Electroforming.

Electroplating, baths therefor.

Electroplating characterized by the process; pretreatment or after-treatment of workpieces.

Electroplating characterized by the article coated.

Electrolytic coating other than with metals.

Electrolytic coating by surface reaction, reforming conversion layers.

Electrophoretic coating.

Electrolytic or electrophoretic production of coating containing embedded materials, e.g. particles, whiskers, wires.

Constructional parts, or assemblies thereof, of cells for electrolytic coating.

Electrolytic coating plants.

Processes and equipment for servicing or operating cells for electrolytic coating

References H05K 3/18, C23F 13/00, and C30B are non-limiting in the subclass C25D. CPC will be updated once this inconsistency in IPC is resolved.

The subject of claims are completely classified, in the light of the description, using as many entries of the scheme as possible. The various features constituting in combination the subject matter of a claim, i.e. the invention, are given their respective information symbols. An invention information symbol is allocated to the main features of the claim and additional information symbols to the secondary features.

The claim relates to a fountain plater comprising a shielding device. The subject matter is classified in C25D 17/001 (invention) and C25D 17/008 (invention as well, because the shielding device is most probably the core of the invention).

The claim relates to an electroplating apparatus comprising an ion-exchange membrane and an inert anode. The subject matter is classified in C25D 17/005 (invention) and C25D 17/10 (additional if any well-known inert anode can be used, invention if the examples actually focus on one particular material for the inert anode).

Electroforming processes, i.e. processes involving the reproduction or formation of objects by electrodeposition or electrophoresis in which, typically, the deposit does not permanently remain with the base upon which deposition is made.

Apparatuses and devices especially designed for electroforming.

Electrolytic baths especially formulated for electroforming.

Electroformed products

The criterion "the deposit does not permanently remain with the base upon which deposition is made" does not need to be fulfilled when the base, after deposition of the material, becomes actually irrelevant for the function of the electroformed object.

Examples:

The step of removing the template may also intervene only at a later stage, not explicitly described in the document. For example, a process of manufacturing a peelable thin foil composite comprising a carrier layer, a release layer and a foil layer "electroplated" on the release layer, provides actually an electroformed foil, since the carrier layer will eventually be removed, e.g. after lamination of the foil composite on an insulating circuit board material.

In certain cases, the base may even remain and constitute the final object together with the electroformed part, but wherein it is still more appropriate to speak of electroforming than of electroplating in the sense of C25D 5/00, see the definition of C25D 1/003.

In case of doubt, the document is classified in both C25D 1/00 subgroups and C25D 5/00 subgroups and/or C25D 7/00 subgroups. For example, the process of manufacturing a peelable thin foil composite mentioned above is appropriately classified in both C25D 1/04 and C25D 7/0614.

Baths especially formulated for electroforming are classified in C25D 1/00 in combination with the relevant subgroups C25D 3/02 - C25D 3/665.

When a document is directed to an apparatus or a device for electroforming, the latter is classified in C25D 1/00 (as a hint to specific apparatus features), in combination with the subgroups C25D 1/003 - C25D 1/22.

Electroforming processes for building high-aspect-ratio structures extending from the surface of the base, wherein it would be inappropriate to describe the product obtained as a coated product in the sense of C25D 7/00 and wherein the 3-D structure and the base will typically form the final product, e.g. a metal spring electroformed on a base by successive masking and deposition steps. However, the high-aspect-ratio structures may finally be removed from the base as well.

Electroforming of nanostrutures, e.g. electroforming of nanowire arrays using AAO templates.

Nanotubes, nanorings and hollow bodies of nanometric scale are classified in C25D 1/006 in combination with C25D 1/02.

Nanowires, nanostrips and nanofoils are classified in C25D 1/006 in combination with C25D 1/04.

Perforated objects, e.g. nozzle plates and foraminous objects, e.g. metal foams.

Moulds, masks and masterforms used for electroforming are classified in C25D 1/00.

Electrophoretic forming processes, i.e. processes involving the reproduction or formation of objects by electrophoretic deposition in which, typically, the deposit does not permanently remain with the base upon which deposition is made.

Apparatus for performing an electrophoretic forming process.

Products obtained by such processes.

Baths for electroforming by electrophoresis.

Baths for electroplating, e.g. solutions, melts.

Solid electrolytes used for electroplating are classified in C25D 3/00.

Baths especially formulated for electroforming are classified in C25D 1/00 in combination with the relevant subgroups C25D 3/02 - C25D 3/665.

Subject matter relating to both electroplating baths (C25D 3/00) and electroplating processes (C25D 5/00) is classified in both subgroups.

Electrolytic solutions for electroplating, aqueous as well as nonaqueous.

Subject matter relating to both electroplating baths and electroplating processes is classified in both groups.

Copper electroplating baths containing cyanide ions, e.g. baths containing Cu+ ions as copper source.

Electrolytic baths for plating alloys.

