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Color Curly Brackets (indicating CPC extensions to IPC) References Date Revised
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CPC
COOPERATIVE PATENT CLASSIFICATION
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PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS (details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01 , H01L 27/13 ; non-printed means for electric connections to or between printed circuits,
{
electric connections or line connectors, apparatus or processes for manufacturing, assembling, maintaining or repairing such connections or connectors
}
H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes)
[2013‑01]
NOTE

  • This subclass covers:
    • combinations of a radio or television receiver with apparatus having a different main function;
    • printed circuits structurally associated with non-printed electric components;
    • {
      printed connectors (non printed connectors H01R)
      }
  • In this subclass, the following expression is used with the meaning indicated:
    • "printed circuits" covers all kinds of mechanical constructions of circuits that consist of an insulating base or support carrying the conductor and are combined structurally with the conductor throughout their length, especially in a two-dimensional plane, the conductors of which are secured to the base in a non-dismountable manner, and also covers the processes or apparatus for manufacturing such constructions, e.g. forming the circuit by mechanical or chemical treatment of a conductive foil, paste, or film on an insulating support.
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Printed circuits (assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00 ; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00) [2013‑01]
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H05K 1/02
.
Details [2013‑01]
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H05K 1/0201
. .
{
Thermal arrangements, e.g. for cooling, heating or preventing overheating
}
[2013‑01]
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. . .
{
Cooling of mounted components (H05K 1/0272 takes precedence)
}
[2013‑01]
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. . . .
{
using means for thermal conduction connection in the thickness direction of the substrate (H05K 1/0207 takes precedence)
}
[2013‑01]
H05K 1/0206
. . . . .
{
by printed thermal vias
}
[2013‑01]
H05K 1/0207
. . . .
{
using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
}
[2013‑01]
H05K 1/0209
. . . .
{
External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
}
[2013‑01]
H05K 1/021
. . . .
{
Components thermally connected to metal substrates or heat-sinks by insert mounting
}
[2013‑01]
H05K 1/0212
. . .
{
Printed circuits or mounted components having integral heating means
}
[2013‑01]
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. .
{
Electrical arrangements not otherwise provided for (screening H05K 9/00 ; emergency protective circuits H02H)
}
[2013‑01]
H05K 1/0215
. . .
{
Grounding of printed circuits by connection to external grounding means
}
[2013‑01]
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. . .
{
Reduction of cross-talk, and noise or electromagnetic interference (grounding H05K 1/0215)
}
[2013‑01]
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. . . .
{
by printed shielding conductors, ground planes or power plane (H05K 1/0236 takes precedence)
}
[2013‑01]
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H05K 1/0219
. . . . .
{
Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
}
[2013‑01]
H05K 1/0221
. . . . . .
{
Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines (coaxially shielded vias H05K 1/0222)
}
[2013‑01]
H05K 1/0222
. . . . . .
{
for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
}
[2013‑01]
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H05K 1/0224
. . . . .
{
Patterned shielding planes, ground planes or power planes (H05K 1/0253 takes precedence)
}
[2013‑01]
H05K 1/0225
. . . . . .
{
Single or multiple openings in a shielding, ground or power plane (H05K 1/0227 takes precedence)
}
[2013‑01]
H05K 1/0227
. . . . . .
{
Split or nearly split shielding or ground planes
}
[2013‑01]
H05K 1/0228
. . . .
{
Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors (balanced signal pairs H05K 1/0245)
}
[2013‑01]
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. . . .
{
using auxiliary mounted passive components or auxiliary substances (printed passive components H05K 1/16)
}
[2013‑01]
H05K 1/0231
. . . . .
{
Capacitors or dielectric substances
}
[2013‑01]
H05K 1/0233
. . . . .
{
Filters, inductors or a magnetic substance
}
[2013‑01]
H05K 1/0234
. . . . .
{
Resistors or by disposing resistive or lossy substances in or near power planes (H05K 1/0246 takes precedence)
}
[2013‑01]
H05K 1/0236
. . . .
{
Electromagnetic band-gap structures (conductive planes with an opening or a split H05K 1/0225 , H05K 1/0227)
}
[2013‑01]
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H05K 1/0237
. . .
{
High frequency adaptations (H05K 1/0216 takes precedence)
}
[2013‑01]
H05K 1/0239
. . . .
{
Signal transmission by AC coupling
}
[2013‑01]
H05K 1/024
. . . .
{
Dielectric details, e.g. changing the dielectric material around a transmission line
}
[2013‑01]
H05K 1/0242
. . . .
{
Structural details of individual signal conductors, e.g. related to the skin effect
}
[2013‑01]
H05K 1/0243
. . . .
{
Printed circuits associated with mounted high frequency components
}
[2013‑01]
H05K 1/0245
. . . .
{
Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
}
[2013‑01]
H05K 1/0246
. . . .
{
Termination of transmission lines
}
[2013‑01]
H05K 1/0248
. . . .
{
Skew reduction or using delay lines
}
[2013‑01]
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. . . .
{
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K 1/024 and H05K 1/0243 take precedence; for semiconductor devices H01L 23/66)
}
[2013‑01]
H05K 1/0251
. . . . .
{
related to vias or transitions between vias and transmission lines
}
[2013‑01]
H05K 1/0253
. . . . .
{
Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K 1/0251 takes precedence)
}
[2013‑01]
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. . .
{
High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection (electrostatic discharge protection for electric apparatus in general H05K 9/0067 , H05K 9/0079); Arrangements for regulating voltages or for using plural voltages
}
[2013‑01]
H05K 1/0256
. . . .
{
Electrical insulation details, e.g. around high voltage areas
}
[2013‑01]
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H05K 1/0257
. . . .
{
Overvoltage protection
}
[2013‑01]
H05K 1/0259
. . . . .
{
Electrostatic discharge [ESD] protection
}
[2013‑01]
H05K 1/026
. . . . .
{
Spark gaps (spark gaps per se H01T)
}
[2013‑01]
H05K 1/0262
. . . .
{
Arrangements for regulating voltages or for using plural voltages
}
[2013‑01]
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. . .
{
High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K 1/0293 takes precedence)
}
[2013‑01]
H05K 1/0265
. . . .
{
characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
}
[2013‑01]
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H05K 1/0266
. .
{
Marks, test patterns, inspection means or identification means
}
[2013‑01]
H05K 1/0268
. . .
{
for electrical inspection or testing
}
[2013‑01]
H05K 1/0269
. . .
{
for visual or optical inspection
}
[2013‑01]
H05K 1/0271
. .
{
Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
}
[2013‑01]
H05K 1/0272
. .
{
Adaptations for fluid transport, e.g. channels, holes
}
[2013‑01]
H05K 1/0274
. .
{
Optical details, e.g. printed circuits comprising integral optical means (H05K 1/0269 takes precedence; Coupling light guides with opto-electronic components G02B 6/42)
}
[2013‑01]
H05K 1/0275
. .
{
Security details, e.g. tampering prevention or detection (security details of computer components G06F 21/70)
}
[2013‑01]
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. .
{
Bendability or stretchability details (not used, see subgroups; H05K 1/038 , H05K 3/4691 take precedence)
}
[2013‑01]
H05K 1/0278
. . .
{
Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
}
[2013‑01]
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H05K 1/028
. . .
{
Bending or folding regions of flexible printed circuits (H05K 1/0283 takes precedence)
}
[2013‑01]
H05K 1/0281
. . . .
{
Reinforcement details thereof
}
[2013‑01]
H05K 1/0283
. . .
{
Stretchable printed circuits
}
[2013‑01]
H05K 1/0284
. .
{
Details of three-dimensional rigid printed circuit boards (H05K 1/119 takes precedence; shaping of the substrate H05K 3/0014)
}
[2013‑01]
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. .
{
Programmable, customizable or modifiable circuits (by programmable non-printed jumper connections H05K 3/222)
}
[2013‑01]
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H05K 1/0287
. . .
{
having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
}
[2013‑01]
H05K 1/0289
. . . .
{
having a matrix lay-out, i.e. having slectively interconnectable sets of X-conductors and Y-conductors in different planes
}
[2013‑01]
H05K 1/029
. . .
{
having a programmable lay-out, i.e. adapted for choosing between a few possibilities
}
[2013‑01]
H05K 1/0292
. . .
{
having a modifiable lay-out, i.e. adapted for engineering changes or repair (H05K 1/0293 takes precedence)
}
[2013‑01]
H05K 1/0293
. . .
{
Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
}
[2013‑01]
H05K 1/0295
. . .
{
adapted for choosing between different types or different locations of mounted components
}
[2013‑01]
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. .
{
Conductive pattern lay-out details not covered by sub groups H05K 1/02 to H05K 1/0295 (H05K 1/11 takes precedence; lay-out adapted to mounted component configuration H05K 1/18)
}
[2013‑01]
H05K 1/0298
. . .
{
Multilayer circuits
}
[2013‑01]
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. .
Use of materials for the substrate
{
(substrates for semiconductor chips H01L 23/00)
}
[2013‑01]
H05K 1/0306
. . .
{
Inorganic insulating substrates, e.g. ceramic, glass
}
[2013‑01]
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H05K 1/0313
. . .
{
Organic insulating material
}
[2013‑01]
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H05K 1/032
. . . .
{
consisting of one material
}
[2013‑01]
NOTE

  • In this group, in the absence of an indication to the contrary, a material is classified in the last appropriate place
H05K 1/0326
. . . . .
{
containing O
}
[2013‑01]
H05K 1/0333
. . . . .
{
containing S
}
[2013‑01]
H05K 1/034
. . . . .
{
containing halogen
}
[2013‑01]
H05K 1/0346
. . . . .
{
containing N
}
[2013‑01]
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H05K 1/0353
. . . .
{
consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
}
[2013‑01]
H05K 1/036
. . . . .
{
Multilayers with layers of different types
}
[2013‑01]
H05K 1/0366
. . . . .
{
reinforced, e.g. by fibres, fabrics (H05K 1/036 takes precedence)
}
[2013‑01]
H05K 1/0373
. . . . .
{
containing additives, e.g. fillers (H05K 1/036 takes precedence)
}
[2013‑01]
H05K 1/038
. . .
{
Textiles (used as reinforcing materials for organic insulating substrates H05K 1/0366)
}
[2013‑01]
H05K 1/0386
. . .
{
Paper sheets (used as reinforcing materials for organic insulating substrates H05K 1/0366)
}
[2013‑01]
H05K 1/0393
. . .
{
Flexible materials (H05K 1/038 takes precedence; specific organic compositions are classified in H05K 1/0313 and subgroups)
}
[2013‑01]
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. . .
Insulated metal substrate
{
or other insulated electrically conductive substrate (thermal coupling of mounted components and metal substrate H05K 1/0204 , H05K 1/021)
}
[2013‑01]
H05K 1/053
. . . .
{
the metal substrate being covered by an inorganic insulating layer
}
[2013‑01]
H05K 1/056
. . . .
{
the metal substrate being covered by an organic insulating layer
}
[2013‑01]
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H05K 1/09
. .
Use of materials for the metallic pattern
{
or other conductive pattern (materials for conductors H01B 1/00)
}
[2013‑01]
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H05K 1/092
. . .
{
Dispersed materials, e.g. conductive pastes or inks (Conductive material dispersed in non-conductive material in general H01B 1/14 to H01B 1/24 ; Conductive inks in general C09D 11/52)
}
[2013‑01]
H05K 1/095
. . . .
{
for polymer thick films, i.e. having a permanent organic polymeric binder
}
[2013‑01]
H05K 1/097
. . . .
{
Inks comprising nanoparticles, i.e. inks which are sinterable at low temperatures
}
[2013‑01]
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H05K 1/11
. .
Printed elements for providing electric connections to or between printed circuits [2013‑01]
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H05K 1/111
. . .
{
Pads for surface mounting, e.g. lay-out
}
[2013‑01]
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H05K 1/112
. . . .
{
directly combined with via connections
}
[2013‑01]
H05K 1/113
. . . . .
{
Via provided in pad; Pad over filled via
}
[2013‑01]
H05K 1/114
. . . . .
{
Pad being close to via, but not surrounding the via
}
[2013‑01]
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H05K 1/115
. . .
{
Via connections; Lands around holes or via connections (H05K 1/112 takes precedence)
}
[2013‑01]
H05K 1/116
. . . .
{
Lands, clearance holes or other lay-out details concerning the surrounding of a via
}
[2013‑01]
H05K 1/117
. . .
{
Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
}
[2013‑01]
H05K 1/118
. . .
{
specially for flexible printed circuits, e.g. using folded portions
}
[2013‑01]
H05K 1/119
. . .
{
Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K 1/117 takes precedence)
}
[2013‑01]
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. .
Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K 1/11 , H01R 9/09 , H01R 23/68) [2013‑01]
H05K 1/141
. . .
{
One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters (H05K 1/142 and H05K 1/147 take precedence)
}
[2013‑01]
H05K 1/142
. . .
{
Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
}
[2013‑01]
H05K 1/144
. . .
{
Stacked arrangements of planar printed circuit boards
}
[2013‑01]
H05K 1/145
. . .
{
Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
}
[2013‑01]
H05K 1/147
. . .
{
at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K 1/148 takes precedence)
}
[2013‑01]
H05K 1/148
. . .
{
Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
}
[2013‑01]
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.
incorporating printed electric components, e.g. printed resistor, capacitor, inductor
{
(thick-film or thin-film circuits H01L 27/01 , H01L 27/13)
}
[2013‑01]
H05K 1/162
. .
{
incorporating printed capacitors
}
[2013‑01]
H05K 1/165
. .
{
incorporating printed inductors
}
[2013‑01]
H05K 1/167
. .
{
incorporating printed resistors
}
[2013‑01]
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.
Printed circuits structurally associated with non-printed electric components (
{
H05K 1/0201 , H05K 1/023 , H05K 1/0243 ,
}
H05K 1/16 take precedence)
[2013‑01]
H05K 1/181
. .
{
associated with surface mounted components
}
[2013‑01]
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H05K 1/182
. .
{
associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
}
[2013‑01]
H05K 1/183
. . .
{
Components mounted in and supported by recessed areas of the printed circuit board
}
[2013‑01]
H05K 1/184
. . .
{
Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
}
[2013‑01]
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H05K 1/185
. . .
{
Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit (semiconductor chips encapsulated by interconnect and support structures H01L 23/5389 , H01L 24/00)
}
[2013‑01]
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H05K 1/186
. . . .
{
manufactured by mounting on or connecting to patterned circuits before or during embedding
}
[2013‑01]
H05K 1/187
. . . . .
{
the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
}
[2013‑01]
H05K 1/188
. . . .
{
manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
}
[2013‑01]
H05K 1/189
. .
{
characterised by the use of a flexible or folded printed circuit (H05K 3/326 takes precedence)
}
[2013‑01]
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Apparatus or processes for manufacturing printed circuits (photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F ; involving the manufacture of semiconductor devices H01L) [2013‑01]
H05K 3/0002
.
{
for manufacturing artworks for printed circuits
}
[2013‑01]
H05K 3/0005
.
{
for designing circuits by computer
}
[2013‑01]
H05K 3/0008
.
{
for aligning or positioning of tools relative to the circuit board (H05K 3/4638 , H05K 3/4679 take precedence; for manufacturing assemblages of components H05K 13/0015)
}
[2013‑01]
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.
{
Working of insulating substrates or insulating layers (making copper-clad substrates H05K 3/022 ; surface treatment for improvement of adhesion H05K 3/381)
}
[2013‑01]
H05K 3/0014
. .
{
Shaping of the substrate, e.g. by moulding
}
[2013‑01]
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H05K 3/0017
. .
{
Etching of the substrate by chemical or physical means
}
[2013‑01]
H05K 3/002
. . .
{
by liquid chemical etching
}
[2013‑01]
H05K 3/0023
. . .
{
by exposure and development of a photosensitive insulating layer
}
[2013‑01]
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H05K 3/0026
. . .
{
by laser ablation
}
[2013‑01]
H05K 3/0029
. . . .
{
of inorganic insulating material
}
[2013‑01]
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H05K 3/0032
. . . .
{
of organic insulating material
}
[2013‑01]
H05K 3/0035
. . . . .
{
of blind holes, i.e. having a metal layer at the bottom
}
[2013‑01]
H05K 3/0038
. . . . .
{
combined with laser drilling through a metal layer
}
[2013‑01]
H05K 3/0041
. . .
{
by plasma etching
}
[2013‑01]
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H05K 3/0044
. .
{
Mechanical working of the substrate, e.g. drilling or punching (H05K 3/0008 takes precedence)
}
[2013‑01]
H05K 3/0047
. . .
{
Drilling of holes
}
[2013‑01]
H05K 3/005
. . .
{
Punching of holes
}
[2013‑01]
H05K 3/0052
. . .
{
Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
}
[2013‑01]
H05K 3/0055
. .
{
After-treatment, e.g. cleaning or desmearing of holes
}
[2013‑01]
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.
{
Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K 1/0281 takes precedence)
}
[2013‑01]
H05K 3/0061
. .
{
onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K 7/20)
}
[2013‑01]
H05K 3/0064
. .
{
onto a polymeric substrate
}
[2013‑01]
H05K 3/0067
. .
{
onto an inorganic, non-metallic substrate
}
[2013‑01]
H05K 3/007
.
{
Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K 1/187 , H05K 3/20 and H05K 3/4682 take precedence)
}
[2013‑01]
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.
{
Masks not provided for in groups H05K 3/02 to H05K 3/46 , e.g. for photomechanical production of patterned surfaces
}
[2013‑01]
H05K 3/0076
. .
