1. CPC Sections
  2. CPC Section H
  3. CPC Class H10
  4. CPC Subclass H10W
Printable version [PDF]
Version: 2026.01
Loading Scheme...
CPC
COOPERATIVE PATENT CLASSIFICATION
​
H10W
GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 [2026-01]
NOTES

  • This subclass covers:
    • packages of devices and parts of such packages;
    • interconnections of devices in chips, wafers, substrates or packages;
    • connectors of devices in packages;
    • other constructional details of devices in chips, wafers, substrates or packages, e.g. isolation regions between components of integrated devices;
    • detachable holders for supporting packaged chips in operation;
    • the manufacture or treatment of aspects (a)-(e);
    when aspects (a)-(e) are
    • (1) applicable to devices covered by subclass H10B;
    • (2) applicable to devices covered by subclass H10D, except for semiconductor bodies or electrodes thereof, which are covered by subgroups H10D 62/00 or H10D 64/00; or
    • (3) generically applicable to devices covered by subclasses H10B, H10D, H10F, H10H, H10K or H10N.
  • {In this subclass, the periodic system used is the I to VIII group system indicated in the Periodic Table under Note (3) of section C.}
Constructional details of integrated devices in chips, wafers or substrates [2026-01]
H10W 10/00
Isolation regions in semiconductor bodies between components of integrated devices [2026-01]
H10W 10/01
.
{Manufacture or treatment} [2026-01]
H10W 10/011
. .
{of isolation regions comprising dielectric materials} [2026-01]
H10W 10/012
. . .
{using local oxidation of silicon [LOCOS]} [2026-01]
H10W 10/0121
. . . .
{in regions recessed from the surface, e.g. in trenches or grooves} [2026-01]
H10W 10/0123
. . . . .
{using auxiliary pillars in the regions} [2026-01]
H10W 10/0124
. . . . .
{the regions having non-rectangular shapes, e.g. rounded (H10W 10/0123 takes precedence)} [2026-01]
H10W 10/0125
. . . .
{comprising introducing electrical impurities in local oxidation regions, e.g. to alter LOCOS oxide growth characteristics} [2026-01]
H10W 10/0126
. . . . .
{introducing electrical active impurities in local oxidation regions to create channel stoppers} [2026-01]
H10W 10/0127
. . . . . .
{using both n-type and p-type impurities, e.g. for isolation of complementary doped regions} [2026-01]
H10W 10/0128
. . . .
{comprising multiple local oxidation process steps} [2026-01]
H10W 10/014
. . .
{using trench refilling with dielectric materials, e.g. shallow trench isolations} [2026-01]
H10W 10/0142
. . . .
{the dielectric materials being chemical transformed from non-dielectric materials} [2026-01]
H10W 10/0143
. . . .
{comprising concurrently refilling multiple trenches having different shapes or dimensions} [2026-01]
H10W 10/0145
. . . .
{of trenches having shapes other than rectangular or V-shape (H10W 10/0143 takes precedence)} [2026-01]
H10W 10/0147
. . . . .
{the shapes being altered by a local oxidation of silicon process, e.g. trench corner rounding by LOCOS} [2026-01]
H10W 10/0148
. . . .
{comprising introducing impurities in side walls or bottom walls of trenches, e.g. for forming channel stoppers} [2026-01]
H10W 10/018
. . .
{using selective deposition of crystalline silicon, e.g. using epitaxial growth of silicon} [2026-01]
H10W 10/019
. . .
{using epitaxial passivated integrated circuit [EPIC] processes} [2026-01]
H10W 10/021
. .
{of air gaps} [2026-01]
H10W 10/031
. .
{of isolation regions comprising PN junctions} [2026-01]
H10W 10/041
. .
{of isolation regions comprising polycrystalline semiconductor materials} [2026-01]
H10W 10/051
. .
{of isolation region based on field-effect} [2026-01]
H10W 10/061
. .
{using SOI processes together with lateral isolation, e.g. combinations of SOI and shallow trench isolations} [2026-01]
H10W 10/10
.
Isolation regions comprising dielectric materials [2026-01]
H10W 10/13
. .
formed using local oxidation of silicon [LOCOS], e.g. sealed interface localised oxidation [SILO] or side-wall mask isolation [SWAMI] [2026-01]
H10W 10/17
. .
formed using trench refilling with dielectric materials, e.g. shallow trench isolations [2026-01]
H10W 10/181
. .
{Semiconductor-on-insulator [SOI] isolation regions, e.g. buried oxide regions of SOI wafers} [2026-01]
H10W 10/20
.
Air gaps [2026-01]
H10W 10/30
.
Isolation regions comprising PN junctions [2026-01]
H10W 10/40
.
Isolation regions comprising polycrystalline semiconductor materials [2026-01]
H10W 10/50
.
Isolation regions based on field-effect [2026-01]
H10W 15/00
Highly-doped buried regions of integrated devices [2026-01]
H10W 15/01
.
{Manufacture or treatment} [2026-01]
​
H10W 20/00
Interconnections in chips, wafers or substrates [2026-01]
NOTES

  • This group covers:
    • interconnections in chips;
    • interconnections in or on wafers;
    • interconnections in or on substrates.
  • This group does not cover interconnections in packages, such as in or on package substrates, which are covered by subgroups H10W 70/00 or H10W 72/00.
H10W 20/01
.
{Manufacture or treatment} [2026-01]
H10W 20/021
. .
{of interconnections within wafers or substrates} [2026-01]
​
H10W 20/023
. . .
{the interconnections being through-semiconductor vias} [2026-01]
WARNING

​
H10W 20/0234
. . . .
{comprising etching via holes that stop on pads or on electrodes} [2026-01]
WARNING

H10W 20/0238
. . . .
{comprising etching via holes through pads or through electrodes} [2026-01]
H10W 20/0242
. . . .
{comprising etching via holes from the back sides of the chips, wafers or substrates} [2026-01]
H10W 20/0245
. . . .
{comprising use of blind vias during the manufacture} [2026-01]
H10W 20/0249
. . . .
{wherein the through-semiconductor via protrudes from backsides of the chips, wafers or substrates during the manufacture} [2026-01]
H10W 20/0253
. . . .
{comprising forming the through-semiconductor vias after stacking of the chips, wafers or substrates} [2026-01]
H10W 20/0257
. . . .
{comprising using a sacrificial placeholder, e.g. using a sacrificial plug} [2026-01]
H10W 20/0261
. . . .
{characterised by the filling method or the material of the conductive fill} [2026-01]
H10W 20/0265
. . . .
{characterised by the sidewall insulation} [2026-01]
H10W 20/031
. .
{of conductive parts of the interconnections} [2026-01]
H10W 20/032
. . .
{of conductive barrier, adhesion or liner layers} [2026-01]
H10W 20/033
. . . .
{in openings in dielectrics} [2026-01]
H10W 20/034
. . . . .
{bottomless barrier, adhesion or liner layers} [2026-01]
H10W 20/035
. . . . .
{combinations of barrier, adhesion or liner layers, e.g. multi-layered barrier layers} [2026-01]
H10W 20/036
. . . . .
{the barrier, adhesion or liner layers being within a main fill metal} [2026-01]
​
H10W 20/037
. . . . .
{the barrier, adhesion or liner layers being on top of a main fill metal} [2026-01]
WARNING

​
H10W 20/0372
. . . . . .
{comprising multiple barrier, adhesion or liner layers} [2026-01]
WARNING

H10W 20/0375
. . . .
{comprising multiple stacked thin barrier, adhesion or liner layers not being formed in openings in dielectrics} [2026-01]
H10W 20/038
. . . .
{covering conductive structures (H10W 20/037 takes precedence)} [2026-01]
H10W 20/039
. . . . .
{also covering sidewalls of the conductive structures} [2026-01]
H10W 20/041
. . . .
{the barrier, adhesion or liner layers being discontinuous} [2026-01]
H10W 20/042
. . . .
{the barrier, adhesion or liner layers being seed or nucleation layers} [2026-01]
H10W 20/0425
. . . . .
{comprising multiple stacked seed or nucleation layers} [2026-01]
H10W 20/043
. . . . .
{for electroplating} [2026-01]
H10W 20/044
. . . . .
{for electroless plating} [2026-01]
H10W 20/045
. . . . .
{for deposition from the gaseous phase, e.g. for chemical vapour deposition [CVD]} [2026-01]
H10W 20/046
. . . .
{the barrier, adhesion or liner layers being associated with interconnections of capacitors} [2026-01]
H10W 20/047
. . . .
{by introducing additional elements therein} [2026-01]
H10W 20/048
. . . . .
{by using plasmas or gaseous environments, e.g. by nitriding} [2026-01]
H10W 20/049
. . . . .
{by diffusing alloying elements} [2026-01]
H10W 20/051
. . . . .
{by ion implantation} [2026-01]
H10W 20/052
. . . .
{by treatments not introducing additional elements therein} [2026-01]
H10W 20/0523
. . . . .
{by irradiating with ultraviolet or particle radiation} [2026-01]
H10W 20/0526
. . . . .
{by thermal treatment thereof} [2026-01]
H10W 20/054
. . . .
{by selectively removing parts thereof (H10W 20/034 takes precedence)} [2026-01]
H10W 20/055
. . . .
{by formation methods other than physical vapour deposition [PVD], chemical vapour deposition [CVD] or liquid deposition} [2026-01]
H10W 20/0552
. . . . .
{by diffusing metallic dopants to react with dielectrics} [2026-01]
H10W 20/0554
. . .
{of nanotubes or nanowires} [2026-01]
​
H10W 20/056
. . .
{by filling conductive material into holes, grooves or trenches} [2026-01]
WARNING

H10W 20/057
. . . .
{by selectively depositing, e.g. by using selective CVD or plating} [2026-01]
H10W 20/058
. . . .
{by depositing on sacrificial masks, e.g. using lift-off} [2026-01]
H10W 20/059
. . . .
{by reflowing or applying pressure} [2026-01]
​
H10W 20/0595
. . . .
{by using multiple deposition steps separated by etching steps} [2026-01]
WARNING

H10W 20/062
. . .
{by smoothing of conductive parts, e.g. by planarisation} [2026-01]
​
H10W 20/063
. . .
{by forming conductive members before forming protective insulating material} [2026-01]
WARNING

​
H10W 20/0633
. . . .
{using subtractive patterning of the conductive members} [2026-01]
WARNING

H10W 20/0636
. . . .
{the conductive members being on sidewalls} [2026-01]
H10W 20/064
. . .
{by modifying the conductivity of conductive parts, e.g. by alloying} [2026-01]
H10W 20/065
. . . .
{by making at least a portion of the conductive part non-conductive, e.g. by oxidation} [2026-01]
H10W 20/066
. . . .
{by forming silicides of refractory metals} [2026-01]
H10W 20/067
. . .
{by modifying the pattern of conductive parts} [2026-01]
H10W 20/068
. . . .
{by using a laser, e.g. laser cutting or laser direct writing} [2026-01]
​
H10W 20/069
. . .
{by forming self-aligned vias or self-aligned contact plugs} [2026-01]
WARNING