Electrolytic baths for plating tin alloys, including tin-phosphorous (Sn-P) alloys.

Electrolytic baths based on melts, fused baths or ionic liquids.

Electrolytic baths based on ionic liquids or deep eutectic solvents, which are liquid at a temperature typically, lower than 100°C, in particular Room Temperature Ionic Liquids (RTILs).

Electroplating processes, i.e. processes of electrolytic coating the substrate with a firmly adhering metallic layer, including the preparation of the workpieces for subsequent electroplating.

Processes comprising the agitation of the electrolytic bath using a gas are classified in C25D 5/003 in combination with C25D 21/10.

Processes of electroplating with moving electrodes, e.g. moving counter-electrodes.

The conveyance of substrates during continuous electroplating processes are classified in C25D 7/06 and/or C25D 17/06.

Processes of electroplating with a moving, e.g. rotating, substrate is classified in C25D 21/10.

As far as electroplating is concerned, C25D 5/08 and C25D 21/10 are similar in scope but:

Electrolyte flow directing devices modifying the hydrodynamics of the plating cell are classified in C25D 5/08 in combination with C25D 17/008.

Electroplating on non-metallic surfaces, e.g. graphite, ceramics, etc.

For example:

Aspects relating to electroplating on plastics or polymers (e.g. filled, catalysed, etc.) are classified in C25D 5/56.

Electroplating of plastics and polymers, for example:

Processes of electroplating to form a specific electroplated article. However, certain aspects are directly classified in the relevant subgroups C25D 7/003 - C25D 7/126.

Electroplated jewels, clockworks, coins.

Electroplated wires, strips or foils, apparatuses and processes for electroplating wires, strips or foils.

Apparatus for electroplating metallic strips or foils are classified in C25D 7/06 subgroups only when relevant subgroups, e.g. radial cells, are available. If no relevant subgroups are available, then apparatus for electroplating metallic strips or foils are classified in C25D 7/06 or C25D 7/06 and C25D 17/00 subgroups

The group C25D 7/06 is preferably not used. All the aspects are directly classified in the relevant subgroups C25D 7/0607 - C25D 7/0692.

Apparatuses for electroplating wires are classified in C25D 7/0607 in combination with any relevant subgroups under C25D 17/00 and C25D 21/00.

Processes for electroplating wires are classified in C25D 7/0607 in combination with any relevant subgroups under C25D 5/00 and C25D 21/00.

In case of ambiguity regarding the characteristics "elongated" and "flexible" of a flat article, the latter is classified in both C25D 7/00 (or lower) and C25D 7/0614 and the corresponding apparatus/process is classified in both C25D 7/0614 (or lower) and C25D 17/00 (or lower).

In any case, the occurrence of one of the terms "sheet", "strip" or "foil" should normally result in the classification of the document in C25D 7/0614 (or lower).

Rods, beams, flat works, boards (e.g. rigid PCBs) are classified in C25D 7/00.

Apparatuses for electroplating elongate flexible strip-shaped articles are classified in the relevant subgroups C25D 7/0614 - C25D 7/0692.

The following subgroups under C25D 17/00 are used for classifying apparatuses for electroplating strip-shaped articles in combination with the subgroups C25D 7/0614 - C25D 7/0692.

Apparatuses for electroplating rods, beams, flat works, boards (e.g. rigid PCBs) are classified in C25D 17/00.

C25D 17/004: sealing devices, C25D 17/005: contacting devices, but C25D 7/0657 takes precedence for conducting rolls, C25D 17/007: current conducting devices (i.e. thief electrodes, etc.), C25D 17/008: current insulating devices (i.e. shielding devices, virtual anodes, etc.), C25D 17/02 and C25D 17/04: tanks and external supporting frames or structures, C25D 17/10 and C25D 17/12: electrodes, but C25D 7/0642 takes precedence for anodes.

The following subgroup under C25D 17/00 is not used for classifying apparatuses for electroplating strip-shaped articles: C25D 17/002: since C25D 7/065 takes precedence.

The subgroups under C25D 21/00 are used for classification in combination with the subgroups C25D 7/0614 - C25D 7/0692.

Processes for electroplating elongate flexible strip-shaped articles are classified in the relevant subgroups C25D 7/0614 - C25D 7/0692 in combination with any relevant subgroups under C25D 5/00 and C25D 21/00.

The following subgroups under C25D 5/00 are not used for classifying processes for electroplating strip-shaped articles: C25D 5/02, since C25D 7/0671 takes precedence,

C25D 5/022, since C25D 7/0678 takes precedence.

with the additional restrictions that a foil is very thin (e.g. thickness < 0.20 mm) and a strip of a limited width (e.g. < 600 mm).

Electroplated antifriction means as balls or rollers, designed to receive a rotating shaft, or to be used in connection with a pivoted, sliding, or rotary element.

Details of processes of electroplating semiconductor substrates or devices, such as silicon wafers.

Processes of electroplating semiconductor substrates or devices first coated with a seed layer prior to electroplating are classified in C25D 7/123.