{
characterised by the composition of the mask
}
[2013‑01]
H05K 3/0079
. .
{
characterised by the method of application or removal of the mask (H05K 3/0091 takes precedence)
}
[2013‑01]
H05K 3/0082
. .
{
characterised by the exposure method of radiation-sensitive masks
}
[2013‑01]
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.
{
Apparatus for treatments of printed circuits with liquids not provided for in groups H05K 3/02 to H05K 3/46 ; conveyers and holding means therefor (apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K 13/00)
}
[2013‑01]
H05K 3/0088
. .
{
for treatment of holes
}
[2013‑01]
H05K 3/0091
.
{
Apparatus for coating printed circuits using liquid non-metallic coating compositions
}
[2013‑01]
H05K 3/0094
.
{
Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
}
[2013‑01]
H05K 3/0097
.
{
Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K 3/0052 takes precedence)
}
[2013‑01]
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H05K 3/02
.
in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding [2013‑01]
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H05K 3/022
. .
{
Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates (laminates in general B32B)
}
[2013‑01]
H05K 3/025
. . .
{
by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
}
[2013‑01]
H05K 3/027
. .
{
the conductive material being removed by irradiation, e.g. by photons, alpha, beta particles (machining by laser in general B23K 26/00 ; electron - or ion beam tubes therefor H01J 37/00)
}
[2013‑01]
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H05K 3/04
. .
the conductive material being removed mechanically, e.g. by punching [2013‑01]
H05K 3/041
. . .
{
by using a die for cutting the conductive material
}
[2013‑01]
H05K 3/043
. . .
{
by using a moving tool for milling or cutting the conductive material
}
[2013‑01]
H05K 3/045
. . .
{
by making a conductive layer having a relief pattern, followed by abrading of the raised portions
}
[2013‑01]
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H05K 3/046
. . .
{
by selective transfer or selective detachment of a conductive layer
}
[2013‑01]
H05K 3/048
. . . .
{
using a lift-off resist pattern or a release layer pattern
}
[2013‑01]
Collapse
. .
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
{
(Non-mechanical removal of metallic material from surfaces C23F; semi-additive methods H05K 3/108)
}
[2013‑01]
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H05K 3/061
. . .
{
Etching masks (local etching C23F 1/02)
}
[2013‑01]
H05K 3/062
. . . .
{
consisting of metals or alloys or metallic inorganic compounds (H05K 3/065 takes precedence)
}
[2013‑01]
H05K 3/064
. . . .
{
Photoresists
}
[2013‑01]
H05K 3/065
. . . .
{
applied by electrographic, electrophotographic or magnetographic methods (in general G03G)
}
[2013‑01]
H05K 3/067
. . .
{
Etchants (in general C23F 1/10 to C23F 1/46)
}
[2013‑01]
H05K 3/068
. . .
{
Apparatus for etching printed circuits (in general C23F 1/08)
}
[2013‑01]
H05K 3/07
. . .
being removed electrolytically [2013‑01]
H05K 3/08
. .
the conductive material being removed by electric discharge, e.g. by spark erosion
{
(working of metal by electro-erosion per se B23H)
}
[2013‑01]
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H05K 3/10
.
in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern [2013‑01]
H05K 3/101
. .
{
by casting or moulding of conductive material
}
[2013‑01]
H05K 3/102
. .
{
by bonding of conductive powder, i.e. metallic powder (H05K 3/12 takes precedence)
}
[2013‑01]
H05K 3/103
. .
{
by bonding or embedding conductive wires or strips
}
[2013‑01]
Collapse
H05K 3/105
. .
{
by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
}
[2013‑01]
H05K 3/106
. . .
{
by photographic methods (in general G03C)
}
[2013‑01]
H05K 3/107
. .
{
by filling grooves in the support with conductive material (H05K 3/045 , H05K 3/101 , H05K 3/1258 and H05K 3/465 take precedence)
}
[2013‑01]
H05K 3/108
. .
{
by semi-additive methods; masks therefor (characterised by metallic etch mask H05K 3/062 ; electroplating methods or apparatus H05K 3/241)
}
[2013‑01]
Collapse
. .
{
using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns (printing techniques in general B41M, printing apparatus B41F)
}
[2013‑01]
H05K 3/1208
. . .
{
Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns (providing shape patterns H05K 3/1258 ; adhesion treatments H05K 3/38)
}
[2013‑01]
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H05K 3/1216
. . .
{
by screen printing or stencil printing
}
[2013‑01]
H05K 3/1225
. . . .
{
Screens or stencils (in general B41N 1/24 ; manufacturing of screens or stencils B41C 1/14); Holders therefor (stencil holders for applying liquids B05C 17/08)
}
[2013‑01]
H05K 3/1233
. . . .
{
Methods or means for supplying the conductive material and for forcing it through the screen or stencil
}
[2013‑01]
Collapse
H05K 3/1241
. . .
{
by ink-jet printing or drawing by dispensing
}
[2013‑01]
H05K 3/125
. . . .
{
by ink-jet printing (in general B41J)
}
[2013‑01]
H05K 3/1258
. . .
{
by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
}
[2013‑01]
H05K 3/1266
. . .
{
by electrographic or magnetographic printing (in general G03G)
}
[2013‑01]
H05K 3/1275
. . .
{
by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
}
[2013‑01]
Collapse
H05K 3/1283
. . .
{
After-treatment of the printed patterns, e.g. sintering or curing methods
}
[2013‑01]
H05K 3/1291
. . . .
{
Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
}
[2013‑01]
Collapse
. .
using spraying techniques to apply the conductive material
{
including vapour evaporation; (covering metals by metal spraying C23C 4/00 ; coating by vacuum evaporation C23C 14/00)
}
[2013‑01]
H05K 3/143
. . .
{
Masks therefor (H05K 3/048 takes precedence)
}
[2013‑01]
H05K 3/146
. . .
{
By vapour deposition
}
[2013‑01]
H05K 3/16
. . .
by cathodic sputtering
{
(covering materials by cathodic sputtering C23C 14/34 ; discharge devices therefor H01J 37/34)
}
[2013‑01]
Collapse
. .
using precipitation techniques to apply the conductive material
{
(chemical coating of a substrate by decomposition C23C 18/00)
}
[2013‑01]
Collapse
H05K 3/181
. . .
{
by electroless plating (adhesives therefor H05K 3/387 ; electroless plating in general C23C 18/16)
}
[2013‑01]
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H05K 3/182
. . . .
{
characterised by the patterning method
}
[2013‑01]
H05K 3/184
. . . . .
{
using masks
}
[2013‑01]
H05K 3/185
. . . . .
{
by making a catalytic pattern by photo-imaging
}
[2013‑01]
H05K 3/187
. . . .
{
means therefor, e.g. baths, apparatus
}
[2013‑01]
H05K 3/188
. . .
{
by direct electroplating
}
[2013‑01]
Collapse
. .
by affixing prefabricated conductor pattern
{
(H05K 1/187 , H05K 3/046 , H05K 3/4658 , H05K 3/4682 takes precedence)
}
[2013‑01]
H05K 3/202
. . .
{
using self-supporting metal foil pattern
}
[2013‑01]
H05K 3/205
. . .
{
using a pattern electroplated or electroformed on a metallic carrier
}
[2013‑01]
H05K 3/207
. . .
{
using a prefabricated paste pattern, ink pattern or powder pattern
}
[2013‑01]
Collapse
.
Secondary treatment of printed circuits
{
(H05K 3/1283 takes precedence; embedding circuits in grooves by pressure H05K 3/107)
}
[2013‑01]
H05K 3/222
. .
{
Completing of printed circuits by adding non-printed jumper connections (printed jumper connections H05K 3/4685)
}
[2013‑01]
H05K 3/225
. .
{
Correcting or repairing of printed circuits (H05K 1/0292 , H05K 3/222 , H05K 3/288 , H05K 3/4685 take precedence)
}
[2013‑01]
H05K 3/227
. .
{
Drying of printed circuits
}
[2013‑01]
Collapse
. .
Reinforcing the conductive pattern
{
(by solder coating H05K 3/3457)
}
[2013‑01]
Collapse
H05K 3/241
. . .
{
characterised by the electroplating method; means therefor, e.g. baths, apparatus (electroplating in general C25D)
}
[2013‑01]
H05K 3/242
. . . .
{
characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
}
[2013‑01]
H05K 3/243
. . .
{
characterised by selective plating, e.g. for finish plating of pads (selective plating for making the circuit pattern H05K 3/108 , H05K 3/182)
}
[2013‑01]
H05K 3/244
. . .
{
Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K 3/243 ; finish plating of conductors made by printing techniques H05K 3/246 ; solder as finish H05K 3/3457 , e.g. by plating H05K 3/3473)
}
[2013‑01]
Collapse
H05K 3/245
. . .
{
Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
}
[2013‑01]
H05K 3/246
. . . .
{
Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
}
[2013‑01]
Collapse
H05K 3/247
. . . .
{
Finish coating of conductors by using conductive pastes, inks or powders
}
[2013‑01]
H05K 3/248
. . . . .
{
fired compositions for inorganic substrates
}
[2013‑01]
H05K 3/249
. . . . .
{
comprising carbon particles as main constituent
}
[2013‑01]
H05K 3/26
. .
Cleaning or polishing of the conductive pattern [2013‑01]
Collapse
. .
Applying non-metallic protective coatings
{
(H05K 3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K 3/4673)
}
[2013‑01]
H05K 3/281
. . .
{
by means of a preformed insulating foil (H05K 3/284 takes precedence)
}
[2013‑01]
H05K 3/282
. . .
{
for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
}
[2013‑01]
H05K 3/284
. . .
{
for encapsulating mounted components (H05K 1/185 takes precedence)
}
[2013‑01]
Collapse
H05K 3/285
. . .
{
Permanent coating compositions
}
[2013‑01]
H05K 3/287
. . . .
{
Photosensitive compositions
}
[2013‑01]
H05K 3/288
. . .
{
Removal of non-metallic coatings, e.g. for repairing
}
[2013‑01]
Collapse
H05K 3/30
.
Assembling printed circuits with electric components, e.g. with resistor [2013‑01]
H05K 3/301
. .
{
by means of a mounting structure (H05K 3/325 takes precedence)
}
[2013‑01]
Collapse
H05K 3/303
. .
{
Surface mounted components, e.g. affixing before soldering, aligning means, spacing means (H05K 3/32 takes precedence)
}
[2013‑01]
H05K 3/305
. . .
{
Affixing by adhesive
}
[2013‑01]
Collapse
H05K 3/306
. .
{
Lead-in-hole components, e.g. affixing or retention before soldering, spacing means (H05K 3/32 takes precedence)
}
[2013‑01]
H05K 3/308
. . .
{
Adaptations of leads (connectors to printed circuits H01R 9/091)
}
[2013‑01]
Collapse
H05K 3/32
. .
electrically connecting electric components or wires to printed circuits [2013‑01]
Collapse
H05K 3/321
. . .
{
by conductive adhesive (in general H01R 4/04)
}
[2013‑01]
H05K 3/323
. . . .
{
by applying an anisotropic conductive adhesive layer over an array of pads
}
[2013‑01]
Collapse
H05K 3/325
. . .
{
by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor (adaptations of leads inserted in holes for press-fit connections H05K 3/308)
}
[2013‑01]
H05K 3/326
. . . .
{
the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits (H05K 3/365 takes precedence)
}
[2013‑01]
H05K 3/328
. . .
{
by welding
}
[2013‑01]
Collapse
. . .
by soldering
{
(soldering or desoldering apparatus H05K 13/04 , B23K 1/00 , B23K 3/00)
}
[2013‑01]
H05K 3/3405
. . . .
{
Edge mounted components, e.g. terminals
}
[2013‑01]
Collapse
H05K 3/341
. . . .
{
Surface mounted components
}
[2013‑01]
H05K 3/3415
. . . . .
{
on both sides of the substrate or combined with lead-in-hole components
}
[2013‑01]
Collapse
H05K 3/3421
. . . . .
{
Leaded components
}
[2013‑01]
H05K 3/3426
. . . . . .
{
characterised by the leads
}
[2013‑01]
Collapse
H05K 3/3431
. . . . .
{
Leadless components
}
[2013‑01]
H05K 3/3436
. . . . . .
{
having an array of bottom contacts, e.g. pad grid array or ball grid array components
}
[2013‑01]
H05K 3/3442
. . . . . .
{
having edge contacts, e.g. leadless chip capacitors, chip carriers
}
[2013‑01]
H05K 3/3447
. . . .
{
Lead-in-hole components (H05K 3/3415 takes precedence)
}
[2013‑01]
H05K 3/3452
. . . .
{
Solder masks
}
[2013‑01]
Collapse
H05K 3/3457
. . . .
{
Solder materials or compositions (solder compositions per se B23K 35/24); Methods of application thereof
}
[2013‑01]
H05K 3/3463
. . . . .
{
Solder compositions in relation to features of the printed circuit board or the mounting process
}
[2013‑01]
H05K 3/3468
. . . . .
{
Applying molten solder
}
[2013‑01]
H05K 3/3473
. . . . .
{
Plating of solder
}
[2013‑01]
Collapse
H05K 3/3478
. . . . .
{
Applying solder paste, particles or preforms; Transferring prefabricated solder patterns
}
[2013‑01]
H05K 3/3484
. . . . . .
{
Paste or slurry or powder (screen printing or stencil printing of solder paste H05K 3/1216)
}
[2013‑01]
H05K 3/3489
. . . .
{
Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
}
[2013‑01]
H05K 3/3494
. . . .
{
Heating methods for reflowing of solder (using integral heating means H05K 1/0212)
}
[2013‑01]
Collapse
.
Assembling printed circuits with other printed circuits
{
(H05K 7/142 takes precedence)
}
[2013‑01]
Collapse
H05K 3/361
. .
{
Assembling flexible printed circuits with other printed circuits
}
[2013‑01]
H05K 3/363
. . .
{
by soldering
}
[2013‑01]
H05K 3/365
. . .
{
by abutting, i.e. without alloying process
}
[2013‑01]
H05K 3/366
. .
{
substantially perpendicularly to each other (H05K 3/361 takes precedence)
}
[2013‑01]
H05K 3/368
. .
{
parallel to each other (H05K 3/361 takes precedence)
}
[2013‑01]
Collapse
H05K 3/38
.
Improvement of the adhesion between the insulating substrate and the metal (Laminates per se B32B) [2013‑01]
H05K 3/381
. .
{
by special treatment of the substrate
}
[2013‑01]
Collapse
H05K 3/382
. .
{
by special treatment of the metal
}
[2013‑01]
H05K 3/383
. . .
{
by microetching
}
[2013‑01]
H05K 3/384
. . .
{
by plating
}
[2013‑01]
H05K 3/385
. . .
{
by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
}
[2013‑01]
Collapse
H05K 3/386
. .
{
by the use of an organic polymeric bonding layer, e.g. adhesive
}
[2013‑01]
H05K 3/387
. . .
{
for electroless plating (H05K 3/4661 takes precedence)
}
[2013‑01]
H05K 3/388
. .
{
by the use of a metallic or inorganic thin film adhesion layer
}
[2013‑01]
H05K 3/389
. .
{
by the use of a coupling agent, e.g. silane
}
[2013‑01]
Collapse
H05K 3/40
.
Forming printed elements for providing electric connections to or between printed circuits [2013‑01]
Collapse
H05K 3/4007
. .
{
Surface contacts, e.g. bumps (H05K 3/4092 takes precedence; deposition of finish layers on pads H05K 3/24 ; forming solder bumps H05K 3/3457)
}
[2013‑01]
H05K 3/4015
. . .
{
using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
}
[2013‑01]
H05K 3/403
. .
{
Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof (H05K 3/4092 takes precedence)
}
[2013‑01]
Collapse
H05K 3/4038
. .
{
Through-connections or via connections (H05K 3/403 and H05K 3/42 take precedence)
}
[2013‑01]
H05K 3/4046
. . .
{
using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
}
[2013‑01]
Collapse
H05K 3/4053
. . .
{
by thick-film techniques
}
[2013‑01]
H05K 3/4061
. . . .
{
for via connections in inorganic insulating substrates
}
[2013‑01]
H05K 3/4069
. . . .
{
for via connections in organic insulating substrates
}
[2013‑01]
H05K 3/4076
. . .
{
by thin-film techniques
}
[2013‑01]
H05K 3/4084
. . .
{
by deforming at least one of the conductive layers
}
[2013‑01]
H05K 3/4092
. .
{
Integral conductive tabs, i.e. conductive parts partly detached from the substrate
}
[2013‑01]
Collapse
H05K 3/42
. .
Plated through-holes
{
or plated via connections
}
[2013‑01]
H05K 3/421
. . .
{
Blind plated via connections (H05K 3/422 , H05K 3/423 and H05K 3/425 take precedence)
}
[2013‑01]
H05K 3/422
. . .
{
characterised by electroless plating method; pretreatment therefor
}
[2013‑01]
Collapse
H05K 3/423
. . .
{
characterised by electroplating method
}
[2013‑01]
H05K 3/424
. . . .
{
by direct electroplating
}
[2013‑01]
Collapse
H05K 3/425
. . .
{
characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
}
[2013‑01]
H05K 3/426
. . . .
{
initial plating of through-holes in substrates without metal
}
[2013‑01]
H05K 3/427
. . . .
{
initial plating of through-holes in metal-clad substrates
}
[2013‑01]
H05K 3/428
. . . .
{
initial plating of through-holes in substrates having a metal pattern
}
[2013‑01]
H05K 3/429
. . .
