Electrostatic motors, electric motors using thermal effect

H02N 1/002, H02N 10/00

Microphones, microspeakers: Electrostatic transducers using semiconductor materials

Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators. Details of micro-electro-mechanical resonators, Driving or d etection means, Comb electrodes

H03H 9/02244, H03H 9/2405, H03H 9/2447

Piezo-electric devices (includes rotory motors, actuators and sensors using a piezo-electric element)

Electro active polymer (EAP) actuated artificial muscles

Mechanically-driven clocks or watches; mechanical parts of clocks or watches in general N.B.: Processes for making gears (in particular for clocks) are classified in B81C 99/0075+

Micro pumps

F04B 19/006, G01N 2035/1034

Micro pumps having electric drive having plate-like flexible members, e.g. diaphragms

Ink jet, Nozzles, Production of nozzles, manufacturing processes, etching, dry etching, wet etching.

B41J 2/1626, B41J 2/1628, B41J 2/1629

Electrostatic relays; Electro-adhesion relays; making use of micromechanics

Switches making use of micromechanics; Apparatus or processes for their manufacturing, e.g. anisotropic etching (for electrostatic relays H01H 59/0009, for relays in general H01H 50/005)

Micromanipulators

Gyroscopes; Turn-sensitive devices using gyroscopic effect, e.g. using gas, using electron beam. Turn-sensitive devices with vibrating masses, e.g. tuning fork, the vibrating mass being an essentially two-dimensional body which undergoes a deformation or translation vibration in a micromechanical structure

Accelerometers, Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration

G01P 15/00, G01P 15/0802

Pressure sensors, manufacturing methods of pressure sensors

G01L 9/0041, G01L 9/0042

Measuring volume flow or mass flow

IR sensor

Arrangements or instruments for measuring magnetic variables (flux or magnetic sensors)

Acoustic emission sensors

Optical switches: Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light, e.g. switching, gating, modulating, the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD. T he reflecting element being moved or deformed by electrostatic means: by means of one or more diffracting elements: N.B: Optical devices or arrangements using movable or deformable optical elements for controlling the intensity, colour, phase, polarisation or direction of light are classified in subgroups of G02B 26/08 . In particular MEMS micromirrors and optical devices using them for changing the direction of light are treated in G02B 26/0833 and its subgroups.

G02B 26/0833, G02B 26/0841, G02B 26/0808

Microreactors, e.g. miniaturised or micro-fabricated reactors

Containers for the purpose of retaining a material to be analysed with fluid transport, e.g. multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip

B01L 3/5027, B01L 3/5027

Micromixers

Manufacture of fluid circuit elements; Manufacture of assemblages of such elements as integrated circuits (microvalves)

Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means. Electrophoresis for analysis in microdevices

Measuring or testing processes involving nucleic acids (DNA analysis)

Processes specially adapted for manufacturing semi-permeable membranes for separation processes or apparatus, Inorganic membrane formation (micropores)

Microneedles (devices for introducing media into the body) N.B.: Manufacturing methods (other then plastic moulding) for making raised tips (in particular microneedles) are classified in B81C 1/00111. Methods for coating the needles with an active material for therapeutic purposes is not classified in B81

Microneedles (Devices for taking blood samples by percutaneous method)

Recording or reproducing by means directly associated with the tip of a microscopic electrical probe as used in Scanning Tunneling Microscopy [STM] or Atomic Force Microscopy [AFM] for inducing physical or electrical perturbations in a recording medium

Digital stores characterised by movement of mechanical parts to effect storage, e.g. using balls; Storage elements therefor (storing by actuating contacts G11C 11/48) - RAM with mechanical structure

Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties. Bidimensional, e.g. nanoscale period nanomagnet arrays.

Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor, using electric elements, using ferroelectric elements (using multibit ferroelectric storage elements G11C 11/5657)

Read-only memory structures including field-effect components

Micromanipulators N.B: Documents which comply with the following criteria are to be classified in B81: The micromanipulator is specific to the manipulation and assembling of micro- or nanoparts for MEMS or NEMS. The device solves the problem of surface forces being higher than the gravitational force The document describes the structure and manufacturing process of the micro-manipulator. Methods for controlling the micromanipulator are to be classified in B25J 7/00 only.

