CPC Definition - Subclass H05K

Last Updated Version: 2019.08
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
Definition statement

This place covers:

Constructional features of

  • electronic circuit boards such as board design, interconnection models, material
  • casings / cabinets of electronic equipment having cooling and EMI shielding specifications
  • machines for mounting electronic components on circuit boards
  • printed circuits structurally associated with non-printed electric components
  • printed connectors
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Details of instruments or comparable details of other apparatus not otherwise provided for

G12B

Thin-film or thick-film circuits

H01L 27/01, H01L 27/13

Non-printed means for electric connections to or between printed circuits, electric connections or line connectors, apparatus or processes for manufacturing, assembling, maintaining or repairing such connections or connectors

H01R

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

Printed circuits

covers all kinds of mechanical constructions of circuits that consist of an insulating base or support carrying the conductor and are combined structurally with the conductor throughout their length, especially in a two-dimensional plane, the conductors of which are secured to the base in a non-dismountable manner, and also covers the processes or apparatus for manufacturing such constructions, e.g. forming the circuit by mechanical or chemical treatment of a conductive foil, paste, or film on an insulating support.

Printed circuits
Definition statement

This place covers:

Details of printed circuit boards [PCBs], use of materials for PCBs, printed elements for electrical connection to or between printed circuits, printed electric components, structural association of two or more PCBs, structural association of PCBs and non-printed electric components.

H05K 1/00 covers mainly structural aspects (incl. layout) of printed circuits and materials for printed circuits. However certain sub-groups of H05K 1/00 cover also the respective manufacturing aspects (e.g. H05K 1/16, H05K 1/185).

Relationships with other classification places

There is no clear boundary between the field of printed circuit boards and other more specific fields, e.g. inductors (H01F), antennas (H01Q), waveguides (H01P), chip cards (G06K 19/07), thin film and thick film circuits (H01L 27/00), other packaging levels (semiconductor packages H01L 21/48, H01L 23/00, H01L 25/00), connectors (H01R) and various electronic components. The materials and methods (deposition, patterning, connection etc) used for manufacture of printed circuit boards have their general fields.

Documents often contain information relevant to several technical fields and have to be circulated for classification in these fields, in particular to H01L (semiconductors) but also the other parts of H05K, H01R (connectors).

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Backplanes

H05K 7/14

Screening against electric or magnetic fields

H05K 9/00

Electrostatic discharge protection for electric apparatus in general

H05K 9/0067, H05K 9/0079

Handling / Transporting

H05K 13/0061, B65G, H01L 21/68

Cleaning

B08B

Casting of metals

B22D

Metal powder processing

B22F

Mechanical drilling

B23B

Mechanical milling

B23C

Metal milling

B23C

Slotting, etc.

B23D

Erosion by electric discharge

B23H

Soldering or welding

B23K

Laser ablation

B23K 26/00

Patterning by laser ablation

B23K 26/00

Details of machining apparatus

B23Q

Grinding

B24B

Grinding, polishing

B24B

Abrasive working

B24C

Cutting, Punching

B26D, B26F

Laminating

B32B 37/00

Printing forms, e.g. masks

B41C, B41N

Printing apparatus

B41F

Inkjet printing

B41J 2/00

Printing processes

B41M

Selective transfer processes

B41M 5/00

Handling flexible substrates

B65G

Etching polymeric substrates

C08J 7/00

Coating by dipping in molten metal

C23C 2/00

Coating by spraying with molten metal

C23C 4/00

Coating by physical vapour deposition or sputtering or ion implantation

C23C 14/00

Coating by chemical deposition

C23C 16/00

Coating by decomposition of compounds

C23C 18/00, C23C 20/00

Coating by electroless plating

C23C 18/16

Conversion coating of metals

C23C 22/00

Coating by powder methods

C23C 24/00

Other coating methods

C23C 26/00

Coating metal with enamel (glass)

C23D

Corrosion protection of metal

C23F

Cleaning or degreasing of metal

C23G

Electroplating of metal

C25D

Electroforming of metal

C25D 1/00

Anodizing of metal

C25D 11/00

Electrophoretic coating of metal

C25D 13/00

Electrolytic etching of metal

C25F

Lighting devices

F21K, F21S, F21V, H05B

Drying

F26B

Testing, inspection of material

G01N

Electrical testing

G01R 31/00

Electro-optical devices comprising optical waveguides

G02B 6/00

Modules /PCBs having optical waveguides

G02B 6/00

Coupling light guides with opto-electronic components

G02B 6/42

Liquid crystal displays

G02F 1/13

LCD displays

G02F 1/13

Photolithography masks

G03F 1/00

Photoresists

G03F 7/00

Other lithography

G03F 7/00

Photolithography registration

G03F 9/00

Electrography

G03G

Computers

G06F

Touch screens

G06F 3/00

Designing of the conductive pattern

G06F 17/50

Security details of computer components

G06F 21/70

Chip cards

G06K 19/07

Circuits for displays

G09F 9/00

Disk drive suspensions

G11B 5/00

Memory modules

G11C 5/00

Cables

H01B

Flat cables

H01B 7/00, H01B 13/00

Printed resistors

H01C

Resistors

H01C

Printed inductors

H01F

Inductors

H01F

Printed capacitors

H01G

Capacitors

H01G

Switches, fuses

H01H

Plasma displays

H01J 17/49

Semiconductor devices

H01L

Inorganic semiconductor devices

H01L 21/00

Semiconductor packages

H01L 21/48, H01L 23/00, H01L 25/00

Treatment apparatus for semiconductor components

H01L 21/68

Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance for semiconductor devices

