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Outline
Indent Level
Color Curly Brackets (indicating CPC extensions to IPC) References Date Revised

CPC
COOPERATIVE PATENT CLASSIFICATION
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MAGNETS ; INDUCTANCES ; TRANSFORMERS ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ( ceramics based on ferrites C04B 35/26 ; alloys C22C;
{
construction of loading coils H01B
}
; thermomagnetic devices H01L 37/00 ; loudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers H04R )
NOTE
-
In this subclass, inductances and transformers are regarded as being "for power supply" if they are intended for this purpose even in systems operating at frequencies above 60 cycles/sec.

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Magnets or magnetic bodies characterised by the magnetic materials therefor ; Selection of materials for their magnetic properties
H01F 1/0009
.
{
Antiferromagnetic materials, i.e. materials exhibiting a Néel transition temperature ( H01F 1/0036 takes precedence )
}
WARNING
-
This groups is not complete pending the completion of reclassification; see provisionally also H01F 1/00 - H01F 1/447

H01F 1/0018
.
{
Diamagnetic or paramagnetic materials, i.e. materials with low susceptibility and no hysteresis ( H01F 1/0036 takes precedence )
}
H01F 1/0027
.
{
Thick magnetic films ( forming thick magnetic films H01F 41/16 ; magnetic record carriers G11B 5/70 )
}
NOTE
-
Group H01F 1/0036 takes precedence over groups H01F 1/09 , H01F 1/11 , H01F 1/20 , H01F 1/33 and H01F 1/36

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.
{
showing low dimensional magnetism, i.e. spin rearrangements due to a restriction of dimensions, e.g. showing giant magnetoresistivity, ( H01F 1/153 , H01F 1/42 and H01F 10/00 take precedence; magnetoresistive sensors G01D 5/16 , G01R 33/06 ; magnetoresistive recording G11B 5/39 ; magnetic-field-controlled resistors H01L 43/08 )
}
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H01F 1/0045
. .
{
Zero dimensional, e.g. nanoparticles, soft nanoparticles for medical/biological use ( preparation of fullerenes in general C01B 31/0206 )
}
H01F 1/0054
. . .
{
Coated nanoparticles, e.g. nanoparticles coated with organic surfactant
}
H01F 1/0063
. . .
{
in a non-magnetic matrix, e.g. granular solids ( granular films H01F 10/007 )
}
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H01F 1/0072
. .
{
one dimensional, i.e. linear or dendritic nanostructures
}
H01F 1/0081
. . .
{
in a non-magnetic matrix, e.g. Fe-nanowires in a nanoporous membrane
}
H01F 1/009
. .
{
bidimensional, e.g. nanoscale period nanomagnet arrays ( H01F 10/007 takes precedence )
}
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.
of inorganic materials ( H01F 1/44 takes precedence )
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H01F 1/012
. .
{
adapted for magnetic entropy change by magnetocaloric effect, e.g. used as magnetic refrigerating material ( refrigeration systems using magnetic effects F25B 21/00 )
}
H01F 1/015
. . .
{
Metals or alloys
}
H01F 1/017
. . .
{
Compounds
}
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. .
characterised by their coercivity
{
( H01F 1/40 takes precedence )
}
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H01F 1/0302
. . .
{
characterised by unspecified or heterogeneous hardness or specially adapted for magnetic hardness transitions
}
H01F 1/0304
. . . .
{
adapted for large Barkhausen jumps or domain wall rotations, e.g. WIEGAND or MATTEUCCI effect ( H01F 1/143 and H01F 1/15391 take precedence )
}
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H01F 1/0306
. . . .
{
Metals or alloys, e.g. LAVES phase alloys of the MgCu2-type ( H01F 1/0304 takes precedence )
}
H01F 1/0308
. . . . .
{
with magnetic shape memory (MSM), i.e. with lattice transformations driven by a magnetic field, e.g. Heusler alloys
}
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H01F 1/0311
. . . .
{
Compounds ( H01F 1/0304 takes precedence )
}
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H01F 1/0313
. . . . .
{
Oxidic compounds
}
H01F 1/0315
. . . . . .
{
Ferrites
}
H01F 1/0317
. . . . . .
{
Manganites
}
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. . .
of hard-magnetic materials
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H01F 1/04
. . . .
Metals or alloys
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H01F 1/047
. . . . .
Alloys characterised by their composition
NOTE
-
In groups H01F 1/053 to H01F 1/059 , an alloy is classified in the last appropriate place

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H01F 1/053
. . . . . .
containing rare earth metals
H01F 1/0533
. . . . . . .
{
in a bonding agent
}
H01F 1/0536
. . . . . . .
{
sintered
}
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H01F 1/055
. . . . . . .
and magnetic transition metals, e.g. SmCo5
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H01F 1/0551
. . . . . . . .
{
in the form of particles, e.g. rapid quenched powders or ribbon flakes
}
H01F 1/0552
. . . . . . . . .
{
with a protective layer
}
H01F 1/0553
. . . . . . . .
{
obtained by reduction or by hydrogen decrepitation or embrittlement
}
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H01F 1/0555
. . . . . . . .
{
pressed, sintered or bonded together
}
H01F 1/0556
. . . . . . . . .
{
pressed
}
H01F 1/0557
. . . . . . . . .
{
sintered
}
H01F 1/0558
. . . . . . . . .
{
bonded together
}
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H01F 1/057
. . . . . . . .
and IIIa elements, e.g. Nd2Fe14B
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H01F 1/0571
. . . . . . . . .
{
in the form of particles, e.g. rapid quenched powders or ribbon flakes
}
H01F 1/0572
. . . . . . . . . .
{
with a protective layer
}
H01F 1/0573
. . . . . . . . . .
{
obtained by reduction or by hydrogen decrepitation or embrittlement
}
H01F 1/0574
. . . . . . . . . .
{
obtained by liquid dynamic compaction
}
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H01F 1/0575
. . . . . . . . . .
{
pressed, sintered or bonded together
}
H01F 1/0576
. . . . . . . . . . .
{
pressed, e.g. hot working
}
H01F 1/0577
. . . . . . . . . . .
{
sintered
}
H01F 1/0578
. . . . . . . . . . .
{
bonded together
}
H01F 1/0579
. . . . . . . . .
{
with exchange spin coupling between hard and soft nanophases, e.g. nanocomposite spring magnets
}
H01F 1/058
. . . . . . . .
and IVa elements, e.g. Gd2Fe14C
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H01F 1/059
. . . . . . . .
and Va elements, e.g. Sm2Fe17N2
H01F 1/0593
. . . . . . . . .
{
of tetragonal ThMn12-structure
}
H01F 1/0596
. . . . . . . . .
{
of rhombic or rhombohedral Th2Zn17 structure or hexagonal Th2Ni17 structure
}
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. . . . .
in the form of particles, e.g. powder ( H01F 1/047 takes precedence;
{
record carriers G11B 5/70605
}
)
H01F 1/061
. . . . . .
{
with a protective layer
}
H01F 1/063
. . . . . .
{
with a non magnetic core
}
H01F 1/065
. . . . . .
{
obtained by a reduction
}
H01F 1/066
. . . . . .
{
obtained by liquid dynamic compaction
}
H01F 1/068
. . . . . .
{
having a L10 crystallographic structure, e.g. [Co,Fe
}
[Pt,Pd] (nano)particles]
WARNING
-
This groups is not complete pending the completion of reclassification; see provisionally also H01F 1/06 - H01F 1/066