Nanowires as interconnects for ICs

H01L 21/768

Nanowires as semiconductor heterojunction of materials of different groups

Semi-conductor nanowires / nanotubes / whiskers

Manufacturing method for silicon nanowires / nanotubes / whiskers

H01L 21/30

Single crystal growth methods of nanorods and nanowires (deposition)

Coated nanoparticles for use as pigments and/or fillers

C01G, C09C

Other nanoparticles

C01B 13/00, C01B 17/00, C01C, C01F

Semi-conductor nanoparticles

Nanowires: electrolytic coating by surface reaction, i.e. forming conversion layers

Hyperbranched macromolecules

Details of semiconductor or other solid state devices, marks applied to semiconductor devices (or parts), e.g. registration marks, test patterns (alignment structures, wafer maps), using circuits for characterising or monitoring manufacturing processes, e.g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process/product control monitors or PCM, devices in scribe-line/kerv, drop-in devices

Measuring probes, probe needles, cantilever beams, "bump" contacts; replaceable spring loaded probe pinsN.B: plugs, sockets or clips are in G01R 1/0408; testing of connections in G01R 31/04; contacting IC's for test purposes when probe design is not the essential feature in G01R 31/2886; using radiation beam as probe in G01R 31/302; end pieces for wires terminating in a probe in H01R 11/18

G01R 1/06711

Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor, Apparatus for microlithography

Imprinting and embossing machines

Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes (no fixed position being assigned to or needed to be assigned to the individual characters or partial characters), by control of light from an independent source. Control circuit for an array of optical MEMS, for example for avoiding stiction.

Apparatus or processes specially adapted for manufacturing or assembling transformers, inductances, reactors or choke coils, for applying magnetic films to substrates (covering metals, or materials with metals, in general C23C; manufacturing record carriers G11B 5/84), for applying nanostructures, e.g. by molecular beam epitaxy (MBE)

Variable MEMS capacitors

Injection moulding (for example for micro-needles)

B29C 45/00

Extending structures

Pillar / ColumnTip

Depressed structures

Cavity GrooveHole

Suspended structures

Bridge Cantilever Diaphragm See-sawComb structure

Extending structures

AnchorRib

Depressed structures

ChannelNozzle

Suspended structures

Flexure Membrane Spring Torsion hingeProof mass

Rotating elements

Gears Rack and pinionHinge

Pillar/Column

A tall vertical structure, usually narrow in proportion to its height, which is usually used as a support structure, anti-adhesion structure or a structure for thermal exchange.

Tip

Tips are small pointed or rounded structures often used for Scanning Probe Microscopy probes (SPM) - like atomic force microscope (AFM), but also for data storage (Millipede), electron tunnelling tip (used in sensors) or microneedles.

Bump

is also used in relation to structures for reducing adhesion.

Functional layers

Functional layers are used mostly as protective coatings. They can protect structures against chemical or mechanical corrosion that can release particles into the protected cavity. Special coatings are used also to prevent adhesion of movable structures or to reduce the stress. Metallic layers covering polymer sealing are used to make them hermetic, but can be used also to compensate the RF-interferences.

Anchor

Anchors are structures connecting the suspended movable parts to the substrate. They can affect the resonant frequency and the reliability of the device. Figure 2 : Anchor (US2005032266)

Rib

Stiffening ribs are may be used to improve the stiffness of suspended structures. Improving the stiffness to mass ratio, they can have impact on resonant frequency and efficiency of the devices.

Cavity

In bulk micromachining, cavity is used to make the movement of a suspended element possible. It can be used also for the protection of movable structures in packaging, for thermal insulation or as a container for fluids (see Figure 1). The synonyms are chamber, hollow, well.

Groove

A typical example is a V-Groove (see Figure 1), which can be formed in 100 - Si substrate by KOH etching. Sometimes the groove in 111 - Si substrate is called channel or trench to distinguish them, but we consider channel to be a function oriented definition. Grooves are usually used in microfluidic applications, but can also be used for precise positioning of optical fibres or controlled weakening of structures holding a device prior to its separation by breaking.

Hole

An aperture passing through anything, a perforation, opening.

Channel

A tube or tubular passage, natural or artificial, usually for liquids or fluids.

Nozzle

A spout, mouthpiece, projecting aperture, or a short terminal pipe from which a jet of gas or liquid may issue or be discharged (see Figure 1).

Bridge

A bridge is a structure, erected or suspended over a surface, depression or an obstruction, connecting two or more extremities, including structures with supports deformable in torsion (see Figure 4), flexion or supported by springs (see Figure 5 ). Figure 3 : Bridge (flow sensor: US6626037) Figure 4 : Bridge with torsion hinges (accelerometer: EP1431240) Figure 5 : Bridge with springs (inertial sensor: DE10118340) Application : thermal insulation for flow sensors, infra-red sensors, bolometers. According to this definition, most of the accelerometers, gyroscopes and micromirrors are bridges