H01L 23/66

Assemblies of a plurality of individual semiconductor or solid state devices

H01L 25/00

Devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits

H01L 27/00

Thick film or thin film circuits

H01L 27/00

Solar cells, Photovoltaic devices

H01L 31/00

LEDs

H01L 33/00

Thermoelectric devices

H01L 35/00

Piezoelectric devices

H01L 41/00

Polymeric semiconductor devices

H01L 51/00

Batteries, Cells

H01M

Waveguides

H01P

Printed antennas

H01Q

Antennas

H01Q

Non-printed means for electric connections to or between printed Circuits

H01R

Connectors

H01R

Laser devices

H01S

Spark gaps, Overvoltage arresters

H01T

Emergency protective circuits

H02H

Power conversion

H02M

Receivers / Transceivers (modules)

H04B 1/00

Telephones

H04M

Optical modules

H04N, H01L 27/00, G03B

Electromechanical transducers

H04R

Special rules of classification

In this main group, both "invention information" and "additional information" are classified by the appropriate CPC group symbol.

Indexing Codes are also attributed to provide additional information when no CPC sub-group exists, i.e. to subdivide subject matter belonging to a sub-group.

{Cooling of mounted components (H05K 1/0272 takes precedence)}
References
Limiting references

This place does not cover:

Adaptations for fluid transport, e.g. channels, holes

H05K 1/0272

{using means for thermal conduction connection in the thickness direction of the substrate (H05K 1/0207 takes precedence)}
References
Limiting references

This place does not cover:

Using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes

H05K 1/0207

{Electrical arrangements not otherwise provided for}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Screening

H05K 9/00

Emergency protective circuits

H02H

{Reduction of cross-talk, noise or electromagnetic interference (grounding H05K 1/0215)}
References
Limiting references

This place does not cover:

Grounding

H05K 1/0215

{by printed shielding conductors, ground planes or power plane (H05K 1/0236 takes precedence)}
References
Limiting references

This place does not cover:

Electromagnetic band-gap structures

H05K 1/0236

{Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Coaxially shielded vias

H05K 1/0222

{Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K 1/0245)}
References
Limiting references

This place does not cover:

Balanced signal pairs

H05K 1/0245

{using auxiliary mounted passive components or auxiliary substances (printed passive components H05K 1/16)}
References
Limiting references

This place does not cover:

Incorporating printed electric components, e.g. printed resistor, capacitor, inductor

H05K 1/16

{Electromagnetic band-gap structures}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Conductive planes with an opening or a split

H05K 1/0225, H05K 1/0227

{Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K 1/024 and H05K 1/0243 take precedence; for semiconductor devices H01L 23/66)}
References
Limiting references

This place does not cover:

Dielectric details, e.g. changing the dielectric material around a transmission line

H05K 1/024

Printed circuits associated with mounted high frequency components

H05K 1/0243

Impedance arrangements of semiconductor or other solid state devices

H01L 23/64

High frequency adaptations of semiconductor or other solid state devices

H01L 23/66

Special rules of classification

Indexing Codes are used to additionally specify how impedance is adjusted, e.g. for change in trace width of differential pair H05K 1/0245.

{Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K 1/0251 takes precedence)}
References
Limiting references

This place does not cover:

Impedance arrangements related to vias or transitions between vias and transmission lines

H05K 1/0251

Special rules of classification

The lay-out of the power plane is additionally classified with Indexing Codes, e.g. when slotted H05K 1/0236. Except for H05K 1/0224 because that is the default layout in H05K 1/0253.

{High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection (electrostatic discharge protection for electric apparatus in general H05K 9/0067, H05K 9/0079); Arrangements for regulating voltages or for using plural voltages}
References
Limiting references

This place does not cover:

Devices for protecting against damage from electrostatic discharge

H05K 9/0067

Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges

H05K 9/0079

{Spark gaps}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Spark gaps per se

H01T

{High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K 1/0293 takes precedence)}
References
Limiting references

This place does not cover:

Individual printed conductors which are adapted for modification, e.g. fusible or breakable conductors, printed switches

H05K 1/0293

{Optical details, e.g. printed circuits comprising integral optical means (H05K 1/0269 takes precedence; coupling light guides with opto-electronic components G02B 6/42)}
References
Limiting references

This place does not cover:

Marks, test patterns, inspection means or identification means for visual or optical inspection

H05K 1/0269

Coupling light guides with opto-electronic components

G02B 6/42

{Security details, e.g. tampering prevention or detection}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Security details of computer components

G06F 21/70

{Bendability or stretchability details (H05K 1/038, H05K 3/4691 take precedence)}
References
Limiting references

This place does not cover:

Textiles

H05K 1/038

Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

H05K 3/4691

{Details of three-dimensional rigid printed circuit boards (H05K 1/119 takes precedence; shaping of the substrate H05K 3/0014)}
References
Limiting references

This place does not cover:

Details of rigid insulating substrates therefor, e.g. three-dimensional details

H05K 1/119

Shaping of the substrate

H05K 3/0014

{Programmable, customizable or modifiable circuits (by programmable non-printed jumper connections H05K 3/222)}
References
Limiting references

This place does not cover:

