Version: 2025.01
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CPC | COOPERATIVE PATENT CLASSIFICATION | |||
| H10H | INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS [2025-01] NOTES
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H10H 20/00 | Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED] [2025-01] |
| H10H 20/01 | . | Manufacture or treatment [2025-01] WARNING
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| H10H 20/011 | . . | {of bodies, e.g. forming semiconductor layers} [2025-01] WARNING
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H10H 20/012 | . . . | {having light-emitting regions comprising only Group II-IV materials} [2025-01] |
H10H 20/0125 | . . . . | {with a substrate not being Group II-VI materials} [2025-01] |
H10H 20/013 | . . . | {having light-emitting regions comprising only Group III-V materials} [2025-01] |
H10H 20/0133 | . . . . | {with a substrate not being Group III-V materials} [2025-01] |
H10H 20/01335 | . . . . . | {the light-emitting regions comprising nitride materials} [2025-01] |
H10H 20/0137 | . . . . | {the light-emitting regions comprising nitride materials} [2025-01] |
| H10H 20/014 | . . . | {having light-emitting regions comprising only Group IV materials} [2025-01] WARNING
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| H10H 20/0145 | . . . . | {comprising polycrystalline, amorphous or porous Group IV materials} [2025-01] WARNING
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H10H 20/016 | . . . | {Thermal treatments} [2025-01] |
H10H 20/0165 | . . . . | {for recrystallisation} [2025-01] |
H10H 20/017 | . . . | {Etching} [2025-01] |
| H10H 20/018 | . . . | {Bonding of wafers} [2025-01] WARNING
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| H10H 20/019 | . . . | {Removal of at least a part of a substrate on which semiconductor layers have been formed} [2025-01] WARNING
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| H10H 20/021 | . . | {Singulating, e.g. dicing} [2025-01] WARNING
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| H10H 20/032 | . . | {of electrodes} [2025-01] WARNING
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| H10H 20/034 | . . | {of coatings} [2025-01] WARNING
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| H10H 20/036 | . . | {of packages} [2025-01] WARNING
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| H10H 20/0361 | . . . | {of wavelength conversion means} [2025-01] WARNING
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| H10H 20/0362 | . . . | {of encapsulations} [2025-01] WARNING
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| H10H 20/0363 | . . . | {of optical field-shaping means} [2025-01] WARNING
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| H10H 20/0364 | . . . | {of interconnections} [2025-01] WARNING
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| H10H 20/0365 | . . . | {of means for heat extraction or cooling} [2025-01] WARNING
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H10H 20/042 | . | {Superluminescent diodes} [2025-01] |
H10H 20/052 | . | {Light-emitting semiconductor devices having Schottky type light-emitting regions; Light emitting semiconductor devices having Metal-Insulator-Semiconductor type light-emitting regions} [2025-01] |
H10H 20/062 | . | {Light-emitting semiconductor devices having field effect type light-emitting regions, e.g. light-emitting High-Electron Mobility Transistors} [2025-01] |
| H10H 20/80 | . | Constructional details [2025-01] WARNING
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H10H 20/81 | . . | Bodies [2025-01] |
| H10H 20/811 | . . . | having quantum effect structures or superlattices, e.g. tunnel junctions [2025-01] WARNING
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| H10H 20/812 | . . . . | within the light-emitting regions, e.g. having quantum confinement structures [2025-01] WARNING
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| H10H 20/813 | . . . | having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies [2025-01] WARNING
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| H10H 20/8131 | . . . . | {Stacked light-emitting regions} [2025-01] WARNING
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| H10H 20/8132 | . . . . | {Laterally arranged light-emitting regions, e.g. nano-rods} [2025-01] WARNING
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H10H 20/8133 | . . . . . | {having core-shell structures} [2025-01] |
H10H 20/814 | . . . | having reflecting means, e.g. semiconductor Bragg reflectors [2025-01] |
H10H 20/8142 | . . . . | {forming resonant cavity structures} [2025-01] |
H10H 20/815 | . . . | having stress relaxation structures, e.g. buffer layers [2025-01] |
H10H 20/816 | . . . | having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures [2025-01] |
H10H 20/8162 | . . . . | {Current-blocking structures} [2025-01] |
H10H 20/817 | . . . | characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous [2025-01] |
| H10H 20/818 | . . . . | within the light-emitting regions [2025-01] NOTE
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H10H 20/819 | . . . | characterised by their shape, e.g. curved or truncated substrates [2025-01] |