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H01F 1/08
. . . . . .
pressed, sintered, or bound together
H01F 1/083
. . . . . . .
{
in a bonding agent
}
H01F 1/086
. . . . . . .
{
sintered
}
. . . .
Mixtures of metallic and non-metallic particles ; Metallic particles having oxide skin
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. . . .
Non-metallic substances, e.g. ferrites
{
e.g. [(Ba,Sr)O(Fe2O3)6
}
ferrites with hexagonal structure]
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H01F 1/11
. . . . .
in the form of particles
{
( for magnetic record carriers G11B 5/70626 )
}
H01F 1/111
. . . . . .
{
with a non-magnetic core
}
H01F 1/112
. . . . . .
{
with a skin ( H01F 1/113 takes precedence )
}
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H01F 1/113
. . . . . .
in a bonding agent
H01F 1/117
. . . . . . .
Flexible bodies
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. . .
of soft-magnetic materials
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H01F 1/14
. . . .
Metals or alloys
H01F 1/143
. . . . .
{
in the form of wires ( H01F 1/147 takes precedence )
}
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H01F 1/147
. . . . .
Alloys characterised by their composition
{
( treatment thereof for enhancing their electromagnetic properties C21D 8/12 )
}
NOTE
-
In groups H01F 1/14708 to H01F 1/15391 , an alloy is classified in the last appropriate place

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H01F 1/14708
. . . . . .
{
Fe-Ni based alloys ( pure Fe or Ni H01F 1/14 , H01F 1/16 or H01F 1/20 )
}
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H01F 1/14716
. . . . . . .
{
in the form of sheets
}
H01F 1/14725
. . . . . . . .
{
with insulating coating
}
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H01F 1/14733
. . . . . . .
{
in the form of particles
}
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H01F 1/14741
. . . . . . . .
{
pressed, sintered or bonded together
}
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H01F 1/1475
. . . . . . . . .
{
the particles being insulated
}
H01F 1/14758
. . . . . . . . . .
{
by macromolecular organic substances
}
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H01F 1/14766
. . . . . .
{
Fe-Si based alloys
}
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H01F 1/14775
. . . . . . .
{
in the form of sheets
}
H01F 1/14783
. . . . . . . .
{
with insulating coating
}
H01F 1/14791
. . . . . . .
{
Fe-Si-Al based alloys, e.g. Sendust
}
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. . . . . .
Amorphous metallic alloys, e.g. glassy metals
{
( making ferrous amorphous alloys C22C 33/003 )
}
H01F 1/15308
. . . . . . .
{
based on Fe/Ni ( H01F 1/15325 takes precedence )
}
H01F 1/15316
. . . . . . .
{
based on Co ( H01F 1/15325 takes precedence )
}
H01F 1/15325
. . . . . . .
{
containing rare earths
}
H01F 1/15333
. . . . . . .
{
containing nanocrystallites, e.g. obtained by annealing
}
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H01F 1/15341
. . . . . . .
{
Preparation processes therefor
}
H01F 1/1535
. . . . . . . .
{
by powder metallurgy, e.g. spark erosion
}
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H01F 1/15358
. . . . . . .
{
Making agglomerates therefrom, e.g. by pressing
}
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H01F 1/15366
. . . . . . . .
{
using a binder
}
H01F 1/15375
. . . . . . . . .
{
using polymers
}
H01F 1/15383
. . . . . . .
{
Applying coatings thereon ( H01F 1/15366 takes precedence )
}
H01F 1/15391
. . . . . . .
{
Elongated structures, e.g. wires
}
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. . . . .
in the form of sheets ( H01F 1/147 takes precedence )
H01F 1/18
. . . . . .
with insulating coating
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. . . . .
in the form of particles, e.g. powder ( H01F 1/147 takes precedence )
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H01F 1/22
. . . . . .
pressed, sintered, or bound together
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H01F 1/24
. . . . . . .
the particles being insulated
H01F 1/26
. . . . . . . .
by macromolecular organic substances
H01F 1/28
. . . . . .
dispersed or suspended in a bonding agent
. . . .
Mixtures of metallic and non-metallic particles ; Metallic particles having oxide skin
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. . . .
Non-metallic substances, e.g. ferrites
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H01F 1/342
. . . . .
{
Oxides ( H01F 1/36 and H01F 1/38 take precedence )
}
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H01F 1/344
. . . . . .
{
Ferrites, e.g. having a cubic spinel structure (X2+O)(Y23+O3); e.g. magnetite Fe3O4
}
H01F 1/346
. . . . . . .
[(TO4) 3] with T= Si, Al, Fe, Ga ( H01F 10/24 takes precedence; Faraday rotators G02F 1/09 )]
H01F 1/348
. . . . . . .
{
Hexaferrites with decreased hardness or anisotropy, i.e. with increased permeability in the microwave (GHz) range, e.g. having a hexagonal crystallographic structure
}
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H01F 1/36
. . . . .
in the form of particles
{
( H01F 1/346 , H01F 1/348 and H01F 1/38 take precedence )
}
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H01F 1/37
. . . . . .
in a bonding agent
H01F 1/375
. . . . . . .
Flexible bodies
H01F 1/38
. . . . .
amorphous, e.g. amorphous oxides
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. .
of magnetic semiconductor materials, e.g. CdCr2S4 ( devices using galvano-magnetic or similar effects H01L 43/00 )
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H01F 1/401
. . .
{
diluted
}
NOTE
-
In group H01F 1/401 , a diluted magnetic semiconductor (DMS) is classified in the last appropriate place