Completing of printed circuits by adding non-printed jumper connections

H05K 3/222

{Conductive pattern lay-out details not covered by sub groups H05K 1/02 - H05K 1/0295 (H05K 1/11 takes precedence; lay-out adapted to mounted component configuration H05K 1/18)}
References
Limiting references

This place does not cover:

Printed elements for providing electric connections to or between printed circuits

H05K 1/11

Lay-out adapted to mounted component configuration

H05K 1/18

References out of a residual place

Examples of places in relation to which this place is residual:

Use of materials for the substrate
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Substrates for semiconductor chips

H01L 23/00

Insulated {conductive substrates, e.g. insulated} metal substrate
Definition statement

This place covers:

Insulated electrically conductive substrates, e.g. insulated metal substrates

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Thermal coupling of mounted components and metal substrate

H05K 1/0204, H05K 1/021

Use of materials for the {conductive, e.g. } metallic pattern
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Materials for conductors

H01B 1/00

{Dispersed materials, e.g. conductive pastes or inks}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Conductive inks in general

C09D 11/52

Conductive material dispersed in non-conductive material in general

H01B 1/14H01B 1/24

Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K 1/11, H01R 12/00)
References
Limiting references

This place does not cover:

Printed elements for providing electric connections to or between printed circuits

H05K 1/11

Connectors for connection to or between printed circuits

H01R 12/00

incorporating printed electric components, e.g. printed resistor, capacitor, inductor
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Thick-film or thin-film circuits

H01L 27/01, H01L 27/13

Printed circuits structurally associated with non-printed electric components ({H05K 1/0201, H05K 1/023, H05K 1/0243, } H05K 1/16 take precedence)
References
Limiting references

This place does not cover:

Thermal arrangements, e.g. for cooling, heating or preventing overheating

H05K 1/0201

Reduction of cross-talk, and noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances

H05K 1/023

Printed circuits associated with mounted high frequency components

H05K 1/0243

Incorporating printed electric components, e.g. printed resistor, capacitor, inductor

H05K 1/16

Apparatus or processes for manufacturing printed circuits
Definition statement

This place covers:

General processing of printed circuit boards (PCBs) including processing of insulating substrates and layers for PCBs and processing of conductive layers for PCBs; forming printed elements for providing electric connection to or between printed circuits; manufacturing multilayer printed circuits; manufacturing metal core printed circuits; secondary treatment of PCBs; assembling PCBs with electric components and/or other PCBs.

H05K 3/00 covers mainly manufacturing (apparatuses and process) of printed circuits. However certain sub-groups of H05K 3/00 cover also the respective structural aspects (e.g. H05K 3/303, H05K 3/306) and materials (e.g. H05K 3/386).

Relationships with other classification places

There is no clear boundary between the field of printed circuit boards and other more specific fields, e.g. inductors (H01F), antennas (H01Q), waveguides (H01P), chip cards (G06K 19/07), thin film and thick film circuits (H01L 27/00), other packaging levels (semiconductor packages H01L 21/48, H01L 23/00, H01L 25/00), connectors (H01R) and various electronic components. The materials and methods (deposition, patterning, connection etc) used for manufacture of printed circuit boards have their general fields.

Documents often contain information relevant to several technical fields and have to be circulated for classification in these fields, in particular to H01L (semiconductors) but also the other parts of H05K, H01R (connectors) etc. (see Annex 2).

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards

H05K 13/00

Mounting of components

H05K 13/04

Working of metal by electro-erosion per se

B23H

Soldering, e.g. brazing, or unsoldering in general

B23K 1/00

Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods

B23K 3/00

Machining by laser in general

B23K 26/00

Selection of soldering or welding materials proper, i.e. solder compositions per se

B23K 35/24

Laminates in general

B32B

Printing apparatus in general

B41F

Printing techniques in general

B41M

Screens or stencils, manufacturing thereof in general

B41N 1/24, B41C 1/14

Covering metals by metal spraying

C23C 4/00

Coating by vacuum evaporation

C23C 14/00

Covering materials by cathodic sputtering

C23C 14/34

Chemical coating of a substrate by decomposition in general

C23C 18/00

Electroless plating in general

C23C 18/16

Non-mechanical removal of metallic material from surfaces

C23F

Local etching in general

C23F 1/02

Apparatus for etching in general

C23F 1/08

Etchants in general

C23F 1/10 - C23F 1/46

Electroplating in general

C25D

Photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general

G03F

Etching masks applied by electrographic, electrophotographic or magnetographic methods in general

G03G

Electron-beam or ion-beam tubes for localised treatment

H01J 37/30

Discharge devices for covering materials by cathodic sputtering

H01J 37/34

Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L 21/00

Electrically-conductive connections between two or more conductive members in direct contact using electrically conductive adhesives, in general

H01R 4/04

Connectors for printed circuits

H01R 12/00

Special rules of classification

In this main group, both "invention information" and "additional information" are classified by the appropriate CPC group symbol.

Indexing Codes are also attributed to provide additional information when no CPC sub-group exists, i.e. to subdivide subject matter belonging to a sub-group.

