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CPC
COOPERATIVE PATENT CLASSIFICATION
H10H
INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS [2025-01]
NOTES

  • This subclass covers inorganic light-emitting semiconductor devices that emit visible, infrared [IR] or ultraviolet [UV] light. This includes light-emitting diodes [LED] and superluminescent diodes [SLD].
  • This subclass does not cover semiconductor lasers, which are covered by group H01S 5/00.
  • In this subclass, the periodic system used is the I to VIII group system indicated in the Periodic Table under Note (3) of section C.
H10H 20/00
Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED] [2025-01]
H10H 20/01
.
Manufacture or treatment [2025-01]
H10H 20/011
. .
{of bodies, e.g. forming semiconductor layers} [2025-01]
WARNING

H10H 20/012
. . .
{having light-emitting regions comprising only Group II-IV materials} [2025-01]
H10H 20/0125
. . . .
{with a substrate not being Group II-VI materials} [2025-01]
H10H 20/013
. . .
{having light-emitting regions comprising only Group III-V materials} [2025-01]
H10H 20/0133
. . . .
{with a substrate not being Group III-V materials} [2025-01]
H10H 20/01335
. . . . .
{the light-emitting regions comprising nitride materials} [2025-01]
H10H 20/0137
. . . .
{the light-emitting regions comprising nitride materials} [2025-01]
H10H 20/014
. . .
{having light-emitting regions comprising only Group IV materials} [2025-01]
WARNING

H10H 20/0145
. . . .
{comprising polycrystalline, amorphous or porous Group IV materials} [2025-01]
WARNING

H10H 20/016
. . .
{Thermal treatments} [2025-01]
H10H 20/0165
. . . .
{for recrystallisation} [2025-01]
H10H 20/017
. . .
{Etching} [2025-01]
H10H 20/018
. . .
{Bonding of wafers} [2025-01]
WARNING

H10H 20/019
. . .
{Removal of at least a part of a substrate on which semiconductor layers have been formed} [2025-01]
WARNING

H10H 20/021
. .
{Singulating, e.g. dicing} [2025-01]
WARNING

H10H 20/032
. .
{of electrodes} [2025-01]
WARNING

H10H 20/034
. .
{of coatings} [2025-01]
WARNING

H10H 20/036
. .
{of packages} [2025-01]
WARNING

H10H 20/0361
. . .
{of wavelength conversion means} [2025-01]
WARNING

H10H 20/0362
. . .
{of encapsulations} [2025-01]
WARNING

H10H 20/0363
. . .
{of optical field-shaping means} [2025-01]
WARNING

H10H 20/0364
. . .
{of interconnections} [2025-01]
WARNING

H10H 20/0365
. . .
{of means for heat extraction or cooling} [2025-01]
WARNING

H10H 20/042
.
{Superluminescent diodes} [2025-01]
H10H 20/052
.
{Light-emitting semiconductor devices having Schottky type light-emitting regions; Light emitting semiconductor devices having Metal-Insulator-Semiconductor type light-emitting regions} [2025-01]
H10H 20/062
.
{Light-emitting semiconductor devices having field effect type light-emitting regions, e.g. light-emitting High-Electron Mobility Transistors} [2025-01]
H10H 20/80
.
Constructional details [2025-01]
WARNING

H10H 20/81
. .
Bodies [2025-01]
H10H 20/811
. . .
having quantum effect structures or superlattices, e.g. tunnel junctions [2025-01]
WARNING

H10H 20/812
. . . .
within the light-emitting regions, e.g. having quantum confinement structures [2025-01]
WARNING

H10H 20/813
. . .
having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies [2025-01]
WARNING

H10H 20/8131
. . . .
{Stacked light-emitting regions} [2025-01]
WARNING

H10H 20/8132
. . . .
{Laterally arranged light-emitting regions, e.g. nano-rods} [2025-01]
WARNING

H10H 20/8133
. . . . .
{having core-shell structures} [2025-01]
H10H 20/814
. . .
having reflecting means, e.g. semiconductor Bragg reflectors [2025-01]
H10H 20/8142
. . . .
{forming resonant cavity structures} [2025-01]
H10H 20/815
. . .
having stress relaxation structures, e.g. buffer layers [2025-01]
H10H 20/816
. . .
having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures [2025-01]
H10H 20/8162
. . . .
{Current-blocking structures} [2025-01]
H10H 20/817
. . .
characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous [2025-01]
H10H 20/818
. . . .
within the light-emitting regions [2025-01]
NOTE