H10H 20/82 | . . . . | Roughened surfaces, e.g. at the interface between epitaxial layers [2025-01] |
H10H 20/821 | . . . . | of the light-emitting regions, e.g. non-planar junctions [2025-01] |
H10H 20/8215 | . . . | {characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping} [2025-01] |
| H10H 20/822 | . . . | Materials of the light-emitting regions [2025-01] NOTE
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H10H 20/823 | . . . . | comprising only Group II-VI materials, e.g. ZnO [2025-01] |
H10H 20/8232 | . . . . . | {characterised by the dopants} [2025-01] |
H10H 20/824 | . . . . | comprising only Group III-V materials, e.g. GaP [2025-01] |
H10H 20/8242 | . . . . . | {characterised by the dopants} [2025-01] |
H10H 20/825 | . . . . . | containing nitrogen, e.g. GaN [2025-01] |
H10H 20/8252 | . . . . . . | {characterised by the dopants} [2025-01] |
| H10H 20/826 | . . . . | comprising only Group IV materials [2025-01] WARNING
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H10H 20/8262 | . . . . . | {characterised by the dopants} [2025-01] |
| H10H 20/8264 | . . . . . | {comprising polycrystalline, amorphous or porous Group IV materials} [2025-01] WARNING
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| H10H 20/83 | . . | Electrodes [2025-01] WARNING
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| H10H 20/831 | . . . | characterised by their shape [2025-01] WARNING
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H10H 20/8312 | . . . . | {extending at least partially through the bodies} [2025-01] |
H10H 20/8314 | . . . . | {extending at least partially onto an outer side surface of the bodies} [2025-01] |
H10H 20/8316 | . . . . | {Multi-layer electrodes comprising at least one discontinuous layer} [2025-01] |
| H10H 20/832 | . . . | characterised by their material [2025-01] WARNING
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| H10H 20/833 | . . . . | Transparent materials [2025-01] WARNING
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| H10H 20/835 | . . . . | {Reflective materials} [2025-01] WARNING
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| H10H 20/84 | . . | Coatings, e.g. passivation layers or antireflective coatings [2025-01] WARNING
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| H10H 20/841 | . . . | Reflective coatings, e.g. dielectric Bragg reflectors [2025-01] WARNING
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| H10H 20/85 | . . | Packages [2025-01] WARNING
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| H10H 20/8502 | . . . | {Surface mount technology [SMT] type packages} [2025-01] WARNING
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| H10H 20/8504 | . . . | {Chip-scale type packages} [2025-01] WARNING
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| H10H 20/8506 | . . . | {Containers} [2025-01] WARNING
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| H10H 20/8508 | . . . | {Package substrates, e.g. submounts} [2025-01] WARNING
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| H10H 20/851 | . . . | Wavelength conversion means [2025-01] WARNING
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| H10H 20/8511 | . . . . | {characterised by their material, e.g. binder} [2025-01] WARNING
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| H10H 20/8512 | . . . . . | {Wavelength conversion materials} [2025-01] WARNING
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| H10H 20/8513 | . . . . . . | {having two or more wavelength conversion materials} [2025-01] WARNING
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| H10H 20/8514 | . . . . | {characterised by their shape, e.g. plate or foil} [2025-01] WARNING
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| H10H 20/8515 | . . . . | {not being in contact with the bodies} [2025-01] WARNING
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| H10H 20/8516 | . . . . | {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient} [2025-01] WARNING
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| H10H 20/852 | . . . | Encapsulations [2025-01] WARNING
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| H10H 20/853 | . . . . | characterised by their shape [2025-01] WARNING
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| H10H 20/854 | . . . . | characterised by their material, e.g. epoxy or silicone resins [2025-01] WARNING
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| H10H 20/855 | . . . | Optical field-shaping means, e.g. lenses [2025-01] WARNING
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| H10H 20/856 | . . . . | Reflecting means [2025-01] WARNING
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| H10H 20/857 | . . . | Interconnections, e.g. lead-frames, bond wires or solder balls [2025-01] WARNING
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| H10H 20/858 | . . . | Means for heat extraction or cooling [2025-01] WARNING
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| H10H 20/8581 | . . . . | {characterised by their material} [2025-01] WARNING
