Skip over navigation
Outline
Indent Level
Color Curly Brackets (indicating CPC extensions to IPC)

CPC
COOPERATIVE PATENT CLASSIFICATION
Collapse
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING (decorating textiles by metallising D06Q 1/04; manufacturing printed circuits by metal deposition H05K 3/18); APPARATUS THEREFOR
WARNING
-
The following IPC groups are not used in the CPC system. Subject matter covered by these groups is classified in the following CPC groups : C25D5/24 covered by C25D 5/34C25D5/26 covered by C25D 5/36C25D5/28 covered by C25D 5/38C25D5/30 covered by C25D 5/42, C25D 5/44C25D5/32 covered by C25D 5/46C25D 13/06 covered by C09D 5/44C25D 13/08 covered by C09D 5/4476C25D 13/10 covered by C09D 5/448C25D19/00 covered by C25D 17/00

Collapse
Electroforming
C25D 1/003
.
{
3D structures, e.g. superposed patterned layers
}
C25D 1/006
.
{
Nanostructures, e.g. aluminum anodic oxidation templates [AAO]
}
C25D 1/02
.
Tubes; Rings; Hollow bodies
C25D 1/04
.
Wires;Strips; Foils
C25D 1/06
.
Wholly-metallic mirrors
C25D 1/08
.
Perforated or foraminous objects, e.g. sieves (C25D 1/10 takes precedence)
C25D 1/10
.
Moulds; Masks; Masterforms
{
, e.g. mandrels, stampers
}
Collapse
C25D 1/12
.
by electrophoresis
{
(electrophoretic coating C25D 13/00)
}
Collapse
C25D 1/14
. .
of inorganic material
C25D 1/16
. . .
Metals
C25D 1/18
. .
of organic material
Collapse
C25D 1/20
.
Separation of the formed objects from the electrodes
{
with no destruction of said electrodes
}
C25D 1/22
. .
Separating compounds
Collapse
Electroplating: Baths therefor
Collapse
C25D 3/02
.
from solutions (C25D5/24 to C25D5/32 take precedence)
Collapse
C25D 3/04
. .
of chromium
C25D 3/06
. . .
from solutions of trivalent chromium
C25D 3/08
. . .
Deposition of black chromium
{
, e.g. hexavalent chromium, CrVI
}
C25D 3/10
. . .
characterised by the organic bath constituents used
Collapse
C25D 3/12
. .
of nickel or cobalt
{
(C25D 3/56 takes precedence)
}
Collapse
C25D 3/14
. . .
from baths containing acetylenic or heterocyclic compounds
C25D 3/16
. . . .
Acetylenic compounds
C25D 3/18
. . . .
Heterocyclic compounds
C25D 3/20
. .
of iron
Collapse
C25D 3/22
. .
of zinc
C25D 3/24
. . .
from cyanide baths
Collapse
C25D 3/26
. .
of cadmium
C25D 3/28
. . .
from cyanide baths
Collapse
C25D 3/30
. .
of tin
C25D 3/32
. . .
characterised by the organic bath constituents used
Collapse
C25D 3/34
. .
of lead
C25D 3/36
. . .
characterised by the organic bath constituents used
Collapse
C25D 3/38
. .
of copper
. . .
from cyanide baths
{
, e.g. with Cu+
}
Collapse
C25D 3/42
. .
of light metals
C25D 3/44
. . .
Aluminium
C25D 3/46
. .
of silver
C25D 3/48
. .
of gold
Collapse
C25D 3/50
. .
of platinum group metals
C25D 3/52
. . .
characterised by the organic bath constituents used
C25D 3/54
. .
of metals not provided for in groups C25D 3/04 to C25D 3/50
Collapse
. .
of alloys
C25D 3/562
. . .
{
containing more than 50% by weight of iron or nickel or cobalt
{
; NiP, FeP, CoP (Phosphatising C25D 11/36)
}
}
C25D 3/565
. . .
{
containing more than 50% by weight of zinc
}
C25D 3/567
. . .
{
containing more than 50% by weight of platinum group metals
}
C25D 3/58
. . .
containing more than 50% by weight of copper
. . .
containing more than 50% by weight of of tin
{
; SnP
}
C25D 3/62
. . .
containing more than 50% by weight of gold
C25D 3/64
. . .
containing more than 50% by weight of silver
Collapse
.
from melts
C25D 3/665
. .
{
from ionic liquids
}
WARNING
-
Group C25D 3/665 is not complete, pending reorganization, see also C25D 3/66]