{
Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
}
[2013‑01]
Collapse
.
Manufacture insulated metal core circuits
{
or other insulated electrically conductive core circuits (H05K 3/0058 , H05K 3/4641 , H05K 3/4608 take precedence)
}
[2013‑01]
H05K 3/445
. .
{
having insulated holes or insulated via connections through the metal core
}
[2013‑01]
Collapse
.
Manufacturing multilayer circuits
{
(incorporating non-printed electric components in internal layers H05K 1/185)
}
[2013‑01]
Collapse
H05K 3/4602
. .
{
characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
}
[2013‑01]
H05K 3/4605
. . .
{
made from inorganic insulating material
}
[2013‑01]
H05K 3/4608
. . .
{
comprising an electrically conductive core
}
[2013‑01]
Collapse
H05K 3/4611
. .
{
by laminating two or more circuit boards (H05K 3/4652 takes precedence)
}
[2013‑01]
Collapse
H05K 3/4614
. . .
{
the electrical connections between the circuit boards being made during lamination
}
[2013‑01]
H05K 3/4617
. . . .
{
characterized by laminating only or mainly similar single-sided circuit boards
}
[2013‑01]
H05K 3/462
. . . .
{
characterized by laminating only or mainly similar double-sided circuit boards
}
[2013‑01]
H05K 3/4623
. . .
{
the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards (H05K 3/462 takes precedence)
}
[2013‑01]
Collapse
H05K 3/4626
. . .
{
characterised by the insulating layers or materials (H05K 3/4688 takes precedence)
}
[2013‑01]
H05K 3/4629
. . . .
{
laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
}
[2013‑01]
H05K 3/4632
. . . .
{
laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
}
[2013‑01]
H05K 3/4635
. . . .
{
laminating flexible circuit boards using additional insulating adhesive materials between the boards
}
[2013‑01]
H05K 3/4638
. . .
{
Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
}
[2013‑01]
H05K 3/4641
. . .
{
having integrally laminated metal sheets or special power cores
}
[2013‑01]
Collapse
H05K 3/4644
. .
{
by building the multilayer layer by layer, i.e. build-up multilayer circuits (making via holes in the insulating layers H05K 3/0011 ; special circuit boards as base or core whereon the multilayer is built H05K 3/4602)
}
[2013‑01]
H05K 3/4647
. . .
{
by applying an insulating layer around previously made via studs
}
[2013‑01]
H05K 3/465
. . .
{
by applying an insulating layer having channels for the next circuit layer
}
[2013‑01]
Collapse
H05K 3/4652
. . .
{
Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K 3/4647 takes precedence)
}
[2013‑01]
H05K 3/4655
. . . .
{
by using a laminate characterized by the insulating layer (general-purpose insulating materials H05K 1/03 , H05K 3/4673)
}
[2013‑01]
H05K 3/4658
. . . .
{
characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
}
[2013‑01]
H05K 3/4661
. . .
{
Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor (other insulating materials H05K 3/387)
}
[2013‑01]
Collapse
H05K 3/4664
. . .
{
Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders (H05K 3/4647 takes precedence)
}
[2013‑01]
H05K 3/4667
. . . .
{
characterized by using an inorganic intermediate insulating layer
}
[2013‑01]
H05K 3/467
. . .
{
Adding a circuit layer by thin film methods (H05K 3/4647 takes precedence)
}
[2013‑01]
Collapse
H05K 3/4673
. . .
{
Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K 3/28)
}
[2013‑01]
H05K 3/4676
. . . .
{
Single layer compositions
}
[2013‑01]
H05K 3/4679
. . .
{
Aligning added circuit layers or via connections relative to previous circuit layers
}
[2013‑01]
H05K 3/4682
. . .
{
Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
}
[2013‑01]
H05K 3/4685
. .
{
Manufacturing of cross-over conductors
}
[2013‑01]
Collapse
H05K 3/4688
. .
{
Composite multilayer circuits, i.e. comprising insulating layers having different properties (having a special base or central core H05K 3/4602)
}
[2013‑01]
H05K 3/4691
. . .
{
Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
}
[2013‑01]
H05K 3/4694
. . .
{
Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density (H05K 3/4691 takes precedence)
}
[2013‑01]
H05K 3/4697
. .
{
having cavities, e.g. for mounting components (H05K 3/4691 takes precedence)
}
[2013‑01]
Collapse
Casings, cabinets or drawers for electric apparatus (in general A47B; radio receiver cabinets H04B 1/08 ; television receiver cabinets H04N 5/64 ;
{
constructional details or arrangements for computers G06F 1/16
}
)
[2013‑01]
Collapse
H05K 5/0004
.
{
comprising several parts forming a closed casing
}
[2013‑01]
H05K 5/0008
. .
{
assembled by screws
}
[2013‑01]
H05K 5/0013
. .
{
assembled by resilient members
}
[2013‑01]
H05K 5/0017
.
{
with display or control units
}
[2013‑01]
H05K 5/0021
.
{
Side-by-side or stacked arrangements
}
[2013‑01]
Collapse
H05K 5/0026
.
{
provided with connectors and printed circuit boards (PCB), e.g. automotive electronic control units
}
[2013‑01]
H05K 5/003
. .
{
having an integrally preformed housing
}
[2013‑01]
H05K 5/0034
. .
{
having an overmolded housing covering the PCB
}
[2013‑01]
H05K 5/0039
. .
{
having a tubular housing wherein the PCB is inserted longitudinally
}
[2013‑01]
H05K 5/0043
. .
{
comprising a frame housing mating with two lids wherein the PCB is flat mounted on the frame housing
}
[2013‑01]
Collapse
H05K 5/0047
. .
{
having a two-part housing enclosing a PCB
}
[2013‑01]
H05K 5/0052
. . .
{
characterized by joining features of the housing parts
}
[2013‑01]
H05K 5/0056
. . .
{
characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
}
[2013‑01]
H05K 5/006
. . .
{
characterized by features for holding the PCB within the housing
}
[2013‑01]
H05K 5/0065
. .
{
wherein modules are associated together, e.g. electromechanical assemblies, modular structures
}
[2013‑01]
H05K 5/0069
. .
{
having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
}
[2013‑01]
H05K 5/0073
. .
{
having specific features for mounting the housing on an external structure
}
[2013‑01]
H05K 5/0078
. .
{
specially adapted for acceleration sensors, e.g. crash sensors, airbag sensors
}
[2013‑01]
H05K 5/0082
. .
{
specially adapted for transmission control units, e.g. gearbox controllers
}
[2013‑01]
H05K 5/0086
.
{
portable, e.g. battery operated apparatus (casings for switching devices H01H 9/02)
}
[2013‑01]
Collapse
H05K 5/0091
.
{
Housing specially adapted for small components (for resistors H01C; for capacitors H01G; for integrated circuits H01L 23/00)
}
[2013‑01]
H05K 5/0095
. .
{
hermetically-sealed
}
[2013‑01]
Collapse
H05K 5/02
.
Details [2013‑01]
H05K 5/0204
. .
{
Mounting supporting structure on the outside of casings (mounting supporting structure in casings H05K 7/14)
}
[2013‑01]
H05K 5/0208
. .
{
Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
}
[2013‑01]
H05K 5/0213
. .
{
Thermal insulation; Venting means; Condensation eliminators
}
[2013‑01]
Collapse
H05K 5/0217
. .
{
Mechanical details of casings (G06F 1/1613 , H01M 2/10 , H04M 1/0202 take precedence)
}
[2013‑01]
H05K 5/0221
. . .
{
Locks; Latches
}
[2013‑01]
H05K 5/0226
. . .
{
Hinges (H02B 1/38 takes precedence)
}
[2013‑01]
H05K 5/023
. . .
{
Handles; Grips
}
[2013‑01]
H05K 5/0234
. . .
{
Feet; Stands; Pedestals, e.g. wheels for moving casing on floor
}
[2013‑01]
H05K 5/0239
. . .
{
Lids; Hoods, e.g. members for covering aperture
}
[2013‑01]
H05K 5/0243
. . .
{
for decorative purposes
}
[2013‑01]
H05K 5/0247
. .
{
Electrical details of casings, e.g. terminals, passages for cables or wiring
}
[2013‑01]
H05K 5/0252
. .
{
Labels, e.g. for identification, markings or configuration store
}
[2013‑01]
Collapse
H05K 5/0256
. .
{
of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
}
[2013‑01]
Collapse
H05K 5/026
. . .
{
having standardized interfaces (flash memory cards G06K 19/077)
}
[2013‑01]
Collapse
H05K 5/0265
. . . .
{
of PCMCIA type
}
[2013‑01]
H05K 5/0269
. . . . .
{
Card housings therefor e.g. covers, frames, PCB
}
[2013‑01]
H05K 5/0273
. . . . .
{
having extensions for peripherals e.g. LAN, antennas (details of antennas H01Q 1/2275)
}
[2013‑01]
H05K 5/0278
. . . .
{
of USB type (details relating to connectors H01R 27/00)
}
[2013‑01]
H05K 5/0282
. . .
{
Adapters for connecting cards having a first standard in receptacles having a second standard
}
[2013‑01]
Collapse
H05K 5/0286
. . .
{
Receptacles therefor e.g. card slots, module sockets, card groundings
}
[2013‑01]
H05K 5/0291
. . . .
{
for multiple cards
}
[2013‑01]
H05K 5/0295
. . . .
{
having ejection mechanisms
}
[2013‑01]
H05K 5/03
. .
Covers [2013‑01]
H05K 5/04
.
Metal casings [2013‑01]
Collapse
.
Hermetically-sealed casings
{
(specially adapted for small components H05K 5/0095)
}
[2013‑01]
H05K 5/061
. .
{
sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
}
[2013‑01]
H05K 5/062
. .
{
sealed by a material injected between a non-removable cover and a body, e.g. hardening in situ
}
[2013‑01]
H05K 5/063
. .
{
sealed by a labyrinth structure provided at the joining parts
}
[2013‑01]
H05K 5/064
. .
{
sealed by potting, e.g. waterproof resin poured in a rigid casing
}
[2013‑01]
H05K 5/065
. .
{
sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
}
[2013‑01]
H05K 5/066
. .
{
sealed by fusion of the joining parts without bringing material; sealed by brazing
}
[2013‑01]
H05K 5/067
. .
{
containing a dielectric fluid
}
[2013‑01]
H05K 5/068
. .
{
having a pressure compensation device, e.g. membrane (venting means H05K 5/0213)
}
[2013‑01]
H05K 5/069
. .
{
Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
}
[2013‑01]
Collapse
Constructional details common to different types of electric apparatus (casings, cabinets, drawers H05K 5/00) [2013‑01]
H05K 7/005
.
{
arrangements of circuit components without supporting structure
}
[2013‑01]
Collapse
H05K 7/02
.
Arrangements of circuit components or wiring on supporting structure [2013‑01]
H05K 7/023
. .
{
Stackable modules
}
[2013‑01]
H05K 7/026
. .
{
Multiple connections subassemblies
}
[2013‑01]
H05K 7/04
. .
on conductive chassis [2013‑01]
Collapse
H05K 7/06
. .
on insulating boards
{
e.g. wiring harnesses (for printed circuits H05K 1/18 , H05K 3/30)
}
[2013‑01]
H05K 7/08
. . .
on perforated boards [2013‑01]
Collapse
. .
Plug-in assemblages of components,
{
e.g. IC sockets (for connection on printed circuit board H01R 23/6806)
}
[2013‑01]
H05K 7/1007
. . .
{
with means for increasing contact pressure at the end of engagement of coupling parts
}
[2013‑01]
Collapse
H05K 7/1015
. . .
{
having exterior leads
}
[2013‑01]
H05K 7/1023
. . . .
{
co-operating by abutting, e.g. flat pack
}
[2013‑01]
Collapse
H05K 7/103
. . . .
{
co-operating by sliding, e.g. DIP carriers
}
[2013‑01]
H05K 7/1038
. . . . .
{
with spring contact pieces (H05K 7/1046 takes precedence)
}
[2013‑01]
H05K 7/1046
. . . . .
{
J-shaped leads
}
[2013‑01]
Collapse
H05K 7/1053
. . .
{
having interior leads
}
[2013‑01]
Collapse
H05K 7/1061
. . . .
{
co-operating by abutting
}
[2013‑01]
H05K 7/1069
. . . . .
{
with spring contact pieces
}
[2013‑01]
Collapse
H05K 7/1076
. . . .
{
co-operating by sliding
}
[2013‑01]
H05K 7/1084
. . . . .
{
pin grid array package carriers
}
[2013‑01]
H05K 7/1092
. . .
{
with built-in components, e.g. intelligent sockets
}
[2013‑01]
H05K 7/12
. .
Resilient or clamping means for holding component to structure (holding two-part couplings together H01R 13/00) [2013‑01]
Collapse
.
Mounting supporting structure in casing or on frame or rack
{
(H05K 7/18 takes precedence; test adapters G01R 31/2808)
}
[2013‑01]
Collapse
H05K 7/1401
. .
{
comprising clamping or extracting means (H05K 7/10 takes precedence)
}
[2013‑01]
Collapse
H05K 7/1402
. . .
{
for securing or extracting printed circuit boards
}
[2013‑01]
H05K 7/1404
. . . .
{
by edge clamping, e.g. wedges
}
[2013‑01]
H05K 7/1405
. . . .
{
by clips or resilient members, e.g. hooks
}
[2013‑01]
H05K 7/1407
. . . .
{
by turn-bolt or screw member
}
[2013‑01]
H05K 7/1408
. . . .
{
by a unique member which latches several boards, e.g. locking bars
}
[2013‑01]
H05K 7/1409
. . . .
{
by lever-type mechanisms
}
[2013‑01]
Collapse
H05K 7/1411
. . .
{
for securing or extracting box-type drawers
}
[2013‑01]
H05K 7/1412
. . . .
{
hold down mechanisms, e.g. avionic racks
}
[2013‑01]
H05K 7/1414
. . .
{
with power interlock
}
[2013‑01]
H05K 7/1415
. . .
{
manual gripping tools
}
[2013‑01]
Collapse
H05K 7/1417
. .
{
having securing means for mounting boards, plates or wiring boards (H05K 7/1461 takes precedence)
}
[2013‑01]
H05K 7/1418
. . .
{
Card guides, e.g. grooves (H05K 7/1425 takes precedence)
}
[2013‑01]
H05K 7/142
. . .
{
Spacers not being card guides
}
[2013‑01]
H05K 7/1421
. .
{
Drawers for printed circuit boards
}
[2013‑01]
Collapse
H05K 7/1422
. .
{
Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
}
[2013‑01]
Collapse
H05K 7/1424
. . .
{
Card cages
}
[2013‑01]
H05K 7/1425
. . . .
{
of standardised dimensions, e.g. 19"-subrack
}
[2013‑01]
Collapse
H05K 7/1427
. . .
{
Housings
}
[2013‑01]
H05K 7/1428
. . . .
{
for small modular apparatus with terminal block
}
[2013‑01]
Collapse
H05K 7/1429
. . . .
{
for circuits carrying a CPU and adapted to receive expansion cards
}
[2013‑01]
H05K 7/1431
. . . . .
{
Retention mechanisms for CPU modules
}
[2013‑01]
H05K 7/1432
. . . .
{
for power drive units
}
[2013‑01]
H05K 7/1434
. . . .
{
for electronics exposed to high gravitational force; Cylindrical housings
}
[2013‑01]
H05K 7/1435
. . .
{
Expandable constructions
}
[2013‑01]
Collapse
H05K 7/1438
. .
{
Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
}
[2013‑01]
Collapse
H05K 7/1439
. . .
{
Back panel mother boards
}
[2013‑01]
H05K 7/1441
. . . .
{
with a segmented structure
}
[2013‑01]
H05K 7/1442
. . . .
{
with a radial structure
}
[2013‑01]
H05K 7/1444
. . . .
{
Complex or three-dimensional-arrangements; Stepped or dual mother boards
}
[2013‑01]
H05K 7/1445
. . . .
{
with double-sided connections
}
[2013‑01]
Collapse
H05K 7/1447
. . .
{
External wirings; Wiring ducts; Laying cables
}
[2013‑01]
H05K 7/1448
. . . .
{
with connections to the front board
}
[2013‑01]
H05K 7/1449
. . . .
{
with connections to the back board
}
[2013‑01]
H05K 7/1451
. . . .
{
with connections between circuit boards or units
}
[2013‑01]
Collapse
H05K 7/1452
. . .
{
Mounting of connectors; Switching; Reinforcing of back panels
}
[2013‑01]
H05K 7/1454
. . . .
{
Alignment mechanisms; Drawout cases
}
[2013‑01]
H05K 7/1455
. . . .
{
Coding for prevention of wrong insertion
}
[2013‑01]
H05K 7/1457
. . .
{
Power distribution arrangements
}
[2013‑01]
H05K 7/1458
. . .
{
Active back panels; Back panels with filtering means
}
[2013‑01]
H05K 7/1459
. . .
{
Circuit configuration, e.g. routing signals
}
[2013‑01]
H05K 7/1461
. .
{
Slidable card holders; Card stiffeners; Control or display means therefor
}
[2013‑01]
Collapse
H05K 7/1462
. .
{
for programmable logic controllers [PLC] for automation and/or industrial process control (programmable logic controllers per se G05B 19/05)
}
[2013‑01]
H05K 7/1464
. . .
{
Functional units accommodated in the same PLC module housing
}
[2013‑01]
H05K 7/1465
. . .