H01F 1/402
. . . .
{
of II-VI type, e.g. Zn1-x Crx Se
}
H01F 1/404
. . . .
{
of III-V type, e.g. In1-x Mnx As
}
H01F 1/405
. . . .
{
of IV type, e.g. Ge1-xMnx
}
H01F 1/407
. . . .
{
Diluted non-magnetic ions in a magnetic cation-sublattice, e.g. perovskites, La1-x(Ba,Sr)xMnO3
}
H01F 1/408
. . .
{
half-metallic, i.e. having only one electronic spin direction at the Fermi level, e.g. CrO2, Heusler alloys ( H01F 10/1936 takes precedence )
}
.
of organic or organo-metallic materials,
{
e.g. graphene
}
( H01F 1/44 akes precedence )
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.
of magnetic liquids, e.g. ferrofluids ( particles in a bonding agent H01F 1/28 , H01F 1/36 ,
{
H01F 1/37
}
)
H01F 1/442
. .
{
the magnetic component being a metal or alloy, e.g. Fe ( H01F 1/447 takes precedence )
}
H01F 1/445
. .
{
the magnetic component being a compound, e.g. Fe3O4 ( H01F 1/447 takes precedence )
}
H01F 1/447
. .
{
characterised by magnetoviscosity, e.g. magnetorheological, magnetothixotropic, magnetodilatant liquids ( electrorheological fluids C10M 171/001 )
}
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Cores, Yokes, or armatures ( magnetic materials H01F 1/00 ; permanent magnets H01F 7/02 )
H01F 2003/005
.
{
Magnetic cores for receiving several windings with perpendicular axes, e.g. for antennae or inductive power transfer
}
H01F 3/02
.
made from sheets
H01F 3/04
.
made from strips or ribbons
H01F 3/06
.
made from wires
H01F 3/08
.
made from powder ( powder coatings on sheets H01F 3/02 ; on strips or ribbons H01F 3/04 ; on wires H01F 3/06 )
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H01F 3/10
.
Composite arrangements of magnetic circuits
H01F 2003/103
. .
{
Magnetic circuits with permanent magnets
}
H01F 2003/106
. .
{
Magnetic circuits using combinations of different magnetic materials
}
H01F 3/12
. .
Magnetic shunt paths
H01F 3/14
. .
Constrictions ; Gaps, e.g. air-gaps ( in magnetic shunt paths H01F 3/12 )
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Coils ( superconducting coils H01F 6/06 ; fixed inductances of the signal type H01F 17/00 )
H01F 5/003
.
{
Printed circuit coils
}
H01F 2005/006
.
{
with conical spiral form
}
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H01F 5/02
.
wound on non-magnetic supports, e.g. formers
H01F 2005/022
. .
{
wound on formers with several winding chambers separated by flanges, e.g. for high voltage applications
}
H01F 2005/025
. .
{
wound on coaxial arrangement of two or more formers
}
H01F 2005/027
. .
{
wound on formers for receiving several coils with perpendicular winding axes, e.g. for antennae or inductive power transfer
}
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H01F 5/04
.
Arrangements of electric connections to coils, e.g. leads
H01F 2005/043
. .
{
having multiple pin terminals, e.g. arranged in two parallel lines at both sides of the coil
}
H01F 2005/046
. .
{
Details of formers and pin terminals related to mounting on printed circuits
}
H01F 5/06
.
Insulation of windings
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Superconducting magnets ; Superconducting coils
{
( magnetic resonance assemblies using superconducting coil systems G01R 33/3815 )
}
H01F 2006/001
.
{
Constructive details of inductive current limiters
}
H01F 6/003
.
{
Methods and means for discharging superconductive storage ( superconducting alloys C22C ; static memories with superconducting elements G11C 11/44 ; superconducting circuit breakers with contacts H01H 33/004 ; superconducting material H01L 39/00 ; power cryotons H01L 39/20 ; superconducting switches for low power H03K 17/92 )
}
H01F 6/005
.
{
Methods and means for increasing the stored energy in superconductive coils by increments ( flux pumps )
}
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H01F 6/006
.
{
Supplying energising or de-energising current; Flux pumps
}
H01F 6/008
. .
{
Electric circuit arrangements for energising superconductive electromagnets
}
H01F 6/02
.
Quenching ; Protection arrangements during quenching
{
( protection circuits H02H 7/001 )
}
H01F 6/04
.
Cooling
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H01F 6/06
.
Coils, e.g. winding, insulating, terminating or casing arrangements therefor
H01F 6/065
. .
{
Feed-through bushings, terminals and joints ( leading of conductors or axles through casings of transformers H01F 27/04 )
}
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Magnets ( superconducting magnets H01F 6/00 ; for separation of solid materials or fluids B03C 1/00 ; for bench or like work-holders B23B 31/28 , B23Q 3/00 ; work-holding devices B25B 11/00 ; lifting magnets B66C 1/00 ;
{
operating or controlling locks using permanent magnets E05B 47/0038 ; devices for holding a wing, e.g. door or window, by magnetic or electromagnetic attraction E05C 19/16 ; relieving load or bearings using magnetic means F16C 39/06
}
; for electric meters G01R ; for relays H01H ;
{
for electric discharge tubes H01J , e.g. H01J 3/24 , H01J 23/10 , H01J 29/68
}
; for dynamo-electric machines H02K )
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H01F 7/02
.
Permanent magnets
{
(PM)
}
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H01F 7/0205
. .
{
Magnetic circuits with PM in general
}
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H01F 7/021
. . .
{
Construction of PM ( H01F 7/0278 takes precedence; PM compositions H01F 1/032 )
}
H01F 7/0215
. . . .
{
Flexible forms, sheets
}
H01F 7/0221
. . .
{
Mounting means for PM, supporting, coating, encapsulating PM
}
H01F 7/0226
. . .
{
PM with variable field strength ( H01F 7/0284 takes precedence )
}
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H01F 7/0231
. .
{
Magnetic circuits with PM for power or force generation
}
H01F 7/0236
. . .
{
Magnetic suspension or levitation ( for vehicles B60L 13/04 ; magnetic bearings F16C 39/063 )
}
H01F 7/0242
. . .
{
Magnetic drives, magnetic coupling devices
}
H01F 7/0247
. . .
{
Orientating, locating, transporting arrangements
}
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H01F 7/0252
. . .
{
PM holding devices ( H01F 7/021 , H01F 7/0215 , H01F 7/0226 take precedence )
}
H01F 7/0257
. . . .
{
Lifting, pick-up magnetic objects
}
H01F 7/0263
. . . .
{
Closures, bags, bands, engagement devices with male and female parts
}
H01F 7/0268
. . . .
{
Magnetic cylinders
}
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H01F 7/0273
. .
{
Magnetic circuits with PM for magnetic field generation
}
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H01F 7/0278
. . .
{
for generating uniform fields, focusing, deflecting electrically charged particles ( for magnetic separation by Lorentz force B03C 1/023 ; specially adapted for NMR applications G01R 33/383 )
}
H01F 7/0284
. . . .
{
using a trimmable or adjustable magnetic circuit, e.g. for a symmetric dipole or quadrupole magnetic field
}
H01F 7/0289
. . .
{
Transducers, loudspeakers, moving coil arrangements
}
H01F 7/0294
. . .
{
Detection, inspection, magnetic treatment
}
H01F 7/04
. .
Means for releasing the attractive force
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H01F 7/06
.
Electromagnets ; Actuators including electromagnets
{
( electric coils H01F 5/00 ; devices for holding workpieces using electric force B23Q 3/15 ; load-engaging elements for lifting articles electromagnetically B66C 1/06 ; electromagnetic couplings F16D 27/00 ; magnetic brakes F16D 63/002 ; electromagnetically operated valves F16K 11/24 , F16K 31/00 ; magnetically locked mine lamps F21L 11/00 ; analysing materials by magnetic means G01N 27/72 , G01N 27/80 ; electromagnets for winding mechanical clocks G04C 1/02 ; electromagnetic relays H01H 51/00 ; windings for salient poles of dynamo-electric machines H02K 3/18 ; electromagnets for telegraphic communication H04L ; for arc lamps H05B 31/28 )
}
H01F 2007/062
. .
{
Details of terminals or connectors for electromagnets
}
H01F 7/064
. .
{
Circuit arrangements for actuating electromagnets ( circuit arrangements for obtaining special operating characteristics H01F 7/18 ; driving circuits for electromagnets making use of a switching regulator H01H 47/325 )
}
H01F 7/066
. .
{
Electromagnets with movable winding
}
H01F 2007/068
. .
{
using printed circuit coils
}
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H01F 7/08
. .
with armatures
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H01F 7/081
. . .
{
Magnetic constructions
}
H01F 2007/083
. . . .
{
External yoke surrounding the coil bobbin, e.g. made of bent magnetic sheet
}
H01F 2007/085
. . . .
{
Yoke or polar piece between coil bobbin and armature having a gap, e.g. filled with nonmagnetic material
}
H01F 2007/086
. . . .
{
Structural details of the armature
}
H01F 7/088
. . .
{
provided with means for absorbing shocks
}
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H01F 7/10
. . .
specially adapted for alternating current
H01F 7/11
. . . .
reducing or eliminating the effects of eddy currents
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H01F 7/12
. . . .
having anti-chattering arrangements
H01F 7/1205
. . . . .
{
having short-circuited conductors ( electromagnetic relays provided with short-circuited conducting sleeves H01H 47/00 )
}
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H01F 7/121
. . .
Guiding or setting position of armatures, e.g. retaining armatures in their end position
H01F 7/122
. . . .
by permanent magnets
{
( H01F 7/1615 , H01F 7/1646 take precedence )
}
H01F 7/123
. . . .
by ancillary coil
H01F 7/124
. . . .
by mechanical latch, e.g. detent
H01F 7/126
. . .
Supporting or mounting
H01F 7/127
. . .
Assembling
Collapse
H01F 7/128
. . .
Encapsulating, encasing or sealing
H01F 7/129
. . . .
of armatures
H01F 7/13
. . .
characterised by pulling-force characteristics
Collapse
H01F 7/14
. . .
Pivoting armatures ( H01F 7/17 takes precedence )
H01F 7/145
. . . .
{
Rotary electromagnets with variable gap ( with fixed gap or torque motors H02K 26/00 )
}
Collapse
H01F 7/16
. . .
Rectilinearly-movable armatures ( H01F 7/17 takes precedence )
Collapse
H01F 7/1607
. . . .
{
Armatures entering the winding
}
H01F 7/1615
. . . . .
{
Armatures or stationary parts of magnetic circuit having permanent magnet
}
H01F 7/1623
. . . . .
{
Armatures having T-form
}
H01F 2007/163
. . . . .
{
with axial bearing
}
Collapse
H01F 7/1638
. . . .
{
Armatures not entering the winding
}
H01F 7/1646
. . . . .
{
Armatures or stationary parts of magnetic circuit having permanent magnet
}
H01F 7/1653
. . . .
{
Magnetic circuit having axially spaced pole-pieces
}
H01F 2007/1661
. . . .
{
Electromagnets or actuators with anti-stick disc
}
H01F 2007/1669
. . . .
{
Armatures actuated by current pulse, e.g. bistable actuators
}
H01F 2007/1676
. . . .
{
Means for avoiding or reducing eddy currents in the magnetic circuit, e.g. radial slots
}
H01F 2007/1684
. . . .
{
Armature position measurement using coils
}
H01F 2007/1692
. . . .
{
Electromagnets or actuators with two coils
}
H01F 7/17
. . .
Pivoting and rectilinearly-movable armatures
Collapse
H01F 7/18
. . .
Circuit arrangements for obtaining desired operating characteristics, e.g. for slow operation, for sequential energisation of windings, for high-speed energisation of windings
Collapse
H01F 7/1805
. . . .
{
Circuit arrangements for holding the operation of electromagnets or for holding the armature in attracted position with reduced energising current ( for holding relay armature in attracted position with reduced energising current H01H 47/04 ; quick energising of electro-dynamic machines H02P 9/08 ; for quickly de-energising of dynamo-electric generators H02P 9/123 )
}
H01F 7/1811
. . . . .
{
demagnetising upon switching off, removing residual magnetism
}
Collapse
H01F 7/1816
. . . . .
{
making use of an energy accumulator ( for relays H01H 47/043 )
}
H01F 2007/1822
. . . . . .
{
using a capacitor to produce a boost voltage
}
H01F 7/1827
. . . . .
{
by changing number of serially-connected turns or windings ( for relays H01H 47/06 )
}
H01F 7/1833
. . . . .
{
by changing number of parallel-connected turns or windings ( for relays H01H 47/08 )
}
H01F 7/1838
. . . . .
{
by switching-in or -out impedance ( for relays H01H 47/10 )
}
Collapse
H01F 7/1844
. . . .
{
Monitoring or fail-safe circuits ( for relays H01H 47/002 )
}
H01F 2007/185
. . . . .
{
with armature position measurement
}
H01F 2007/1855
. . . . .
{
using a stored table to deduce one variable from another
}
H01F 2007/1861
. . . . .
{
using derivative of measured variable
}
H01F 2007/1866
. . . . .
{
with regulation loop
}
H01F 7/1872
. . . .
{
Bistable or bidirectional current devices ( relays H01H 47/226 )
}
H01F 7/1877
. . . .
{
controlling a plurality of loads
}
H01F 7/1883
. . . .
{
by steepening leading and trailing edges of magnetisation pulse, e.g. printer drivers
}
H01F 2007/1888
. . . .
{
using pulse width modulation
}
H01F 2007/1894
. . . .
{
minimizing impact energy on closure of magnetic circuit
}
Collapse
H01F 7/20
. .
without armatures ( cores H01F 3/00 ; coils H01F 5/00 ;
{
shaping metal by applying magnetic forces B21D 26/14 ; analysing methods using magnetic fields G01N24/06 ; electromagnets specially adapted for NMR applications G01R 33/381
}
)
Collapse
H01F 7/202
. . .
{
Electromagnets for high magnetic field strength ( for superconducting electromagnets H01F 6/00 ; for transformers or inductances without a magnetic core H01F 30/08 )
}
H01F 7/204
. . . .
{
Circuits for energising or de-energising
}
Collapse
H01F 7/206
. . .
{
Electromagnets for lifting, handling or transporting of magnetic pieces or material ( electromagnets for guidance of vehicles, workpieces B65G 21/2009 ; for magnetic suspension or levitation H02N 15/00 )
}
H01F 2007/208
. . . .
{
combined with permanent magnets
}
Collapse
Thin magnetic films, e.g. of one-domain structure ( magnetic record carriers G11B 5/00 ; thin-film magnetic stores G11C )
H01F 10/002
.
{
Antiferromagnetic thin films, i.e. films exhibiting a Néel transition temperature ( H01F 10/3218 and H01F 10/3268 take precedence )
}
WARNING
-
This groups is not complete pending the completion of reclassification; see provisionally also H01F 10/00 - H01F 10/30