Collapse
Electroplating characterised by the process; Pretreatment or after-treatment of work-pieces
C25D 5/003
.
{
Electroplating characterised by the use of gases, e.g. pressure influence (removal or gases or vapours, C25D 21/04)
}
WARNING
-
Groups C25D5/00B, C25D 5/006 are not complete, pending reorganization, see also C25D 5/00

C25D 5/006
.
{
Electroplating with applied electromagnetic field, not locally , e.g. for plating magnetic layers
}
Collapse
C25D 5/02
.
Electroplating of selected surface areas
C25D 5/022
. .
{
using masking means
{
(C25D 11/022 takes precedence)
}
}
C25D 5/024
. .
{
using locally applied electromagnetic radiation e.g. lasers
}
C25D 5/026
. .
{
using locally applied jets of electrolyte
}
C25D 5/028
. .
{
one side electroplating
{
, e.g. substrate conveyed in a bath with inhibited background plating
}
}
Collapse
C25D 5/04
.
Electroplating with moving electrodes
C25D 5/06
. .
Brush or pad plating
{
(electrodes for pad plating C25D 17/14)
}
.
Electroplating with moving electrolyte
{
, characterised by electrolyte flow
}
, e.g. jet electroplating
{
(spraying of electrolyte on wires strip or foils C25D 7/0642, means or devices for moving the electrolyte C25D 21/10, C25D 5/026 takes precedence)
}
Collapse
C25D 5/10
.
Electroplating with more than one layer of the same or of different metals (for bearings C25D 7/10)
Collapse
C25D 5/12
. .
at least one layer being of nickel or chromium
C25D 5/14
. . .
two or more layers being of nickel or chromium, e.g. duplex or triplex layers
.
Electroplating with layers of varying thickness
{
, e.g. rough surfaces
}
{
; Hull cells
}
C25D 5/18
.
Electroplating using modulated, pulsed or reversing current
C25D 5/20
.
Electroplating using ultrasonics
{
, vibrations
}
C25D 5/22
.
Electroplating combined with mechanical treatment during the deposition
Collapse
C25D 5/34
.
Pretreatment of metallic surfaces to be electroplated
C25D 5/36
. .
of iron or steel
Collapse
C25D 5/38
. .
of refractory metals or nickel
C25D 5/40
. . .
Nickel; Chromium
Collapse
C25D 5/42
. .
of light metals
C25D 5/44
. . .
Aluminium
C25D 5/46
. .
of actinides
Collapse
C25D 5/48
.
After-treatment of electroplated surfaces
Collapse
C25D 5/50
. .
by heat-treatment
C25D 5/505
. . .
{
of electroplated tin coatings, e.g. by melting
}
C25D 5/52
. .
by brightening or burnishing
Collapse
.
Electroplating
{
on
}
non-metallic surfaces
{
,e.g. on carbon or carbon composites
}
(C25D 7/12 takes precedence)
. .
on
{
thin or conductive
}
plastics
{
(coating metallic material C23C)
}
Collapse
Electroplating characterised by the article coated
C25D 7/001
.
{
Magnets
}
WARNING
-
Groups C25D7/00B-C25D 7/008 are not complete, pending reorganization, see also C25D 7/00