{
Modular PLC assemblies with separable functional units
}
[2013‑01]
H05K 7/1467
. . .
{
PLC mounted in a cabinet or chassis
}
[2013‑01]
Collapse
H05K 7/1468
. . .
{
Mechanical features of input/output (I/O) modules
}
[2013‑01]
H05K 7/1469
. . . .
{
Terminal blocks for connecting sensors (terminal blocks in general H01R 9/24)
}
[2013‑01]
H05K 7/1471
. . . .
{
Modules for controlling actuators
}
[2013‑01]
H05K 7/1472
. . . .
{
Bus coupling modules, e.g. bus distribution modules
}
[2013‑01]
H05K 7/1474
. . .
{
Mounting of modules, e.g. on a base or rail or wall
}
[2013‑01]
Collapse
H05K 7/1475
. . .
{
Bus assemblies for establishing communication between PLC modules
}
[2013‑01]
H05K 7/1477
. . . .
{
including backplanes
}
[2013‑01]
H05K 7/1478
. . . .
{
including a segmented bus
}
[2013‑01]
H05K 7/1479
. . . .
{
including decentralized modules, e.g. connected to other modules using fieldbus
}
[2013‑01]
H05K 7/1481
. . .
{
User interface, e.g. status displays; Programming interface, e.g. connector for computer programming; Monitoring
}
[2013‑01]
H05K 7/1482
. . .
[PLC power supply; PLC accessories, e.g. for safety] [2013‑01]
H05K 7/1484
. . .
{
Electrical diagrams relating to constructional features, e.g. signal routing within PLC; Provisions for disaster recovery, e.g. redundant systems
}
[2013‑01]
Collapse
H05K 7/1485
. .
{
Servers; Data center rooms, e.g. 19-inch computer racks
}
[2013‑01]
H05K 7/1487
. . .
{
Blade assembly, e.g. cases and inner arrangements
}
[2013‑01]
Collapse
H05K 7/1488
. . .
{
Cabinets therefore, e.g. chassis, racks
}
[2013‑01]
H05K 7/1489
. . . .
{
characterized by the mounting of blades therein, e.g. brackets, rails, trays (H05K 7/1491 takes precedence)
}
[2013‑01]
H05K 7/1491
. . . .
{
having cable management arrangements (management of optical cables G02B 6/444 ; in telecommunication cabinets H04Q 1/06)
}
[2013‑01]
H05K 7/1492
. . . .
{
having electrical distribution arrangements, e.g. power supply or data communications
}
[2013‑01]
H05K 7/1494
. . . .
{
having hardware for monitoring blades, e.g. keyboards, displays (methods or software therefore H05K 7/1498)
}
[2013‑01]
H05K 7/1495
. . . .
{
providing data protection in case of earthquakes, floods, storms, nuclear explosions, intrusions, fire
}
[2013‑01]
H05K 7/1497
. . .
{
Rooms for data centers; Shipping containers therefor
}
[2013‑01]
H05K 7/1498
. . .
{
Resource management, Optimisation arrangements, e.g. configuration, identification, tracking, physical location (thermal management H05K 7/20836)
}
[2013‑01]
H05K 7/16
. .
on hinges or pivots [2013‑01]
Collapse
H05K 7/18
.
Construction of rack or frame [2013‑01]
H05K 7/183
. .
{
support rails therefor
}
[2013‑01]
H05K 7/186
. .
{
for supporting telecommunication equipment (selecting apparatus H04Q 1/02)
}
[2013‑01]
Collapse
.
Modifications to facilitate cooling, ventilating, or heating
{
(of printed circuits H05K 1/0201 ; of resistors H01C; of capacitors H01G; of individual semiconductor components H01L 23/34 , H01L 31/024 ; of LEDs H01L 33/64 ; of personal computers G06F 1/20)
}
[2013‑01]
Collapse
H05K 7/20009
. .
{
using a gaseous coolant in electronic enclosures (in cabinets of standardized dimensions H05K 7/20536 ; in server cabinets H05K 7/20709 ; in vehicle electronic casings H05K 7/20845 ; in power control electronics H05K 7/2089 ; in displays H05K 7/20954)
}
[2013‑01]
H05K 7/20127
. . .
{
Natural convection
}
[2013‑01]
Collapse
H05K 7/20136
. . .
{
Forced ventilation, e.g. by fans (H05K 7/202 takes precedence)
}
[2013‑01]
H05K 7/20145
. . . .
{
Means for directing air flow, e.g. ducts, deflectors, plenum or guides
}
[2013‑01]
Collapse
H05K 7/20154
. . . .
{
Heat dissipaters coupled to components
}
[2013‑01]
H05K 7/20163
. . . . .
{
the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
}
[2013‑01]
H05K 7/20172
. . . .
{
Fan mounting or fan specifications (blowers in general F04D 29/601)
}
[2013‑01]
H05K 7/20181
. . . .
{
Filters; Louvers (filters in general B01D 46/00)
}
[2013‑01]
H05K 7/2019
. . . .
{
Fan safe systems, e.g. mechanical devices for non stop cooling
}
[2013‑01]
H05K 7/202
. . .
{
Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
}
[2013‑01]
H05K 7/20209
. . .
{
Thermal management, e.g. fan control
}
[2013‑01]
Collapse
H05K 7/20218
. .
{
using a liquid coolant without phase change in electronic enclosures (in cabinets of standardized dimensions H05K 7/20536 ; in server cabinets H05K 7/20709 ; in vehicle electronic casings H05K 7/20845 ; in power control electronics H05K 7/2089 ; in displays H05K 7/20954)
}
[2013‑01]
H05K 7/20236
. . .
{
by immersion
}
[2013‑01]
H05K 7/20245
. . .
{
by natural convection; Thermosiphons
}
[2013‑01]
H05K 7/20254
. . .
{
Cold plates transferring heat from heat source to coolant
}
[2013‑01]
H05K 7/20263
. . .
{
Heat dissipaters releasing heat from coolant
}
[2013‑01]
H05K 7/20272
. . .
{
Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
}
[2013‑01]
H05K 7/20281
. . .
{
Thermal management, e.g. liquid flow control
}
[2013‑01]
Collapse
H05K 7/2029
. .
{
using a liquid coolant with phase change in electronic enclosures (in cabinets of standardized dimensions H05K 7/20536 ; in server cabinets H05K 7/20709 ; in vehicle electronic casings H05K 7/20845 ; in power control electronics H05K 7/2089 ; in displays H05K 7/20954)
}
[2013‑01]
H05K 7/203
. . .
{
by immersion
}
[2013‑01]
H05K 7/20309
. . .
{
Evaporators
}
[2013‑01]
H05K 7/20318
. . .
{
Condensers
}
[2013‑01]
H05K 7/20327
. . .
{
Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
}
[2013‑01]
H05K 7/20336
. . .
{
Heat pipes, e.g. wicks or capillary pumps
}
[2013‑01]
H05K 7/20345
. . .
{
Sprayers; Atomizers
}
[2013‑01]
H05K 7/20354
. . .
{
Refrigerating circuit comprising a compressor
}
[2013‑01]
H05K 7/20363
. . .
{
Refrigerating circuit comprising a sorber
}
[2013‑01]
H05K 7/20372
. . .
{
Cryogenic cooling; Nitrogen liquid cooling
}
[2013‑01]
H05K 7/20381
. . .
{
Thermal management, e.g. evaporation control
}
[2013‑01]
Collapse
H05K 7/2039
. .
{
characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F 13/00)
}
[2013‑01]
Collapse
H05K 7/20409
. . .
{
Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
}
[2013‑01]
H05K 7/20418
. . . .
{
the radiating structures being additional and fastened onto the housing
}
[2013‑01]
H05K 7/20427
. . . .
{
having radiation enhancing surface treatment, e.g. black coating
}
[2013‑01]
Collapse
H05K 7/20436
. . .
{
Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
}
[2013‑01]
Collapse
H05K 7/20445
. . . .
{
the coupling element being an additional piece, e.g. thermal standoff
}
[2013‑01]
H05K 7/20454
. . . . .
{
with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
}
[2013‑01]
H05K 7/20463
. . . . .
{
Filling compound, e.g. potted resin
}
[2013‑01]
Collapse
H05K 7/20472
. . . . .
{
Sheet interfaces
}
[2013‑01]
H05K 7/20481
. . . . . .
{
characterised by the material composition exhibiting specific thermal properties
}
[2013‑01]
H05K 7/2049
. . . .
{
Pressing means used to urge contact, e.g. springs
}
[2013‑01]
H05K 7/205
. . .
{
Thermal paths through the printed circuit board [PCB] (details of PCBs related to heat transfer H05K 1/0201)
}
[2013‑01]
H05K 7/20509
. . .
{
Cold plates, e.g. multi-component heat spreader, support plates, non closed structures
}
[2013‑01]
H05K 7/20518
. . .
{
Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
}
[2013‑01]
Collapse
H05K 7/20536
. .
{
for racks or cabinets of standardized dimensions, e.g. 19-inch electronic racks
}
[2013‑01]
H05K 7/20545
. . .
{
Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
}
[2013‑01]
Collapse
H05K 7/20554
. . .
{
Forced ventilation of a gaseous coolant (in closed loop H05K 7/206 or H05K 7/20609 or H05K 7/20618)
}
[2013‑01]
H05K 7/20563
. . . .
{
within sub-racks for removing heat from electronic boards
}
[2013‑01]
Collapse
H05K 7/20572
. . . .
{
within cabinets for removing heat from sub-racks, e.g. plenum
}
[2013‑01]
H05K 7/20581
. . . . .
{
Cabinets including a drawer for fans
}
[2013‑01]
H05K 7/2059
. . . .
{
within rooms for removing heat from cabinets, e.g. by air conditioning device
}
[2013‑01]
H05K 7/206
. . .
{
Air circulating in closed loop within cabinets wherein heat is removed through air-to-air heat-exchanger
}
[2013‑01]
H05K 7/20609
. . .
{
Air circulating in closed loop within cabinets wherein heat is removed through air-to-liquid heat-exchanger
}
[2013‑01]
H05K 7/20618
. . .
{
Air circulating in different modes under control of air guidance flaps
}
[2013‑01]
Collapse
H05K 7/20627
. . .
{
Liquid coolant without phase change
}
[2013‑01]
H05K 7/20636
. . . .
{
within sub-racks for removing heat from electronic boards
}
[2013‑01]
H05K 7/20645
. . . .
{
within cabinets for removing heat from sub-racks
}
[2013‑01]
H05K 7/20654
. . . .
{
within rooms for removing heat from cabinets
}
[2013‑01]
Collapse
H05K 7/20663
. . .
{
Liquid coolant with phase change, e.g. heat pipes
}
[2013‑01]
H05K 7/20672
. . . .
{
within sub-racks for removing heat from electronic boards
}
[2013‑01]
H05K 7/20681
. . . .
{
within cabinets for removing heat from sub-racks
}
[2013‑01]
H05K 7/2069
. . . .
{
within rooms for removing heat from cabinets
}
[2013‑01]
H05K 7/207
. . .
{
Thermal management, e.g. cabinet temperature control
}
[2013‑01]
Collapse
H05K 7/20709
. .
{
for server racks or cabinets; for data centers, e.g. 19-inch computer racks
}
[2013‑01]
Collapse
H05K 7/20718
. . .
{
Forced ventilation of a gaseous coolant (in closed loop H05K 7/20754)
}
[2013‑01]
H05K 7/20727
. . . .
{
within server blades for removing heat from heat source
}
[2013‑01]
H05K 7/20736
. . . .
{
within cabinets for removing heat from server blades
}
[2013‑01]
H05K 7/20745
. . . .
{
within rooms for removing heat from cabinets, e.g. by air conditioning device
}
[2013‑01]
H05K 7/20754
. . .
{
Air circulating in closed loop within cabinets
}
[2013‑01]
Collapse
H05K 7/20763
. . .
{
Liquid cooling without phase change
}
[2013‑01]
H05K 7/20772
. . . .
{
within server blades for removing heat from heat source
}
[2013‑01]
H05K 7/20781
. . . .
{
within cabinets for removing heat from server blades
}
[2013‑01]
H05K 7/2079
. . . .
{
within rooms for removing heat from cabinets
}
[2013‑01]
Collapse
H05K 7/208
. . .
{
Liquid cooling with phase change
}
[2013‑01]
H05K 7/20809
. . . .
{
within server blades for removing heat from heat source
}
[2013‑01]
H05K 7/20818
. . . .
{
within cabinets for removing heat from server blades
}
[2013‑01]
H05K 7/20827
. . . .
{
within rooms for removing heat from cabinets, e.g. air conditioning devices
}
[2013‑01]
H05K 7/20836
. . .
{
Thermal management, e.g. server temperature control
}
[2013‑01]
Collapse
H05K 7/20845
. .
{
for vehicle electronic casings
}
[2013‑01]
H05K 7/20854
. . .
{
Heat transfer by conduction from internal heat source to heat radiating structure (H05K 7/20863 takes precedence)
}
[2013‑01]
H05K 7/20863
. . .
{
Forced ventilation, e.g. on heat dissipaters coupled to components
}
[2013‑01]
H05K 7/20872
. . .
{
Liquid coolant without phase change
}
[2013‑01]
H05K 7/20881
. . .
{
Liquid coolant with phase change
}
[2013‑01]
Collapse
H05K 7/2089
. .
{
for power electronics, e.g. for inverters for controlling motor
}
[2013‑01]
H05K 7/209
. . .
{
Heat transfer by conduction from internal heat source to heat radiating structure (H05K 7/20909 takes precedence)
}
[2013‑01]
Collapse
H05K 7/20909
. . .
{
Forced ventilation, e.g. on heat dissipaters coupled to components
}
[2013‑01]
H05K 7/20918
. . . .
{
the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
}
[2013‑01]
H05K 7/20927
. . .
{
Liquid coolant without phase change
}
[2013‑01]
H05K 7/20936
. . .
{
Liquid coolant with phase change
}
[2013‑01]
H05K 7/20945
. . .
{
Thermal management, e.g. inverter temperature control
}
[2013‑01]
Collapse
H05K 7/20954
. .
{
for display panels (cooling means for computer displays G06F 1/20 ; heating or cooling of liquid crystal cells G02F 1/133382 ; cooling for projectors G03B 21/16 ; plasma display panels per se H01J 17/49)
}
[2013‑01]
H05K 7/20963
. . .
{
Heat transfer by conduction from internal heat source to heat radiating structure (H05K 7/20972 takes precedence)
}
[2013‑01]
H05K 7/20972
. . .
{
Forced ventilation, e.g. on heat dissipaters coupled to components
}
[2013‑01]
H05K 7/20981
. . .
{
Liquid coolant without phase change
}
[2013‑01]
H05K 7/2099
. . .
{
Liquid coolant with phase change
}
[2013‑01]
Collapse
Screening of apparatus or components against electric or magnetic fields (devices for absorbing radiation from an aerial H01Q 17/00 ;
{
screening of semiconductor devices H01L 24/00 , H01L 23/58 ; screening structurally associated with dynamo-electric machines H02K 11/00 ; shielding against nuclear radiation G21F
}
)
[2013‑01]
Collapse
H05K 9/0001
.
{
Rooms, chambers (building construction in general E04B; anechoic room G01R 29/0821 ; Nuclear magnetic resonance G01R 33/42)
}
[2013‑01]
H05K 9/0003
. .
{
Shielded walls, floors, ceilings, e.g. wallpaper, wall panel, electro-conductive plaster, concrete, cement, mortar
}
[2013‑01]
H05K 9/0005
. .
{
Shielded windows (window for building construction in general E06B 5/00)
}
[2013‑01]
Collapse
H05K 9/0007
.
{
Casings (standardised racks H05K 9/0062)
}
[2013‑01]
H05K 9/0009
. .
{
with provisions to reduce EMI leakage through the joining parts
}
[2013‑01]
Collapse
H05K 9/0015
. .
{
Gaskets or seals
}
[2013‑01]
H05K 9/0016
. . .
{
having a spring contact
}
[2013‑01]
H05K 9/0018
. .
{
with provisions to reduce aperture leakages in walls, e.g. terminals, connectors, cables
}
[2013‑01]
Collapse
H05K 9/002
. .
{
with localised screening
}
[2013‑01]
Collapse
H05K 9/0022
. . .
{
of components mounted on printed circuit boards [PCB
}
(shields integrated within component packages H01L 23/552 ; shields integrated within PCB H05K 1/0218 ]) [2013‑01]
Collapse
H05K 9/0024
. . . .
{
Shield cases mounted on a PCB, e.g. cans, caps, conformal shields
}
[2013‑01]
Collapse
H05K 9/0026
. . . . .
{
integrally formed from metal sheet
}
[2013‑01]
H05K 9/0028
. . . . . .
{
with retainers or specific soldering features
}
[2013‑01]
H05K 9/003
. . . . .
{
made from electro-conductive plastic material or combining different shielding materials
}
[2013‑01]
Collapse
H05K 9/0032
. . . . .
{
having multiple parts, e.g. frames mating with lids
}
[2013‑01]
H05K 9/0033
. . . . . .
{
disposed on both PCB faces
}
[2013‑01]
H05K 9/0035
. . . . . .
{
with retainers mounted beforehand on the PCB, e.g. clips
}
[2013‑01]
H05K 9/0037
. . . .
{
Housings with compartments containing a PCB, e.g. partitioning walls
}
[2013‑01]
H05K 9/0039
. . .
{
Ground layout on printed circuit board
}
[2013‑01]
H05K 9/0041
. .
{
Ventilation panels having provisions for screening
}
[2013‑01]
H05K 9/0043
. .