H01F 10/005
.
{
organic or organo-metallic films, e.g. monomolecular films obtained by Langmuir-Blodgett technique, graphene
}
H01F 10/007
.
{
ultrathin or granular films ( H01F 10/005 and H01F 10/3227 take precedence; applying ultrathin or granular layers to substrates H01F 41/301 )
}
.
characterised by the coupling or physical contact with connecting or interacting conductors
Collapse
.
characterised by magnetic layers (
{
H01F 10/32 takes precedence
}
; applying thin magnetic films to substrates H01F 41/14 )
Collapse
. .
characterised by the composition
Collapse
H01F 10/12
. . .
being metal or alloys ( intermetallic compounds H01F 10/18 )
H01F 10/123
. . . .
{
having a L10 crystallographic structure, e.g. [Co,Fe
}
[Pt,Pd] thin films]
WARNING
-
This groups is not complete pending the completion of reclassification; see provisionally also H01F 10/16

H01F 10/126
. . . .
{
containing rare earth metals ( H01F 10/133 takes precedence )
}
Collapse
H01F 10/13
. . . .
Amorphous metallic alloys, e.g. glassy metals
{
( H01F 10/3204 takes precedence )
}
NOTE
-
In this group, amorphous metallic alloys are classified in the last appropriate place

H01F 10/131
. . . . .
{
containing iron or nickel
}
H01F 10/132
. . . . .
{
containing cobalt
}
Collapse
H01F 10/133
. . . . .
{
containing rare earth metals
}
Collapse
H01F 10/135
. . . . . .
{
containing transition metals
}
H01F 10/136
. . . . . . .
{
containing iron
}
H01F 10/137
. . . . . . .
{
containing cobalt
}
H01F 10/138
. . . . .
{
containing nanocrystallites, e.g. obtained by annealing
}
Collapse
H01F 10/14
. . . .
containing iron or nickel (
{
H01F 10/126
}
, H01F 10/13 , H01F 10/16 take precedence )
NOTE
-
In this group, alloys containing iron or nickel are classified in the last appropriate place