{for aligning or positioning of tools relative to the circuit board (H05K 3/4638, H05K 3/4679 take precedence; for manufacturing assemblages of components H05K 13/0015)}
References
Limiting references

This place does not cover:

Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits

H05K 3/4638

Aligning added circuit layers or via connections relative to previous circuit layers

H05K 3/4679

Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

H05K 13/0015

{Working of insulating substrates or insulating layers}
Definition statement

This place covers:

  • Shaping of the substrate, e.g. by moulding
  • Etching of the substrate by chemical or physical means
  • Mechanical working of the substrate, e.g. drilling or punching
  • After-treatment, e.g. cleaning or desmearing of holes
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Making copper-clad substrates

H05K 3/022

Surface treatment for improvement of adhesion

H05K 3/38

{Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K 1/0281 takes precedence)}
References
Limiting references

This place does not cover:

Reinforcement details

H05K 1/0281

{Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K 1/187, H05K 3/20 and H05K 3/4682 take precedence)}
References
Limiting references

This place does not cover:

Patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier

H05K 1/187

Applying conductive material to the insulating support by affixing prefabricated conductor pattern

H05K 3/20

Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil

H05K 3/4682

{Masks not provided for in groups H05K 3/02 - H05K 3/46, e.g. for photomechanical production of patterned surfaces}
References
References out of a residual place

Examples of places in relation to which this place is residual:

Apparatus or processes for manufacturing printed circuits

H05K 3/02 - H05K 3/46

{Apparatus for treatments of printed circuits with liquids not provided for in groups H05K 3/02 - H05K 3/46; conveyors and holding means therefor (apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K 13/00)}
References
Limiting references

This place does not cover:

Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

H05K 13/00

References out of a residual place

Examples of places in relation to which this place is residual:

Apparatus or processes for manufacturing printed circuits

H05K 3/02 - H05K 3/46

{Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K 3/0052 takes precedence)}
References
Limiting references

This place does not cover:

De-panelling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

H05K 3/0052

{Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Laminates in general

B32B

{the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Machining by laser in general

B23K 26/00

Electron or ion beam tubes therefor

H01J 37/00

the conductive material being removed chemically or electrolytically, e.g. by photo-etch process {(semi-additive methods H05K 3/108)}
References
Limiting references

This place does not cover:

Semi-additive methods

H05K 3/108

Informative references

Attention is drawn to the following places, which may be of interest for search:

Non-mechanical removal of metallic material from surfaces

C23F

{Etching masks}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Local etching

C23F 1/02

{applied by electrographic, electrophotographic or magnetographic methods}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Electrography, electrophotography, magnetography in general

G03G

{Etchants}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Etching compositions in general

C23F 1/10C23F 1/46

{Apparatus for etching printed circuits}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Apparatus for etching in general

C23F 1/08

the conductive material being removed by electric discharge, e.g. by spark erosion
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Working of metal by electro-erosion per se

B23H

{by photographic methods}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Photographic processes in general

G03C

using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Printing apparatus

B41F

Printing techniques in general

B41M

{Screens or stencils; Holders therefor}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Stencil holders for applying liquids

B05C 17/08

Manufacturing of screens or stencils

B41C 1/14

Screens or stencils in general

B41N 1/24

{by ink-jet printing}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Ink-jet printers in general

B41J

{by electrographic or magnetographic printing}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Electrography, magnetography in general

G03G

using spraying techniques to apply the conductive material {, e.g. vapour evaporation}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Covering metals by metal spraying

C23C 4/00

Coating by vacuum evaporation

C23C 14/00

by cathodic sputtering
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Covering materials by cathodic sputtering

C23C 14/34

Discharge devices therefor

H01J 37/34

using precipitation techniques to apply the conductive material
Definition statement

This place covers:

  • Electroless plating
  • Electroplating, e.g. electrodeposition
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Chemical coating of a substrate by decomposition

C23C 18/00

{by electroless plating (adhesives therefor H05K 3/387)}
References
Limiting references

This place does not cover:

Adhesives therefor

H05K 3/387

Informative references

Attention is drawn to the following places, which may be of interest for search:

Electroless plating in general

C23C 18/16

by affixing prefabricated conductor pattern {(H05K 1/187, H05K 3/046, H05K 3/4658, H05K 3/4682 takes precedence)}
References
Limiting references

This place does not cover:

Patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier

H05K 1/187

Selective transfer or selective detachment of a conductive layer

H05K 3/046

Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

H05K 3/4658

Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil

H05K 3/4682

Secondary treatment of printed circuits {(H05K 3/1283 takes precedence; embedding circuits in grooves by pressure H05K 3/107)}
Definition statement

This place covers:

  • Completing of printed circuits by adding non-printed jumper connections
  • Correcting or repairing of printed circuits
  • Drying of printed circuits
  • Reinforcing the conductive pattern
  • Cleaning or polishing of the conductive pattern
  • Applying non-metallic protective coatings
References
Limiting references

This place does not cover:

Embedding circuits in grooves by pressure

H05K 3/107

After-treatment of the printed patterns, e.g. sintering or curing methods

H05K 3/1283

{Correcting or repairing of printed circuits (H05K 1/0292, H05K 3/222, H05K 3/288, H05K 3/4685 take precedence)}
References
Limiting references

This place does not cover:

Programmable, customizable or modifiable circuits

H05K 1/0286

Completing of printed circuits by adding non-printed jumper connections

H05K 3/222

Removal of non-metallic coatings, e.g. for repairing

H05K 3/288

Reinforcing the conductive pattern {(by solder coating H05K 3/3457)}
References
Limiting references

This place does not cover:

By solder coating

H05K 3/3457

{characterised by the electroplating method; means therefor, e.g. baths or apparatus}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Electroplating in general

C25D

Applying non-metallic protective coatings {(H05K 3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K 3/4673)}
References
Limiting references