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| H10H 20/8582 | . . . . | {characterised by their shape} [2025-01] WARNING
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| H10H 20/8583 | . . . . | {not being in contact with the bodies} [2025-01] WARNING
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| H10H 20/8584 | . . . . | {electrically controlled, e.g. Peltier elements} [2025-01] WARNING
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| H10H 20/8585 | . . . . | {being an interconnection} [2025-01] WARNING
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| H10H 20/8586 | . . . . | {comprising fluids, e.g. heat-pipes} [2025-01] WARNING
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| H10H 20/862 | . . | {Resonant cavity structures (formed by reflecting means in the bodies H10H 20/8142)} [2025-01] WARNING
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| H10H 20/872 | . . | {Periodic patterns for optical field-shaping, e.g. photonic bandgap structures} [2025-01] WARNING
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| H10H 20/882 | . . | {Scattering means (H10H 20/82 takes precedence)} [2025-01] WARNING
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H10H 29/00 | Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H 20/00 [2025-01] |
| H10H 29/01 | . | Manufacture or treatment [2025-01] WARNING
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| H10H 29/011 | . . | {of integrated devices comprising at least one light-emitting semiconductor component covered by group H10H 20/00} [2025-01] WARNING
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H10H 29/012 | . . | {of active-matrix LED displays} [2025-01] |
H10H 29/02 | . . | using pick-and-place processes [2025-01] |
H10H 29/03 | . . | using mass transfer of LEDs, e.g. by using liquid suspensions [2025-01] |
| H10H 29/032 | . . | {of electrodes} [2025-01] WARNING
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| H10H 29/034 | . . | {of coatings} [2025-01] WARNING
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| H10H 29/036 | . . | {of packages} [2025-01] WARNING
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| H10H 29/0361 | . . . | {of wavelength conversion means} [2025-01] WARNING
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| H10H 29/0362 | . . . | {of encapsulations} [2025-01] WARNING
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| H10H 29/0363 | . . . | {of optical field-shaping means} [2025-01] WARNING
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| H10H 29/0364 | . . . | {of interconnections} [2025-01] WARNING
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| H10H 29/0365 | . . . | {of means for heat extraction or cooling} [2025-01] WARNING
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| H10H 29/10 | . | Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H 20/00 (active-matrix LED displays H10H 29/30) [2025-01] WARNING
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| H10H 29/14 | . . | comprising multiple light-emitting semiconductor components [2025-01] WARNING
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| H10H 29/142 | . . . | {Two-dimensional arrangements, e.g. asymmetric LED layout} [2025-01] WARNING
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H10H 29/20 | . | Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H 20/00 (active-matrix LED displays H10H 29/30) [2025-01] |
H10H 29/24 | . . | comprising multiple light-emitting semiconductor devices [2025-01] |
| H10H 29/30 | . | Active-matrix LED displays [2025-01] NOTE
WARNING
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H10H 29/32 | . . | characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel [2025-01] |
H10H 29/34 | . . | characterised by the geometry or arrangement of subpixels within a pixel, e.g. relative disposition of the RGB subpixels [2025-01] |
H10H 29/345 | . . . | {the area of the subpixels being different} [2025-01] |
H10H 29/352 | . . | {characterised by differences in geometry or arrangement of elements, subpixels or pixels in different regions of the display, e.g. at the central and peripheral regions} [2025-01] |
H10H 29/362 | . . | {comprising more than three subpixels, e.g. red-green-blue-white [RGBW]} [2025-01] |
H10H 29/37 | . . | Pixel-defining structures, e.g. banks between the LEDs [2025-01] |
H10H 29/39 | . . | Connection of the pixel electrodes to the driving transistors [2025-01] |
H10H 29/41 | . . | Insulating layers formed between the driving transistors and the LEDs [2025-01] |
H10H 29/45 | . . | comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates [2025-01] |
| H10H 29/49 | . . | Interconnections, e.g. wiring lines or terminals (connection of the pixel electrodes to the driving transistors H10H 29/39) [2025-01] WARNING
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| H10H 29/80 | . | Constructional details [2025-01] NOTE
WARNING
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| H10H 29/832 | . . | {Electrodes} [2025-01] WARNING
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| H10H 29/8321 | . . . | {characterised by their shape} [2025-01] WARNING