Collapse
H01F 10/142
. . . . .
{
containing Si
}
H01F 10/145
. . . . . .
{
containing Al, e.g. SENDUST
}
H01F 10/147
. . . . .
{
with lattice under strain, e.g. expanded by interstitial nitrogen ( H01F 10/26 to H01F 10/30 take precedence )
}
H01F 10/16
. . . .
containing cobalt (
{
H01F 10/126
}
, H01F 10/13 take precedence )
Collapse
. . .
being compounds
H01F 10/187
. . . .
Amorphous compounds
{
( H01F 10/3204 takes precedence )
}
Collapse
H01F 10/193
. . . .
Magnetic semiconductor compounds
{
( in general H01F 1/40 ; multilayers, e.g. superlattices H01F 10/3213 )
}
H01F 10/1933
. . . . .
{
Perovskites
}
WARNING
-
This groups is not complete pending the completion of reclassification; see provisionally also H01F 10/193

H01F 10/1936
. . . . .
{
Half-metallic, e.g. epitaxial CrO2 or NiMnSb films
}
Collapse
H01F 10/20
. . . .
Ferrites
H01F 10/205
. . . . .
{
Hexagonal ferrites
}
H01F 10/22
. . . . .
Orthoferrites
{
e.g. RFeO3 (R= rare earth element) with orthorhombic structure
}
Collapse
H01F 10/24
. . . . .
Garnets
{
( in general H01F 1/346 ; multilayers, e.g. superlattices H01F 10/3209 ; applying magnetic garnet films to substrates by sputtering H01F 41/186 )
}
H01F 10/245
. . . . . .
{
Modifications for enhancing interaction with electromagnetic wave energy
}
Collapse
.
characterised by the substrate or intermediate layers
{
( H01F 10/06 and H01F 10/32 take precedence )
}
H01F 10/265
. .
{
Magnetic multilayers non exchange-coupled ( H01F 10/32 takes precedence )
}
WARNING
-
This groups is not complete pending the completion of reclassification; see provisionally also H01F 10/00 - H01F 10/30