​
H10W 20/0693
. . . .
{by forming self-aligned vias} [2026-01]
WARNING

H10W 20/0696
. . . .
{by using sacrificial placeholders, e.g. using sacrificial plugs} [2026-01]
H10W 20/0698
. . .
{Local interconnections} [2026-01]
H10W 20/071
. .
{of dielectric parts thereof} [2026-01]
H10W 20/072
. . .
{of dielectric parts comprising air gaps} [2026-01]
H10W 20/074
. . .
{of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers} [2026-01]
H10W 20/075
. . . .
{of multilayered thin functional dielectric layers} [2026-01]
H10W 20/076
. . . .
{in via holes or trenches} [2026-01]
H10W 20/0765
. . . . .
{the thin functional dielectric layers being temporary, e.g. sacrificial layers} [2026-01]
H10W 20/077
. . . .
{on sidewalls or on top surfaces of conductors (H10W 20/076 takes precedence)} [2026-01]
H10W 20/081
. . .
{by forming openings in the dielectric parts} [2026-01]
H10W 20/082
. . . .
{the openings being tapered via holes} [2026-01]
H10W 20/083
. . . .
{the openings being via holes penetrating underlying conductors} [2026-01]
H10W 20/084
. . . .
{for dual-damascene structures} [2026-01]
H10W 20/085
. . . . .
{involving intermediate temporary filling with material} [2026-01]
H10W 20/086
. . . . .
{involving buried masks} [2026-01]
H10W 20/087
. . . . .
{involving multiple stacked pre-patterned masks} [2026-01]
H10W 20/088
. . . . .
{involving partial etching of via holes} [2026-01]
H10W 20/0882
. . . . .
{wherein the dual damascene structure is in a photoresist layer} [2026-01]
H10W 20/0884
. . . . .
{involving forming vias by burying sacrificial pillars in the dielectric parts and removing the pillars} [2026-01]
H10W 20/0886
. . . . .
{involving forming a via in a via-level dielectric prior to deposition of a trench-level dielectric} [2026-01]
H10W 20/0888
. . . . .
{wherein via-level dielectrics are compositionally different than trench-level dielectrics} [2026-01]
H10W 20/089
. . . .
{using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning} [2026-01]
H10W 20/091
. . . .
{by printing or stamping} [2026-01]
H10W 20/092
. . .
{by smoothing the dielectric parts} [2026-01]
H10W 20/093
. . .
{by modifying materials of the dielectric parts} [2026-01]
H10W 20/094
. . . .
{by transforming insulators into conductors} [2026-01]
H10W 20/095
. . . .
{by irradiating with electromagnetic or particle radiation (plasma treatment H10W 20/096)} [2026-01]
H10W 20/096
. . . .
{by contacting with gases, liquids or plasmas} [2026-01]
H10W 20/097
. . . .
{by thermally treating} [2026-01]
H10W 20/098
. . .
{by filling between adjacent conductive parts} [2026-01]
​
H10W 20/20
.
Interconnections within wafers or substrates, e.g. through-silicon vias [TSV] [2026-01]
WARNING

​
H10W 20/211
. .
{Through-semiconductor vias, e.g. TSVs} [2026-01]
WARNING

​
H10W 20/212
. . .
{Top-view shapes or dispositions, e.g. top-view layouts of the vias} [2026-01]
WARNING

H10W 20/2125
. . . .
{Top-view shapes} [2026-01]
H10W 20/2128
. . . . .
{Coaxial through-semiconductor vias} [2026-01]
​
H10W 20/213
. . .
{Cross-sectional shapes or dispositions} [2026-01]
WARNING

H10W 20/2134
. . . .
{TSVs extending from the semiconductor wafer into back-end-of-line layers} [2026-01]
H10W 20/215
. . .
{characterised by thin functional layers between the through-semiconductor vias and sidewalls of the via holes, e.g. barrier layers or adhesion layers} [2026-01]
​
H10W 20/216
. . .
{characterised by dielectric material at least partially filling the via holes, e.g. covering the through-semiconductor vias in the via holes} [2026-01]
WARNING

H10W 20/217
. . .
{comprising ring-shaped isolation structures outside of the via holes} [2026-01]
H10W 20/218
. . .
{in silicon-on-insulator [SOI] wafers} [2026-01]
​
H10W 20/222
. .
{Vias through non-semiconductor substrates, e.g. through-glass vias} [2026-01]
WARNING

​
H10W 20/233
. .
{parallel to the active surface, e.g. horizontal traces in trenches in the surface of the wafer} [2026-01]
WARNING

​
H10W 20/40
.
Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes [2026-01]
WARNING

​
H10W 20/41
. .
characterised by their conductive parts [2026-01]
WARNING

​
H10W 20/42
. . .
Vias, e.g. via plugs [2026-01]
WARNING

​
H10W 20/421
. . . .
{Skip vias, i.e. vias that do not connect all metallization layers that they pass through} [2026-01]
WARNING

​
H10W 20/422
. . . .
{Vias connecting to electrodes, e.g. contact plugs} [2026-01]
WARNING

H10W 20/423
. . .
{Shielding layers} [2026-01]
​
H10W 20/425
. . .
{Barrier, adhesion or liner layers} [2026-01]
WARNING

H10W 20/427
. . .
{Power or ground buses} [2026-01]
H10W 20/43
. . .
Layouts of interconnections [2026-01]
H10W 20/432
. . . .
{comprising crossing interconnections} [2026-01]
H10W 20/435
. . .
{Cross-sectional shapes or dispositions of interconnections} [2026-01]
H10W 20/438
. . .
{Interconnections with multiple fill metals, e.g. having different metals in wide and narrow interconnections, or having different metals in vias and in trenches} [2026-01]
H10W 20/44
. . .
Conductive materials thereof [2026-01]
​
H10W 20/4403
. . . .
{based on metals, e.g. alloys, metal silicides (H10W 20/4484 takes precedence)} [2026-01]
WARNING

H10W 20/4405
. . . . .
{the principal metal being aluminium} [2026-01]
H10W 20/4407
. . . . . .
{Aluminium alloys} [2026-01]
H10W 20/4421
. . . . .
{the principal metal being copper} [2026-01]
H10W 20/4424
. . . . . .
{Copper alloys} [2026-01]
H10W 20/4432
. . . . .
{the principal metal being a noble metal, e.g. gold} [2026-01]
H10W 20/4435
. . . . . .
{Noble-metal alloys} [2026-01]
​
H10W 20/4437
. . . . .
{the principal metal being a transition metal} [2026-01]
WARNING

H10W 20/4441
. . . . . .
{the principal metal being a refractory metal} [2026-01]
H10W 20/4446
. . . . . . .
{Refractory-metal alloys} [2026-01]
H10W 20/4451
. . . .
{Semiconductor materials, e.g. polysilicon} [2026-01]
H10W 20/4462
. . . .
{Carbon or carbon-containing materials, e.g. graphene} [2026-01]
H10W 20/4473
. . . .
{Conductive organic materials, e.g. conductive adhesives or conductive inks} [2026-01]
H10W 20/4484
. . . .
{Superconducting materials} [2026-01]
​
H10W 20/45
. .
characterised by their insulating parts [2026-01]
WARNING

​
H10W 20/455
. . .
{Thin functional dielectric layers} [2026-01]
WARNING

H10W 20/46
. . .
comprising air gaps [2026-01]
H10W 20/47
. . .
comprising two or more dielectric layers having different properties, e.g. different dielectric constants [2026-01]
H10W 20/48
. . .
Insulating materials thereof [2026-01]
​
H10W 20/481
. .
{on the rear surfaces of the wafers or substrates} [2026-01]
WARNING

​
H10W 20/482
. .
{for individual devices provided for in groups H10D 8/00 - H10D 48/00, e.g. for power transistors} [2026-01]
WARNING

H10W 20/483
. . .
{Interconnections over air gaps, e.g. air bridges} [2026-01]
H10W 20/484
. . .
{Interconnections having extended contours, e.g. pads having mesh shape or interconnections comprising connected parallel stripes} [2026-01]
H10W 20/49
. .
Adaptable interconnections, e.g. fuses or antifuses [2026-01]
H10W 20/491
. . .
{Antifuses, i.e. interconnections changeable from non-conductive to conductive} [2026-01]
H10W 20/492
. . . .
{changeable by the use of an external beam, e.g. laser beam or ion beam} [2026-01]
H10W 20/493
. . .
{Fuses, i.e. interconnections changeable from conductive to non-conductive} [2026-01]
H10W 20/494
. . . .
{changeable by the use of an external beam, e.g. laser beam or ion beam} [2026-01]
H10W 20/495
. .
{Capacitive arrangements or effects of, or between wiring layers} [2026-01]
H10W 20/496
. . .
{Capacitor integral with wiring layers} [2026-01]
H10W 20/497
. .
{Inductive arrangements or effects of, or between, wiring layers} [2026-01]
H10W 20/498
. .
{Resistive arrangements or effects of, or between, wiring layers} [2026-01]
H10W 29/00
Generic parts of integrated devices, not otherwise provided for [2026-01]
H10W 29/01
.
{Manufacture or treatment} [2026-01]
Constructional details related to chips, wafers, substrates or packages [2026-01]
​
H10W 40/00
Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D 89/60) [2026-01]
WARNING

  • Group H10W 40/00 is incomplete pending reclassification of documents from group H10W 99/00. Group H10W 40/00 is also impacted by reclassification into groups H10W 40/20 and H10W 40/50.
    All groups listed in this Warning should be considered in order to perform a complete search.
​
H10W 40/01
.
{Manufacture or treatment} [2026-01]
WARNING

​
H10W 40/03
. .
{of arrangements for cooling} [2026-01]
WARNING

​
H10W 40/033
. . .
{using mechanical treatments, e.g. deforming, punching or cutting} [2026-01]
WARNING

H10W 40/037
. . .
{Assembling together parts thereof} [2026-01]
H10W 40/10
.
Arrangements for heating [2026-01]
​
H10W 40/20
.
Arrangements for cooling [2026-01]
WARNING

​
H10W 40/22
. .
characterised by their shape, e.g. having conical or cylindrical projections [2026-01]
WARNING

​
H10W 40/226
. . .
{characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W 70/461)} [2026-01]
WARNING

H10W 40/228
. . . .
{the projecting parts being wire-shaped or pin-shaped} [2026-01]
​
H10W 40/231
. .
{characterised by their places of attachment or cooling paths} [2026-01]
WARNING