{
being flexible containers, e.g. pouch, pocket, bag
}
[2013‑01]
H05K 9/0045
. .
{
being rigid plastic containers having a coating of shielding material
}
[2013‑01]
H05K 9/0047
. .
{
being rigid plastic containers having conductive particles, fibres or mesh embdded therein
}
[2013‑01]
H05K 9/0049
. .
{
being metallic containers
}
[2013‑01]
H05K 9/005
. .
{
being nesting containers
}
[2013‑01]
H05K 9/0052
. .
{
Shielding other than Faraday cages
}
[2013‑01]
H05K 9/0054
. .
{
specially adapted for display applications
}
[2013‑01]
H05K 9/0056
. .
{
specially adapted for microwave applications
}
[2013‑01]
H05K 9/0058
. .
{
specially adapted for optoelectronic applications
}
[2013‑01]
H05K 9/006
. .
{
specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
}
[2013‑01]
H05K 9/0062
.
{
Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications
}
[2013‑01]
H05K 9/0064
.
{
Earth or grounding circuit
}
[2013‑01]
H05K 9/0066
.
{
Constructional details of transient suppressor (protective circuit H02H)
}
[2013‑01]
H05K 9/0067
.
{
Devices for protecting against damage from electrostatic discharge (materials see H05K 9/0079)
}
[2013‑01]
H05K 9/0069
.
{
Methods for measuring the shielding efficiency; Apparatus therefor; Isolation container for testing
}
[2013‑01]
H05K 9/0071
.
{
Active shielding
}
[2013‑01]
Collapse
H05K 9/0073
.
{
Shielding materials (H05K 9/0003 takes precedence)
}
[2013‑01]
Collapse
H05K 9/0075
. .
{
Magnetic shielding materials (magnetic material in general H01F 1/00 ; for electrical motor H02K 11/00 ; for transformer H01F 27/28)
}
[2013‑01]
H05K 9/0077
. . .
{
comprising superconductors (superconductors in general H01L 39/00)
}
[2013‑01]
H05K 9/0079
. .
{
Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
}
[2013‑01]
Collapse
H05K 9/0081
. .
{
Electromagnetic shielding materials, e.g. EMI, RFI shielding (H05K 9/0003 takes precedence)
}
[2013‑01]
H05K 9/0083
. . .
{
comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers (H05K 9/0086 takes precedence)
}
[2013‑01]
H05K 9/0084
. . .
{
comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
}
[2013‑01]
H05K 9/0086
. . .
{
comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
}
[2013‑01]
H05K 9/0088
. . .
{
comprising a plurality of shielding layers; combining different shielding material structure
}
[2013‑01]
H05K 9/009
. . .
{
comprising electro-conductive fibres, e.g. metal fibres, carbon fibres metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked (Screening during electrotherapy A61N 1/16)
}
[2013‑01]
H05K 9/0092
. . .
{
comprising electro-conductive pigments, e.g. paint, ink, tampon printing
}
[2013‑01]
Collapse
H05K 9/0094
. .
{
being light-transmitting, e.g. transparent, translucent
}
[2013‑01]
H05K 9/0096
. . .
{
for television displays, e.g. plasma display panel
}
[2013‑01]
H05K 9/0098
. .
{
for shielding electrical cables
}
[2013‑01]
H05K 10/00
Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit [2013‑01]
Collapse
Combination of a radio or television receiver with apparatus having a different main function
{
(combined with clocks G04B 47/00 ; controlled by a clock G04C 21/28)
}
[2013‑01]
H05K 11/02
.
with vehicles [2013‑01]
Collapse
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components [2013‑01]
H05K 13/0007
.
{
using handtools (for mounting on a circuit board H05K 13/0447)
}
[2013‑01]
H05K 13/0015
.
{
Orientation; Alignment; Positioning
}
[2013‑01]
H05K 13/0023
.
{
Making assemblies of electric components, e.g. modules (H05K 13/04 take precedence)
}
[2013‑01]
Collapse
.
{
Placing of components on belts holding the terminals
}
[2013‑01]
H05K 13/0038
. .
{
placing the components in a predetermined order
}
[2013‑01]
H05K 13/0046
.
{
Encapsulation of electrical assemblies in resins (hermetically-sealed casings H05K 5/06)
}
[2013‑01]
H05K 13/0053
.
{
Means for helping with the manual mounting of components, e.g. special tables, light spots indicating the place for mounting (handtools H05K 13/0447)
}
[2013‑01]
Collapse
.
{
Tools for holding the circuit boards during processing; handling transport of printed circuit boards
}
[2013‑01]
H05K 13/0069
. .
{
Holders for printed circuit boards
}
[2013‑01]
H05K 13/0076
. .
{
Straightening or aligning terminal leads of pins mounted on boards, during transport of the boards (during the mounting operation, after fitting components on the board H05K 13/0473)
}
[2013‑01]
H05K 13/0084
.
{
Containers and magazines for components, e.g. tube-like magazines
}
[2013‑01]
H05K 13/0092
.
{
Treatment of the terminal leads as a seperate operation (during transport H05K 13/0076 , H05K 13/023 ; during mounting H05K 13/04)
}
[2013‑01]
Collapse
.
Feeding of components (in general B65G) [2013‑01]
H05K 13/021
. .
{
Loading or unloading of containers (H05K 13/028 takes precedence)
}
[2013‑01]
H05K 13/022
. .
{
with orientation of the elements (orientation while mounting H05K 13/0413 ; in general B23P 19/00)
}
[2013‑01]
Collapse
. .
{
with bending or straightening of the terminal leads (bending and cutting after the mounting on a p.c. board H05K 13/0473)
}
[2013‑01]
Collapse
. . .
{
Straightening or aligning terminal leads
}
[2013‑01]
H05K 13/025
. . . .
{
of components having oppositely extending terminal leads
}
[2013‑01]
H05K 13/026
. . . .
{
of components having terminal leads in side by side relationship, e.g. using combing elements
}
[2013‑01]
H05K 13/027
. .
{
Fluid transport of components
}
[2013‑01]
H05K 13/028
. .
{
Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
}
[2013‑01]
H05K 13/029
. .
{
Feeding axial lead components, e.g. using vibrating bowls, magnetic fields (H05K 13/022 takes precedence)
}
[2013‑01]
Collapse
.
Mounting of components
{
e.g. of leadless components
}
[2013‑01]
Collapse
. .
{
pick and place heads or apparatus, e.g. with jaws
}
[2013‑01]
H05K 13/0408
. . .
{
incorporating a sucking device (H05K 13/0413 takes precedence)
}
[2013‑01]
H05K 13/0413
. . .
{
with orientation of the component while holding it (orientation while feeding H05K 13/022)
}
[2013‑01]
Collapse
. .
{
Feeding with belts
}
[2013‑01]
H05K 13/0421
. . .
{
with treatment of the terminal leads (bending and cutting after fitting on a circuit board H05K 13/0473)
}
[2013‑01]
H05K 13/0426
. . .
{
for components being oppositely extending terminal leads (H05K 13/0421 takes precedence)
}
[2013‑01]
Collapse
. .
{
Feeding one by one by other means than belts
}
[2013‑01]
H05K 13/0434
. . .
{
with containers
}
[2013‑01]
H05K 13/0439
. . .
{
incorporating means for treating the terminal leads only before insertion
}
[2013‑01]
H05K 13/0443
. . .
{
incorporating means for treating the terminal leads before and after insertion or only after insertion
}
[2013‑01]
H05K 13/0447
. .
{
Hand tools therefor
}
[2013‑01]
H05K 13/0452
. .
{
different components being guided to the same mounting place
}
[2013‑01]
H05K 13/0456
. .
{
simultaneously punching the circuit board
}
[2013‑01]
Collapse
. .
{
Surface mounting (surface mounted components H05K 3/341)
}
[2013‑01]
H05K 13/0465
. . .
{
by soldering (H05K 13/0469 takes precedence; soldering apparatus in general B23K)
}
[2013‑01]
H05K 13/0469
. . .
{
by applying a glue or viscous material
}
[2013‑01]
H05K 13/0473
. .
{
Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board (during transport H05K 13/0076)
}
[2013‑01]
Collapse
. .
{
Simultaneously mounting of different components
}
[2013‑01]
H05K 13/0482
. . .
{
using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
}
[2013‑01]
Collapse
. .
{
Replacement and removal of components
}
[2013‑01]
H05K 13/0491
. . .
{
Hand tools therefor
}
[2013‑01]
H05K 13/0495
. .
{
having a plurality of work-stations
}
[2013‑01]
Collapse
.
Wiring by machine [2013‑01]
H05K 13/065
. .
{
Accessories therefor, e.g. light spots
}
[2013‑01]
H05K 13/08
.
Monitoring manufacture of assemblages [2013‑01]
Collapse
H05K 2201/00
Indexing scheme relating to printed circuits covered by H05K 1/00 [2013‑01]
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H05K 2201/01
.
Dielectrics [2013‑01]
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H05K 2201/0104
. .
Properties and characteristics in general [2013‑01]
H05K 2201/0108
. . .
Transparent [2013‑01]
H05K 2201/0112
. . .
Absorbing light, e.g. dielectric layer with carbon filler for laser processing [2013‑01]
H05K 2201/0116
. . .
Porous, e.g. foam [2013‑01]
H05K 2201/012
. . .
Flame-retardant; Preventing of inflammation [2013‑01]
H05K 2201/0125
. . .
Shrinkable, e.g. heat-shrinkable polymer [2013‑01]
H05K 2201/0129
. . .
Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer [2013‑01]
H05K 2201/0133
. . .
Elastomeric or compliant polymer (elastomeric conductor H05K 2201/0314) [2013‑01]
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H05K 2201/0137
. .
Materials [2013‑01]
H05K 2201/0141
. . .
Liquid crystal polymer [LCP] [2013‑01]
H05K 2201/0145
. . .
Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN] [2013‑01]
H05K 2201/015
. . .
Fluoropolymer, e.g. polytetrafluoroethylene [PTFE] [2013‑01]
H05K 2201/0154
. . .
Polyimide [2013‑01]
H05K 2201/0158
. . .
Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP] [2013‑01]
H05K 2201/0162
. . .
Silicon containing polymer, e.g. silicone [2013‑01]
H05K 2201/0166
. . .
Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching [2013‑01]
H05K 2201/017
. . .
Glass ceramic coating, e.g. formed on inorganic substrate (inorganic, non-metallic substrates H05K 1/0306) [2013‑01]
H05K 2201/0175
. . .
Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor [2013‑01]
H05K 2201/0179
. . .
Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor [2013‑01]
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H05K 2201/0183
. .
Dielectric layers [2013‑01]
H05K 2201/0187
. . .
with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties [2013‑01]
H05K 2201/0191
. . .
wherein the thickness of the dielectric plays an important role [2013‑01]
H05K 2201/0195
. . .
Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure [2013‑01]
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H05K 2201/02
.
Fillers; Particles; Fibers; Reinforcement materials [2013‑01]
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H05K 2201/0203
. .
Fillers and particles [2013‑01]
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H05K 2201/0206
. . .
Materials [2013‑01]
H05K 2201/0209
. . . .
Inorganic, non-metallic particles [2013‑01]
H05K 2201/0212
. . . .
Resin particles [2013‑01]
H05K 2201/0215
. . . .
Metallic fillers [2013‑01]
H05K 2201/0218
. . . .
Composite particles, i.e. first metal coated with second metal [2013‑01]
H05K 2201/0221
. . . .
Insulating particles having an electrically conductive coating [2013‑01]
H05K 2201/0224
. . . .
Conductive particles having an insulating coating [2013‑01]
H05K 2201/0227
. . . .
Insulating particles having an insulating coating [2013‑01]
H05K 2201/023
. . . .
Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode [2013‑01]
H05K 2201/0233
. . . .
Deformable particles (insulating particles having an electrically conductive coating H05K 2201/0221) [2013‑01]
H05K 2201/0236
. . . .
Plating catalyst as filler in insulating material (catalytic ink H05K 2203/0709) [2013‑01]
H05K 2201/0239
. . . .
Coupling agent for particles (using a coupling agent to improve the adhesion between an insulating substrate and a metal H05K 3/389) [2013‑01]
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H05K 2201/0242
. . .
Shape of an individual particle [2013‑01]
H05K 2201/0245
. . . .
Flakes, flat particles or lamellar particles [2013‑01]
H05K 2201/0248
. . . .
Needles or elongated particles; Elongated cluster of chemically bonded particles (microfibers H05K 2201/0251 ; stacked conductors H05K 2201/0379) [2013‑01]
H05K 2201/0251
. . . .
Non-conductive microfibers (relatively short elongated particles H05K 2201/0248) [2013‑01]
H05K 2201/0254
. . . .
Microballoons or hollow filler particles [2013‑01]
H05K 2201/0257
. . . .
Nanoparticles (inks comprising nanoparticles H05K 1/097) [2013‑01]
H05K 2201/026
. . . .
Nanotubes or nanowires [2013‑01]
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H05K 2201/0263
. . .
Details about a collection of particles [2013‑01]
H05K 2201/0266
. . . .
Size distribution [2013‑01]
H05K 2201/0269
. . . .
Non-uniform distribution or concentration of particles [2013‑01]
H05K 2201/0272
. . . .
Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape [2013‑01]
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H05K 2201/0275
. .
Fibers and reinforcement materials [2013‑01]
H05K 2201/0278
. . .
Polymeric fibers [2013‑01]
H05K 2201/0281
. . .
Conductive fibers [2013‑01]
H05K 2201/0284
. . .
Paper, e.g. as reinforcement (paper sheet substrates H05K 1/0386) [2013‑01]
H05K 2201/0287
. . .
Unidirectional or parallel fibers [2013‑01]
H05K 2201/029
. . .
Woven fibrous reinforcement or textile (textile substrates H05K 1/038) [2013‑01]
H05K 2201/0293
. . .
Non-woven fibrous reinforcement [2013‑01]
H05K 2201/0296
. . .
Fibers with a special cross-section, e.g. elliptical [2013‑01]
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H05K 2201/03
.
Conductive materials [2013‑01]
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H05K 2201/0302
. .
Properties and characteristics in general [2013‑01]
H05K 2201/0305
. . .
Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns [2013‑01]
H05K 2201/0308
. . .
Shape memory alloy [SMA] [2013‑01]
H05K 2201/0311
. . .
Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact [2013‑01]
H05K 2201/0314
. . .
Elastomeric connector or conductor, e.g. rubber with metallic filler (elastomeric dielectric H05K 2201/0133) [2013‑01]
H05K 2201/0317
. . .
Thin film conductor layer; Thin film passive component [2013‑01]
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H05K 2201/032
. .
Materials [2013‑01]
H05K 2201/0323
. . .
Carbon [2013‑01]
H05K 2201/0326
. . .
Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO] [2013‑01]
H05K 2201/0329
. . .
Intrinsically conductive polymer [ICP]; Semiconductive polymer [2013‑01]
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H05K 2201/0332
. .
Structure of the conductor [2013‑01]
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H05K 2201/0335
. . .
Layered conductors or foils [2013‑01]
H05K 2201/0338
. . . .
Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer (etched tri-metal structure H05K 2201/0361) [2013‑01]
H05K 2201/0341
. . . .
Intermediate metal, e.g. before reinforcing of conductors by plating [2013‑01]
H05K 2201/0344
. . . .
Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer [2013‑01]
H05K 2201/0347
. . . .
Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias (reinforcing the conductive pattern H05K 3/24) [2013‑01]
H05K 2201/035
. . . .
Paste overlayer, i.e. conductive paste or solder paste over conductive layer [2013‑01]
H05K 2201/0352
. . . .
Differences between the conductors of different layers of a multilayer [2013‑01]
H05K 2201/0355
. . . .
Metal foils [2013‑01]
H05K 2201/0358
. . . .
Resin coated copper [RCC] [2013‑01]
H05K 2201/0361
. . . .
Etched tri-metal structure, i.e. metal layers or metal patterns on both sides of a different central metal layer which is later at least partly etched [2013‑01]
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H05K 2201/0364
. . .
Conductor shape [2013‑01]
H05K 2201/0367
. . . .
Metallic bump or raised conductor not used as solder bump (solder materials or compositions and methods of application thereof H05K 3/3457) [2013‑01]
H05K 2201/037
. . . .
Hollow conductors, i.e. conductors partially or completely surrounding a void, e.g. hollow waveguides [2013‑01]
H05K 2201/0373
. . . .
Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool (providing micro- or nanometer scale roughness on a metal surface H05K 2203/0307) [2013‑01]
H05K 2201/0376
. . . .
Flush conductors, i.e. flush with the surface of the printed circuit [2013‑01]
H05K 2201/0379
. . . .
Stacked conductors [2013‑01]
H05K 2201/0382
. . . .
Continuously deformed conductors [2013‑01]
H05K 2201/0385
. . . .
Displaced conductors [2013‑01]
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H05K 2201/0388
. . .
Other aspects of conductors [2013‑01]
H05K 2201/0391
. . . .
Using different types of conductors [2013‑01]
H05K 2201/0394
. . . .
Conductor crossing over a hole in the substrate [2013‑01]
H05K 2201/0397
. . . .
Tab (forming integral conductive tabs H05K 3/4092) [2013‑01]
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H05K 2201/04
.
Assemblies of printed circuits [2013‑01]
H05K 2201/041
. .
Stacked PCBs, i.e. having neither an empty space nor mounted components in between [2013‑01]
H05K 2201/042
. .
Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other [2013‑01]
H05K 2201/043
. .