Cantilever

A cantilever is a structure which projects beyond a supporting column on a wall and is counterbalanced and/or supported at only one end. Cantilevers are also called flexures, suspension or cantilever beams and suspension springs if their structure is more complicated. These elements usually store and release mechanical energy by deformation resulting in vibration. A proof mass can be attached to one extremity of a cantilever. If there is a cantilever on both sides of a supported structure (proof mass or a micromirror), this structure is called a bridge. Figure 6: Cantilever/flexure with proof mass (accelerometer: EP1431240) Figure 7 : Cantilever (microvalve: EP1496269)Application: switches, resonators, chemical and biological sensors, accelerometers

Diaphragm

A diaphragm is a layer covering a hole or a cavity, fixed to a frame all along its periphery, separating two environments. This separation can be hermetic or not, permanent or temporal and its opening can be controllable. Diaphragms can be perforated or have a seismic mass attached to it. Figure 8 : Diaphragm (micropump: FR2862629) Applications: pressure sensors, microphones, ultra-sound resonators, valves, accelerometers, thermal insulation

See-saw

See-saw structures are suspended structures supported by a flexible element which main axis is usually perpendicular to the substrate plane. These structures can be used as a support for micromirrors, switches, gyroscopes and resonators. Figure 9: See-saw (EP1306348)

Comb structure, comb drive

A comb is a structure with a pair of comb-shaped electrodes. This shape increases the total capacitor surface. Comb structures are used for actuation or sensing. When voltage is applied, the combs are attracted to each-other. They are often attached to a deformable element that pulls them back to the initial position because they can not develop a repulsive force. Figure 10 : Comb structure (EP1868024)

Flexure

Flexure or a flexure beam is a structural element that carries load primarily in bending. Deformation comprises bending about an axis normal to the beam's axis. This allows the structures to move along the perpendicular axis to the substrate (see Figure 6).

Membrane

A membrane is a thin layer separating two environments allowing selective mass transport control, like chemical or physical filtering or separation of substances. Membrane is often used as synonym to diaphragm.

Spring

Spring is a suitably shaped structure that can return to its original shape after a deformation (see Figure 5).

Torsion hinge

Torsion hinge also called deformation hinge or a torsion beam is an element that deforms by twisting about an axis parallel to the beam's axis. This allows the structures to rotate around the axis parallel to the substrate (see Figure 4).

Proof mass

Proof mass also called seismic mass is a structural element usually connected to a deformable element. The mass of this element defines the resonant frequency, sensitivity and precision of the system. In some cases, holes or grooves are made on the proof mass to control or eliminate damping (see Figure 6).

Gears

A gear is a toothed wheel designed to transmit torque to another gear or toothed component.

Rack and pinion

Structure used to transform rotation to translation movement.

Hinge

The movable joint or mechanism to provide for the turning of two movable parts. Figure 11: Hinge

Interconnects

Electrically conducting element for transmitting a signal from one point to another one. Interconnects that may be formed on, in or through the substrate or any element formed on the substrate (e.g. lid of a package). A via is a particular form of an interconnect.

Electrodes

Electrically conducting element through which an electric current enters or leaves a substance (or a vacuum) whose electrical characteristics are being measured, used, or manipulated. Also terminal points in electrical components.

Thermal actuators

The movement is generated by the difference in thermal expansion of two of more elements (generally beams), each elements having at least one anchoring point to the substrate. A typical thermal actuator is formed out of two parallel beams (one cold beam and one thermal beam) attached at one end to the substrate and having one connecting point at the other end. When the temperature of the thermal beam becomes higher than the temperature of the cold beam, the difference of thermal expansion generates a deflection at the connecting point. Figure 12 : Thermal beam (US2003002133) Search and Classification Notes: Thermal actuators are also found in H01H.

Bimorph and unimorph actuators

A bimorph is a cantilever that consists of two active layers. These layers produce a displacement via: Thermal activation (a temperature change causes one layer to expand more than the other). Electrical activation as in a piezoelectric bimorph (electric field(s) cause one layer to extend and the other layer to contract). A piezoelectric unimorph has one active (i.e. piezoelectric) layer and one inactive (i.e. non-piezoelectric) layer. For example in the following figure, in response to application of a voltage to the first movable electrode 25, the second movable electrode 26, and the third movable electrode 27, the piezoelectric thin film 1 extends/contracts and the movable section 23 is driven toward the substrate 21. Figure 13 : Bimorph actuator (US2008296529)

Microneedles (devices for introducing media into the body)

Microneedles (Devices for taking blood samples by percutaneous method)

Micro Dynamo-electric machines, rotary and linear motors or generators

Integration of a processing unit (circuit that transforms, amplifies, computes...) with a MEMS device (Smart-MEMS)

Networks or arrays of similar micro-structural devices