C25D 7/003
.
{
Threaded pieces, e.g. bolts, nuts
}
C25D 7/005
.
{
Jewels or clockworks
}
C25D 7/006
.
{
Nanoparticles
}
C25D 7/008
.
{
Thermal barrier coatings
}
C25D 7/02
.
Slide fasteners
C25D 7/04
.
Tubes; Rings; Hollow bodies
Collapse
.
Wires; Strips; Foils
C25D 7/0607
. .
{
Wires
}
Collapse
C25D 7/0614
. .
{
Strips or foils
}
C25D 7/0621
. . .
{
In horizontal cells
}
C25D 7/0628
. . .
{
In vertical cells
}
C25D 7/0635
. . .
{
In radial cells
}
C25D 7/0642
. . .
{
Anodes
}
C25D 7/065
. . .
{
Diaphragms
}
C25D 7/0657
. . .
{
Conducting rolls
}
C25D 7/0664
. . .
{
Isolating rolls
}
Collapse
C25D 7/0671
. . .
{
Selective plating
}
C25D 7/0678
. . . .
{
using masks
}
C25D 7/0685
. . .
{
Spraying of electrolyte
}
C25D 7/0692
. . .
{
Regulating the thickness of the coating
}
C25D 7/08
.
Mirrors; Reflectors
.
Bearings
Collapse
.
Semiconductors
{
without seed layer
}
C25D 7/123
. .
{
Semiconductors first coated with a seed layer for filling vias
}
WARNING
-
Groups C25D7/12B-C25D 7/126 are not complete, pending reorganization, see also C25D 7/12]

C25D 7/126
. .
{
Semiconductors first coated with a seed layer for solar cells
}
Collapse
Electrolytic coating other than with metals (C25D 11/00, C25D 15/00 take precedence; electrophoretic coating C25D 13/00)
C25D 9/02
.
with organic materials
Collapse
C25D 9/04
.
with inorganic materials
C25D 9/06
. .
by anodic processes
Collapse
C25D 9/08
. .
by cathodic processes
C25D 9/10
. . .
on iron or steel
C25D 9/12
. . .
on light metals
Collapse
Electrolytic coating by surface reaction, i.e. forming conversion layers
C25D 11/005
.
{
Apparatus specially adapted for electrolytic conversion coating (apparatus in general for electrolytic coating C25D 17/00)
}
WARNING
-
Groups C25B11/00B, C25D 11/022-C25D11/02F, C25D 11/045 are not complete, pending reorganization, see also C25D 11/00

Collapse
C25D 11/02
.
Anodisation
C25D 11/022
. .
{
Anodisation on selected surface areas
}
C25D 11/024
. .
{
Anodisation under pulsed or modulated current or potential
}
C25D 11/026
. .
{
Anodisation with spark discharge [ANOF]
}
C25D 11/028
. .
{
Borodising,, i.e. borides formed electrochemically
}
Collapse
C25D 11/04
. .
of aluminium or alloys based thereon
C25D 11/045
. . .
{
for forming AAO templates
}
Collapse
C25D 11/06
. . .
characterised by the electrolytes used
C25D 11/08
. . . .
containing inorganic acids
C25D 11/10
. . . .
containing organic acids
C25D 11/12
. . .
Anodising more than once, e.g. in different baths
C25D 11/14
. . .
Producing integrally coloured layers
. . .
Pretreatment
{
, e.g. desmutting
}
Collapse
. . .
After-treatment, e.g. pore sealing (lacquering B44D)
Collapse
C25D 11/20
. . . .
Electrolytic after-treatment
C25D 11/22
. . . . .
for colouring layers
Collapse
C25D 11/24
. . . .
Chemical after-treatment
C25D 11/243
. . . . .
{
using organic dyestuffs
}
C25D 11/246
. . . . .
{
for sealing layers
}
C25D 11/26
. .
of refractory metals or alloys based thereon
C25D 11/28
. .
of actinides or alloys based thereon
C25D 11/30
. .
of magnesium or alloys based thereon
C25D 11/32
. .
of semiconducting materials
C25D 11/34
. .
of metals or alloys not provided for in groups C25D 11/04 to C25D 11/32
.
Phosphatising
{
, e.g. NiP, CoP, FeP (bath solutions of NiP, CoP, FeP C25D 3/562)
}
C25D 11/38
.
Chromatising
Collapse
Electrophoretic coating (C25D 15/00 takes precedence; apparatus for continuously conveying articles into baths B65G, e.g. B65G 49/00)
C25D 13/02
.
with inorganic material
Collapse
C25D 13/04
.
with organic material
Collapse
C25D 13/06
. .
with polymers
{
not used, see C09D 5/44
}
C25D 13/08
. . .
by polymerisation in situ of monomeric materials
{
not used, see C09D 5/4476
}
C25D 13/10
.
characterised by the additives used
{
not used, see C09D 5/448
}
Collapse
C25D 13/12
.
characterised by the article coated
C25D 13/14
. .
Tubes; Rings; Hollow bodies
C25D 13/16
. .
Wires; Strips; Foils
C25D 13/18
.
using modulated, pulsed, or reversing current
C25D 13/20
.
Pre-treatment
Collapse
.
Servicing or operating
{
apparatus or multistep processes
}
C25D 13/24
. .
Regeneration of process liquids
Collapse
Electrolytic or electrophoretic production of coatings containing
{
uncharged
}
embedded materials, e.g. particles, whiskers, wires
.
Combined electrolytic and electrophoretic processes
{
with charged materials
}
Collapse
Constructional parts, or assemblies thereof, of cells for electrolytic coating (apparatus for continuously conveying articles into baths B65G, e.g. B65G 49/00; electric devices see the relevant classes, e.g. H01B, H02G)
{
(C25D 7/06, C25D11/42, C25D 13/22, C25 takes precedence)
}
C25D 17/001
.
{
Apparatus specially adapted for plating wafers, e.g. semiconductors, solar cells
}
WARNING
-
Groups C25B17/00B-C25D 17/008 are not complete, pending reorganization, see also C25D 17/00