Stacked PCBs with their backs attached to each other without electrical connection [2013‑01]
H05K 2201/044
. .
Details of backplane or midplane for mounting orthogonal PCBs [2013‑01]
H05K 2201/045
. .
Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important [2013‑01]
H05K 2201/046
. .
Planar parts of folded PCBs making an angle relative to each other (assembling printed circuits perpendicularly to each other H05K 3/366) [2013‑01]
H05K 2201/047
. .
Box-like arrangements of PCBs [2013‑01]
H05K 2201/048
. .
Second PCB mounted on first PCB by inserting in window or holes of the first PCB [2013‑01]
H05K 2201/049
. .
PCB for one component, e.g. for mounting onto mother PCB [2013‑01]
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H05K 2201/05
.
Flexible printed circuits [FPCs] [2013‑01]
H05K 2201/051
. .
Rolled [2013‑01]
H05K 2201/052
. .
Branched [2013‑01]
H05K 2201/053
. .
Tails [2013‑01]
H05K 2201/055
. .
Folded back on itself [2013‑01]
H05K 2201/056
. .
Folded around rigid support or component [2013‑01]
H05K 2201/057
. .
Shape retainable [2013‑01]
H05K 2201/058
. .
Direct connection between two or more FPCs or between flexible parts of rigid PCBs [2013‑01]
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H05K 2201/06
.
Thermal details [2013‑01]
H05K 2201/062
. .
Means for thermal insulation, e.g. for protection of parts [2013‑01]
H05K 2201/064
. .
Fluid cooling, e.g. by integral pipes [2013‑01]
H05K 2201/066
. .
Heatsink mounted on the surface of the PCB (heatsink inserted in the PCB H05K 2201/10416) [2013‑01]
H05K 2201/068
. .
wherein the coefficient of thermal expansion is important [2013‑01]
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H05K 2201/07
.
Electric details [2013‑01]
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H05K 2201/0707
. .
Shielding [2013‑01]
H05K 2201/0715
. . .
provided by an outer layer of PCB [2013‑01]
H05K 2201/0723
. . .
provided by an inner layer of PCB [2013‑01]
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H05K 2201/073
. .
High voltage adaptations (overvoltage protection H05K 1/0257) [2013‑01]
H05K 2201/0738
. . .
Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials [2013‑01]
H05K 2201/0746
. . .
Protection against transients, e.g. layout adapted for plugging of connector [2013‑01]
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H05K 2201/0753
. .
Insulation [2013‑01]
H05K 2201/0761
. . .
Insulation resistance, e.g. of the surface of the PCB between the conductors [2013‑01]
H05K 2201/0769
. . .
Anti metal-migration, e.g. avoiding tin whisker growth [2013‑01]
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H05K 2201/0776
. .
Resistance and impedance [2013‑01]
H05K 2201/0784
. . .
Uniform resistance, i.e. equalizing the resistance of a number of conductors [2013‑01]
H05K 2201/0792
. . .
Means against parasitic impedance; Means against eddy currents [2013‑01]
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H05K 2201/08
.
Magnetic details [2013‑01]
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H05K 2201/083
. .
Magnetic materials [2013‑01]
H05K 2201/086
. . .
for inductive purposes, e.g. printed inductor with ferrite core [2013‑01]
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H05K 2201/09
.
Shape and layout [2013‑01]
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H05K 2201/09009
. .
Substrate related [2013‑01]
H05K 2201/09018
. . .
Rigid curved substrate [2013‑01]
H05K 2201/09027
. . .
Non-rectangular flat PCB, e.g. circular [2013‑01]
H05K 2201/09036
. . .
Recesses or grooves in insulating substrate (recess in metallic substrate H05K 2201/09745) [2013‑01]
H05K 2201/09045
. . .
Locally raised area or protrusion of insulating substrate (rigid curved substrate H05K 2201/09018) [2013‑01]
H05K 2201/09054
. . .
Raised area or protrusion of metal substrate [2013‑01]
H05K 2201/09063
. . .
Holes or slots in insulating substrate not used for electrical connections [2013‑01]
H05K 2201/09072
. . .
Hole or recess under component or special relationship between hole and component [2013‑01]
H05K 2201/09081
. . .
Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure [2013‑01]
H05K 2201/0909
. . .
Preformed cutting or breaking line [2013‑01]
H05K 2201/091
. . .
Locally and permanently deformed areas including dielectric material [2013‑01]
H05K 2201/09109
. . .
Locally detached layers, e.g. in multilayer [2013‑01]
H05K 2201/09118
. . .
Moulded substrate [2013‑01]
H05K 2201/09127
. . .
PCB or component having an integral separable or breakable part [2013‑01]
H05K 2201/09136
. . .
Means for correcting warpage [2013‑01]
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H05K 2201/09145
. .
Edge details [2013‑01]
H05K 2201/09154
. . .
Bevelled, chamferred or tapered edge [2013‑01]
H05K 2201/09163
. . .
Slotted edge [2013‑01]
H05K 2201/09172
. . .
Notches between edge pads [2013‑01]
H05K 2201/09181
. . .
Notches in edge pads [2013‑01]
H05K 2201/0919
. . .
Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes (shielding provided by an inner layer of PCB H05K 2201/0723) [2013‑01]
H05K 2201/092
. . .
Exposing inner circuit layers or metal planes at the walls of high aspect ratio holes (forming plated-through holes H05K 3/42 ; cutting around hole H05K 2203/0242) [2013‑01]
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H05K 2201/09209
. .
Shape and layout details of conductors [2013‑01]
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H05K 2201/09218
. . .
Conductive traces [2013‑01]
H05K 2201/09227
. . . .
Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting [2013‑01]
H05K 2201/09236
. . . .
Parallel layout (layout of balanced signal pairs H05K 1/0245 ; superposed layout H05K 2201/09672) [2013‑01]
H05K 2201/09245
. . . .
Crossing layout (alternating conductors H05K 2201/097) [2013‑01]
H05K 2201/09254
. . . .
Branched layout [2013‑01]
H05K 2201/09263
. . . .
Meander [2013‑01]
H05K 2201/09272
. . . .
Layout details of angles or corners [2013‑01]
H05K 2201/09281
. . . .
Layout details of a single conductor (meander H05K 2201/09263 ; layout details of angles or corners H05K 2201/09272) [2013‑01]
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H05K 2201/0929
. . .
Conductive planes [2013‑01]
H05K 2201/093
. . . .
Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein (reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K 1/0224) [2013‑01]
H05K 2201/09309
. . . .
Core having two or more power planes; Capacitive laminate of two power planes [2013‑01]
H05K 2201/09318
. . . .
Core having one signal plane and one power plane [2013‑01]
H05K 2201/09327
. . . .
Special sequence of power, ground and signal layers in multilayer PCB [2013‑01]
H05K 2201/09336
. . . .
Signal conductors in same plane as power plane [2013‑01]
H05K 2201/09345
. . . .
Power and ground in the same plane; Power planes for two voltages in one plane [2013‑01]
H05K 2201/09354
. . . .
Ground conductor along edge of main surface (edge contacts H05K 3/403) [2013‑01]
H05K 2201/09363
. . . .
wherein only contours around conductors are removed for insulation [2013‑01]
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H05K 2201/09372
. . .
Pads and lands [2013‑01]
H05K 2201/09381
. . . .
Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component (notches in edge pads H05K 2201/09181) [2013‑01]
H05K 2201/0939
. . . .
Curved pads, e.g. semi-circular or elliptical pads or lands [2013‑01]
H05K 2201/094
. . . .
Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads (using different types of conductors H05K 2201/0391) [2013‑01]
H05K 2201/09409
. . . .
Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components [2013‑01]
H05K 2201/09418
. . . .
Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation [2013‑01]
H05K 2201/09427
. . . .
Special relation between the location or dimension of a pad or land and the location or dimension of a terminal [2013‑01]
H05K 2201/09436
. . . .
Pads or lands on permanent coating which covers the other conductors [2013‑01]
H05K 2201/09445
. . . .
Pads for connections not located at the edge of the PCB, e.g. for flexible circuits [2013‑01]
H05K 2201/09454
. . . .
Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB [2013‑01]
H05K 2201/09463
. . . .
Partial lands, i.e. lands or conductive rings not completely surrounding the hole (landless plated-through hole or via H05K 2201/09545) [2013‑01]
H05K 2201/09472
. . . .
Recessed pad for surface mounting (recess in pad H05K 2201/09745); Recessed electrode of component [2013‑01]
H05K 2201/09481
. . . .
Via in pad; Pad over filled via (if used for surface mounting H05K 1/113) [2013‑01]
H05K 2201/0949
. . . .
Pad close to a hole, not surrounding the hole (if used for surface mounting H05K 1/114) [2013‑01]
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H05K 2201/095
. . .
Conductive through-holes or vias [2013‑01]
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H05K 2201/09509
. . . .
Blind vias, i.e. vias having one side closed [2013‑01]
H05K 2201/09518
. . . . .
Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer [2013‑01]
H05K 2201/09527
. . . . .
Inverse blind vias, i.e. bottoms outwards in multilayer PCB; Blind vias in centre of PCB having opposed bottoms [2013‑01]
H05K 2201/09536
. . . .
Buried plated through-holes, i.e. plated through-holes formed in a core before lamination [2013‑01]
H05K 2201/09545
. . . .
Plated through-holes or blind vias without lands [2013‑01]
H05K 2201/09554
. . . .
Via connected to metal substrate [2013‑01]
H05K 2201/09563
. . . .
Metal filled via (plated through-hole filled with insulating material H05K 2201/0959) [2013‑01]
H05K 2201/09572
. . . .
Solder filled plated through-hole in the final product (soldering lead-in-hole components H05K 3/3447) [2013‑01]
H05K 2201/09581
. . . .
Applying an insulating coating on the walls of holes [2013‑01]
H05K 2201/0959
. . . .
Plated through-holes or plated blind vias filled with insulating material [2013‑01]
H05K 2201/096
. . . .
Vertically aligned vias, holes or stacked vias [2013‑01]
H05K 2201/09609
. . . .
Via grid, i.e. two-dimensional array of vias or holes in a single plane (interposers H05K 2201/10378) [2013‑01]
H05K 2201/09618
. . . .
Via fence, i.e. one-dimensional array of vias [2013‑01]
H05K 2201/09627
. . . .
Special connections between adjacent vias, not for grounding vias (redundant conductors or connections H05K 2201/0979) [2013‑01]
H05K 2201/09636
. . . .
Details of adjacent, not connected vias [2013‑01]
H05K 2201/09645
. . . .
Patterning on via walls; Plural lands around one hole [2013‑01]
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H05K 2201/09654
. . .
covering at least two types of conductors provided for in H05K 2201/09218 - H05K 2201/095 [2013‑01]
H05K 2201/09663
. . . .
Divided layout, i.e. conductors divided in two or more parts (branched layout H05K 2201/09254) [2013‑01]
H05K 2201/09672
. . . .
Superposed layout, i.e. in different planes (parallel traces in one plane H05K 2201/09236) [2013‑01]
H05K 2201/09681
. . . .
Mesh conductors, e.g. as a ground plane [2013‑01]
H05K 2201/0969
. . . .
Apertured conductors [2013‑01]
H05K 2201/097
. . . .
Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components [2013‑01]
H05K 2201/09709
. . . .
Staggered pads, lands or terminals; Parallel conductors in different planes [2013‑01]
H05K 2201/09718
. . . .
Clearance holes [2013‑01]
H05K 2201/09727
. . . .
Varying width along a single conductor; Conductors or pads having different widths [2013‑01]
H05K 2201/09736
. . . .
Varying thickness of a single conductor; Conductors in the same plane having different thicknesses [2013‑01]
H05K 2201/09745
. . . .
Recess in conductor, e.g. in pad or in metallic substrate [2013‑01]
H05K 2201/09754
. . . .
Connector integrally incorporated in the PCB or in housing (mounted connecter H05K 2201/10189) [2013‑01]
H05K 2201/09763
. . . .
Printed component having superposed conductors, but integrated in one circuit layer [2013‑01]
H05K 2201/09772
. . . .
Conductors directly under a component but not electrically connected to the component (cooling of mounted components by printed thermal vias H05K 1/0206) [2013‑01]
H05K 2201/09781
. . . .
Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components [2013‑01]
H05K 2201/0979
. . . .
Redundant conductors or connections, i.e. more than one current path between two points [2013‑01]
H05K 2201/098
. . . .
Special shape of the cross-section of conductors, e.g. very thick plated conductors [2013‑01]
H05K 2201/09809
. . . .
Coaxial layout (reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K 1/0222) [2013‑01]
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H05K 2201/09818
. .
Other shape and layout details not provided for in H05K 2201/09009 - H05K 2201/09209; Shape and layout details covering several of these groups [2013‑01]
H05K 2201/09827
. . .
Tapered, e.g. tapered hole, via or groove (bevelled, chamferred or tapered edge H05K 2201/09154) [2013‑01]
H05K 2201/09836
. . .
Oblique hole, via or bump [2013‑01]
H05K 2201/09845
. . .
Stepped hole, via, edge, bump or conductor [2013‑01]
H05K 2201/09854
. . .
Hole or via having special cross-section, e.g. elliptical [2013‑01]
H05K 2201/09863
. . .
Concave hole or via [2013‑01]
H05K 2201/09872
. . .
Insulating conformal coating (foil encapsulation H05K 2203/1311) [2013‑01]
H05K 2201/09881
. . .
Coating only between conductors, i.e. flush with the conductors [2013‑01]
H05K 2201/0989
. . .
Coating free areas, e.g. areas other than pads or lands free of solder resist [2013‑01]
H05K 2201/099
. . .
Coating over pads, e.g. solder resist partly over pads [2013‑01]
H05K 2201/09909
. . .
Special local insulating pattern, e.g. as dam around component [2013‑01]
H05K 2201/09918
. . .
Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components [2013‑01]
H05K 2201/09927
. . .
Machine readable code, e.g. bar code [2013‑01]
H05K 2201/09936
. . .
Marks, inscriptions, etc. for information [2013‑01]
H05K 2201/09945
. . .
Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer [2013‑01]
H05K 2201/09954
. . .
More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads [2013‑01]
H05K 2201/09963
. . .
Programming circuit by using small elements, e.g. small PCBs [2013‑01]
H05K 2201/09972
. . .
Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently [2013‑01]
H05K 2201/09981
. . .
Metallised walls [2013‑01]
H05K 2201/0999
. . .
Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing [2013‑01]
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H05K 2201/10
.
Details of components or other objects attached to or integrated in a printed circuit board [2013‑01]
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H05K 2201/10007
. .
Types of components [2013‑01]
H05K 2201/10015
. . .
Non-printed capacitor [2013‑01]
H05K 2201/10022
. . .
Non-printed resistor [2013‑01]
H05K 2201/1003
. . .
Non-printed inductor [2013‑01]
H05K 2201/10037
. . .
Printed or non-printed battery [2013‑01]
H05K 2201/10045
. . .
Mounted network component having plural terminals [2013‑01]
H05K 2201/10053
. . .
Switch [2013‑01]
H05K 2201/1006
. . .
Non-printed filter [2013‑01]
H05K 2201/10068
. . .
Non-printed resonator [2013‑01]
H05K 2201/10075
. . .
Non-printed oscillator [2013‑01]
H05K 2201/10083
. . .
Electromechanical or electro-acoustic component, e.g. microphone [2013‑01]
H05K 2201/1009
. . .
Electromotor [2013‑01]
H05K 2201/10098
. . .
Component for radio transmission, e.g. Radio Frequency Identification Tag [RFID] [2013‑01]
H05K 2201/10106
. . .
Light emitting diode [LED] [2013‑01]
H05K 2201/10113
. . .
Lamp [2013‑01]
H05K 2201/10121
. . .
Optical component, e.g. opto-electronic component [2013‑01]
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H05K 2201/10128
. . .
Display [2013‑01]
H05K 2201/10136
. . . .
Liquid Crystal display [LCD] [2013‑01]
H05K 2201/10143
. . .
Solar cell [2013‑01]
H05K 2201/10151
. . .
Sensor [2013‑01]
H05K 2201/10159
. . .
Memory [2013‑01]
H05K 2201/10166
. . .
Transistor [2013‑01]
H05K 2201/10174
. . .
Diode [2013‑01]
H05K 2201/10181
. . .
Fuse [2013‑01]
H05K 2201/10189
. . .
Non-printed connector [2013‑01]
H05K 2201/10196
. . .
Variable component, e.g. variable resistor [2013‑01]
H05K 2201/10204
. . .
Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning [2013‑01]
H05K 2201/10212
. . .
Programmable component [2013‑01]
H05K 2201/10219
. . .
Thermoelectric component [2013‑01]
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H05K 2201/10227
. .
Other objects, e.g. metallic pieces [2013‑01]
H05K 2201/10234
. . .
Metallic balls (solder balls H05K 2203/041) [2013‑01]
H05K 2201/10242
. . .
Metallic cylinders (small solder preforms other than balls H05K 2203/0415) [2013‑01]
H05K 2201/1025
. . .
Metallic discs (small solder preforms other than balls H05K 2203/0415) [2013‑01]
H05K 2201/10257
. . .
Hollow pieces of metal, e.g. used in connection between component and PCB [2013‑01]
H05K 2201/10265
. . .
Metallic coils or springs, e.g. as part of a connection element [2013‑01]
H05K 2201/10272
. . .
Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors (metal strips H05K 2201/1028) [2013‑01]
H05K 2201/1028
. . .
Thin metal strips as connectors or conductors [2013‑01]
H05K 2201/10287
. . .