This place does not cover:

Apparatus for coating printed circuits using liquid non-metallic coating compositions

H05K 3/0091

Methods for intermediate insulating layers for build-up multilayer circuits

H05K 3/4673

{for encapsulating mounted components (H05K 1/185 takes precedence)}
References
Limiting references

This place does not cover:

Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

H05K 1/185

{by conductive adhesives}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Using electrically conductive adhesives in general

H01R 4/04

by soldering
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Soldering or de-soldering apparatus

H05K 13/04, B23K 1/00, B23K 3/00

{Solder materials or compositions; Methods of application thereof}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Solder compositions per se

B23K 35/24

Assembling printed circuits with other printed circuits {(H05K 7/142 takes precedence)}
References
Limiting references

This place does not cover:

Spacers not being card guides

H05K 7/142

Special rules of classification

H05K 3/36 relates to the method of assembling at least two printed circuits to form a single entity as a final product, whereas H05K 3/0097 relates to processing two printed circuits at the same time. This implicitly means that after processing, the printed circuits are again separated from one another.

Improvement of the adhesion between the insulating substrate and the metal
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Laminates per se

B32B

Manufacture insulated metal core circuits {or other insulated electrically conductive core circuits (H05K 3/0058, H05K 3/4641, H05K 3/4608 take precedence)}
References
Limiting references

This place does not cover:

Laminating printed circuit boards onto other substrates, e.g. metallic substrates

H05K 3/0058

Special circuit board as base or central core comprising an electrically conductive core

H05K 3/4608

Laminating two or more circuit boards having integrally laminated metal sheets or special power cores

H05K 3/4641

Manufacturing multilayer circuits
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Incorporating non-printed electric components in internal layers

H05K 1/185

Casings, cabinets or drawers for electric apparatus
Definition statement

This place covers:

Constructional features of electronic housings when the inner electronic arrangement is not described in the document such as:

  • assembling means of the housing parts
  • association means of several housings
  • venting means
  • sealing means
  • interlocking means
  • displaying and controlling means
  • mounting and fixing means
  • handling means
References
Application-oriented references

Examples of places where the subject matter of this place is covered when specially adapted, used for a particular purpose, or incorporated in a larger system:

Radio receiver cabinets

H04B 1/08

Television receiver cabinets

H04N 5/64

Informative references

Attention is drawn to the following places, which may be of interest for search:

Furniture/cabinets

A47B 87/00

Electric distribution centers in vehicle in general

B60R 16/0238

Electronic boxes of vehicles in general

B60R 16/0239

Handles and grip in general

B65D

Locks and Latches in general

E05B, E05C

Hinges in general

E05D

Sealing in general

F16J 15/00

Stands and supports for apparatus in general

F16M 11/00

LCD display panels

G02F 1/13

Projectors

G03B 21/00

Desktop and laptop computer housings

G06F 1/16

Constructional details of record carriers in general

G06K 7/00

Casings and housings of instrument

G12B 9/00

Plasma display panels

H01J 29/00

Receptacles of batteries

H01M 2/10

Connectors in general

H01R

Mobile phone housings

H04M 1/0202

Details for decorative purposes in mobiles phones

H04M 1/0283

CRT Television housings

H04N 5/00

Hermetically-sealed casings {(specially adapted for small components H05K 5/0095)}
References
Limiting references

This place does not cover:

Specially adapted for small components

H05K 5/0095

Constructional details common to different types of electric apparatus (casings, cabinets, drawers H05K 5/00)
Definition statement

This place covers:

  • constructional features of electronic housings when the inner electronic arrangement is also described,
  • constructional features of standardized electronic cabinets and racks for receiving Printed Circuit Boards (PCB) such as guides, retainers, drawers, plug-in modules;
  • constructional features of Servers, Data Center Rooms, 19-inch computer racks such as mounting means of blades within cabinets, cable management, power distribution, mobile data centers arranged in shipping containers;
  • constructional features of industrial controllers such as PLCs;
  • cooling features of electronic housings,
  • cooling features of standardized electronic cabinets and racks for receiving Printed Circuit Boards (PCB);
  • cooling features of Servers, Data Center Rooms, 19-inch computer racks;
  • cooling features of power electronics, such as inverters;
  • cooling features of vehicle control units;
  • cooling features of display panels;
  • cooling features of outdoor telecommunication equipments, such as base stations.
References
Limiting references

This place does not cover:

Casings, cabinets, drawers

H05K 5/00

Informative references

Attention is drawn to the following places, which may be of interest for search:

Blowers and fans in general

F04D 29/00

Cooling tubular elements with fins for cooling

F28F 1/10

Cooling element with means for increasing heat exchange area

F28F 3/02

Constructional details of optoelectronic equipments

G02B 6/42

Program control systems PLC without constructional details

G05B 19/00

Inner arrangements of desktop and laptop computers

G06F 1/18

Cooling arrangements of desktop and laptop computers

G06F 1/20

Bus systems and interfaces of computers

G06F 13/409

Constructional details of record carriers

G06K 7/00

Constructional details of Hard disk drives

G11B 33/00

CPU cooling; Cooling of electronic components not using the housing for the heat transfer

H01L 23/34

Stacked arrangements of semiconductor devices

H01L 25/065

Cooling of batteries

H01M 10/60

Telecommunication distribution frames and equipments

H04Q 1/00

Plug-in assemblages of components {, e.g. IC sockets}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