  • When classifying in this group, classification is also made in group H10H 20/822 in order to identify the chemical composition of the light-emitting region.
H10H 20/819
. . .
characterised by their shape, e.g. curved or truncated substrates [2025-01]
H10H 20/82
. . . .
Roughened surfaces, e.g. at the interface between epitaxial layers [2025-01]
H10H 20/821
. . . .
of the light-emitting regions, e.g. non-planar junctions [2025-01]
H10H 20/8215
. . .
{characterised by crystalline imperfections, e.g. dislocations; characterised by the distribution of dopants, e.g. delta-doping} [2025-01]
H10H 20/822
. . .
Materials of the light-emitting regions [2025-01]
NOTE

  • When classifying in this group, constituents of a material are considered irrespective of any dopants or other impurities.
H10H 20/823
. . . .
comprising only Group II-VI materials, e.g. ZnO [2025-01]
H10H 20/8232
. . . . .
{characterised by the dopants} [2025-01]
H10H 20/824
. . . .
comprising only Group III-V materials, e.g. GaP [2025-01]
H10H 20/8242
. . . . .
{characterised by the dopants} [2025-01]
H10H 20/825
. . . . .
containing nitrogen, e.g. GaN [2025-01]
H10H 20/8252
. . . . . .
{characterised by the dopants} [2025-01]
H10H 20/826
. . . .
comprising only Group IV materials [2025-01]
WARNING

H10H 20/8262
. . . . .
{characterised by the dopants} [2025-01]
H10H 20/8264
. . . . .
{comprising polycrystalline, amorphous or porous Group IV materials} [2025-01]
WARNING

H10H 20/83
. .
Electrodes [2025-01]
WARNING

H10H 20/831
. . .
characterised by their shape [2025-01]
WARNING

H10H 20/8312
. . . .
{extending at least partially through the bodies} [2025-01]
H10H 20/8314
. . . .
{extending at least partially onto an outer side surface of the bodies} [2025-01]
H10H 20/8316
. . . .
{Multi-layer electrodes comprising at least one discontinuous layer} [2025-01]
H10H 20/832
. . .
characterised by their material [2025-01]
WARNING

H10H 20/833
. . . .
Transparent materials [2025-01]
WARNING

H10H 20/835
. . . .
{Reflective materials} [2025-01]
WARNING

H10H 20/84
. .
Coatings, e.g. passivation layers or antireflective coatings [2025-01]
WARNING

H10H 20/841
. . .
Reflective coatings, e.g. dielectric Bragg reflectors [2025-01]
WARNING

H10H 20/85
. .
Packages [2025-01]
WARNING

H10H 20/8502
. . .
{Surface mount technology [SMT] type packages} [2025-01]
WARNING

H10H 20/8504
. . .
{Chip-scale type packages} [2025-01]
WARNING

H10H 20/8506
. . .
{Containers} [2025-01]
WARNING

H10H 20/8508
. . .
{Package substrates, e.g. submounts} [2025-01]
WARNING

H10H 20/851
. . .
Wavelength conversion means [2025-01]
WARNING

H10H 20/8511
. . . .
{characterised by their material, e.g. binder} [2025-01]
WARNING

H10H 20/8512
. . . . .
{Wavelength conversion materials} [2025-01]
WARNING

H10H 20/8513
. . . . . .
{having two or more wavelength conversion materials} [2025-01]
WARNING

H10H 20/8514
. . . .
{characterised by their shape, e.g. plate or foil} [2025-01]
WARNING

H10H 20/8515
. . . .
{not being in contact with the bodies} [2025-01]
WARNING

H10H 20/8516
. . . .
{having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient} [2025-01]
WARNING

H10H 20/852
. . .
Encapsulations [2025-01]
WARNING

H10H 20/853
. . . .
characterised by their shape [2025-01]
WARNING

H10H 20/854
. . . .
characterised by their material, e.g. epoxy or silicone resins [2025-01]
WARNING