H01F 10/28
. .
characterised by the composition of the substrate
H01F 10/30
. .
characterised by the composition of the intermediate layers
{
e.g. seed, buffer, template, diffusion preventing, cap layers ( H01F 10/06 and H01F 10/32 take precedence )
}
Collapse
.
Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
{
( applying spin-exchange-coupled multilayers to substrates H01F 41/302 )
}
H01F 10/3204
. .
{
Exchange coupling of amorphous multilayers
}
H01F 10/3209
. .
{
Exchange coupling of garnet multilayers
}
H01F 10/3213
. .
{
Exchange coupling of magnetic semiconductor multilayers, e.g. MnSe/ZnSe superlattices ( semiconductor materials for use in semiconductor devices H01L 29/12 )
}
H01F 10/3218
. .
{
Exchange coupling of magnetic films via an antiferromagnetic interface ( H01F 10/3268 takes precedence )
}
H01F 10/3222
. .
{
Exchange coupled hard/soft multilayers, e.g. CoPt/Co or NiFe/CoSm ( nanocomposite spring magnets H01F 1/0579 )
}
Collapse
H01F 10/3227
. .
{
Exchange coupling via one or more magnetisable ultrathin or granular films
}
Collapse
H01F 10/3231
. . .
{
via a non-magnetic spacer
}
H01F 10/3236
. . . .
{
made of a noble metal, e.g.(Co/Pt) n multilayers having perpendicular anisotropy ( H01F 10/3286 takes precedence )
}
Collapse
. .
{
Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
}
H01F 10/3245
. . .
{
the spacer being superconductive
}
H01F 10/325
. . .
{
the spacer being noble metal
}
Collapse
H01F 10/3254
. . .
{
the spacer being semiconducting or insulating, e.g. for spin tunnel junction (STJ)
}
H01F 10/3259
. . . .
{
Spin-exchange-coupled multilayers comprising at least a nano-oxide layer (NOL), e.g. with a NOL spacer
}
H01F 10/3263
. . .
{
the exchange coupling being symmetric, e.g. for dual spin valve, e.g. NiO/Co/Cu/Co/Cu/Co/NiO
}
Collapse
H01F 10/3268
. . .
{
the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve (SV) structure, e.g. NiFe/Cu/NiFe/FeMn
}
Collapse
H01F 10/3272
. . . .
{
by use of anti-parallel coupled (APC) ferromagnetic layers, e.g. artificial ferrimagnets (AFI), artificial (AAF) or synthetic (SAF) anti-ferromagnets
}
H01F 10/3277
. . . . .
{
by use of artificial ferrimagnets (AFI) only
}
H01F 10/3281
. . . .
{
only by use of asymmetry of the magnetic film pair itself, i.e. so-called pseudospin valve (PSV) structure, e.g. NiFe/Cu/Co
}
H01F 10/3286
. . .
{
Spin-exchange coupled multilayers having at least one layer with perpendicular magnetic anisotropy
}
H01F 10/329
. . .
{
Spin-exchange coupled multilayers wherein the magnetisation of the free layer is switched by a spin-polarised current, e.g. spin torque effect
}
H01F 10/3295
. . .
{
Spin-exchange coupled multilayers wherein the magnetic pinned or free layers are laminated without anti-parallel coupling within the pinned and free layers
}
Collapse
Apparatus or processes for magnetising or demagnetising (
{
devices for holding workpieces using magnetic or electric force acting directly on the workpieces B23Q 3/15
}
; for degaussing ships B63G 9/06 ; for clocks or watches G04D 9/00 ;
{
recording or erasing of information on magnetic record carriers G11B 5/00
}
; demagnetising arrangements for colour television H04N 9/29 )
H01F 13/003
.
{
Methods and devices for magnetising permanent magnets ( permanent magnets H01F 7/02 )
}
H01F 13/006
.
{
Methods and devices for demagnetising of magnetic bodies, e.g. workpieces, sheet material ( for erasing of information on magnetic record carriers G11B 5/00 )
}
Collapse
Fixed inductances of the signal type ( coils in general H01F 5/00
{
inductors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof and multistep manufacturing processes therefor H01L 28/10
}
)
Collapse
H01F 17/0006
.
{
Printed inductances ( printed coils for dynamo-electric machines H02K 3/26 ; printed circuits H05K )
}
Collapse
H01F 17/0013
. .
{
with stacked layers ( H01F 27/2804 takes precedence )
}
H01F 2017/002
. . .
{
Details of via holes for interconnecting the layers
}
H01F 2017/0026
. . .
{
Multilayer LC-filter
}
H01F 17/0033
. .
{
with the coil helically wound around a magnetic core
}
H01F 2017/004
. .
{
with the coil helically wound around an axis without a core
}
H01F 2017/0046
. .
{
with a conductive path having a bridge
}
H01F 2017/0053
. .
{
with means to reduce eddy currents
}
H01F 2017/006
. .
{
flexible printed inductors
}
H01F 2017/0066
. .
{
with a magnetic layer
}
H01F 2017/0073
. .
{
with a special conductive pattern, e.g. flat spiral
}
H01F 2017/008
. .
{
Electric or magnetic shielding of printed inductances
}
H01F 2017/0086
. .
{
on semiconductor substrate ( inductors for integrated circuits H01L 28/10 )
}
H01F 2017/0093
.
{
Common mode choke coil
}
Collapse
H01F 17/02
.
without magnetic core
H01F 17/03
. .
with ceramic former
Collapse
H01F 17/04
.
with magnetic core
H01F 17/041
. .
{
Means for preventing rotation or displacement of the core
}
H01F 17/043
. .
{
with two, usually identical or nearly identical parts enclosing completely the coil ( pot cores )
}
Collapse
H01F 17/045
. .
{
with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
}
H01F 2017/046
. . .
{
helical coil made of flat wire, e.g. with smaller extension of wire cross section in the direction of the longitudinal axis
}
H01F 2017/048
. .
{
with encapsulating core, e.g. made of resin and magnetic powder
}
Collapse
H01F 17/06
. .
with core substantially closed in itself, e.g. toroid
H01F 17/062
. . .
{
Toroidal core with turns of coil around it
}
H01F 2017/065
. . .
{
Core mounted around conductor to absorb noise, e.g. EMI filter
}
H01F 2017/067
. . .
{
Core with two or more holes to lead through conductor
}
H01F 17/08
. . .
Loading coils for telecommunication circuits
Collapse
Fixed transformers or mutual inductances of the signal type ( H01F 36/00 takes precedence )
H01F 19/02
.
Audio-frequency transformers or mutual inductances, i.e. not suitable for handling frequencies considerably beyond the audio range
Collapse
H01F 19/04
.
Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range ( resonant circuits H03H )
H01F 19/06
. .
Broad-band transformers, e.g. suitable for handling frequencies well down into the audio range
Collapse
H01F 19/08
. .
Transformers having magnetic bias, e.g. for handling pulses
H01F 2019/085
. . .
{
Transformer for galvanic isolation
}
Collapse
Variable inductances or transformers of the signal type ( H01F 36/00 takes precedence )
H01F 21/005
.
{
Inductances without magnetic core
}
Collapse
H01F 21/02
.
continuously variable, e.g. variometers
H01F 21/04
. .
by relative movement of turns or parts of windings
Collapse
H01F 21/06
. .
by movement of core or part of core relative to the windings as a whole
H01F 21/065
. . .
{
Measures for obtaining a desired relation between the position of the core and the inductance
}
H01F 21/08
. .
by varying the permeability of the core, e.g. by varying magnetic bias
H01F 21/10
. .
by means of a movable shield
Collapse
H01F 21/12
.
discontinuously variable, e.g. tapped
H01F 2021/125
. .
{
Printed variable inductor with taps, e.g. for VCO
}
Collapse
Details of transformers or inductances, in general
H01F 27/002
.
{
Arrangements provided on the transformer facilitating its transport
}
H01F 27/004
.
{
Arrangements for interchanging inductances, transformers or coils thereof
}
H01F 27/006
.
{
with special arrangement or spacing of turns of the winding(s), e.g. to produce desired self-resonance
}
H01F 27/008
.
{
with temperature compensation
}
Collapse
H01F 27/02
.
Casings
H01F 27/022
. .
{
Encapsulation
}
H01F 27/025
. .
{
Constructional details relating to cooling
}
H01F 27/027
. .
{
specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
}
H01F 27/04
. .
Leading of conductors or axles through casings, e.g. for tap-changing arrangements
Collapse
H01F 27/06
.
Mounting, supporting or suspending transformers, reactors or choke coils
{
not being of the signal type
}
H01F 2027/065
. .
{
Mounting on printed circuit boards
}
Collapse
H01F 27/08
.
Cooling ( heat-transfer elements F28F ) ; Ventilating ( structural details of casings H01F 27/02 )
H01F 27/085
. .
{
Cooling by ambient air
}
Collapse
H01F 27/10
. .
Liquid cooling
H01F 27/105
. . .
{
Cooling by special liquid or by liquid of particular composition
}
Collapse
H01F 27/12
. . .
Oil cooling
H01F 27/125
. . . .
{
Cooling by synthetic insulating and incombustible liquid
}
H01F 27/14
. . . .
Expansion chambers ; Oil conservators ; Gas cushions ; Arrangements for purifying, drying, or filling
H01F 27/16
. . .
Water cooling
H01F 27/18
. . .
by evaporating liquids
H01F 27/20
. .
Cooling by special gases or non-ambient air
H01F 27/22
. .
Cooling by heat conduction through solid or powdered fillings
H01F 27/23
.
Corrosion protection
Collapse
H01F 27/24
.
Magnetic cores
Collapse
H01F 27/245
. .
made from sheets, e.g. grain-oriented ( H01F 27/26 takes precedence )
H01F 27/2455
. . .
{
using bent laminations
}
H01F 27/25
. .
made from strips or ribbons ( H01F 27/26 takes precedence )
H01F 27/255
. .
made from particles ( H01F 27/26 takes precedence )
Collapse
H01F 27/26
. .
Fastening parts of the core together ; Fastening or mounting the core on casing or support ( on coil H01F 27/30 )
H01F 27/263
. . .
{
Fastening parts of the core together
}
H01F 27/266
. . .
{
Fastening or mounting the core on casing or support ( on coil H01F 27/30 )
}
Collapse
H01F 27/28
.
Coils ; Windings ; Conductive connections
Collapse
H01F 27/2804
. .
{
Printed windings
}
H01F 2027/2809
. . .
{
on stacked layers
}
H01F 2027/2814
. . .
{
with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
}
H01F 2027/2819
. . .
{
Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
}
Collapse
H01F 27/2823
. .
{
Wires ( H01F 27/2866 takes precedence )
}
H01F 27/2828
. . .
{
Construction of conductive connections, of leads
}
H01F 2027/2833
. . .
{
using coaxial cable as wire
}
H01F 2027/2838
. . .
{
using transposed wires
}
H01F 2027/2842
. . .
{
Wire coils wound in conical zigzag to reduce voltage between winding turns
}
Collapse
H01F 27/2847
. .
{
Sheets; Strips ( H01F 27/2866 takes precedence )
}
H01F 27/2852
. . .
{
Construction of conductive connections, of leads
}
H01F 2027/2857
. . .
{
Coil formed from wound foil conductor
}
H01F 2027/2861
. . .
{
Coil formed by folding a blank
}
H01F 27/2866
. .
{
Combination of wires and sheets
}
H01F 27/2871
. .
{
Pancake coils
}
H01F 27/2876
. .
{
Cooling ( cooling transformers and inductances in general H01F 27/08 )
}
Collapse
H01F 27/288
. .
{
Shielding
}
H01F 27/2885
. . .
{
with shields or electrodes ( shields or electrodes for pancake coils H01F 27/2871 ; construction of electric or magnetic shields or screens H01F 27/36 )
}
H01F 27/289
. . .
{
with auxiliary windings ( for pancake coils H01F 27/2871 )
}
H01F 27/2895
. .
{
Windings disposed upon ring cores
}
Collapse
H01F 27/29
. .
Terminals ; Tapping arrangements
{
for signal inductances
}
Collapse
H01F 27/292
. . .
{
Surface mounted devices
}
H01F 2027/295
. . . .
{
with flexible terminals
}
H01F 2027/297
. . .
{
with pin-like terminal to be inserted in hole of printed path
}
Collapse
H01F 27/30
. .
Fastening or clamping coils, windings, or parts thereof together ; Fastening or mounting coils or windings on core, casing, or other support
H01F 27/303
. . .
{
Clamping coils, windings or parts thereof together
}
H01F 27/306
. . .
{
Fastening or mounting coils or windings on core, casing or other support
}
Collapse
H01F 27/32
. .
Insulating of coils, windings, or parts thereof
H01F 27/321
. . .
{
using a fluid for insulating purposes only
}
H01F 27/322