H10W 40/233
. . .
{attached to chips} [2026-01]
H10W 40/235
. . .
{attached to package parts} [2026-01]
H10W 40/237
. . .
{attached to additional arrangements for cooling} [2026-01]
H10W 40/242
. . .
{comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders} [2026-01]
H10W 40/25
. .
characterised by their materials [2026-01]
H10W 40/251
. . .
{Organics} [2026-01]
H10W 40/253
. . .
{Semiconductors} [2026-01]
H10W 40/254
. . .
{Diamond} [2026-01]
H10W 40/255
. . .
{having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates} [2026-01]
H10W 40/257
. . .
{having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W 40/254, H10W 40/251 take precedence)} [2026-01]
H10W 40/258
. . .
{Metallic materials (H10W 40/254, H10W 40/257, H10W 40/255, H10W 40/251, H10W 40/253 take precedence)} [2026-01]
H10W 40/259
. . .
{Ceramics or glasses (H10W 40/254, H10W 40/257, H10W 40/255, H10W 40/251, H10W 40/253 take precedence)} [2026-01]
H10W 40/28
. .
comprising Peltier coolers [2026-01]
H10W 40/30
.
wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid [2026-01]
H10W 40/305
. .
{the fluid being a liquefied gas, e.g. liquid nitrogen} [2026-01]
H10W 40/40
.
involving heat exchange by flowing fluids [2026-01]
H10W 40/43
. .
by flowing gases, e.g. forced air cooling [2026-01]
H10W 40/47
. .
by flowing liquids, e.g. forced water cooling [2026-01]
H10W 40/475
. . .
{using jet impingement (H10W 40/776 takes precedence)} [2026-01]
​
H10W 40/50
.
Arrangements for sensing temperature [2026-01]
WARNING

H10W 40/60
.
Securing means for detachable heating or cooling arrangements, e.g. clamps [2026-01]
H10W 40/611
. .
{Bolts or screws} [2026-01]
H10W 40/613
. . .
{for stacked arrangements of a plurality of semiconductor devices} [2026-01]
H10W 40/625
. .
{Clamping parts not primarily conducting heat} [2026-01]
H10W 40/641
. .
{Snap-on arrangements, e.g. clips} [2026-01]
H10W 40/70
.
Fillings or auxiliary members in containers or in encapsulations for thermal protection or control [2026-01]
H10W 40/73
. .
for cooling by change of state [2026-01]
H10W 40/735
. . .
{by melting or evaporation of solids} [2026-01]
H10W 40/77
. .
Auxiliary members characterised by their shape [2026-01]
H10W 40/772
. . .
{Bellows} [2026-01]
H10W 40/774
. . .
{Pistons, e.g. spring-loaded members} [2026-01]
H10W 40/776
. . .
{Arrangements for jet impingement, e.g. for spraying} [2026-01]
H10W 40/778
. . .
{in encapsulations} [2026-01]
​
H10W 40/80
.
Circuit arrangements for thermal protection or control of packages [2026-01]
WARNING

​
H10W 42/00
Arrangements for protection of devices (arrangements for thermal protection H10W 40/00) [2026-01]
WARNING

​
H10W 42/101
.
{protecting against moisture, e.g. getters (fillers in containers for absorbing or reacting with moisture or other undesired substances H10W 76/48)} [2026-01]
WARNING

H10W 42/121
.
{protecting against mechanical damage (H10W 76/00, H10W 74/00 take precedence)} [2026-01]
​
H10W 42/20
.
protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons [2026-01]
WARNING

H10W 42/25
. .
against alpha rays, e.g. for outer space applications [2026-01]
​
H10W 42/261
. .
{characterised by their shapes or dispositions} [2026-01]
WARNING

H10W 42/263
. . .
{Shielding bumps} [2026-01]
H10W 42/265
. . .
{Shielding wires, e.g. constant potential wires} [2026-01]
H10W 42/267
. . .
{Patterned shielding planes} [2026-01]
H10W 42/271
. . .
{the arrangements being between stacked chips} [2026-01]
H10W 42/273
. . .
{the arrangements being between laterally adjacent chips, e.g. walls between chips} [2026-01]
H10W 42/276
. . .
{the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation} [2026-01]
​
H10W 42/281
. .
{characterised by their materials} [2026-01]
WARNING

H10W 42/284
. . .
{shielding resins} [2026-01]
H10W 42/287
. . .
{materials for magnetic shielding, e.g. ferromagnetic materials} [2026-01]
​
H10W 42/40
.
protecting against tampering, e.g. unauthorised inspection or reverse engineering [2026-01]
WARNING

H10W 42/405
. .
{using active circuits} [2026-01]
H10W 42/60
.
protecting against electrostatic charges or discharges, e.g. Faraday shields (integrated devices comprising arrangements for electrical protection H10D 89/60) [2026-01]
H10W 42/80
.
protecting against overcurrent or overload, e.g. fuses or shunts (integrated devices comprising arrangements for electrical protection H10D 89/60) [2026-01]
H10W 44/00
Electrical arrangements for controlling or matching impedance [2026-01]
H10W 44/20
.
at high-frequency [HF] or radio frequency [RF] [2026-01]
H10W 44/203
. .
{Electrical connections} [2026-01]
H10W 44/206
. . .
{Wires} [2026-01]
H10W 44/209
. . .
{Vertical interconnections, e.g. vias} [2026-01]
H10W 44/212
. . . .
{Coaxial feed-throughs in substrates} [2026-01]
H10W 44/216
. . .
{Waveguides, e.g. strip lines} [2026-01]
H10W 44/219
. . . .
{characterised by transitions between different types of waveguides} [2026-01]
H10W 44/223
. . .
{Differential pair signal lines} [2026-01]
H10W 44/226
. .
{for HF amplifiers} [2026-01]
H10W 44/231
. . .
{Arrangements for applying bias} [2026-01]
H10W 44/234
. . .
{Arrangements for impedance matching} [2026-01]
H10W 44/241
. .
{for passive devices or passive elements} [2026-01]
H10W 44/243
. . .
{for decoupling, e.g. bypass capacitors} [2026-01]
H10W 44/248
. . .
{for antennas} [2026-01]
H10W 44/251
. .
{for monolithic microwave integrated circuits [MMIC]} [2026-01]
H10W 44/255
. .
{for operation at multiple different frequencies} [2026-01]
H10W 44/259
. .
{Optical signal interface} [2026-01]
H10W 44/401
.
{Resistive arrangements (H10W 44/20, H10W 42/80 take precedence)} [2026-01]
H10W 44/501
.
{Inductive arrangements (H10W 44/20 takes precedence)} [2026-01]
H10W 44/601
.
{Capacitive arrangements (H10W 44/20 takes precedence)} [2026-01]
​
H10W 46/00
Marks applied to devices, e.g. for alignment or identification [2026-01]
NOTE

  • This group covers marks in or on chips, wafers, substrates or packages.
H10W 46/101
.
{characterised by the type of information, e.g. logos or symbols} [2026-01]
H10W 46/103
. .
{alphanumeric information, e.g. words, letters or serial numbers} [2026-01]
H10W 46/106
. .
{digital information, e.g. bar codes} [2026-01]
H10W 46/201
.
{located on the periphery of wafers, e.g. orientation notches or lot numbers} [2026-01]
H10W 46/301
.
{for alignment} [2026-01]
H10W 46/401
.
{for identification or tracking} [2026-01]
H10W 46/403
. .
{for non-wireless electrical read out} [2026-01]
H10W 46/407
. .
{for wireless electrical read out} [2026-01]
H10W 46/501
.
{for use before dicing} [2026-01]
H10W 46/503
. .
{Located in scribe lines} [2026-01]
H10W 46/507
. .
{Located in dummy chips or in reference chips} [2026-01]
H10W 46/601
.
{for use after dicing} [2026-01]
H10W 46/603
. .
{Formed on wafers or substrates before dicing and remaining on chips after dicing} [2026-01]
H10W 46/607
. .
{Located on parts of packages, e.g. on encapsulations or on package substrates} [2026-01]
Aspects of packages [2026-01]
​
H10W 70/00
Package substrates; Interposers; Redistribution layers [RDL] [2026-01]
WARNING

H10W 70/01
.
Manufacture or treatment [2026-01]
​
H10W 70/02
. .
of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W 70/04) [2026-01]
WARNING

H10W 70/023
. . .
{Connecting or disconnecting interconnections thereto or therefrom, e.g. connecting bond wires or bumps} [2026-01]
​
H10W 70/027
. . .
{Mechanical treatments, e.g. deforming, punching or cutting} [2026-01]
WARNING

H10W 70/04
. .
of leadframes [2026-01]
H10W 70/041
. . .
{Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps} [2026-01]
H10W 70/042
. . .
{Etching} [2026-01]
H10W 70/045
. . .
{Cleaning} [2026-01]
H10W 70/047
. . .
{Attaching leadframes to insulating supports, e.g. for tape automated bonding [TAB]} [2026-01]
H10W 70/048
. . .
{Mechanical treatments, e.g. punching, cutting, deforming or cold welding} [2026-01]
​
H10W 70/05
. .
of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W 70/04) [2026-01]
WARNING

​
H10W 70/06
. . .
using temporary auxiliary supports [2026-01]
WARNING

​
H10W 70/08
. . .
by depositing layers on the chip or wafer, e.g. "chip-first" RDLs [2026-01]
WARNING

  • Groups H10W 70/08 and H10W 70/09 are incomplete pending reclassification of documents from groups H10W 70/05 and H10W 99/00.
    All groups listed in this Warning should be considered in order to perform a complete search.
H10W 70/09
. . . .
extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs [2026-01]
​
H10W 70/092
. . .
{Adapting interconnections, e.g. making engineering charges, repairing} [2026-01]
WARNING

H10W 70/093
. . .
{Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps} [2026-01]
H10W 70/095
. . .
{of vias therein} [2026-01]
H10W 70/096
. . .
{Cutting or separating} [2026-01]
H10W 70/097
. . .
{Cleaning} [2026-01]
H10W 70/098
. . .
{Applying pastes or inks, e.g. screen printing (H10W 70/095 takes precedence)} [2026-01]
H10W 70/099
.
{Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} [2026-01]
H10W 70/20
.
Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W 70/40) [2026-01]
H10W 70/22
. .
{having an heterogeneous or anisotropic structure} [2026-01]
H10W 70/24
. .
{characterised by materials} [2026-01]
H10W 70/26
. . .
{Semiconductor materials} [2026-01]
H10W 70/28
. . .
{Carbon-containing materials} [2026-01]
H10W 70/40
.
Leadframes [2026-01]
H10W 70/411
. .
{Chip-supporting parts, e.g. die pads} [2026-01]
H10W 70/413
. . .
{Insulating or insulated substrates serving as die pads (H10W 70/468 takes precedence)} [2026-01]
H10W 70/415
. . .
{Leadframe inner leads serving as die pads} [2026-01]
H10W 70/417
. . .
{Bonding materials between chips and die pads} [2026-01]
H10W 70/421
. .
{Shapes or dispositions} [2026-01]
H10W 70/424
. . .
{Cross-sectional shapes (H10W 70/481 takes precedence)} [2026-01]
H10W 70/427
. . . .
{Bent parts} [2026-01]
H10W 70/429
. . . . .
{being the outer leads} [2026-01]
H10W 70/433
. . .
{of deformation-absorbing parts, e.g. leads having meandering shapes (H10W 70/481 takes precedence)} [2026-01]
H10W 70/435
. . .
{of insulating layers on leadframes, e.g. bridging members} [2026-01]
H10W 70/438
. . .
{of side rails, e.g. having holes} [2026-01]
H10W 70/442
. . .
{of multiple leadframes in a single chip} [2026-01]
H10W 70/451
. .
{Multilayered leadframes} [2026-01]
H10W 70/453
. .
{comprising flexible metallic tapes} [2026-01]
H10W 70/456
. .
{Materials} [2026-01]
H10W 70/457
. . .
{of metallic layers on leadframes} [2026-01]
H10W 70/458
. . .
{of insulating layers on leadframes} [2026-01]
H10W 70/461
. .
{specially adapted for cooling} [2026-01]
H10W 70/464
. .
{Additional interconnections in combination with leadframes} [2026-01]
H10W 70/465
. . .
{Bumps or wires} [2026-01]
H10W 70/466
. . .
{Tape carriers or flat leads} [2026-01]
H10W 70/467
. . .
{Multilayered additional interconnections} [2026-01]
H10W 70/468
. . .
{Circuit boards} [2026-01]
H10W 70/474
. .
{Batteries in combination with leadframes} [2026-01]
H10W 70/475
. .
{Capacitors in combination with leadframes} [2026-01]
H10W 70/476
. .
{Oscillators in combination with leadframes} [2026-01]
H10W 70/479
. .
{on or in insulating or insulated package substrates, interposers, or redistribution layers} [2026-01]
H10W 70/481
. .
{for devices being provided for in groups H10D 8/00 - H10D 48/00} [2026-01]
​
H10W 70/60
.
Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W 70/40) [2026-01]
WARNING