Metal wires as connectors or conductors [2013‑01]
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H05K 2201/10295
. . .
Metallic connector elements partly mounted in a hole of the PCB [2013‑01]
H05K 2201/10303
. . . .
Pin-in-hole mounted pins [2013‑01]
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H05K 2201/1031
. . .
Surface mounted metallic connector elements [2013‑01]
H05K 2201/10318
. . . .
Surface mounted metallic pins [2013‑01]
H05K 2201/10325
. . .
Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support [2013‑01]
H05K 2201/10333
. . .
Individual female type metallic connector elements [2013‑01]
H05K 2201/1034
. . .
Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB (tab H05K 2201/0397) [2013‑01]
H05K 2201/10348
. . .
Fuzz's as connector elements, i.e. small pieces of metallic fiber to make connection [2013‑01]
H05K 2201/10356
. . .
Cables [2013‑01]
H05K 2201/10363
. . .
Jumpers, i.e. non-printed cross-over connections [2013‑01]
H05K 2201/10371
. . .
Shields or metal cases [2013‑01]
H05K 2201/10378
. . .
Interposers [2013‑01]
H05K 2201/10386
. . .
Clip leads; Terminals gripping the edge of a substrate [2013‑01]
H05K 2201/10393
. . .
Clamping a component by an element or a set of elements [2013‑01]
H05K 2201/10401
. . .
Eyelets, i.e. rings inserted into a hole through a circuit board [2013‑01]
H05K 2201/10409
. . .
Screws [2013‑01]
H05K 2201/10416
. . .
Metallic blocks or heatsinks completely inserted in a PCB (metallic supports H05K 3/0061) [2013‑01]
H05K 2201/10424
. . .
Frame holders [2013‑01]
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H05K 2201/10431
. .
Details of mounted components (printed components H05K 1/16) [2013‑01]
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H05K 2201/10439
. . .
Position of a single component [2013‑01]
H05K 2201/10446
. . . .
Mounted on an edge (soldering edge mounted components H05K 3/3405 ; edge terminals H05K 2201/1034) [2013‑01]
H05K 2201/10454
. . . .
Vertically mounted [2013‑01]
H05K 2201/10462
. . . .
Flat component oriented parallel to the PCB surface [2013‑01]
H05K 2201/10469
. . . .
Asymmetrically mounted component [2013‑01]
H05K 2201/10477
. . . .
Inverted [2013‑01]
H05K 2201/10484
. . . .
Obliquely mounted [2013‑01]
H05K 2201/10492
. . . .
Electrically connected to another device (mounted components directly electrically connected to each other H05K 2201/1053) [2013‑01]
H05K 2201/105
. . . .
Mechanically attached to another device (attached components H05K 2201/10537) [2013‑01]
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H05K 2201/10507
. . .
Involving several components [2013‑01]
H05K 2201/10515
. . . .
Stacked components [2013‑01]
H05K 2201/10522
. . . .
Adjacent components [2013‑01]
H05K 2201/1053
. . . .
Mounted components directly electrically connected to each other, i.e. not via the PCB [2013‑01]
H05K 2201/10537
. . . .
Attached components [2013‑01]
H05K 2201/10545
. . . .
Related components mounted on both sides of the PCB [2013‑01]
H05K 2201/10553
. . .
Component over metal, i.e. metal plate in between bottom of component and surface of PCB [2013‑01]
H05K 2201/1056
. . .
Metal over component, i.e. metal plate over component mounted on or embedded in PCB [2013‑01]
H05K 2201/10568
. . .
Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element [2013‑01]
H05K 2201/10575
. . .
Insulating foil under component (permanent spacer or stand-off H05K 2201/2036) [2013‑01]
H05K 2201/10583
. . .
Cylindrically shaped component; Fixing means therefore [2013‑01]
H05K 2201/1059
. . .
Connections made by press-fit insertion [2013‑01]
H05K 2201/10598
. . .
Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB [2013‑01]
H05K 2201/10606
. . .
Permanent holder for component or auxiliary PCB mounted on a PCB (clamping a component by an element or a set of elements H05K 2201/10393) [2013‑01]
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H05K 2201/10613
. .
Details of electrical connections of non-printed components, e.g. special leads [2013‑01]
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H05K 2201/10621
. . .
Components characterised by their electrical contacts [2013‑01]
H05K 2201/10628
. . . .
Leaded surface mounted device (soldering surface mounted leaded components H05K 3/3421) [2013‑01]
H05K 2201/10636
. . . .
Leadless chip, e.g. chip capacitor or resistor [2013‑01]
H05K 2201/10643
. . . .
Disc shaped leadless component [2013‑01]
H05K 2201/10651
. . . .
Component having two leads, e.g. resistor, capacitor [2013‑01]
H05K 2201/10659
. . . .
Different types of terminals for the same component, e.g. solder balls combined with leads [2013‑01]
H05K 2201/10666
. . . .
Plated through-hole for surface mounting on PCB [2013‑01]
H05K 2201/10674
. . . .
Flip chip [2013‑01]
H05K 2201/10681
. . . .
Tape Carrier Package [TCP]; Flexible sheet connector [2013‑01]
H05K 2201/10689
. . . .
Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL] [2013‑01]
H05K 2201/10696
. . . .
Single-in-line [SIL] package [2013‑01]
H05K 2201/10704
. . . .
Pin grid array [PGA] [2013‑01]
H05K 2201/10712
. . . .
Via grid array, e.g. via grid array capacitor [2013‑01]
H05K 2201/10719
. . . .
Land grid array [LGA] [2013‑01]
H05K 2201/10727
. . . .
Leadless chip carrier [LCC], e.g. chip-modules for cards [2013‑01]
H05K 2201/10734
. . . .
Ball grid array [BGA]; Bump grid array [2013‑01]
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H05K 2201/10742
. . .
Details of leads [2013‑01]
Collapse
H05K 2201/1075
. . . .
Shape details [2013‑01]
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H05K 2201/10757
. . . . .
Bent leads [2013‑01]
H05K 2201/10765
. . . . . .
Leads folded back, i.e. bent with an angle of 180 deg [2013‑01]
H05K 2201/10772
. . . . . .
Leads of a surface mounted component bent for providing a gap between the lead and the pad during soldering [2013‑01]
H05K 2201/1078
. . . . .
Leads having locally deformed portion, e.g. for retention [2013‑01]
H05K 2201/10787
. . . . .
Leads having protrusions, e.g. for retention or insert stop [2013‑01]
H05K 2201/10795
. . . . .
Details of lead tips, e.g. pointed [2013‑01]
H05K 2201/10803
. . . . .
Tapered leads, i.e. leads having changing width or diameter [2013‑01]
H05K 2201/1081
. . . . .
Special cross-section of a lead; Different cross-sections of different leads; Matching cross-section, e.g. matched to a land [2013‑01]
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H05K 2201/10818
. . . . .
Flat leads [2013‑01]
H05K 2201/10825
. . . . . .
Distorted or twisted flat leads, i.e. deformed by torque [2013‑01]
H05K 2201/10833
. . . . . .
having a curved or folded cross-section [2013‑01]
H05K 2201/1084
. . . . .
Notched leads [2013‑01]
H05K 2201/10848
. . . . .
Thinned leads [2013‑01]
H05K 2201/10856
. . . . .
Divided leads, e.g. by slot in length direction of lead, or by branching of the lead [2013‑01]
H05K 2201/10863
. . . . .
Adaptations of leads or holes for facilitating insertion [2013‑01]
H05K 2201/10871
. . . . .
Leads having an integral insert stop [2013‑01]
H05K 2201/10878
. . . . .
Means for retention of a lead in a hole [2013‑01]
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H05K 2201/10886
. . . .
Other details [2013‑01]
H05K 2201/10893
. . . . .
Grouped leads, i.e. element comprising multiple leads distributed around but not through a common insulator [2013‑01]
H05K 2201/10901
. . . . .
Lead partly inserted in hole or via [2013‑01]
H05K 2201/10909
. . . . .
Materials of terminal, e.g. of leads or electrodes of components [2013‑01]
H05K 2201/10916
. . . . .
Terminals having auxiliary metallic piece, e.g. for soldering [2013‑01]
H05K 2201/10924
. . . . .
Leads formed from a punched metal foil (affixing a prefabricated self-supporting metal foil pattern H05K 3/202) [2013‑01]
H05K 2201/10931
. . . . .
Exposed leads, i.e. encapsulation of component partly removed for exposing a part of lead, e.g. for soldering purposes [2013‑01]
H05K 2201/10939
. . . . .
Lead of component used as a connector [2013‑01]
H05K 2201/10946
. . . . .
Leads attached onto leadless component after manufacturing the component [2013‑01]
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H05K 2201/10954
. . .
Other details of electrical connections [2013‑01]
H05K 2201/10962
. . . .
Component not directly connected to the PCB [2013‑01]
H05K 2201/10969
. . . .
Metallic case or integral heatsink of component electrically connected to a pad on PCB [2013‑01]
H05K 2201/10977
. . . .
Encapsulated connections (applying non-metallic protective coatings for encapsulating mounted components H05K 3/284) [2013‑01]
H05K 2201/10984
. . . .
Component carrying a connection agent, e.g. solder, adhesive (soldering leadless components having an array of bottom contacts H05K 3/3436 ; BGA components H05K 2201/10734) [2013‑01]
H05K 2201/10992
. . . .
Using different connection materials, e.g. different solders, for the same connection [2013‑01]
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H05K 2201/20
.
Details of printed circuits not provided for in H05K 2201/01 - H05K 2201/10 [2013‑01]
H05K 2201/2009
. .
Reinforced areas, e.g. for a specific part of a flexible printed circuit [2013‑01]
H05K 2201/2018
. .
Presence of a frame in a printed circuit or printed circuit assembly [2013‑01]
H05K 2201/2027
. .
Guiding means, e.g. for guiding flexible circuits [2013‑01]
H05K 2201/2036
. .
Permanent spacer or stand-off in a printed circuit or printed circuit assembly (pattern for applying drops or paste H05K 2203/0545) [2013‑01]
H05K 2201/2045
. .
Protection against vibrations [2013‑01]
H05K 2201/2054
. .
Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics [2013‑01]
H05K 2201/2063
. .
mixed adhesion layer containing metallic/inorganic and polymeric materials [2013‑01]
H05K 2201/2072
. .
Anchoring, i.e. one structure gripping into another (providing micro- or nanometer scale roughness on a metal surface H05K 2203/0307) [2013‑01]
H05K 2201/2081
. .
Compound repelling a metal, e.g. solder [2013‑01]
H05K 2201/209
. .
Auto-mechanical connection between a component and a PCB or between two PCBs [2013‑01]
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H05K 2203/00
Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K 3/00 [2013‑01]
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H05K 2203/01
.
Tools for processing; Objects used during processing [2013‑01]
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H05K 2203/0104
. .
for patterning or coating [2013‑01]
H05K 2203/0108
. . .
Male die used for patterning, punching or transferring [2013‑01]
H05K 2203/0113
. . .
Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern [2013‑01]
H05K 2203/0117
. . .
Pattern shaped electrode used for patterning, e.g. plating or etching [2013‑01]
H05K 2203/0121
. . .
Patterning, e.g. plating or etching by moving electrode [2013‑01]
H05K 2203/0126
. . .
Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes [2013‑01]
H05K 2203/013
. . .
Inkjet printing, e.g. for printing insulating material or resist (using ink-jet printing to form a conductive pattern H05K 3/125) [2013‑01]
H05K 2203/0134
. . .
Drum, e.g. rotary drum or dispenser with a plurality of openings [2013‑01]
H05K 2203/0139
. . .
Blade or squeegee, e.g. for screen printing or filling of holes [2013‑01]
H05K 2203/0143
. . .
Using a roller; Specific shape thereof; Providing locally adhesive portions thereon [2013‑01]
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H05K 2203/0147
. .
Carriers and holders [2013‑01]
H05K 2203/0152
. . .
Temporary metallic carrier, e.g. for transferring material (affixing a prefabricated conductor pattern formed by electroplating or electroforming on a metallic carrier H05K 3/205) [2013‑01]
H05K 2203/0156
. . .
Temporary polymeric carrier or foil, e.g. for processing or transferring [2013‑01]
H05K 2203/016
. . .
Temporary inorganic, non-metallic carrier, e.g. for processing or transferring [2013‑01]
H05K 2203/0165
. . .
Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing [2013‑01]
H05K 2203/0169
. . .
Using a temporary frame during processing [2013‑01]
H05K 2203/0173
. . .
Template for holding a PCB having mounted components thereon [2013‑01]
H05K 2203/0178
. .
Projectile, e.g. for perforating substrate [2013‑01]
H05K 2203/0182
. .
Using a temporary spacer element or stand-off during processing [2013‑01]
H05K 2203/0186
. .
Mask formed or laid on PCB, the mask having recesses or openings specially designed for mounting components or body parts thereof [2013‑01]
H05K 2203/0191
. .
Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste [2013‑01]
H05K 2203/0195
. .
Tool for a process not provided for in H05K 3/00 , e.g. tool for handling objects using suction, for deforming objects, for applying local pressure [2013‑01]
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H05K 2203/02
.
Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound [2013‑01]
H05K 2203/0207
. .
Partly drilling through substrate until a controlled depth, e.g. with end-point detection [2013‑01]
H05K 2203/0214
. .
Back-up or entry material, e.g. for mechanical drilling [2013‑01]
H05K 2203/0221
. .
Perforating [2013‑01]
H05K 2203/0228
. .
Cutting, sawing, milling or shearing [2013‑01]
H05K 2203/0235
. .
Laminating followed by cutting or slicing perpendicular to plane of the laminate; Embedding wires in an object and cutting or slicing the object perpendicular to direction of the wires [2013‑01]
H05K 2203/0242
. .
Cutting around hole, e.g. for disconnecting land or Plated Through-Hole [PTH] or for partly removing a PTH [2013‑01]
H05K 2203/025
. .
Abrading, e.g. grinding or sand blasting (deburring, rounding, bevelling or smoothing conductor edges H05K 2203/0346) [2013‑01]
H05K 2203/0257
. .
Brushing, e.g. cleaning the conductive pattern by brushing or wiping [2013‑01]
H05K 2203/0264
. .
Peeling insulating layer, e.g. foil, or separating mask [2013‑01]
H05K 2203/0271
. .
Mechanical force other than pressure, e.g. shearing or pulling [2013‑01]
H05K 2203/0278
. .
Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive [2013‑01]
H05K 2203/0285
. .
Using ultrasound, e.g. for cleaning, soldering or wet treatment [2013‑01]
H05K 2203/0292
. .
Using vibration, e.g. during soldering or screen printing [2013‑01]
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H05K 2203/03
.
Metal processing [2013‑01]
H05K 2203/0307
. .
Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites [2013‑01]
H05K 2203/0315
. .
Oxidising metal [2013‑01]
H05K 2203/0323
. .
Working metal substrate or core, e.g. by etching, deforming [2013‑01]
H05K 2203/033
. .
Punching metal foil, e.g. solder foil (affixing a prefabricated self-supporting metal foil pattern H05K 3/202) [2013‑01]
H05K 2203/0338
. .
Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component (affixing a prefabricated conductor pattern H05K 3/20) [2013‑01]
H05K 2203/0346
. .
Deburring, rounding, bevelling or smoothing conductor edges [2013‑01]
H05K 2203/0353
. .
Making conductive layer thin, e.g. by etching (selective thinning for providing different thickness H05K 2203/0369) [2013‑01]
H05K 2203/0361
. .
Stripping a part of an upper metal layer to expose a lower metal layer, e.g by etching or using a laser [2013‑01]
H05K 2203/0369
. .
Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist [2013‑01]
H05K 2203/0376
. .
Etching temporary metallic carrier substrate [2013‑01]
H05K 2203/0384
. .
Etch stop layer, i.e. a buried barrier layer for preventing etching of layers under the etch stop layer [2013‑01]
H05K 2203/0392
. .
Pretreatment of metal, e.g. before finish plating, etching (improvement of the adhesion between an insulating substrate and a metal by special treatment of the metal H05K 3/382) [2013‑01]
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H05K 2203/04
.
Soldering or other types of metallurgic bonding (using molten metal H05K 2203/128) [2013‑01]
H05K 2203/0405
. .
Solder foil, tape or wire [2013‑01]
H05K 2203/041
. .
Solder preforms in the shape of solder balls (soldering leadless components having an array of bottom contacts H05K 3/3436) [2013‑01]
H05K 2203/0415
. .
Small preforms other than balls, e.g. discs, cylinders or pillars [2013‑01]
H05K 2203/042
. .
Remote solder depot on the PCB, the solder flowing to the connections from this depot [2013‑01]
H05K 2203/0425
. .
Solder powder or solder coated metal powder [2013‑01]
H05K 2203/043
. .
Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste [2013‑01]
H05K 2203/0435
. .
Metal coated solder, e.g. for passivation of solder balls [2013‑01]
H05K 2203/044
. .
Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering [2013‑01]
H05K 2203/0445
. .
Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking [2013‑01]
H05K 2203/045
. .
Solder filled PTH during processing (solder filled plated through-hole in the final product H05K 2201/09572) [2013‑01]
H05K 2203/0455
. .
PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting [2013‑01]
H05K 2203/046
. .
Means for drawing solder, e.g. for removing excess solder from pads [2013‑01]
H05K 2203/0465
. .
Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads [2013‑01]
H05K 2203/047
. .
Soldering with different solders, e.g. two different solders on two sides of the PCB [2013‑01]
H05K 2203/0475
. .