. . .
{
the insulation forming channels for circulation of the fluid
}
H01F 27/323
. . .
{
Insulation between winding turns, between winding layers
}
Collapse
H01F 27/324
. . .
{
Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
}
H01F 27/325
. . . .
{
Coil bobbins ( formers for coils in general H01F 5/02 )
}
H01F 27/326
. . . .
{
specifically adapted for discharge lamp ballasts
}
Collapse
H01F 27/327
. . .
{
Encapsulating or impregnating ( encapsulating coil and core H01F 27/022 )
}
H01F 2027/328
. . . .
{
Dry-type transformer with encapsulated foil winding, e.g. windings coaxially arranged on core legs with spacers for cooling and with three phases
}
H01F 2027/329
. . .
{
Insulation with semiconducting layer, e.g. to reduce corona effect
}
H01F 27/33
.
Arrangements for noise damping
Collapse
H01F 27/34
.
Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
H01F 27/341
. .
{
Preventing or reducing no-load losses or reactive currents
}
Collapse
H01F 27/343
. .
{
Preventing or reducing surge voltages; oscillations
}
H01F 27/345
. . .
{
using auxiliary conductors
}
H01F 27/346
. .
{
Preventing or reducing leakage fields ( using magnetic shields H01F 27/365 ; using auxiliary windings H01F 27/38 )
}
H01F 2027/348
. .
{
Preventing eddy currents
}
Collapse
H01F 27/36
. .
Electric or magnetic shields or screens ( movable for varying inductance H01F 21/10 )
H01F 27/362
. . .
{
Electric shields or screens
}
Collapse
H01F 27/365
. . .
{
Magnetic shields or screens
}
H01F 27/367
. . . .
{
using non-magnetic screens
}
Collapse
H01F 27/38
. .
Auxiliary core members ; Auxiliary coils or windings
H01F 27/385
. . .
{
for reducing harmonics
}
Collapse
H01F 27/40
.
Structural association with built-in electric component, e.g. fuse
Collapse
H01F 27/402
. .
{
Association of measuring or protective means
}
H01F 2027/404
. . .
{
Protective devices specially adapted for fluid filled transformers
}
H01F 2027/406
. . .
{
Temperature sensor or protection
}
H01F 2027/408
. .
{
Association with diode or rectifier
}
Collapse
H01F 27/42
.
Circuits specially adapted for the purpose of modifying, or compensating for, electric characteristics of transformers, reactors, or choke coils ( circuits for controlling transformers, reactors or choke coils, for the purpose of obtaining a desired output H02P 13/00 ; impedance networks H03H )
Collapse
H01F 27/422
. .
{
for instrument transformers
}
H01F 27/425
. . .
{
for voltage transformers
}
H01F 27/427
. . .
{
for current transformers
}
Collapse
Variable transformers or inductances not covered by group H01F 21/00
{
( tap change devices H01H 9/0005 )
}
Collapse
H01F 29/02
.
with tappings on coil or winding ; with provision for rearrangement or interconnection of windings
H01F 29/025
. .
{
Constructional details of transformers or reactors with tapping on coil or windings
}
H01F 29/04
. .
having provision for tap-changing without interrupting the load current
H01F 29/06
.
with current collector gliding or rolling on or along winding
Collapse
H01F 29/08
.
with core, coil, winding, or shield movable to offset variation of voltage or phase shift, e.g. induction regulators
H01F 29/10
. .
having movable part of magnetic circuit
{
( high leakage transformers H01F 38/08 ; dynamo-electric machines with movable part of magnetic circuit H02K 23/44 , H02K 23/48 )
}
H01F 29/12
. .
having movable coil, winding, or part thereof ; having movable shield
Collapse
H01F 29/14
.
with variable magnetic bias (
{
amplitude modulation by means of variable impedance element H03C 1/08
}
; magnetic amplifiers H03F ;
{
circuits for automatic telephonic communication H04M 3/00
}
)
H01F 2029/143
. .
{
with control winding for generating magnetic bias
}
H01F 29/146
. .
{
Constructional details
}
Collapse
Fixed transformers not covered by group H01F 19/00
H01F 30/02
.
Auto-transformers
H01F 30/04
.
having two or more secondary windings, each supplying a separate load, e.g. for radio set power supplies
Collapse
H01F 30/06
.
characterised by the structure
H01F 30/08
. .
without magnetic core
H01F 30/10
. .
Single-phase transformers ( H01F 30/16 takes precedence )
Collapse
H01F 30/12
. .
Two-phase, three-phase or polyphase transformers
H01F 30/14
. . .
for changing the number of phases
H01F 30/16
. .
Toroidal transformers
Transformers with superconductive windings or with windings operating at cryogenic temperature ( superconducting magnets or superconducting coils H01F 6/00 )
Collapse
Fixed inductances not covered by group H01F 17/00
H01F 37/005
.
{
without magnetic core
}
Collapse
Adaptations of transformers or inductances for specific applications or functions
H01F 2038/003
.
{
High frequency transformer for microwave oven
}
H01F 2038/006
.
{
matrix transformer consisting of several interconnected individual transformers working as a whole
}
Collapse
H01F 38/02
.
for non-linear operation
Collapse
H01F 38/023
. .
{
of inductances
}
H01F 2038/026
. . .
{
non-linear inductive arrangements for converters, e.g. with additional windings
}
H01F 38/04
. .
for frequency changing
H01F 38/06
. .
for changing the wave shape
Collapse
H01F 38/08
.
High-leakage transformers or inductances
H01F 38/085
. .
{
Welding transformers
}
H01F 38/10
. .
Ballasts, e.g. for discharge lamps
Collapse
H01F 38/12
.
Ignition, e.g. for IC engines
H01F 2038/122
. .
{
with rod-shaped core
}
H01F 2038/125
. .
{
with oil insulation
}
H01F 2038/127
. .
{
with magnetic circuit including permanent magnet
}
Collapse
H01F 38/14
.
Inductive couplings
{
( for charging batteries from ac mains by converters H02J 7/025 )
}
H01F 2038/143
. .
{
for signals
}
H01F 2038/146
. .
{
in combination with capacitive coupling
}
H01F 38/16
.
Cascade transformers, e.g. for use with extra high tension
H01F 38/18
.
Rotary transformers
Collapse
H01F 38/20
.
Instruments transformers
Collapse
H01F 38/22
. .
for single phase ac
Collapse
H01F 38/24
. . .
Voltage transformers
H01F 38/26
. . . .
Constructions
Collapse
H01F 38/28
. . .
Current transformers
Collapse
H01F 38/30
. . . .
Constructions
H01F 2038/305
. . . . .
{
with toroidal magnetic core
}
H01F 38/32
. . . .
Circuit arrangements
Collapse
H01F 38/34
. . .
Combined voltage and current transformers
H01F 38/36
. . . .
Constructions
H01F 38/38
. .
for polyphase ac
H01F 38/40
. .
for dc
Collapse
H01F 38/42
.
Flyback transformers
H01F 2038/423
. .
{
with adjusting potentiometers
}
H01F 2038/426
. .
{
with gap in transformer core
}
Collapse
Apparatus or processes specially adapted for manufacturing or assembling the devices covered by this subclass
.
{
Impregnating or encapsulating ( insulating of windings H01F 41/12 )
}
Collapse
.
for manufacturing cores, coils, or magnets ( H01F 41/14 takes precedence; for dynamo-electric machines H02K 15/00 )
Collapse
. .
{
Manufacturing of magnetic cores by mechanical means ( magnetic cores per se H01F 27/24 )
}
Collapse
H01F 41/0213
. . .
{
Manufacturing of magnetic circuits made from strip(s) or ribbon(s) ( magnetic cores made by winding a ribbon H01F 27/25 )
}
H01F 41/022
. . . .
{
by winding the strips or ribbons around a coil
}
H01F 41/0226
. . . .
{
from amorphous ribbons
}
Collapse
H01F 41/0233
. . .
{
Manufacturing of magnetic circuits made from sheets ( magnetic cores made from sheets H01F 27/245 ; soft magnetic alloys in the form of sheets H01F 1/16 )
}
H01F 41/024
. . . .
{
Manufacturing of magnetic circuits made from deformed sheets ( magnetic cores made from deformed sheets H01F 27/2455 )
}
H01F 41/0246
. . .
{
Manufacturing of magnetic circuits by moulding or by pressing powder ( magnetic cores made by moulding or by pressing powder H01F 27/255 ; soft magnetic particles H01F 1/20 , H01F 1/36 )
}
Collapse
. .
{
for manufacturing permanent magnets
}
H01F 41/026
. . .
{
protecting methods against environmental influences, e.g. oxygen, by surface treatment ( magnetic particles with skin H01F 1/061 , H01F 1/09 , H01F 1/24 , H01F 1/33 and G11B 5/706 )
}
H01F 41/0266
. . .
{
Moulding; Pressing ( H01F 41/0273 takes precedence; hard magnetic particles H01F 1/06 , H01F 1/11 )
}
Collapse
H01F 41/0273
. . .
{
Imparting anisotropy ( methods and devices for magnetising permanent magnets H01F 13/003 )
}
H01F 41/028
. . . .
{
Radial anisotropy ( for rotor or stator bodies H02K 15/02 )
}
H01F 41/0286
. . .
{
Trimming
}
H01F 41/0293
. . .
{
diffusion of rare earth elements, e.g. Tb, Dy or Ho, into permanent magnets
}
Collapse
. .
for manufacturing coils
{
( coils for transformer or inductances H01F 27/28 )
}
Collapse
H01F 41/041
. . .
{
Printed circuit coils ( apparatus or processes for manufacturing printed circuits in general H05K 3/00 )
}
H01F 41/042
. . . .
{
by thin film techniques
}
H01F 41/043
. . . .
{
by thick film techniques
}
H01F 41/045
. . . .
{
Trimming
}
H01F 41/046
. . . .
{
structurally combined with ferromagnetic material
}
H01F 41/047
. . . .
{
structurally combined with superconductive material
}
H01F 41/048
. . .
{
Superconductive coils
}
Collapse
H01F 41/06
. . .
Winding
Collapse
H01F 41/0604
. . . .
{
Winding sheet material
}
H01F 41/0608
. . . . .
{
with insulation
}
Collapse
H01F 41/0612
. . . .
{
Winding wire material
}
Collapse
H01F 41/0616
. . . . .
{
with insulation
}
H01F 41/062
. . . . . .
{
the insulation being strip material
}
Collapse
H01F 41/0625
. . . . .
{
Winding more than one wire
}
H01F 41/0629
. . . . . .
{
Twisting
}
Collapse
H01F 41/0633
. . . .
{
Devices for guiding or positioning the winding material on the winding form
}
H01F 41/0637
. . . . .
{
forming pancake coils
}
H01F 41/0641
. . . . .
{
positioning the winding material in a special configuration on the winding form ( orthocyclic coils, open mesh coils )
}
H01F 41/0645
. . . . .
{
using revolving flyers
}
Collapse
H01F 41/065
. . . .
{
Winding coils of special form
}
H01F 41/0654
. . . . .
{
Winding on elongate winding forms
}
H01F 41/0658
. . . . .
{
Winding flat coils
}
H01F 2041/0662
. . . . .
{
Winding saddle or deflection coils
}
H01F 41/0666
. . . .
{
Winding with terminal wrapping or soldering; Winding while forming taps or terminals
}
Collapse
H01F 41/067
. . . .
{
Winding machines having a plurality of work holders or winding forms
}
H01F 41/0675
. . . . .
{
Turrets, turntables
}
H01F 41/0679
. . . .
{
Tensioning or braking devices
}
H01F 41/0683
. . . .
{
Dispensing or feeding devices
}
H01F 41/0687
. . . .
{
Winding mandrels, winding forms
}
H01F 41/0691
. . . .
{
Winding with deformation of the winding material section
}
H01F 41/0695
. . . .
{
Winding while measuring electrical characteristics
}
H01F 41/08
. . . .
Winding conductors onto or threading conductors through cores or formers which are closed in themselves, e.g. toroids ( for interconnecting digital storage elements G11C 5/12 )
H01F 41/10
. . .
Connecting leads to windings ( making electric connections in general H01R 43/00 )
Collapse
H01F 41/12
. . .
Insulating of windings (
{
impregnating or encapsulating of transformers H01F 41/005
}
; of conductors in general H01B 13/06 )
H01F 41/122
. . . .
{
Insulating between turns or between winding layers
}
H01F 41/125
. . . .
{
Other insulating structures; Insulating between coil and core, between different winding sections, around the coil
}
H01F 41/127
. . . .
{
Encapsulating or impregnating ( encapsulating coil and core H01F 41/005 )
}
Collapse
.
for applying magnetic films to substrates ( covering metals, or materials with metals, in general C23C ; manufacturing record carriers G11B 5/84 )
NOTE
-
Group H01F 41/30 takes precedence over groups H01F 41/16 to H01F 41/24 , and over group H01F 41/32