H10H 20/855
. . .
Optical field-shaping means, e.g. lenses [2025-01]
WARNING

H10H 20/856
. . . .
Reflecting means [2025-01]
WARNING

H10H 20/857
. . .
Interconnections, e.g. lead-frames, bond wires or solder balls [2025-01]
WARNING

H10H 20/858
. . .
Means for heat extraction or cooling [2025-01]
WARNING

H10H 20/8581
. . . .
{characterised by their material} [2025-01]
WARNING

H10H 20/8582
. . . .
{characterised by their shape} [2025-01]
WARNING

H10H 20/8583
. . . .
{not being in contact with the bodies} [2025-01]
WARNING

H10H 20/8584
. . . .
{electrically controlled, e.g. Peltier elements} [2025-01]
WARNING

H10H 20/8585
. . . .
{being an interconnection} [2025-01]
WARNING

H10H 20/8586
. . . .
{comprising fluids, e.g. heat-pipes} [2025-01]
WARNING

H10H 20/862
. .
{Resonant cavity structures (formed by reflecting means in the bodies H10H 20/8142)} [2025-01]
WARNING

H10H 20/872
. .
{Periodic patterns for optical field-shaping, e.g. photonic bandgap structures} [2025-01]
WARNING

H10H 20/882
. .
{Scattering means (H10H 20/82 takes precedence)} [2025-01]
WARNING

H10H 29/00
Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H 20/00 [2025-01]
H10H 29/01
.
Manufacture or treatment [2025-01]
WARNING

H10H 29/011
. .
{of integrated devices comprising at least one light-emitting semiconductor component covered by group H10H 20/00} [2025-01]
WARNING

H10H 29/012
. .
{of active-matrix LED displays} [2025-01]
H10H 29/02
. .
using pick-and-place processes [2025-01]
H10H 29/03
. .
using mass transfer of LEDs, e.g. by using liquid suspensions [2025-01]
H10H 29/032
. .
{of electrodes} [2025-01]
WARNING

H10H 29/034
. .
{of coatings} [2025-01]
WARNING

H10H 29/036
. .
{of packages} [2025-01]
WARNING

H10H 29/0361
. . .
{of wavelength conversion means} [2025-01]
WARNING

H10H 29/0362
. . .
{of encapsulations} [2025-01]
WARNING

H10H 29/0363
. . .
{of optical field-shaping means} [2025-01]
WARNING

H10H 29/0364
. . .
{of interconnections} [2025-01]
WARNING

H10H 29/0365
. . .
{of means for heat extraction or cooling} [2025-01]
WARNING

H10H 29/10
.
Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H 20/00 (active-matrix LED displays H10H 29/30) [2025-01]
WARNING

H10H 29/14
. .
comprising multiple light-emitting semiconductor components [2025-01]
WARNING

H10H 29/142
. . .
{Two-dimensional arrangements, e.g. asymmetric LED layout} [2025-01]
WARNING

H10H 29/20
.
Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H 20/00 (active-matrix LED displays H10H 29/30) [2025-01]
H10H 29/24
. .
comprising multiple light-emitting semiconductor devices [2025-01]
H10H 29/30
.
Active-matrix LED displays [2025-01]
NOTE

  • This group covers active-matrix displays where the emphasis of the invention concerns the LEDs, the layers closely related to the LEDs or constructional details closely related to the LEDs, e.g. interconnections between the LEDs or their encapsulations.
WARNING

H10H 29/32
. .
characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel [2025-01]
H10H 29/34
. .
characterised by the geometry or arrangement of subpixels within a pixel, e.g. relative disposition of the RGB subpixels [2025-01]
H10H 29/345
. . .
{the area of the subpixels being different} [2025-01]
H10H 29/352
. .
{characterised by differences in geometry or arrangement of elements, subpixels or pixels in different regions of the display, e.g. at the central and peripheral regions} [2025-01]
H10H 29/362
. .
{comprising more than three subpixels, e.g. red-green-blue-white [RGBW]} [2025-01]
H10H 29/37
. .
Pixel-defining structures, e.g. banks between the LEDs [2025-01]
H10H 29/39
. .
Connection of the pixel electrodes to the driving transistors [2025-01]
H10H 29/41
. .
Insulating layers formed between the driving transistors and the LEDs [2025-01]
H10H 29/45
. .
comprising two substrates, each having active devices thereon, e.g. displays comprising LED arrays and driving circuitry on different substrates [2025-01]
H10H 29/49
. .
Interconnections, e.g. wiring lines or terminals (connection of the pixel electrodes to the driving transistors H10H 29/39) [2025-01]
WARNING