C25D 17/002
.
{
Cell separation, e.g. membranes, diaphragms
}
C25D 17/004
.
{
Sealing devices
}
C25D 17/005
.
{
Contacting devices
}
C25D 17/007
.
{
Current conducting devices
}
C25D 17/008
.
{
Current insulating devices
}
Collapse
C25D 17/02
.
Tanks; Installations therefor
C25D 17/04
. .
External supporting frames or structures
Collapse
C25D 17/06
.
Suspending or supporting devices for articles to be coated
. .
{
Supporting
}
racks
{
i.e. not for suspending
}
Collapse
.
Electrodes
{
e.g. composition, counter electrode
}
C25D 17/12
. .
Shape or form (C25D 17/14 takes precedence)
C25D 17/14
. .
for pad-plating
Collapse
C25D 17/16
.
Apparatus for electrolytic coating of small objects in bulk
Collapse
C25D 17/18
. .
having closed containers
C25D 17/20
. . .
Horizontal barrels
Collapse
C25D 17/22
. .
having open containers
C25D 17/24
. . .
Oblique barrels
C25D 17/26
. . .
Oscillating baskets
C25D 17/28
. .
with means for moving the objects individually through the apparatus during treatment
Collapse
Processes for servicing or operating cells for electrolytic coating
C25D 21/02
.
Heating or cooling
.
Removal of gases or vapours
{
; gas or pressure control (electroplating characterized by the use of gases C25D 5/003)
}
.
Filtering
{
particles other than ions (filtering ions C25D 21/22)
}
C25D 21/08
.
Rinsing
.
Agitating of electrolytes; Moving of racks
C25D 21/11
.
Use of protective surface layers on electrolytic baths
Collapse
C25D 21/12
.
Process control or regulation (controlling or regulating in general G05)
C25D 21/14
. .
Controlled addition of electrolyte components
Collapse
C25D 21/16
.
Regeneration of process solutions
{
(C25D 13/24 takes precedence)
}
C25D 21/18
. .
of electrolytes (C25D 21/22 takes precedence)
C25D 21/20
. .
of rinse-solutions (C25D 21/22 takes precedence)
. .
by ion-exchange
This page is owned by Office of Patent Classification.
Last Modified: 10/10/2013