​
H10W 70/611
. .
{for connecting multiple chips together} [2026-01]
WARNING

H10W 70/614
. . .
{the multiple chips being integrally enclosed} [2026-01]
H10W 70/616
. . .
{package substrates, interposers or redistribution layers combined with bridge chips} [2026-01]
​
H10W 70/618
. . . .
{the bridge chips being embedded in the package substrates, interposers or redistribution layers} [2026-01]
WARNING

​
H10W 70/62
. .
characterised by their interconnections [2026-01]
WARNING

H10W 70/63
. . .
Vias, e.g. via plugs [2026-01]
H10W 70/635
. . . .
{Through-vias} [2026-01]
H10W 70/641
. . .
{Adaptable interconnections, e.g. fuses or antifuses} [2026-01]
H10W 70/644
. . .
{Elastic or compliant interconnections, e.g. springs, cantilevers or elastic pads} [2026-01]
​
H10W 70/65
. . .
Shapes or dispositions of interconnections [2026-01]
WARNING

​
H10W 70/652
. . . .
Cross-sectional shapes [2026-01]
WARNING

H10W 70/6523
. . . . .
{for connecting to pads at different heights at the same side of the package substrate, interposer or RDL} [2026-01]
H10W 70/6525
. . . . .
{for securing the interconnections to the substrate, e.g. to prevent peeling} [2026-01]
H10W 70/6528
. . . . .
{of the portions that connect to chips, wafers or package parts} [2026-01]
​
H10W 70/654
. . . .
Top-view layouts [2026-01]
WARNING

H10W 70/655
. . . . .
Fan-out layouts [2026-01]
H10W 70/656
. . . . .
Fan-in layouts [2026-01]
​
H10W 70/6565
. . . .
{recessed into the surface of the package substrates, interposers, or redistribution layers} [2026-01]
WARNING

​
H10W 70/657
. . . .
{on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers} [2026-01]
WARNING

H10W 70/658
. . . .
{for devices provided for in groups H10D 8/00 - H10D 48/00} [2026-01]
​
H10W 70/66
. . .
Conductive materials thereof [2026-01]
WARNING

​
H10W 70/662
. . . .
{Semiconductor materials} [2026-01]
WARNING

H10W 70/664
. . . .
{Carbon-based materials, e.g. fullerenes} [2026-01]
H10W 70/666
. . . .
{Organic materials or pastes} [2026-01]
H10W 70/668
. . . .
{Superconducting materials} [2026-01]
​
H10W 70/67
. .
characterised by their insulating layers or insulating parts [2026-01]
WARNING

H10W 70/68
. . .
Shapes or dispositions thereof [2026-01]
H10W 70/681
. . . .
{comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage} [2026-01]
H10W 70/682
. . . .
{comprising holes having chips therein} [2026-01]
​
H10W 70/685
. . . .
comprising multiple insulating layers [2026-01]
WARNING

​
H10W 70/686
. . . . .
{the multiple insulating layers having different compositions, e.g. polymer layer on glass substrate} [2026-01]
WARNING

​
H10W 70/687
. . . . .
{characterized by the outer layers being for protection, e.g. solder masks, or for protection against chemical or mechanical damage} [2026-01]
WARNING

H10W 70/6875
. . . .
{being on a metallic substrate, e.g. insulated metal substrates [IMS]} [2026-01]
​
H10W 70/688
. . .
{Flexible insulating substrates} [2026-01]
WARNING

​
H10W 70/69
. . .
Insulating materials thereof [2026-01]
WARNING

​
H10W 70/692
. . . .
Ceramics or glasses [2026-01]
WARNING

H10W 70/695
. . . .
Organic materials [2026-01]
H10W 70/698
. . . .
Semiconductor materials that are electrically insulating, e.g. undoped silicon [2026-01]
​
H10W 70/699
. .
{for flat cards, e.g. credit cards} [2026-01]
WARNING

​​
H10W 72/00
Interconnections or connectors in packages [2026-01]
NOTE

  • In this group, bond pads in general, i.e. where the nature of a related connector is unspecified or generic to multiple types of connectors, are classified in group H10W 72/90. Bond pads specially adapted for a specific type of connector are classified in the group covering the connector type. For example, bond pads specially adapted for wire connectors are classified in group H10W 72/59.
WARNING

​
H10W 72/01
.
{Manufacture or treatment} [2026-01]
WARNING

​
H10W 72/011
. .
{Apparatus therefor} [2026-01]
WARNING

H10W 72/0112
. . .
{Apparatus for manufacturing bump connectors} [2026-01]
H10W 72/0113
. . .
{Apparatus for manufacturing die-attach connectors} [2026-01]
H10W 72/0115
. . .
{Apparatus for manufacturing bond wires} [2026-01]
H10W 72/0116
. . .
{Apparatus for manufacturing strap connectors} [2026-01]
​
H10W 72/012
. .
{of bump connectors, dummy bumps or thermal bumps} [2026-01]
WARNING

​
H10W 72/01204
. . .
{using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates} [2026-01]
WARNING

H10W 72/01208
. . .
{using permanent auxiliary members, e.g. using solder flow barriers, spacers or alignment marks} [2026-01]
H10W 72/01212
. . .
{at a different location than on the final device, e.g. forming as prepeg} [2026-01]
H10W 72/01215
. . .
{forming coatings} [2026-01]
​
H10W 72/01221
. . .
{using local deposition} [2026-01]
WARNING

H10W 72/01223
. . . .
{in liquid form, e.g. by dispensing droplets or by screen printing} [2026-01]
H10W 72/01225
. . . .
{in solid form, e.g. by using a powder or by stud bumping} [2026-01]
​
H10W 72/01231
. . .
{using blanket deposition} [2026-01]
WARNING

H10W 72/01233
. . . .
{in liquid form, e.g. spin coating, spray coating or immersion coating} [2026-01]
H10W 72/01235
. . . . .
{by plating, e.g. electroless plating or electroplating} [2026-01]
H10W 72/01236
. . . .
{in solid form, e.g. by using a powder or by laminating a foil} [2026-01]
H10W 72/01238
. . . .
{in gaseous form, e.g. by CVD or PVD} [2026-01]
​
H10W 72/01251
. . .
{Changing the shapes of bumps} [2026-01]
WARNING

H10W 72/01253
. . . .
{by etching} [2026-01]
H10W 72/01255
. . . .
{by using masks} [2026-01]
H10W 72/01257
. . . .
{by reflowing} [2026-01]
​
H10W 72/01261
. . .
{Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W 72/01251)} [2026-01]
WARNING

H10W 72/01265
. . .
{Thermally treating (reflowing H10W 72/01257)} [2026-01]
H10W 72/01271
. . .
{Cleaning, e.g. oxide removal or de-smearing} [2026-01]
​
H10W 72/013
. .
{of die-attach connectors} [2026-01]
WARNING

​
H10W 72/01304
. . .
{using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates} [2026-01]
WARNING

H10W 72/01308
. . .
{using permanent auxiliary members, e.g. using alignment marks} [2026-01]
H10W 72/01315
. . .
{Forming coatings} [2026-01]
​
H10W 72/01321
. . .
{using local deposition} [2026-01]
WARNING

H10W 72/01323
. . . .
{in liquid form, e.g. by dispensing droplets or by screen printing} [2026-01]
H10W 72/01325
. . . .
{in solid form} [2026-01]
​
H10W 72/01331
. . .
{using blanket deposition} [2026-01]
WARNING

H10W 72/01333
. . . .
{in liquid form, e.g. spin coating, spray coating or immersion coating} [2026-01]
H10W 72/01335
. . . . .
{by plating, e.g. electroless plating or electroplating} [2026-01]
H10W 72/01336
. . . .
{in solid form, e.g. by using a powder or by laminating a foil} [2026-01]
H10W 72/01338
. . . .
{in gaseous form, e.g. by CVD or PVD} [2026-01]
​
H10W 72/01351
. . .
{Changing the shapes of die-attach connectors} [2026-01]
WARNING

H10W 72/01353
. . . .
{by etching} [2026-01]
H10W 72/01355
. . . .
{by use of masks} [2026-01]
H10W 72/01357
. . . .
{by reflowing or heating} [2026-01]
H10W 72/01359
. . . .
{by planarisation, e.g. chemical-mechanical polishing [CMP]} [2026-01]
​
H10W 72/01361
. . .
{Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W 72/01351)} [2026-01]
WARNING

H10W 72/01365
. . .
{Thermally treating (reflowing H10W 72/01357)} [2026-01]
H10W 72/01371
. . .
{Cleaning, e.g. oxide removal or de-smearing} [2026-01]
​
H10W 72/014
. .
{of anisotropic conductive adhesives} [2026-01]
WARNING

​
H10W 72/015
. .
{of bond wires} [2026-01]
WARNING

​
H10W 72/01504
. . .
{using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates} [2026-01]
WARNING

H10W 72/01515
. . .
{Forming coatings} [2026-01]
H10W 72/01551
. . .
{Changing the shapes of bond wires} [2026-01]
H10W 72/01553
. . . .
{by etching} [2026-01]
H10W 72/01561
. . .
{Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W 72/01551)} [2026-01]
H10W 72/01565
. . .
{Thermally treating} [2026-01]
H10W 72/01571
. . .
{Cleaning, e.g. oxide removal or de-smearing} [2026-01]
​
H10W 72/016
. .
{of strap connectors} [2026-01]
WARNING

​
H10W 72/01604
. . .
{using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates} [2026-01]
WARNING

H10W 72/01615
. . .
{Forming coatings} [2026-01]
H10W 72/01651
. . .
{Changing the shapes of strap connectors} [2026-01]
H10W 72/01653
. . . .
{by etching} [2026-01]
H10W 72/01661
. . .
{Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W 72/01651)} [2026-01]
H10W 72/01665
. . .
{Thermally treating} [2026-01]
H10W 72/01671
. . .
{Cleaning, e.g. oxide removal or de-smearing} [2026-01]
​
H10W 72/019
. .
{of bond pads} [2026-01]
WARNING