H10H 29/80
.
Constructional details [2025-01]
NOTE

  • Classification is made in group H10H 29/80 when the constructional detail is relevant to integrated devices or assemblies comprising multiple devices. When the constructional detail is relevant to individual devices, then classification is made in group H10H 20/80.
WARNING

H10H 29/832
. .
{Electrodes} [2025-01]
WARNING

H10H 29/8321
. . .
{characterised by their shape} [2025-01]
WARNING

H10H 29/8322
. . .
{characterised by their materials} [2025-01]
WARNING

H10H 29/8323
. . . .
{Transparent materials} [2025-01]
WARNING

H10H 29/8325
. . . .
{Reflective materials} [2025-01]
WARNING

H10H 29/842
. .
{Coatings, e.g. passivation layers or antireflective coatings} [2025-01]
WARNING

H10H 29/8421
. . .
{Reflective coatings, e.g. dielectric Bragg reflectors} [2025-01]
WARNING

H10H 29/85
. .
Packages [2025-01]
WARNING

H10H 29/8506
. . .
{Containers} [2025-01]
WARNING

H10H 29/8508
. . .
{Package substrates, e.g. submounts} [2025-01]
WARNING

H10H 29/851
. . .
Wavelength conversion means [2025-01]
WARNING

H10H 29/8511
. . . .
{characterised by their material, e.g. binder} [2025-01]
WARNING

H10H 29/8512
. . . . .
{Wavelength conversion materials} [2025-01]
WARNING

H10H 29/8513
. . . . . .
{having two or more wavelength conversion materials} [2025-01]
WARNING

H10H 29/8514
. . . .
{characterised by their shape, e.g. plate or foil} [2025-01]
WARNING

H10H 29/8515
. . . .
{not being in contact with the bodies} [2025-01]
WARNING

H10H 29/8516
. . . .
{having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient} [2025-01]
WARNING

H10H 29/8517
. . .
{Colour filters} [2025-01]
WARNING

H10H 29/852
. . .
Encapsulations [2025-01]
WARNING

H10H 29/853
. . . .
characterised by their shape [2025-01]
WARNING

H10H 29/854
. . . .
characterised by their material, e.g. epoxy or silicone resins [2025-01]
WARNING

H10H 29/855
. . .
Optical field-shaping means, e.g. lenses [2025-01]
WARNING

H10H 29/8552
. . . .
{Light absorbing arrangements, e.g. black matrix} [2025-01]
WARNING

H10H 29/856
. . . .
Reflecting means [2025-01]
WARNING

H10H 29/857
. . .
{Interconnections (of active-matrix LED displays H10H 29/49)} [2025-01]
WARNING

H10H 29/858
. . .
{Means for heat extraction or cooling} [2025-01]
WARNING

H10H 29/8581
. . . .
{characterised by their material} [2025-01]
WARNING

H10H 29/8582
. . . .
{characterised by their shape} [2025-01]
WARNING

H10H 29/8583
. . . .
{not being in contact with the bodies} [2025-01]
WARNING

H10H 29/8584
. . . .
{electrically controlled, e.g. Peltier elements} [2025-01]
WARNING

H10H 29/8585
. . . .
{being an interconnection} [2025-01]
WARNING

H10H 29/8586
. . . .
{comprising fluids, e.g. heat-pipes} [2025-01]
WARNING

H10H 29/862
. .
{Resonant cavity structures} [2025-01]
WARNING

H10H 29/872
. .
{Periodic patterns for optical field-shaping, e.g. photonic bandgap structures} [2025-01]
WARNING

H10H 29/882
. .
{Scattering means} [2025-01]
WARNING

H10H 29/922
. .
{Parallel electrical configurations of multiple light-emitting semiconductor components or devices} [2025-01]
WARNING

H10H 29/942
. .
{Serial electrical configurations of multiple light-emitting semiconductor components or devices} [2025-01]
WARNING

H10H 29/962
. .
{Stacked configurations of light-emitting semiconductor components or devices, the components or devices emitting at different wavelengths} [2025-01]
WARNING

H10H 99/00
Subject matter not provided for in other groups of this subclass [2025-01]