted on boards, during the mounting operation, after fitting components on the board |
Components are not definitively fixed.
This place covers:
Any type of container for delivering components to mounting machines and manufacture thereof
Details of component tubes, trays or belts.
Attention is drawn to the following places, which may be of interest for search:
Filling of containers | |
Use of said containers in mounting machines | |
Containers for storage or transport |
In this place, the following terms or expressions are used with the meaning indicated:
Stick | tube-like container |
This place covers:
Preparing leads of components before bringing to mounting machines
Special separate machines for lead treatment.
This place does not cover:
Treatment of the terminal leads as a separate operation during transport | |
Treatment of leads after fitting in printed circuit boards |
Must be a separate machine.
In this place, the following terms or expressions are used with the meaning indicated:
Clinching | bending of leads |
This place covers:
Feeding of components to containers before fitting said container to machines, e.g. filling or refilling of containers
Attention is drawn to the following places, which may be of interest for search:
Emptying of containers by the mounting machine itself | |
Feeding of components in general |
This place covers:
Loading or unloading containers with components, the containers not being in use by the mounting machine.
This place does not cover:
Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields |
Do not classify here documents concerning pick and place in the mounting machine
This place covers:
Giving orientation to components before feeding into containers
Attention is drawn to the following places, which may be of interest for search:
Orientation in general |
This place covers:
Feeding of components with bending or straightening of the terminal leads, e.g. in order to fit into containers
Attention is drawn to the following places, which may be of interest for search:
Treatment of the terminal leads as a separate operation (not during transport) | |
Bending and cutting after the mounting on a pc board |
Not during or after mounting of component.
This place covers:
Straightening or aligning leads during the feeding
This place covers:
Straightening or aligning leads of e.g. resistors
This place covers:
Straightening or aligning lead of chips.
In this place, the following terms or expressions are used with the meaning indicated:
Dual in line | chip with two rows of parallel leads |
This place covers:
Transport of components using fluids, e.g. jets of air, water.
This place covers:
Feeding bulk components simultaneously to containers
Attention is drawn to the following places, which may be of interest for search:
Orientation of the elements |
This place covers:
Feeding bulk axial components to containers.
This place does not cover:
Orientation of the elements |
This place covers:
Mounting machines for components on printed circuit boards.
Attaching containers to mounting machines for components delivery.
This place covers:
Pick-and-place-heads for picking components out of a container and placing them on a printed circuit board using gripping devices.
Attention is drawn to the following places, which may be of interest for search:
Manipulators |
Orientation while holding component is not classified here
In this place, the following terms or expressions are used with the meaning indicated:
Jaws | gripping device having means moving towards each other for pinching component |
This place covers:
Pick-and-place-heads for picking components out of a container and placing them on a printed circuit board by suction, e.g. using vacuum.
Attention is drawn to the following places, which may be of interest for search:
Manipulators |
Orientation while holding component is not classified here
In this place, the following terms or expressions are used with the meaning indicated:
Nozzle | vacuum or air suction device |
This place covers:
Orientation of component held by mounting head just before or during mounting.
Mechanical and vacuum holders for components with orientation provisions.
Vision devices for orientation or correct placing of components.
Includes camera looking at the PC boards before mounting
In this place, the following terms or expressions are used with the meaning indicated:
Vision system | camera |
This place covers:
Delivery of components to a mounting machine via belts or tapes; tape feeders; attachment of tape feeders to the mounting machine; details related to the picking up of components by mounting head from tapes/belts.
Interconnection/splicing of belts/tapes to be classified in H05K 13/021.
In this place, the following terms or expressions are used with the meaning indicated:
Blister, belt, tape | Belt or tape wound on a reel/roll and carrying electronic devices |
Blister | component belt in rolls |
This place covers:
Treatment of leads during or after picking up.
Attention is drawn to the following places, which may be of interest for search:
Feeding one by one by other means than belts | |
Bending and cutting after fitting on a circuit board |
This place covers:
For resistor type components.
This place does not cover:
Treatment of the terminal leads (bending and cutting after fitting on a circuit board |
This place covers:
Delivery of single components by other type of containers.
This place covers:
Delivery with containers, e.g. trays.
Attention is drawn to the following places, which may be of interest for search:
Components belts |
This place covers:
Treatment of leads before insertion.
This place covers:
Treatment of leads before and/or only after insertion.
This place covers:
Mounting machine for several types of components.
Mounting of different type of components to the same mounting place.
Multi nozzle machines
Machines with several holders for pc boards
This place does not cover:
Drive mechanisms for pick-and-place heads | |
Pick-and-place heads having multiple pick-up tools |
Multiple work tables and multiple heads, e.g. revolver heads, are classified here
In this place, the following terms or expressions are used with the meaning indicated:
Revolver head | turning multiple head with multiple nozzles or grippers |
This place covers:
Mounting machines including hole puncher
Attention is drawn to the following places, which may be of interest for search:
Hole shaping and details of holes |
This place covers:
Methods and apparatus for surface mounting electric components in general
This place does not cover:
Surface mounted components |
In this place, the following terms or expressions are used with the meaning indicated:
SMD | Surface mounted device |
This place covers:
Soldering machines of surface mounted components
This place does not cover:
Surface mounting by applying a glue or viscous material |
Attention is drawn to the following places, which may be of interest for search:
Surface mounting on PCBs by soldering | |
Reflow soldering apparatus and process; Soldering process per se |
This place covers:
Use of glue or viscous material with dispenser nozzles.
Attention is drawn to the following places, which may be of interest for search:
Details of glue fixation between component and PC board |
This place covers:
Treatment of leads after insertion out of mounting process
Attention is drawn to the following places, which may be of interest for search:
Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board during transport |
This place covers:
simultaneous mounting of different components placed on PC board at the same moment.
This place covers:
Simultaneous mounting of different components being arranged beforehand in preset positions.
Templates, trays and special multi heads.
This place covers:
Method and apparatus for taking off or replacing misplaced components
No recycling.
May include a de-soldering device
This place covers:
Hand tools for repairing printed circuit boards or exchanging components.
No recycling.
This place covers:
Arrangements of mounting machines in clusters or lines
This place covers:
Placing of wires on or in printed circuit boards by machines; machines therefor.
Attention is drawn to the following places, which may be of interest for search:
Multiplex wire bundles for vehicles |
This place covers:
Accessories for wiring, e.g. special tables or light spots.
This place covers:
Control or planning of manufacturing processes of assemblages, e.g. of processes for mounting components on printed circuit boards
Control of apparatuses therefor
Planning of production facility and apparatus layout
Vision control after placing of components.
Attention is drawn to the following places, which may be of interest for search:
Electrical control of finished printed circuit boards |