​
H10W 72/01904
. . .
{using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates} [2026-01]
WARNING

H10W 72/01908
. . .
{using permanent auxiliary members, e.g. using alignment marks} [2026-01]
​
H10W 72/01921
. . .
{using local deposition} [2026-01]
WARNING

H10W 72/01923
. . . .
{in liquid form, e.g. by dispensing droplets or by screen printing} [2026-01]
H10W 72/01925
. . . .
{in solid form} [2026-01]
​
H10W 72/01931
. . .
{using blanket deposition} [2026-01]
WARNING

H10W 72/01933
. . . .
{in liquid form, e.g. spin coating, spray coating or immersion coating} [2026-01]
H10W 72/01935
. . . . .
{by plating, e.g. electroless plating or electroplating} [2026-01]
H10W 72/01936
. . . .
{in solid form, e.g. by using a powder or by laminating a foil} [2026-01]
H10W 72/01938
. . . .
{in gaseous form, e.g. by CVD or PVD} [2026-01]
​
H10W 72/01951
. . .
{Changing the shapes of bond pads} [2026-01]
WARNING

H10W 72/01953
. . . .
{by etching} [2026-01]
H10W 72/01955
. . . .
{by using masks} [2026-01]
​
H10W 72/01961
. . .
{Chemical or physical modification, e.g. by sintering or anodisation (patterning H10W 72/01951)} [2026-01]
WARNING

H10W 72/01971
. . .
{Cleaning, e.g. oxide removal} [2026-01]
​
H10W 72/0198
. .
{batch processes} [2026-01]
WARNING

H10W 72/071
.
{Connecting or disconnecting} [2026-01]
H10W 72/0711
. .
{Apparatus therefor} [2026-01]
H10W 72/07113
. . .
{Means for calibration} [2026-01]
H10W 72/07118
. . .
{Means for cleaning, e.g. brushes} [2026-01]
H10W 72/07125
. . .
{Means for controlling the bonding environment, e.g. valves or vacuum pumps} [2026-01]
H10W 72/07131
. . .
{Means for applying material, e.g. for deposition or forming coatings} [2026-01]
H10W 72/07139
. . .
{Means for protection against electrical discharge} [2026-01]
H10W 72/07141
. . .
{Means for applying energy, e.g. ovens or lasers} [2026-01]
H10W 72/07152
. . .
{Means for cooling} [2026-01]
H10W 72/07163
. . .
{Means for mechanical processing, e.g. for planarising, pressing, stamping or drilling} [2026-01]
H10W 72/07168
. . .
{Means for storing or moving the material for the connector} [2026-01]
H10W 72/07173
. . .
{Means for moving chips, wafers or other parts, e.g. conveyor belts} [2026-01]
H10W 72/07178
. . .
{Means for aligning} [2026-01]
H10W 72/07183
. . .
{Means for monitoring} [2026-01]
H10W 72/07188
. . .
{Apparatus chuck} [2026-01]
H10W 72/072
. .
{of bump connectors} [2026-01]
H10W 72/07202
. . .
{using auxiliary members} [2026-01]
​
H10W 72/07204
. . . .
{using temporary auxiliary members, e.g. sacrificial coatings} [2026-01]
WARNING

​
H10W 72/07207
. . . . .
{Temporary substrates, e.g. removable substrates} [2026-01]
WARNING

H10W 72/07211
. . .
{Treating the bond pad before connecting, e.g. by applying flux or cleaning} [2026-01]
H10W 72/07221
. . .
{Aligning} [2026-01]
H10W 72/07223
. . . .
{Active alignment, e.g. using optical alignment using marks or sensors} [2026-01]
H10W 72/07227
. . . .
{involving guiding structures, e.g. spacers or supporting members} [2026-01]
H10W 72/07231
. . .
{Techniques} [2026-01]
​
H10W 72/07232
. . . .
{Compression bonding, e.g. thermocompression bonding} [2026-01]
WARNING

​
H10W 72/07233
. . . . .
{Ultrasonic bonding, e.g. thermosonic bonding} [2026-01]
WARNING

H10W 72/07234
. . . .
{Using a reflow oven} [2026-01]
H10W 72/07235
. . . .
{Applying EM radiation, e.g. induction heating or using a laser} [2026-01]
​
H10W 72/07236
. . . .
{Soldering or alloying} [2026-01]
WARNING

H10W 72/07237
. . . .
{using a polymer adhesive, e.g. an adhesive based on silicone or epoxy} [2026-01]
H10W 72/07241
. . .
{Controlling the environment, e.g. atmosphere composition or temperature} [2026-01]
H10W 72/07251
. . .
{characterised by changes in properties of the bump connectors during connecting} [2026-01]
H10W 72/07252
. . . .
{changes in structures or sizes} [2026-01]
H10W 72/07253
. . . .
{changes in shapes} [2026-01]
H10W 72/07254
. . . .
{changes in dispositions} [2026-01]
H10W 72/07255
. . . .
{changes in materials} [2026-01]
H10W 72/07261
. . .
{with the bump connectors facing upwards, i.e. not in flip-chip orientation} [2026-01]
H10W 72/073
. .
{of die-attach connectors} [2026-01]
H10W 72/07302
. . .
{using an auxiliary member} [2026-01]
H10W 72/07304
. . . .
{the auxiliary member being temporary, e.g. a sacrificial coating} [2026-01]
H10W 72/07307
. . . . .
{the auxiliary member being a temporary substrate, e.g. a removable substrate} [2026-01]
H10W 72/07311
. . .
{Treating the bonding area before connecting, e.g. by applying flux or cleaning} [2026-01]
H10W 72/07321
. . .
{Aligning} [2026-01]
H10W 72/07323
. . . .
{Active alignment, e.g. using optical alignment using marks or sensors} [2026-01]
H10W 72/07327
. . . .
{involving guiding structures, e.g. spacers or supporting members} [2026-01]
H10W 72/07331
. . .
{Connecting techniques} [2026-01]
​
H10W 72/07332
. . . .
{Compression bonding, e.g. thermocompression bonding} [2026-01]
WARNING

​
H10W 72/07333
. . . . .
{Ultrasonic bonding, e.g. thermosonic bonding} [2026-01]
WARNING

H10W 72/07334
. . . .
{Using a reflow oven} [2026-01]
H10W 72/07335
. . . .
{Applying EM radiation, e.g. induction heating or using a laser} [2026-01]
​
H10W 72/07336
. . . .
{Soldering or alloying} [2026-01]
WARNING

H10W 72/07337
. . . .
{using a polymer adhesive, e.g. an adhesive based on silicone or epoxy} [2026-01]
H10W 72/07338
. . . . .
{hardening the adhesive by curing, e.g. thermosetting} [2026-01]
H10W 72/07339
. . . . .
{hardening the adhesive by cooling, e.g. thermoplastics} [2026-01]
H10W 72/07341
. . .
{Controlling the bonding environment, e.g. atmosphere composition or temperature} [2026-01]
H10W 72/07351
. . .
{characterised by changes in properties of the die-attach connectors during connecting} [2026-01]
H10W 72/07352
. . . .
{changes in structures or sizes} [2026-01]
H10W 72/07353
. . . .
{changes in shapes} [2026-01]
H10W 72/07354
. . . .
{changes in dispositions} [2026-01]
H10W 72/07355
. . . .
{changes in materials} [2026-01]
​
H10W 72/074
. .
{of anisotropic conductive adhesives} [2026-01]
WARNING

H10W 72/075
. .
{of bond wires} [2026-01]
H10W 72/07502
. . .
{using an auxiliary member} [2026-01]
H10W 72/07504
. . . .
{the auxiliary member being temporary, e.g. a sacrificial coating} [2026-01]
H10W 72/07507
. . . . .
{the auxiliary member being a temporary substrate, e.g. a removable substrate} [2026-01]
H10W 72/07511
. . .
{Treating the bonding area before connecting, e.g. by applying flux or cleaning} [2026-01]
H10W 72/07521
. . .
{Aligning} [2026-01]
H10W 72/07523
. . . .
{Active alignment, e.g. using optical alignment using marks or sensors} [2026-01]
H10W 72/07527
. . . .
{involving guiding structures, e.g. spacers or supporting members} [2026-01]
H10W 72/07531
. . .
{Techniques} [2026-01]
​
H10W 72/07532
. . . .
{Compression bonding, e.g. thermocompression bonding} [2026-01]
WARNING

​
H10W 72/07533
. . . . .
{Ultrasonic bonding, e.g. thermosonic bonding} [2026-01]
WARNING

H10W 72/07535
. . . .
{Applying EM radiation, e.g. induction heating or using a laser} [2026-01]
​
H10W 72/07536
. . . .
{Soldering or alloying} [2026-01]
WARNING

H10W 72/07537
. . . .
{using a polymer adhesive, e.g. an adhesive based on silicone or epoxy} [2026-01]
H10W 72/07541
. . .
{Controlling the environment, e.g. atmosphere composition or temperature} [2026-01]
H10W 72/07551
. . . .
{characterised by changes in properties of the bond wires during the connecting} [2026-01]
H10W 72/07552
. . . .
{changes in structures or sizes} [2026-01]
H10W 72/07553
. . . .
{changes in shapes} [2026-01]
H10W 72/07554
. . . .
{changes in dispositions} [2026-01]
H10W 72/07555
. . . .
{changes in materials} [2026-01]
H10W 72/076
. .
{of strap connectors} [2026-01]
H10W 72/07602
. . .
{using an auxiliary member} [2026-01]
H10W 72/07604
. . . .
{the auxiliary member being temporary, e.g. a sacrificial coating} [2026-01]
H10W 72/07607
. . . . .
{the auxiliary member being a temporary substrate, e.g. a removable substrate} [2026-01]
H10W 72/07611
. . .
{Treating the bonding area before connecting, e.g. by applying flux or cleaning} [2026-01]
H10W 72/07621
. . .
{Aligning} [2026-01]
H10W 72/07623
. . . .
{Active alignment, e.g. using optical alignment using marks or sensors} [2026-01]
H10W 72/07627
. . . .
{involving guiding structures, e.g. spacers or supporting members} [2026-01]
H10W 72/07631
. . .
{Techniques} [2026-01]
​
H10W 72/07632
. . . .
{Compression bonding, e.g. thermocompression bonding} [2026-01]
WARNING

​
H10W 72/07633
. . . . .
{Ultrasonic bonding, e.g. thermosonic bonding} [2026-01]
WARNING

H10W 72/07635
. . . .
{Applying EM radiation, e.g. induction heating or using a laser} [2026-01]
​
H10W 72/07636
. . . .
{Soldering or alloying} [2026-01]
WARNING

H10W 72/07637
. . . .
{using a polymer adhesive, e.g. an adhesive based on silicone or epoxy} [2026-01]
H10W 72/07641
. . .
{Controlling the environment, e.g. atmosphere composition or temperature} [2026-01]
H10W 72/07651
. . .
{characterised by changes in properties of the strap connectors during connecting} [2026-01]
H10W 72/07652
. . . .
{changes in structures or sizes} [2026-01]
H10W 72/07653
. . . .
{changes in shapes} [2026-01]
H10W 72/07654
. . . .
{changes in dispositions} [2026-01]
H10W 72/07655
. . . .
{changes in materials} [2026-01]
H10W 72/077
. .
{Connecting of TAB connectors} [2026-01]
​
H10W 72/20
.
Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps [2026-01]
WARNING