IC sockets for connection on printed circuit board

H01R 12/00

Resilient or clamping means for holding component to structure
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Holding two-part couplings together

H01R 13/00

Mounting supporting structure in casing or on frame or rack {(H05K 7/18 takes precedence)}
References
Limiting references

This place does not cover:

Construction of rack or frame

H05K 7/18

Informative references

Attention is drawn to the following places, which may be of interest for search:

Test adapters

G01R 31/2808

{for programmable logic controllers [PLC] for automation or industrial process control}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Programmable logic controllers per se

G05B 19/05

{Terminal blocks for connecting sensors}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Terminal blocks in general

H01R 9/24

Modifications to facilitate cooling, ventilating, or heating
Definition statement

This place covers:

Arrangements for cooling, ventilating or heating of electric apparatus by:

  • using a gaseous coolant in electronic enclosures
  • using a liquid coolant without phase change in electronic enclosures
  • using a liquid coolant with phase change in electronic enclosures
  • heat transfer by conduction from the heat generating element to a dissipating body
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Cooling, ventilating, or heating of printed circuits

H05K 1/0201

Cooling, ventilating, or heating of personal computers

G06F 1/20

Cooling, ventilating, or heating of resistors

H01C

Cooling, ventilating, or heating of capacitors

H01G

Cooling, ventilating, or heating of individual semiconductor components

H01L 23/34, H01L 31/024

Cooling, ventilating, or heating of LEDs

H01L 33/64

{Fan mounting or fan specifications}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Blowers in general

F04D 29/601

{Filters; Louvers}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Filters in general

B01D 46/00

{for display panels}
References
Application-oriented references

Examples of places where the subject matter of this place is covered when specially adapted, used for a particular purpose, or incorporated in a larger system:

Heating or cooling of liquid crystal cells

G02F 1/133382

Cooling for projectors

G03B 21/16

Cooling means for computer displays

G06F 1/20

Plasma display panels per se

H01J 17/49

Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an antenna H01Q 17/00)
Definition statement

This place covers:

  • screening of electronic equipments against magnetic and electromagnetic fields, transient and electrostatic discharges and shielding features applied to rooms or buildings protecting against external electromagnetic interference;
  • shielded electronic casings achieving electromagnetic compatibility;
  • shielding features of electronic equipments having standardized dimensions, such as 19-inch racks;
  • constructional features of transient suppressors;
  • protection of electronic apparatuses against Electrostatic Discharge (ESD);
  • shielding materials achieving electromagnetic compatibility of electronic apparatuses.
References
Limiting references

This place does not cover:

Devices for absorbing radiation from an antenna

H01Q 17/00

Application-oriented references

Examples of places where the subject matter of this place is covered when specially adapted, used for a particular purpose, or incorporated in a larger system:

Screening of human body against electromagnetic influences

A61N 1/16

Anechoic chambers

G01R 29/0821

Shielding of Nuclear magnetic Resonance devices

G01R 33/42

Grounding and RFI shielding of Desktop and laptop computers

G06F 1/182

Screening against nuclear radiation

G21F

Magnetic shielding of transformers

H01F 27/28

Screening of semiconductor devices

H01L 23/552
,H01L 24/00

Device for absorbing radiation from antenna

H01Q 17/00

Screening of dynamo-electric machines

H02K 11/00

Informative references

Attention is drawn to the following places, which may be of interest for search:

Screening against nuclear radiation

G21F

Conductive materials in general

H01B 1/00

Magnetic materials in general

H01F 1/00

RFI Filter construction

H03H 1/0007

Prevention of electrostatic charge in general

H05F 1/00

{Rooms or chambers (anechoic chambers G01R 29/0821)}
References
Limiting references

This place does not cover:

Anechoic chambers

G01R 29/0821

Informative references

Attention is drawn to the following places, which may be of interest for search:

Building construction in general

E04B

Nuclear magnetic resonance

G01R 33/42

{Shielded windows}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Windows for building construction in general

E06B 5/00

{Constructional details of transient suppressor}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Protective circuits

H02H

{Devices for protecting against damage from electrostatic discharge}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Materials for electrostatic discharge protection

H05K 9/0079

{Magnetic shielding materials}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Magnetic material in general

H01F 1/00

For transformer

H01F 27/28

For electrical motor

H02K 11/00

{comprising superconductors}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Superconductors in general

H01L 39/00

{comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked}
References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Screening during electrotherapy

A61N 1/16

Combinations of a radio or television receiver with apparatus having a different main function {(combined with clocks G04B 47/00; controlled by a clock G04C 21/28)}
References
Limiting references

This place does not cover:

Combinations of a radio or television receiver with clocks

G04B 47/00

Radio or television receiver controlled by a clock

G04C 21/28

Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
Definition statement

This place covers:

This group only relates to bare printed circuit boards and not circuit boards already fitted in an apparatus (thus no displays, no hard disks etc).