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| H10H 29/8322 | . . . | {characterised by their materials} [2025-01] WARNING
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| H10H 29/8323 | . . . . | {Transparent materials} [2025-01] WARNING
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| H10H 29/8325 | . . . . | {Reflective materials} [2025-01] WARNING
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| H10H 29/842 | . . | {Coatings, e.g. passivation layers or antireflective coatings} [2025-01] WARNING
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| H10H 29/8421 | . . . | {Reflective coatings, e.g. dielectric Bragg reflectors} [2025-01] WARNING
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| H10H 29/85 | . . | Packages [2025-01] WARNING
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| H10H 29/8506 | . . . | {Containers} [2025-01] WARNING
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| H10H 29/8508 | . . . | {Package substrates, e.g. submounts} [2025-01] WARNING
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| H10H 29/851 | . . . | Wavelength conversion means [2025-01] WARNING
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| H10H 29/8511 | . . . . | {characterised by their material, e.g. binder} [2025-01] WARNING
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| H10H 29/8512 | . . . . . | {Wavelength conversion materials} [2025-01] WARNING
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| H10H 29/8513 | . . . . . . | {having two or more wavelength conversion materials} [2025-01] WARNING
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| H10H 29/8514 | . . . . | {characterised by their shape, e.g. plate or foil} [2025-01] WARNING
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| H10H 29/8515 | . . . . | {not being in contact with the bodies} [2025-01] WARNING
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| H10H 29/8516 | . . . . | {having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient} [2025-01] WARNING
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| H10H 29/8517 | . . . | {Colour filters} [2025-01] WARNING
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| H10H 29/852 | . . . | Encapsulations [2025-01] WARNING
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| H10H 29/853 | . . . . | characterised by their shape [2025-01] WARNING
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| H10H 29/854 | . . . . | characterised by their material, e.g. epoxy or silicone resins [2025-01] WARNING
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| H10H 29/855 | . . . | Optical field-shaping means, e.g. lenses [2025-01] WARNING
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| H10H 29/8552 | . . . . | {Light absorbing arrangements, e.g. black matrix} [2025-01] WARNING
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| H10H 29/856 | . . . . | Reflecting means [2025-01] WARNING
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| H10H 29/857 | . . . | {Interconnections (of active-matrix LED displays H10H 29/49)} [2025-01] WARNING
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| H10H 29/858 | . . . | {Means for heat extraction or cooling} [2025-01] WARNING
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| H10H 29/8581 | . . . . | {characterised by their material} [2025-01] WARNING
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| H10H 29/8582 | . . . . | {characterised by their shape} [2025-01] WARNING
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| H10H 29/8583 | . . . . | {not being in contact with the bodies} [2025-01] WARNING
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| H10H 29/8584 | . . . . | {electrically controlled, e.g. Peltier elements} [2025-01] WARNING
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| H10H 29/8585 | . . . . | {being an interconnection} [2025-01] WARNING
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| H10H 29/8586 | . . . . | {comprising fluids, e.g. heat-pipes} [2025-01] WARNING
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| H10H 29/862 | . . | {Resonant cavity structures} [2025-01] WARNING
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| H10H 29/872 | . . | {Periodic patterns for optical field-shaping, e.g. photonic bandgap structures} [2025-01] WARNING
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| H10H 29/882 | . . | {Scattering means} [2025-01] WARNING
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| H10H 29/922 | . . | {Parallel electrical configurations of multiple light-emitting semiconductor components or devices} [2025-01] WARNING
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| H10H 29/942 | . . | {Serial electrical configurations of multiple light-emitting semiconductor components or devices} [2025-01] WARNING
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| H10H 29/962 | . . | {Stacked configurations of light-emitting semiconductor components or devices, the components or devices emitting at different wavelengths} [2025-01] WARNING
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H10H 99/00 | Subject matter not provided for in other groups of this subclass [2025-01] |