Molten solder just before placing the component [2013‑01]
H05K 2203/048
. .
Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor [2013‑01]
H05K 2203/0485
. .
Tacky flux, e.g. for adhering components during mounting [2013‑01]
H05K 2203/049
. .
Wire bonding [2013‑01]
H05K 2203/0495
. .
Cold welding [2013‑01]
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H05K 2203/05
.
Patterning and lithography; Masks; Details of resist [2013‑01]
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H05K 2203/0502
. .
Patterning and lithography [2013‑01]
H05K 2203/0505
. . .
Double exposure of the same photosensitive layer [2013‑01]
H05K 2203/0508
. . .
Flood exposure [2013‑01]
H05K 2203/0511
. . .
Diffusion patterning [2013‑01]
H05K 2203/0514
. . .
Photodevelopable thick film, e.g. conductive or insulating paste [2013‑01]
H05K 2203/0517
. . .
Electrographic patterning [2013‑01]
H05K 2203/052
. . .
Magnetographic patterning [2013‑01]
H05K 2203/0522
. . .
Using an adhesive pattern [2013‑01]
H05K 2203/0525
. . .
Patterning by phototackifying or by photopatterning adhesive [2013‑01]
H05K 2203/0528
. . .
Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser [2013‑01]
H05K 2203/0531
. . .
Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate [2013‑01]
H05K 2203/0534
. . .
Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member [2013‑01]
H05K 2203/0537
. . .
Transfer of pre-fabricated insulating pattern [2013‑01]
H05K 2203/054
. . .
Continuous temporary metal layer over resist, e.g. for selective electroplating [2013‑01]
H05K 2203/0542
. . .
Continuous temporary metal layer over metal pattern (reinforcing the conductive pattern characterised by the electroplating method H05K 3/241) [2013‑01]
H05K 2203/0545
. . .
Pattern for applying drops or paste; Applying a pattern made of drops or paste (using thick film techniques to apply conductive material by using a substrate with a shape pattern H05K 3/1258) [2013‑01]
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H05K 2203/0548
. .
Masks [2013‑01]
H05K 2203/0551
. . .
Exposure mask directly printed on the PCB [2013‑01]
H05K 2203/0554
. . .
Metal used as mask for etching vias, e.g. by laser ablation [2013‑01]
H05K 2203/0557
. . .
Non-printed masks [2013‑01]
H05K 2203/056
. . .
Using an artwork, i.e. a photomask for exposing photosensitive layers [2013‑01]
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H05K 2203/0562
. .
Details of resist [2013‑01]
H05K 2203/0565
. . .
Resist used only for applying catalyst, not for plating itself [2013‑01]
H05K 2203/0568
. . .
Resist used for applying paste, ink or powder [2013‑01]
H05K 2203/0571
. . .
Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist [2013‑01]
H05K 2203/0574
. . .
Stacked resist layers used for different processes [2013‑01]
H05K 2203/0577
. . .
Double layer of resist having the same pattern [2013‑01]
H05K 2203/058
. . .
Additional resists used for the same purpose but in different areas, i.e. not stacked [2013‑01]
H05K 2203/0582
. . .
Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist [2013‑01]
H05K 2203/0585
. . .
Second resist used as mask for selective stripping of first resist [2013‑01]
H05K 2203/0588
. . .
Second resist used as pattern over first resist [2013‑01]
H05K 2203/0591
. . .
Organic non-polymeric coating, e.g. for inhibiting corrosion thereby preserving solderability [2013‑01]
H05K 2203/0594
. . .
Insulating resist or coating with special shaped edges [2013‑01]
H05K 2203/0597
. . .
Resist applied over the edges or sides of conductors, e.g. for protection during etching or plating (coating over pads H05K 2201/09818) [2013‑01]
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H05K 2203/06
.
Lamination [2013‑01]
H05K 2203/061
. .
of previously made multilayered subassemblies (laminating only or mainly similar single-sided circuit boards H05K 3/4617 ; laminating only or mainly similar double-sided circuit boards H05K 3/462) [2013‑01]
H05K 2203/063
. .
of preperforated insulating layer [2013‑01]
H05K 2203/065
. .
Binding insulating layers without adhesive, e.g. by local heating or welding, before lamination of the whole PCB [2013‑01]
H05K 2203/066
. .
Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern (transferring an insulating pattern H05K 2203/0537) [2013‑01]
H05K 2203/068
. .
Features of the lamination press or of the lamination process, e.g. using special separator sheets [2013‑01]
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H05K 2203/07
.
Treatments involving liquids, e.g. plating, rinsing [2013‑01]
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H05K 2203/0703
. .
Plating [2013‑01]
H05K 2203/0706
. . .
Inactivating or removing catalyst, e.g. on surface of resist [2013‑01]
H05K 2203/0709
. . .
Catalytic ink or adhesive for electroless plating (catalyst filler H05K 2201/0236) [2013‑01]
H05K 2203/0713
. . .
Plating poison, e.g. for selective plating or for preventing plating on resist [2013‑01]
H05K 2203/0716
. . .
Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts [2013‑01]
H05K 2203/072
. . .
Electroless plating, e.g. finish plating or initial plating [2013‑01]
H05K 2203/0723
. . .
Electroplating, e.g. finish plating [2013‑01]
H05K 2203/0726
. . .
Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure [2013‑01]
H05K 2203/073
. . .
Displacement plating, substitution plating or immersion plating, e.g. for finish plating [2013‑01]
H05K 2203/0733
. . .
Method for plating stud vias, i.e. massive vias formed by plating the bottom of a hole without plating on the walls [2013‑01]
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H05K 2203/0736
. .
Methods for applying liquids, e.g. spraying [2013‑01]
H05K 2203/074
. . .
Features related to the fluid pressure [2013‑01]
H05K 2203/0743
. . .
Mechanical agitation of fluid, e.g. during cleaning of the conductive pattern [2013‑01]
H05K 2203/0746
. . .
Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet [2013‑01]
H05K 2203/075
. . .
Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles [2013‑01]
H05K 2203/0753
. . .
Reversing fluid direction, e.g. in holes [2013‑01]
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H05K 2203/0756
. .
Uses of liquids, e.g. rinsing, coating, dissolving [2013‑01]
H05K 2203/0759
. . .
Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer [2013‑01]
H05K 2203/0763
. . .
Treating individual holes or single row of holes, e.g. by nozzle [2013‑01]
H05K 2203/0766
. . .
Rinsing, e.g. after cleaning or polishing a conductive pattern [2013‑01]
H05K 2203/0769
. . .
Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure [2013‑01]
H05K 2203/0773
. . .
Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler [2013‑01]
H05K 2203/0776
. . .
Uses of liquids not otherwise provided for in H05K 2203/0759 - H05K 2203/0773 [2013‑01]
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H05K 2203/0779
. .
characterised by the specific liquids involved [2013‑01]
H05K 2203/0783
. . .
Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity [2013‑01]
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H05K 2203/0786
. . .
Using an aqueous solution, e.g. for cleaning or during drilling of holes [2013‑01]
H05K 2203/0789
. . . .
Aqueous acid solution, e.g. for cleaning or etching [2013‑01]
H05K 2203/0793
. . . .
Aqueous alkaline solution, e.g. for cleaning or etching [2013‑01]
H05K 2203/0796
. . . .
Oxidant in aqueous solution, e.g. permanganate [2013‑01]
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H05K 2203/08
.
Treatments involving gases [2013‑01]
H05K 2203/081
. .
Blowing of gas, e.g. for cooling or for providing heat during solder reflowing [2013‑01]
H05K 2203/082
. .
Suction, e.g. for holding solder balls or components [2013‑01]
H05K 2203/083
. .
Evaporation or sublimation of a compound, e.g. gas bubble generating agent [2013‑01]
H05K 2203/085
. .
Using vacuum or low pressure [2013‑01]
H05K 2203/086
. .
Using an inert gas [2013‑01]
H05K 2203/087
. .
Using a reactive gas [2013‑01]
H05K 2203/088
. .
Using a vapour or mist, e.g. cleaning using water vapor [2013‑01]
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H05K 2203/09
.
Treatments involving charged particles [2013‑01]
H05K 2203/092
. .
Particle beam, e.g. using an electron beam or an ion beam [2013‑01]
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H05K 2203/095
. .
Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes [2013‑01]
H05K 2203/097
. . .
Corona discharge [2013‑01]
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H05K 2203/10
.
Using electric, magnetic and electromagnetic fields; Using laser light [2013‑01]
H05K 2203/101
. .
Using electrical induction, e.g. for heating during soldering [2013‑01]
H05K 2203/102
. .
Using microwaves, e.g. for curing ink patterns or adhesive [2013‑01]
H05K 2203/104
. .
Using magnetic force, e.g. to align particles or for a temporary connection during processing [2013‑01]
H05K 2203/105
. .
Using an electrical field; Special methods of applying an electric potential (electroplating H05K 2203/0723) [2013‑01]
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H05K 2203/107
. .
Using laser light (shaping a substrate by laser ablation H05K 3/0026) [2013‑01]
H05K 2203/108
. . .
Using a plurality of lasers or laser light with a plurality of wavelengths [2013‑01]
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H05K 2203/11
.
Treatments characterised by their effect, e.g. heating, cooling, roughening [2013‑01]
H05K 2203/1105
. .
Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating [2013‑01]
H05K 2203/111
. .
Preheating, e.g. before soldering [2013‑01]
H05K 2203/1115
. .
Resistance heating, e.g. by current through the PCB conductors or through a metallic mask [2013‑01]
H05K 2203/1121
. .
Cooling, e.g. specific areas of a PCB being cooled during reflow soldering (details related to cooling of mounted components H05K 1/0203) [2013‑01]
H05K 2203/1126
. .
Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents [2013‑01]
H05K 2203/1131
. .
Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity [2013‑01]
H05K 2203/1136
. .
Conversion of insulating material into conductive material, e.g. by pyrolysis [2013‑01]
H05K 2203/1142
. .
Conversion of conductive material into insulating material or into dissolvable compound [2013‑01]
H05K 2203/1147
. .
Sealing or impregnating, e.g. of pores [2013‑01]
H05K 2203/1152
. .
Replicating the surface structure of a sacrificial layer, e.g. for roughening [2013‑01]
H05K 2203/1157
. .
Using means for chemical reduction [2013‑01]
H05K 2203/1163
. .
Chemical reaction, e.g. heating solder by exothermic reaction (oxidising metal H05K 2203/0315) [2013‑01]
H05K 2203/1168
. .
Graft-polymerization [2013‑01]
H05K 2203/1173
. .
Differences in wettability, e.g. hydrophilic or hydrophobic areas [2013‑01]
H05K 2203/1178
. .
Means for venting or for letting gases escape [2013‑01]
H05K 2203/1184
. .
Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching [2013‑01]
H05K 2203/1189
. .
Pressing leads, bumps or a die through an insulating layer [2013‑01]
H05K 2203/1194
. .
Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging [2013‑01]
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H05K 2203/12
.
Using specific substances [2013‑01]
H05K 2203/121
. .
Metallo-organic compounds [2013‑01]
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H05K 2203/122
. .
Organic non-polymeric compounds, e.g. oil, wax, thiol (using solvent H05K 2203/0783) [2013‑01]
H05K 2203/124
. . .
Heterocyclic organic compounds, e.g. azole, furan [2013‑01]
H05K 2203/125
. .
Inorganic compounds, e.g. silver salt [2013‑01]
H05K 2203/127
. .
Lubricants, e.g. during drilling of holes [2013‑01]
H05K 2203/128
. .
Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder (spraying droplets of molten metal H05K 2203/1344) [2013‑01]
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H05K 2203/13
.
Moulding and encapsulation; Deposition techniques; Protective layers [2013‑01]
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H05K 2203/1305
. .
Moulding and encapsulation [2013‑01]
H05K 2203/1311
. . .
Foil encapsulation, e.g. of mounted components [2013‑01]
H05K 2203/1316
. . .
Moulded encapsulation of mounted components [2013‑01]
H05K 2203/1322
. . .
Encapsulation comprising more than one layer [2013‑01]
H05K 2203/1327
. . .
Moulding over PCB locally or completely (applying non-metallic protective coatings for encapsulating mounted components H05K 3/284) [2013‑01]
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H05K 2203/1333
. .
Deposition techniques, e.g. coating [2013‑01]
H05K 2203/1338
. . .
Chemical vapour deposition [2013‑01]
H05K 2203/1344
. . .
Spraying small metal particles or droplets of molten metal [2013‑01]
H05K 2203/135
. . .
Electrophoretic deposition of insulating material [2013‑01]
H05K 2203/1355
. . .
Powder coating of insulating material [2013‑01]
H05K 2203/1361
. . .
Coating by immersion in coating bath (applying molten solder H05K 3/3468) [2013‑01]
H05K 2203/1366
. . .
Spraying coating (apparatus for coating printed circuit boards using liquid non-metallic coating compositions H05K 3/0091) [2013‑01]
H05K 2203/1372
. . .
Coating by using a liquid wave (solder dip coating H05K 2203/04) [2013‑01]
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H05K 2203/1377
. .
Protective layers [2013‑01]
H05K 2203/1383
. . .
Temporary protective insulating layer [2013‑01]
H05K 2203/1388
. . .
Temporary protective conductive layer [2013‑01]
H05K 2203/1394
. . .
Covering open PTHs, e.g. by dry film resist or by metal disc [2013‑01]
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H05K 2203/14
.
Related to the order of processing steps [2013‑01]
H05K 2203/1407
. .
Applying catalyst before applying plating resist [2013‑01]
H05K 2203/1415
. .
Applying catalyst after applying plating resist [2013‑01]
H05K 2203/1423
. .
Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit [2013‑01]
H05K 2203/143
. .
Treating holes before another process, e.g. coating holes before coating the substrate [2013‑01]
H05K 2203/1438
. .
Treating holes after another process, e.g. coating holes after coating the substrate (metal used as mask for etching vias H05K 2203/0554) [2013‑01]
H05K 2203/1446
. .
Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering [2013‑01]
H05K 2203/1453
. .
Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors [2013‑01]
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H05K 2203/1461
. .
Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors [2013‑01]
H05K 2203/1469
. . .
Circuit made after mounting or encapsulation of the components [2013‑01]
H05K 2203/1476
. .
Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning [2013‑01]
H05K 2203/1484
. .
Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components [2013‑01]
H05K 2203/1492
. .
Periodical treatments, e.g. pulse plating of through-holes [2013‑01]
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H05K 2203/15
.
Position of the PCB during processing [2013‑01]
H05K 2203/1509
. .
Horizontally held PCB [2013‑01]
H05K 2203/1518
. .
Vertically held PCB [2013‑01]
H05K 2203/1527
. .
Obliquely held PCB [2013‑01]
H05K 2203/1536
. .
Temporarily stacked PCBs [2013‑01]
H05K 2203/1545
. .
Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path [2013‑01]
H05K 2203/1554
. .
Rotating or turning the PCB in a continuous manner [2013‑01]
H05K 2203/1563
. .
Reversing the PCB [2013‑01]
H05K 2203/1572
. .
Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides [2013‑01]
H05K 2203/1581
. .
Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside [2013‑01]
H05K 2203/159
. .
Using gravitational force; Processing against the gravity direction; Using centrifugal force [2013‑01]
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H05K 2203/16
.
Inspection; Monitoring; Aligning [2013‑01]
H05K 2203/161
. .
Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection [2013‑01]
H05K 2203/162
. .
Testing a finished product, e.g. heat cycle testing of solder joints (patterns for electrical inspection or testing H05K 1/0268) [2013‑01]
H05K 2203/163
. .
Monitoring a manufacturing process [2013‑01]
H05K 2203/165
. .
Stabilizing, e.g. temperature stabilization [2013‑01]
H05K 2203/166
. .
Alignment or registration; Control of registration [2013‑01]
H05K 2203/167
. .
Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment [2013‑01]
H05K 2203/168
. .
Wrong mounting prevention [2013‑01]
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H05K 2203/17
.
Post-manufacturing processes [2013‑01]
H05K 2203/171
. .
Tuning, e.g. by trimming of printed components or high frequency circuits [2013‑01]
H05K 2203/173
. .
Adding connections between adjacent pads or conductors, e.g. for modifying or repairing (programmable, customizable or modifiable circuits H05K 1/0286) [2013‑01]
H05K 2203/175
. .
Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections [2013‑01]
H05K 2203/176
. .
Removing, replacing or disconnecting component; Easily removable component (thermal arrangements, e.g. to prevent overheating H05K 1/0201) [2013‑01]
H05K 2203/178
. .
Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials [2013‑01]
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H05K 2203/30
.
Details of processes not otherwise provided for in H05K 2203/01 - H05K 2203/17 [2013‑01]
H05K 2203/302
. .
Bending a rigid substrate; Breaking rigid substrates by bending (rigid circuit boards or rigid supports locally made bendable H05K 1/0278) [2013‑01]
H05K 2203/304
. .
Protecting a component during manufacturing [2013‑01]
H05K 2203/306
. .
Lifting the component during or after mounting; Increasing the gap between component and PCB [2013‑01]
H05K 2203/308
. .
Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs [2013‑01]
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Guidance heading:
Dummy groups for the purpose of scheme testing, logistics of documents or the like [2013‑01]
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H05K 999/00
dummy group [2013‑01]
WARNING

  • This group and its subgroups are not> real classification places. They are used only for the purpose of scheme testing, logistics of documents or the like.
H05K 999/99
.
dummy group [2013‑01]
This page is owned by Office of Patent Classification.
Last Modified: 10/10/2013