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Manufacture of printed circuit boards

H05K 1/00

Assembling printed circuits with electric components

H05K 3/30

Apparatus and methods for soldering

B23K

Manipulators

B25J

Packaging, Packing or unpacking

B65B

Manufacture or treatments of solid state devices

H01L 21/00

Synonyms and Keywords

In patent documents, the following abbreviations are often used:

PCB

Printed Circuit Board

{using handtools (for mounting on a circuit board H05K 13/0447)}
Definition statement

This place covers:

Hand-tools specially adapted for adjusting assemblages of electric components

References
Limiting references

This place does not cover:

Hand-tools for mounting electric components on a circuit board

H05K 13/0447

{Orientation; Alignment; Positioning}
Definition statement

This place covers:

orientation, alignment and positioning only of the printed circuit boards

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Orientation, alignment and positioning of the printed circuit boards for testing

G01R 31/00

{Placing of components on belts holding the terminals}
Definition statement

This place covers:

preparing the components before delivering to mounting machines by grouping the components for batch mounting

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Attaching a series of articles, e.g. small electrical components, to a continuous web

B65B 15/04

Special rules of classification

Only concerns filling of belts as a separate operation

{placing the components in a predetermined order}
Definition statement

This place covers:

Filling of belts according to the mounting order of different types of components.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Attaching a series of articles, e.g. small electrical components, to a continuous web

B65B 15/04

Special rules of classification

Must concern different type of components

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

Belt

continuous web holding the components in order to be delivered in rolls to the mounting machines

{Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting}
Definition statement

This place covers:

Manual mounting posts for components on PCB

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Hand-tools for mounting electric components on a circuit board

H05K 13/0447

{Tools for holding the circuit boards during processing; handling transport of printed circuit boards}
Definition statement

This place covers:

Provision for displacing printed circuit boards [PCB] between machines or for displacing PCBs inside mounting machines

Gripping PCBs for transport or conveyance

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Transport of articles, e.g. conveyors

B65G

Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof

H01L 21/67

Special rules of classification

Documents must include movement of printed circuit board

{Holders for printed circuit boards}
Definition statement

This place covers:

Fixation of printed circuit boards inside mounting machines

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Fixation of printed circuit boards in testing machines

G01R 31/00

Special rules of classification

Printed circuit board must be static relative to holder.

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

Chuck

Holder, usually using vacuum

{Straightening or aligning terminal leads of pins mounted on boards, during transport of the boards}
Definition statement

This place covers:

Transport of boards temporary fitted with components before definitive fixation, e.g. soldering.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Straightening or aligning terminal leads of pins mounted on boards, during the mounting operation, after fitting components on the board

H05K 13/0473

Special rules of classification

Components are not definitively fixed.

{Containers and magazines for components, e.g. tube-like magazines}
Definition statement

This place covers:

Any type of container for delivering components to mounting machines and manufacture thereof

Details of component tubes, trays or belts.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Filling of containers

H05K 13/02

Use of said containers in mounting machines

H05K 13/04

Containers for storage or transport

B65D

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

Stick

tube-like container

{Treatment of the terminal leads as a separate operation (during transport H05K 13/0076, H05K 13/023; during mounting H05K 13/04)}
Definition statement

This place covers:

Preparing leads of components before bringing to mounting machines

Special separate machines for lead treatment.

References
Limiting references

This place does not cover:

Treatment of the terminal leads as a separate operation during transport

H05K 13/0076, H05K 13/023

Treatment of leads after fitting in printed circuit boards

H05K 13/04

Special rules of classification

Must be a separate machine.

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

Clinching

bending of leads

Feeding of components
Definition statement

This place covers:

Feeding of components to containers before fitting said container to machines, e.g. filling or refilling of containers

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Emptying of containers by the mounting machine itself

H05K 13/04

Feeding of components in general

B65G

{Loading or unloading of containers (H05K 13/028 takes precedence)}
Definition statement

This place covers:

Loading or unloading containers with components, the containers not being in use by the mounting machine.

References
Limiting references

This place does not cover:

Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields

H05K 13/028

Special rules of classification

Do not classify here documents concerning pick and place in the mounting machine

{with orientation of the elements}
Definition statement

This place covers:

Giving orientation to components before feeding into containers

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Orientation in general

B23P 19/00

{with bending or straightening of the terminal leads}
Definition statement

This place covers:

Feeding of components with bending or straightening of the terminal leads, e.g. in order to fit into containers

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Treatment of the terminal leads as a separate operation (not during transport)

H05K 13/0092

Bending and cutting after the mounting on a pc board

H05K 13/0473

Special rules of classification

Not during or after mounting of component.

{Straightening or aligning terminal leads}
Definition statement

This place covers:

Straightening or aligning leads during the feeding

{of components having oppositely extending terminal leads}
Definition statement

This place covers:

Straightening or aligning leads of e.g. resistors

{of components having terminal leads in side by side relationship, e.g. using combing elements}
Definition statement

This place covers:

Straightening or aligning lead of chips.

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

Dual in line

chip with two rows of parallel leads

{Fluid transport of components}
Definition statement

This place covers:

Transport of components using fluids, e.g. jets of air, water.

{Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields}
Definition statement

This place covers:

Feeding bulk components simultaneously to containers

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Orientation of the elements

H05K 13/022

{Feeding axial lead components, e.g. using vibrating bowls, magnetic fields (H05K 13/022 takes precedence)}
Definition statement

This place covers:

Feeding bulk axial components to containers.

References
Limiting references

This place does not cover:

Orientation of the elements

H05K 13/022

Mounting of components {, e.g. of leadless components}
Definition statement

This place covers:

Mounting machines for components on printed circuit boards.