​
H10W 72/221
. .
{Structures or relative sizes} [2026-01]
WARNING

H10W 72/222
. . .
{Multilayered bumps, e.g. a coating on top and side surfaces of a bump core} [2026-01]
H10W 72/223
. . . .
{characterised by the structure of the outermost layers, e.g. multilayered coatings} [2026-01]
H10W 72/224
. . .
{Bumps having multiple side-by-side cores} [2026-01]
H10W 72/225
. . .
{Bumps having a filler embedded in a matrix} [2026-01]
H10W 72/227
. . .
{Multiple bumps having different sizes} [2026-01]
H10W 72/228
. . .
{Multiple bumps having different structures} [2026-01]
​
H10W 72/231
. .
{Shapes} [2026-01]
WARNING

H10W 72/232
. . .
{Plan-view shape, i.e. in top view} [2026-01]
H10W 72/234
. . .
{Cross-sectional shape, i.e. in side view} [2026-01]
H10W 72/235
. . .
{of outermost layers of multilayered bumps, e.g. bump coating not being conformal on a bump core} [2026-01]
H10W 72/237
. . .
{Multiple bump connectors having different shapes} [2026-01]
​
H10W 72/241
. .
{Dispositions, e.g. layouts} [2026-01]
WARNING

H10W 72/242
. . .
{relative to the surface, e.g. recessed, protruding} [2026-01]
H10W 72/244
. . .
{relative to underlying supporting features, e.g. bond pads, RDLs or vias} [2026-01]
H10W 72/245
. . .
{of outermost layers of multilayered bumps, e.g. bump coating being only on a part of a bump core} [2026-01]
H10W 72/247
. . .
{Dispositions of multiple bumps} [2026-01]
H10W 72/248
. . . .
{Top-view layouts, e.g. mirror arrays} [2026-01]
​
H10W 72/251
. .
{Materials} [2026-01]
WARNING

H10W 72/252
. . .
{comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu} [2026-01]
H10W 72/2524
. . . .
{Eutectic alloys} [2026-01]
H10W 72/2528
. . . .
{Intermetallic compounds} [2026-01]
H10W 72/253
. . .
{not comprising solid metals or solid metalloids, e.g. polymers or ceramics} [2026-01]
H10W 72/255
. . .
{of outermost layers of multilayered bumps, e.g. material of a coating} [2026-01]
H10W 72/257
. . .
{Multiple bump connectors having different materials} [2026-01]
​
H10W 72/261
. .
{Functions other than electrical connecting} [2026-01]
WARNING

H10W 72/263
. . .
{Providing mechanical bonding or support, e.g. dummy bumps} [2026-01]
H10W 72/265
. . .
{Providing thermal transfer, e.g. thermal bumps} [2026-01]
H10W 72/267
. . .
{Multiple bump connectors having different functions} [2026-01]
​
H10W 72/281
. .
{Auxiliary members} [2026-01]
WARNING

H10W 72/283
. . .
{Reinforcing structures, e.g. bump collars} [2026-01]
H10W 72/285
. . .
{Alignment aids, e.g. alignment marks} [2026-01]
H10W 72/287
. . .
{Flow barriers} [2026-01]
H10W 72/29
. .
Bond pads specially adapted therefor [2026-01]
​
H10W 72/30
.
Die-attach connectors [2026-01]
WARNING

​
H10W 72/321
. .
{Structures or relative sizes of die-attach connectors} [2026-01]
WARNING

H10W 72/322
. . .
{Multilayered die-attach connectors, e.g. a coating on a top surface of a core} [2026-01]
H10W 72/323
. . . .
{characterised by the structures of the outermost layers, e.g. multilayered coatings} [2026-01]
H10W 72/324
. . .
{Die-attach connectors having multiple side-by-side cores} [2026-01]
H10W 72/325
. . .
{Die-attach connectors having a filler embedded in a matrix} [2026-01]
H10W 72/327
. . .
{Multiple die-attach connectors having different sizes} [2026-01]
H10W 72/328
. . .
{Multiple die-attach connectors having different structures} [2026-01]
​
H10W 72/331
. .
{Shapes of die-attach connectors} [2026-01]
WARNING

H10W 72/332
. . .
{Plan-view shape, i.e. in top view} [2026-01]
H10W 72/334
. . .
{Cross-sectional shape, i.e. in side view} [2026-01]
H10W 72/335
. . .
{of outermost layers of multilayered die-attach connectors, e.g. coating not being conformal on a core} [2026-01]
H10W 72/337
. . .
{Multiple die-attach connectors having different shapes} [2026-01]
​
H10W 72/341
. .
{Dispositions of die-attach connectors, e.g. layouts} [2026-01]
WARNING

H10W 72/342
. . .
{relative to the surface, e.g. recessed, protruding} [2026-01]
H10W 72/344
. . .
{relative to underlying supporting features, e.g. bond pads, RDLs or vias} [2026-01]
H10W 72/345
. . .
{of outermost layers of multilayered die-attach connectors, e.g. coating being only on a part of a core} [2026-01]
H10W 72/347
. . .
{Dispositions of multiple die-attach connectors} [2026-01]
H10W 72/348
. . . .
{Top-view layouts, e.g. mirror arrays} [2026-01]
​
H10W 72/351
. .
{Materials of die-attach connectors} [2026-01]
WARNING

H10W 72/352
. . .
{comprising metals or metalloids, e.g. solders} [2026-01]
H10W 72/3524
. . . .
{Eutectic alloys} [2026-01]
H10W 72/3528
. . . .
{Intermetallic compounds} [2026-01]
H10W 72/353
. . .
{not comprising solid metals or solid metalloids, e.g. ceramics} [2026-01]
H10W 72/354
. . . .
{comprising polymers} [2026-01]
H10W 72/355
. . .
{of outermost layers of multilayered die-attach connectors, e.g. material of a coating} [2026-01]
H10W 72/357
. . .
{Multiple die-attach connectors having different materials} [2026-01]
​
H10W 72/361
. .
{Functions of die-attach connectors, other than mechanically connecting} [2026-01]
WARNING

H10W 72/365
. . .
{Providing thermal transfer} [2026-01]
H10W 72/367
. . .
{Multiple die-attach connectors having different functions} [2026-01]
​
H10W 72/381
. .
{Auxiliary members} [2026-01]
WARNING

H10W 72/383
. . .
{Reinforcing structures, e.g. collars} [2026-01]
H10W 72/385
. . .
{Alignment aids, e.g. alignment marks} [2026-01]
H10W 72/387
. . .
{Flow barriers} [2026-01]
​
H10W 72/40
.
Anisotropic conductive adhesives [2026-01]
WARNING

  • Groups H10W 72/40 and H10W 72/49 are incomplete pending reclassification of documents from groups H10W 72/00 and H10W 72/30.
    All groups listed in this Warning should be considered in order to perform a complete search.
H10W 72/49
. .
Bond pads specially adapted therefor [2026-01]
​
H10W 72/50
.
Bond wires [2026-01]
WARNING

​
H10W 72/521
. .
{Structures or relative sizes of bond wires} [2026-01]
WARNING

H10W 72/522
. . .
{Multilayered bond wires, e.g. having a coating concentric around a core} [2026-01]
H10W 72/523
. . . .
{characterised by the structures of the outermost layers, e.g. multilayered coatings} [2026-01]
H10W 72/524
. . .
{Bond wires having multiple distinct cores} [2026-01]
H10W 72/525
. . .
{Bond wires having a filler embedded in a matrix} [2026-01]
H10W 72/527
. . .
{Multiple bond wires having different sizes} [2026-01]
H10W 72/528
. . .
{Multiple bond wires having different structures} [2026-01]
​
H10W 72/531
. .
{Shapes of wire connectors} [2026-01]
WARNING

H10W 72/533
. . .
{Cross-sectional shape} [2026-01]
H10W 72/534
. . . .
{being rectangular} [2026-01]
H10W 72/535
. . .
{Shapes of outermost layers of multilayered bond wires, e.g. coating not being conformal on a core} [2026-01]
H10W 72/536
. . .
{the connected ends being ball-shaped} [2026-01]
H10W 72/5363
. . .
{the connected ends being wedge-shaped} [2026-01]
H10W 72/5366
. . .
{the bond wires having kinks} [2026-01]
H10W 72/5368
. . .
{the bond wires having helical loops} [2026-01]
H10W 72/537
. . .
{Multiple bond wires having different shapes} [2026-01]
​
H10W 72/541
. .
{Dispositions of bond wires} [2026-01]
WARNING

H10W 72/543
. . .
{of outermost layers of multilayered bond wires, e.g. coating being only on a part of a core} [2026-01]
H10W 72/5434
. . .
{the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires} [2026-01]
H10W 72/5438
. . .
{the bond wires having multiple connections on the same bond pad} [2026-01]
H10W 72/5445
. . .
{being orthogonal to a side surface of the chip, e.g. parallel arrangements} [2026-01]
H10W 72/5449
. . .
{not being orthogonal to a side surface of the chip, e.g. fan-out arrangements} [2026-01]
H10W 72/5453
. . .
{connecting between multiple bond pads on a chip, e.g. daisy chain} [2026-01]
H10W 72/547
. . .
{Dispositions of multiple bond wires} [2026-01]
H10W 72/5473
. . . .
{multiple bond wires connected to a common bond pad} [2026-01]
H10W 72/5475
. . . .
{multiple bond wires connected to common bond pads at both ends of the wires} [2026-01]
​
H10W 72/551
. .
{Materials of bond wires} [2026-01]
WARNING

H10W 72/552
. . .
{comprising metals or metalloids, e.g. silver} [2026-01]
H10W 72/5522
. . . .
{comprising gold [Au]} [2026-01]
H10W 72/5524
. . . .
{comprising aluminium [Al]} [2026-01]
H10W 72/5525
. . . .
{comprising copper [Cu]} [2026-01]
H10W 72/5527
. . . .
{Eutectic alloys} [2026-01]
H10W 72/5528
. . . .
{Intermetallic compounds} [2026-01]
H10W 72/553
. . .
{not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids} [2026-01]
H10W 72/555
. . .
{of outermost layers of multilayered bond wires, e.g. material of a coating} [2026-01]
H10W 72/557
. . .
{Multiple bond wires having different materials} [2026-01]
​
H10W 72/581
. .
{Auxiliary members, e.g. flow barriers} [2026-01]
WARNING

H10W 72/583
. . .
{Reinforcing structures} [2026-01]
H10W 72/585
. . .
{Alignment aids, e.g. alignment marks} [2026-01]
H10W 72/59
. .
Bond pads specially adapted therefor [2026-01]
​
H10W 72/60
.
Strap connectors, e.g. thick copper clips for grounding of power devices [2026-01]
WARNING

​
H10W 72/621
. .
{Structures or relative sizes of strap connectors} [2026-01]
WARNING