. .
the magnetic material being applied in the form of particles, e.g. by serigraphy
{
i.e. forming thick magnetic films and precursors therefor, e.g. magnetisable pastes, inks, glass frits ( H01F 41/18 to H01F 41/24 take precedence; thick magnetic films H01F 1/0027 )
}
Collapse
. .
by cathode sputtering
H01F 41/183
. . .
{
Sputtering targets therefor
}
H01F 41/186
. . .
{
for applying a magnetic garnet film ( magnetic garnet materials H01F 1/346 ; magnetic garnet films H01F 10/24 )
}
Collapse
H01F 41/20
. .
by evaporation
H01F 41/205
. . .
{
by laser ablation, e.g. pulsed laser deposition (PLD)
}
. .
Heat treatment ; Thermal decomposition ; Chemical vapour deposition
Collapse
. .
from liquids
H01F 41/26
. . .
using electric currents
{
e.g. electroplating
}
H01F 41/28
. . .
by liquid phase epitaxy
Collapse
. .
for applying nanostructures, e.g. by molecular beam epitaxy (MBE)
H01F 41/301
. . .
{
for applying ultrathin or granular layers ( ultrathin or granular layers H01F 10/007 )
}
Collapse
H01F 41/302
. . .
{
for applying spin-exchange-coupled multilayers, e.g. nanostructured superlattices ( spin-exchange-coupled multilayers H01F 10/32 )
}
Collapse
H01F 41/303
. . . .
{
with exchange coupling adjustment of magnetic film pairs, e.g. interface modifications by reduction, oxidation
}
H01F 41/304
. . . . .
{
using temporary decoupling, e.g. involving blocking, Néel or Curie temperature transitions by heat treatment in presence/absence of a magnetic field
}
Collapse
H01F 41/305
. . . .
{
applying the spacer or adjusting its interface, e.g. in order to enable particular effect different from exchange coupling
}
H01F 41/306
. . . . .
{
conductive spacer
}
H01F 41/307
. . . . .
{
insulating or semiconductive spacer
}
H01F 41/308
. . . .
{
lift-off processes, e.g. ion milling, for trimming or patterning
}
H01F 41/309
. . . .
{
electroless or electrodeposition processes from plating solution
}
Collapse
.
for applying conductive, insulating or magnetic material on a magnetic film
{
, specially adapted for a thin magnetic film
}
H01F 41/325
. .
{
applying a noble metal capping on a spin-exchange-coupled multilayer e.g. spin filter deposition
}
WARNING
-
This groups is not complete pending the completion of reclassification; see provisionally also H01F 41/32

H01F 41/34
. .
in patterns, e.g. by lithography
This page is owned by Office of Patent Classification.
Last Modified: 10/10/2013