Attaching containers to mounting machines for components delivery.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Assembling printed circuits with electric components

H05K 3/30

Manipulators

B25J

{Pick-and-place heads or apparatus, e.g. with jaws}
Definition statement

This place covers:

Pick-and-place-heads for picking components out of a container and placing them on a printed circuit board using gripping devices.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Manipulators

B25J

Special rules of classification

Orientation while holding component is not classified here

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

Jaws

gripping device having means moving towards each other for pinching component

{Incorporating a pick-up tool}
Definition statement

This place covers:

Pick-and-place-heads for picking components out of a container and placing them on a printed circuit board by suction, e.g. using vacuum.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Manipulators

B25J

Special rules of classification

Orientation while holding component is not classified here

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

Nozzle

vacuum or air suction device

{with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools}
Definition statement

This place covers:

Orientation of component held by mounting head just before or during mounting.

Mechanical and vacuum holders for components with orientation provisions.

Vision devices for orientation or correct placing of components.

Includes camera looking at the PC boards before mounting

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

Vision system

camera

{Feeding with belts or tapes}
Definition statement

This place covers:

Delivery of components to a mounting machine via belts or tapes; tape feeders; attachment of tape feeders to the mounting machine; details related to the picking up of components by mounting head from tapes/belts.

Special rules of classification

Interconnection/splicing of belts/tapes to be classified in H05K 13/021.

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

Blister, belt, tape

Belt or tape wound on a reel/roll and carrying electronic devices

Synonyms and Keywords

Blister

component belt in rolls

{with treatment of the terminal leads}
Definition statement

This place covers:

Treatment of leads during or after picking up.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Feeding one by one by other means than belts

H05K 13/043

Bending and cutting after fitting on a circuit board

H05K 13/0473

{for components being oppositely extending terminal leads (H05K 13/0421 takes precedence)}
Definition statement

This place covers:

For resistor type components.

References
Limiting references

This place does not cover:

Treatment of the terminal leads (bending and cutting after fitting on a circuit board

H05K 13/0421

{Feeding one by one by other means than belts}
Definition statement

This place covers:

Delivery of single components by other type of containers.

{with containers}
Definition statement

This place covers:

Delivery with containers, e.g. trays.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Components belts

H05K 13/0417

{incorporating means for treating the terminal leads only before insertion}
Definition statement

This place covers:

Treatment of leads before insertion.

{incorporating means for treating the terminal leads before and after insertion or only after insertion}
Definition statement

This place covers:

Treatment of leads before and/or only after insertion.

{Mounting machines or lines comprising a plurality of tools for guiding different components to the same mounting place (H05K 13/0406, H05K 13/041 take precedence)}
Definition statement

This place covers:

Mounting machine for several types of components.

Mounting of different type of components to the same mounting place.

Multi nozzle machines

Machines with several holders for pc boards

References
Limiting references

This place does not cover:

Drive mechanisms for pick-and-place heads

H05K 13/0406

Pick-and-place heads having multiple pick-up tools

H05K 13/041

Special rules of classification

Multiple work tables and multiple heads, e.g. revolver heads, are classified here

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

Revolver head

turning multiple head with multiple nozzles or grippers

{simultaneously punching the circuit board}
Definition statement

This place covers:

Mounting machines including hole puncher

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Hole shaping and details of holes

H05K 3/00

{Surface mounting (surface mounted components H05K 3/341)}
Definition statement

This place covers:

Methods and apparatus for surface mounting electric components in general

References
Limiting references

This place does not cover:

Surface mounted components

H05K 3/341

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

SMD

Surface mounted device

{by soldering (H05K 13/0469 takes precedence)}
Definition statement

This place covers:

Soldering machines of surface mounted components

References
Limiting references

This place does not cover:

Surface mounting by applying a glue or viscous material

H05K 13/0469

Informative references

Attention is drawn to the following places, which may be of interest for search:

Surface mounting on PCBs by soldering

H05K 3/341

Reflow soldering apparatus and process; Soldering process per se

B23K

{by applying a glue or viscous material}
Definition statement

This place covers:

Use of glue or viscous material with dispenser nozzles.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Details of glue fixation between component and PC board

H05K 3/00

{Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board}
Definition statement

This place covers:

Treatment of leads after insertion out of mounting process

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board during transport

H05K 13/0076

{Simultaneously mounting of different components}
Definition statement

This place covers:

simultaneous mounting of different components placed on PC board at the same moment.

{using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached}
Definition statement

This place covers:

Simultaneous mounting of different components being arranged beforehand in preset positions.

Templates, trays and special multi heads.

{Replacement and removal of components}
Definition statement

This place covers:

Method and apparatus for taking off or replacing misplaced components

Special rules of classification

No recycling.

May include a de-soldering device

{Hand tools therefor}
Definition statement

This place covers:

Hand tools for repairing printed circuit boards or exchanging components.

Special rules of classification

No recycling.

{having a plurality of work-stations}
Definition statement

This place covers:

Arrangements of mounting machines in clusters or lines

Wiring by machine
Definition statement

This place covers:

Placing of wires on or in printed circuit boards by machines; machines therefor.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Multiplex wire bundles for vehicles

B60R

{Accessories therefor, e.g. light spots}
Definition statement

This place covers:

Accessories for wiring, e.g. special tables or light spots.

Monitoring manufacture of assemblages
Definition statement

This place covers:

Control or planning of manufacturing processes of assemblages, e.g. of processes for mounting components on printed circuit boards

Control of apparatuses therefor

Planning of production facility and apparatus layout

Vision control after placing of components.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Electrical control of finished printed circuit boards

G01R 31/00