H10W 72/622
. . .
{Multilayered strap connectors, e.g. having a coating on a lowermost surface of a core} [2026-01]
H10W 72/623
. . . .
{characterised by the structures of the outermost layers, e.g. multilayered coatings} [2026-01]
H10W 72/624
. . .
{Strap connectors having multiple distinct cores} [2026-01]
H10W 72/625
. . .
{Strap connectors having a filler embedded in a matrix} [2026-01]
H10W 72/627
. . .
{Multiple strap connectors having different structures or shapes} [2026-01]
​
H10W 72/631
. .
{Shapes of strap connectors} [2026-01]
WARNING

H10W 72/634
. . .
{Cross-sectional shape} [2026-01]
H10W 72/635
. . .
{of outermost layers of multilayered strap connectors, e.g. coating not being conformal on a core} [2026-01]
H10W 72/637
. . .
{Multiple strap connectors having different shapes} [2026-01]
​
H10W 72/641
. .
{Dispositions of strap connectors} [2026-01]
WARNING

H10W 72/642
. . .
{being orthogonal to a side surface of the chip, e.g. in parallel arrangements} [2026-01]
H10W 72/643
. . .
{not being orthogonal to a side surface of the chip, e.g. in fan-out arrangements} [2026-01]
H10W 72/644
. . .
{connecting directly between multiple pads on a chip} [2026-01]
H10W 72/645
. . .
{of outermost layers of multilayered strap connectors, e.g. coating being only on a part of a core} [2026-01]
H10W 72/646
. . .
{the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector} [2026-01]
H10W 72/647
. . .
{Dispositions of multiple strap connectors} [2026-01]
H10W 72/6478
. . . .
{multiple strap connectors connecting to a common bond pad} [2026-01]
​
H10W 72/651
. .
{Materials of strap connectors} [2026-01]
WARNING

H10W 72/652
. . .
{comprising metals or metalloids, e.g. silver} [2026-01]
H10W 72/6524
. . . .
{Eutectic alloys} [2026-01]
H10W 72/6528
. . . .
{Intermetallic compounds} [2026-01]
H10W 72/653
. . .
{not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids} [2026-01]
H10W 72/655
. . .
{of outermost layers of multilayered strap connectors, e.g. material of a coating} [2026-01]
H10W 72/657
. . .
{Multiple strap connectors having different materials} [2026-01]
​
H10W 72/681
. .
{Auxiliary members, e.g. flow barriers} [2026-01]
WARNING

H10W 72/683
. . .
{Reinforcing structures, e.g. bump collars} [2026-01]
H10W 72/685
. . .
{Alignment aids, e.g. alignment marks} [2026-01]
​
H10W 72/691
. .
{Bond pads specially adapted therefor} [2026-01]
WARNING

​
H10W 72/701
.
{Tape-automated bond [TAB] connectors} [2026-01]
WARNING

H10W 72/709
. .
{Bond pads specially adapted therefor} [2026-01]
​
H10W 72/801
.
{Interconnections on sidewalls of containers} [2026-01]
WARNING

​
H10W 72/812
.
{Interconnections on sidewalls of encapsulations, e.g. conductive traces on molded resins} [2026-01]
WARNING

​
H10W 72/823
.
{Interconnections through encapsulations, e.g. pillars through molded resin on a lateral side a chip} [2026-01]
WARNING

H10W 72/834
.
{Interconnections on sidewalls of chips} [2026-01]
H10W 72/851
.
{Dispositions of multiple connectors or interconnections} [2026-01]
H10W 72/853
. .
{On the same surface} [2026-01]
H10W 72/856
. . .
{Bump connectors and die-attach connectors (bumps embedded in underfills H10W 74/15)} [2026-01]
H10W 72/859
. . .
{Bump connectors and bond wires} [2026-01]
H10W 72/862
. . .
{Bump connectors and strap connectors} [2026-01]
H10W 72/865
. . .
{Die-attach connectors and bond wires} [2026-01]
H10W 72/868
. . .
{Die-attach connectors and strap connectors} [2026-01]
H10W 72/871
. . .
{Bond wires and strap connectors} [2026-01]
H10W 72/874
. .
{On different surfaces} [2026-01]
H10W 72/877
. . .
{Bump connectors and die-attach connectors} [2026-01]
H10W 72/879
. . .
{Bump connectors and bond wires} [2026-01]
H10W 72/881
. . .
{Bump connectors and strap connectors} [2026-01]
H10W 72/884
. . .
{Die-attach connectors and bond wires} [2026-01]
H10W 72/886
. . .
{Die-attach connectors and strap connectors} [2026-01]
H10W 72/889
. . .
{Bond wires and strap connectors} [2026-01]
​
H10W 72/90
.
​
H10W 72/921
. .
{Structures or relative sizes of bond pads} [2026-01]
WARNING

H10W 72/922
. . .
{Bond pads being integral with underlying chip-level interconnections} [2026-01]
H10W 72/9223
. . . .
{with redistribution layers [RDL]} [2026-01]
H10W 72/9226
. . . .
{with via interconnections} [2026-01]
H10W 72/923
. . .
{Bond pads having multiple stacked layers} [2026-01]
H10W 72/9232
. . . .
{with additional elements interposed between layers} [2026-01]
H10W 72/924
. . .
{Bond pads having multiple side-by-side cores} [2026-01]
H10W 72/925
. . .
{Bond pads having a filler embedded in a matrix} [2026-01]
H10W 72/926
. . .
{Multiple bond pads having different sizes} [2026-01]
H10W 72/927
. . .
{Multiple bond pads having different structures} [2026-01]
​
H10W 72/931
. .
{Shapes of bond pads} [2026-01]
WARNING

H10W 72/932
. . .
{Plan-view shape, i.e. in top view} [2026-01]
H10W 72/934
. . .
{Cross-sectional shape, i.e. in side view} [2026-01]
H10W 72/936
. . .
{Multiple bond pads having different shapes} [2026-01]
​
H10W 72/941
. .
{Dispositions of bond pads} [2026-01]
WARNING

H10W 72/9413
. . .
{on encapsulations} [2026-01]
H10W 72/9415
. . .
{relative to the surface, e.g. recessed, protruding} [2026-01]
H10W 72/942
. . .
{relative to underlying supporting features, e.g. bond pads, RDLs or vias} [2026-01]
H10W 72/944
. . .
{Dispositions of multiple bond pads} [2026-01]
H10W 72/9445
. . . .
{Top-view layouts, e.g. mirror arrays} [2026-01]
​
H10W 72/951
. .
{Materials of bond pads} [2026-01]
WARNING

H10W 72/952
. . .
{comprising metals or metalloids, e.g. PbSn, Ag or Cu} [2026-01]
H10W 72/9524
. . . .
{Eutectic alloys} [2026-01]
H10W 72/9528
. . . .
{Intermetallic compounds} [2026-01]
H10W 72/953
. . .
{not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids} [2026-01]
H10W 72/957
. . .
{Multiple bond pads having different materials} [2026-01]
​
H10W 72/961
. .
{Functions of bonds pads} [2026-01]
WARNING

H10W 72/963
. . .
{Providing mechanical bonding or support, e.g. dummy bond pads} [2026-01]
H10W 72/965
. . .
{Providing thermal transfer} [2026-01]
H10W 72/967
. . .
{Multiple bond pads having different functions} [2026-01]
​
H10W 72/981
. .
{Auxiliary members, e.g. spacers} [2026-01]
WARNING

H10W 72/983
. . .
{Reinforcing structures, e.g. collars} [2026-01]
H10W 72/985
. . .
{Alignment aids, e.g. alignment marks} [2026-01]
H10W 72/987
. . .
{Flow barriers} [2026-01]
H10W 74/00
Encapsulations, e.g. protective coatings [2026-01]
​
H10W 74/01
.
Manufacture or treatment [2026-01]
WARNING

H10W 74/012
. .
{of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills} [2026-01]
H10W 74/014
. .
{using batch processing} [2026-01]
H10W 74/016
. .
{using moulds} [2026-01]
H10W 74/017
. . .
{Auxiliary layers for moulds, e.g. release layers or layers preventing residue} [2026-01]
H10W 74/019
. .
{using temporary auxiliary substrates (H10W 74/017 takes precedence)} [2026-01]
​
H10W 74/10
.
characterised by their shape or disposition [2026-01]
WARNING

H10W 74/111
. .
{the semiconductor body being completely enclosed} [2026-01]
H10W 74/114
. . .
{by a substrate and the encapsulations} [2026-01]
H10W 74/117
. . . .
{the substrate having spherical bumps for external connection} [2026-01]
H10W 74/121
. . .
{by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation} [2026-01]
H10W 74/124
. . .
{the encapsulations having cavities other than that occupied by chips} [2026-01]
H10W 74/127
. . .
{characterised by arrangements for sealing or adhesion} [2026-01]
H10W 74/129
. . .
{forming a chip-scale package [CSP]} [2026-01]
H10W 74/131
. .
{the semiconductor body being only partially enclosed} [2026-01]
H10W 74/134
. . .
{the encapsulations being in grooves in the semiconductor body} [2026-01]
H10W 74/137
. . .
{the encapsulations being directly on the semiconductor body (H10W 74/134 takes precedence)} [2026-01]
H10W 74/141
. . .
{the encapsulations being on at least the sidewalls of the semiconductor body} [2026-01]
H10W 74/142
. . .
{the encapsulations exposing the passive side of the semiconductor body} [2026-01]
H10W 74/144
. . .
{the encapsulations comprising foils} [2026-01]
H10W 74/147
. . .
{the encapsulations being multilayered} [2026-01]
​
H10W 74/15
. .
on active surfaces of flip-chip devices, e.g. underfills [2026-01]
WARNING

H10W 74/40
.
characterised by their materials [2026-01]
H10W 74/43
. .
comprising oxides, nitrides or carbides, e.g. ceramics or glasses [2026-01]
H10W 74/47
. .
comprising organic materials, e.g. plastics or resins [2026-01]
H10W 74/473
. . .
{containing a filler} [2026-01]
H10W 74/476
. . .
{Organic materials comprising silicon} [2026-01]
H10W 74/481
. .
{comprising semiconductor materials} [2026-01]
H10W 76/00
Containers; Fillings or auxiliary members therefor; Seals [2026-01]
​
H10W 76/01
.
Manufacture or treatment [2026-01]
WARNING

H10W 76/05
. .
Providing fillings in containers, e.g. gas filling [2026-01]
H10W 76/10
.
Containers or parts thereof [2026-01]
H10W 76/12
. .
characterised by their shape [2026-01]
H10W 76/13
. . .
Containers comprising a conductive base serving as an interconnection [2026-01]
​
H10W 76/132
. . . .
having other interconnections through an insulated passage in the conductive base [2026-01]
WARNING

  • Groups H10W 76/132 - H10W 76/165 are incomplete pending reclassification of documents from group H10W 72/823.
    All groups listed in this Warning should be considered in order to perform a complete search.
H10W 76/134
. . . .
having other interconnections parallel to the conductive base [2026-01]
H10W 76/136
. . . .
having other interconnections perpendicular to the conductive base [2026-01]
H10W 76/138
. . . .
having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type [2026-01]
H10W 76/15
. . .
Containers comprising an insulating or insulated base [2026-01]
H10W 76/153
. . . .
having interconnections in passages through the insulating or insulated base [2026-01]
H10W 76/157
. . . .
having interconnections parallel to the insulating or insulated base [2026-01]
H10W 76/161
. . .
{Containers comprising no base} [2026-01]
H10W 76/165
. . .
{characterised by interconnections through the top surface of the containers, e.g. in a metal cap} [2026-01]
H10W 76/167
. . .
{the container walls comprising an aperture, e.g. for pressure control} [2026-01]
H10W 76/17
. .
characterised by their materials [2026-01]
H10W 76/18
. . .
Insulating materials, e.g. resins, glasses or ceramics [2026-01]
H10W 76/40
.
Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W 40/70) [2026-01]
​
H10W 76/42
. .
Fillings [2026-01]
NOTE

  • In this group, the phase of the fillings is determined at the operating temperature of the device.
H10W 76/43
. . .
Gaseous fillings [2026-01]
H10W 76/45
. . .
Liquid fillings [2026-01]
H10W 76/47
. . .
Solid or gel fillings [2026-01]
H10W 76/48
. . .
Fillings including materials for absorbing or reacting with moisture or other undesired substances [2026-01]
​
H10W 76/60
.
Seals [2026-01]
WARNING

​
H10W 76/63
. .
characterised by their shape or disposition, e.g. between cap and walls of a container [2026-01]
WARNING

  • Groups H10W 76/63 - H10W 76/67 are incomplete pending reclassification of documents from group H10W 76/60.
    All groups listed in this Warning should be considered in order to perform a complete search.
H10W 76/67
. .
characterised by their materials [2026-01]
H10W 78/00
Detachable holders for supporting packaged chips in operation [2026-01]
​
H10W 80/00
Direct bonding of chips, wafers or substrates [2026-01]
NOTE

  • This group covers direct bonding of:
    • chips, e.g. chip-to-chip;
    • wafers having devices and interconnections therein or thereon, e.g. wafer-to-wafer;
    • substrates having devices and interconnections therein or thereon;
    • combinations thereof, e.g. chip-to-wafer.
H10W 80/011
.
{Manufacture or treatment of pads or other interconnections to be direct bonded} [2026-01]
H10W 80/016
. .
{Cleaning} [2026-01]
H10W 80/023
. .
{Applying a coating on the bonding area} [2026-01]
H10W 80/031
. .
{Changing or setting shapes of the pads} [2026-01]
H10W 80/033
. . .
{by chemical means, e.g. etching} [2026-01]
H10W 80/035
. . .
{by heating, e.g. melting or causing diffusion} [2026-01]
H10W 80/037
. . .
{by mechanical treatment, e.g. by cutting, pressing or stamping} [2026-01]
H10W 80/041
. .
{Thermally treating} [2026-01]
H10W 80/102
.
{Controlling the environment during the bonding, e.g. the temperature or pressure} [2026-01]
H10W 80/161
.
{Aligning} [2026-01]
H10W 80/163
. .
{using active alignment, e.g. detecting marks and correcting position} [2026-01]
H10W 80/165
. .
{using passive alignment, e.g. using self-alignment} [2026-01]
H10W 80/168
. .
{using guiding structures} [2026-01]
H10W 80/211
.
{using auxiliary members, e.g. aids for protecting the bonding area} [2026-01]
H10W 80/301
.
{Bonding techniques, e.g. hybrid bonding} [2026-01]
H10W 80/312
. .
{characterised by the direct bonding of electrically conductive pads} [2026-01]
H10W 80/314
. .
{characterized by direct bonding of pads or other interconnections} [2026-01]
H10W 80/327
. .
{characterised by the direct bonding of insulating parts, e.g. of silicon oxide layers} [2026-01]
H10W 80/331
. .
{characterised by the application of energy for connecting} [2026-01]
H10W 80/333
. . .
{Compression bonding} [2026-01]
H10W 80/334
. . . .
{Thermocompression bonding} [2026-01]
H10W 80/335
. . . .
{Ultrasonic bonding} [2026-01]
H10W 80/337
. . .
{causing reflow} [2026-01]
H10W 80/338
. . .
{using EM radiation or electron beams, e.g. using lasers} [2026-01]
H10W 80/339
. . .
{using integrated means for heating, e.g. embedded heater} [2026-01]
H10W 80/341
. .
{Anodic bonding} [2026-01]
H10W 80/701
.
{characterised by the pads after the direct bonding} [2026-01]
H10W 80/721
. .
{having structure or size changed during the connecting} [2026-01]
H10W 80/732
. .
{having shape changed during the connecting} [2026-01]
H10W 80/743
. .
{having disposition changed during the connecting} [2026-01]
H10W 80/754
. .
{having material changed during the connecting} [2026-01]
​​
H10W 90/00
Package configurations [2026-01]
NOTE

  • This group covers:
    • the relative positions of multiple chips within a single package, e.g. adjacent chips in a single encapsulation;
    • the relative positions of multiple chips within multiple packages, e.g. one encapsulated chip on another encapsulated chip in a "package-on-package" configuration.
WARNING

​
H10W 90/10
.
Configurations of laterally-adjacent chips [2026-01]
WARNING

H10W 90/15
. .
the laterally-adjacent chips having different thicknesses than each other [2026-01]
H10W 90/155
. .
{the laterally-adjacent chips comprising dummy chips} [2026-01]
​
H10W 90/20
.
Configurations of stacked chips [2026-01]
WARNING

H10W 90/22
. .
the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL [2026-01]
H10W 90/231
. .
{the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure} [2026-01]
H10W 90/24
. .
at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape [2026-01]
H10W 90/26
. .
the stacked chips being of the same size without any chips being laterally offset, e.g. chip stacks having a rectangular shape [2026-01]
H10W 90/271
. .
{the chips having passive surfaces facing each other, i.e. in a back-to-back arrangement} [2026-01]
H10W 90/275
. .
{the stacked chips comprising dummy chips} [2026-01]
H10W 90/28
. .
the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape [2026-01]
H10W 90/284
. .
{characterised by structural arrangements for measuring or testing} [2026-01]
H10W 90/288
. .
{characterised by arrangements for thermal management of the stacked chips} [2026-01]
H10W 90/291
. .
{characterised by containers, encapsulations, or other housings for the stacked chips} [2026-01]
H10W 90/293
. .
{characterised by non-galvanic coupling between the chips, e.g. capacitive coupling} [2026-01]
H10W 90/295
. . .
{optical coupling} [2026-01]
H10W 90/297
. .
{characterised by the through-semiconductor vias [TSVs] in the stacked chips} [2026-01]
H10W 90/401
.
{characterised by multiple insulating or insulated package substrates, interposers or RDLs} [2026-01]
​
H10W 90/701
.
{characterised by the relative positions of pads or connectors relative to package parts} [2026-01]
WARNING

​
H10W 90/721
. .
{of bump connectors} [2026-01]
WARNING

H10W 90/722
. . .
{between stacked chips} [2026-01]
H10W 90/723
. . .
{between laterally-adjacent chips} [2026-01]
​
H10W 90/724
. . .
{between a chip and a stacked insulating package substrate, interposer or RDL} [2026-01]
WARNING

​
H10W 90/725
. . .
{between a chip and a laterally-adjacent insulating package substrate, interposer or RDL} [2026-01]
WARNING

​
H10W 90/726
. . .
{between a chip and a stacked lead frame, conducting package substrate or heat sink} [2026-01]
WARNING

H10W 90/727
. . .
{between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink} [2026-01]
H10W 90/728
. . .
{between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors} [2026-01]
H10W 90/729
. . .
{between a chip and a laterally-adjacent discrete passive device} [2026-01]
​
H10W 90/7295
. . .
{on the rear surface of insulating package substrates, interposers or RDLs, for connection outside of the package, e.g. ball grid array [BGA] bumps} [2026-01]
WARNING

​
H10W 90/731
. .
{of die-attach connectors} [2026-01]
WARNING

H10W 90/732
. . .
{between stacked chips} [2026-01]
H10W 90/733
. . .
{between laterally-adjacent chips} [2026-01]
H10W 90/734
. . .
{between a chip and a stacked insulating package substrate, interposer or RDL} [2026-01]
H10W 90/735
. . .
{between a chip and a laterally-adjacent insulating package substrate, interposer or RDL} [2026-01]
H10W 90/736
. . .
{between a chip and a stacked lead frame, conducting package substrate or heat sink} [2026-01]
H10W 90/737
. . .
{between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink} [2026-01]
H10W 90/738
. . .
{between a chip and a stacked discrete passive device} [2026-01]
H10W 90/739
. . .
{between a chip and a laterally-adjacent discrete passive devices} [2026-01]
​
H10W 90/751
. .
{of bond wires} [2026-01]
WARNING

H10W 90/752
. . .
{between stacked chips} [2026-01]
H10W 90/753
. . .
{between laterally-adjacent chips} [2026-01]
​
H10W 90/754
. . .
{between a chip and a stacked insulating package substrate, interposer or RDL} [2026-01]
WARNING

​
H10W 90/755
. . .
{between a chip and a laterally-adjacent insulating package substrate, interpose or RDL} [2026-01]
WARNING

​
H10W 90/756
. . .
{between a chip and a stacked lead frame, conducting package substrate or heat sink} [2026-01]
WARNING

H10W 90/757
. . .
{between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink} [2026-01]
H10W 90/758
. . .
{between a chip and a stacked discrete passive device} [2026-01]
H10W 90/759
. . .
{between a chip and a laterally-adjacent discrete passive device} [2026-01]
​
H10W 90/761
. .
{of strap connectors} [2026-01]
WARNING

H10W 90/762
. . .
{between stacked chips} [2026-01]
H10W 90/763
. . .
{between laterally-adjacent chips} [2026-01]
​
H10W 90/764
. . .
{between a chip and a stacked insulating package substrate, interposer or RDL} [2026-01]
WARNING

​
H10W 90/765
. . .
{between a chip and a laterally-adjacent insulating package substrate, interposer or RDL} [2026-01]
WARNING

H10W 90/766
. . .
{between a chip and a stacked lead frame, conducting package substrate or heat sink} [2026-01]
H10W 90/767
. . .
{between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink} [2026-01]
H10W 90/768
. . .
{between a chip and a stacked discrete passive device} [2026-01]
H10W 90/769
. . .
{between a chip and a laterally-adjacent discrete passive device} [2026-01]
​
H10W 90/791
. .
{of direct-bonded pads} [2026-01]
WARNING

H10W 90/792
. . .
{between multiple chips} [2026-01]
H10W 90/794
. . .
{between a chip and a stacked insulating package substrate, interposer or RDL} [2026-01]
H10W 90/796
. . .
{between a chip and a stacked lead frame, conducting package substrate or heat sink} [2026-01]
H10W 90/798
. . .
{between a chip and a stacked discrete passive device} [2026-01]
​
H10W 90/811
.
{Multiple chips on leadframes} [2026-01]
WARNING

​
H10W 95/00
Packaging processes not covered by the other groups of this subclass [2026-01]
WARNING

​
H10W 99/00
Subject matter not provided for in other groups of this subclass [2026-01]
WARNING