Details of processes of electroplating semiconductor substrates or devices, such as silicon wafers, including a seed layer or a conductive layer deposited prior to electroplating.

Details of processes of electroplating peculiar to the manufacture of solar cells, including a seed layer or a conductive layer deposited prior to electroplating.

Processes of electrolytic coating with other materials than metals.

Apparatuses specially adapted for electrolytic coating other than with metals.

Articles electrolytically coated other than with metals.

When a document is directed to an apparatus or a device for electrolytic coating other than with metals, the latter is classified in C25D 9/00 (as a "tag" referring to apparatus features), in combination with any of the subgroups C25D 9/02 - C25D 9/12, if relevant for the process/product, and any of the subgroups C25D 17/001 - C25D 17/28, if relevant for the apparatus. C25D 21/00 and the subgroups thereof are also available for further classification of apparatus and/or process aspects.

Processes of electrolytic coating with organic materials, e.g. by electrografting.

Articles obtained by such processes.

Compositions for electrophoretic coating of polymers are classified in C09D 5/44.

Compositions for electrophoretic coating of polymers, comprising polymerization in situ, i.e. electropolymerization are classified in C09D 5/4476.

Since the processes involving the electrolysis of water and the protonation/deprotonation of organic compounds at the electrodes are covered by the groups under C25D 13/00 and C09D 5/44, the number of processes to be classified in C25D 9/02 is inherently limited. See the glossary of terms under C25D 13/00.

Electrophoretic coating with low molecular weight organic compounds is classified in C25D 13/04.

Electrolytic coating with inorganic materials, upon partial reduction/oxidation of the source of material to a lower/higher valence state to be deposited or upon variation of the conditions, e.g. variation of the pH further to the electrolysis of water at the working electrode, thereby inducing precipitation of the material.

C25D 9/04 relates to the electrolytic coating by deposition, not by surface reaction.

If the material of the surface of the substrate explicitly participates to the formation of the coating by surface reaction, and is eventually present in the coating formed, such a conversion process is classified under C25D 11/00, not under C25D 9/00.

In case of doubt concerning a possible surface reaction, the process is classified in C25D 9/04 (or any of the relevant subgroups) in combination with C25D 11/00 (or any of the relevant subgroups).

Electrolytic coating with inorganic materials by anodic processes, e.g. an anodic coating process comprising the formation of a film comprising nickel in an average valence state between +2 and +4 from a solution containing NiSO4.

Anodisation is classified in C25D 11/02.

Chromatizing, anodic chromating or anodic chromate treatment, when it results in the presence of the metal of the substrate in the coating is classified in C25D 11/36.

Electrolytic coating with inorganic materials by cathodic processes, e.g. a process comprising the electro-reduction of SiCl4 to silicon on a copper substrate.

Electrolytic coating by surface reaction with formation of conversion layers, which often serve as passivation layers. However, certain processes are directly classified in the relevant subgroups C25D 11/02-C25D 11/38, e.g. anodisation of refractory metals are classified in C25D 11/26.

Apparatus specially adapted for electrolytic conversion coating.

When a document is directed to an apparatus specially adapted for electrolytic coating by surface reaction, the latter is classified in C25D 11/005 in combination with any of the subgroups C25D 11/02 - C25D 11/38, if relevant for the process/product, and in combination with any of the subgroups C25D 17/001 - C25D 17/28, if relevant for the apparatus. C25D 21/00 and subgroups are also available for further classification of apparatus and/or process aspects.

Pretreatment of the substrate surface, e.g. by desmutting.

After-treatment of electrolytic coated surface, e.g. physical or mechanical after-treatments.

Electrolytic conversion processes comprising the formation of an adherent phosphate coating on a metal substrate by immersion thereof in a suitable aqueous phosphate solution and precipitation of insoluble metal phosphate compounds upon variation of the pH in the vicinity of the substrate, wherein part of the metal substrate reacts with the solution to form the coating. A metal source other than the substrate may be added to the solution (e.g. precipitation of zinc phosphate on steel substrate), thereby limiting the actual contribution of the metal of the substrate to the formation of the coating.

Articles obtained by such processes.

The classification in C25D 11/36 implies a surface reaction, typically the acidic/anodic dissolution of the metal surface to form a metal phosphate coating, i.e. a conversion coating.

If the metal of the substrate does explicitly not contribute to the formation of the coating, and no material of the surface is eventually present in the coating formed, such a "pure" precipitation process is classified in any of the subgroups C25D 9/04 - C25D 9/12, not in C25D 11/36.

In case of doubt as to the contribution of the metal of the surface to the formation of the coating, the process is classified in C25D 11/36 in combination with anyone of the subgroups C25D 9/04 - C25D 9/12.

Processes of coating by electrochemical reaction of hexavalent chromium with a metal surface in the presence of other components, or "activators," in an acid solution. The hexavalent chromium is partially reduced to trivalent chromium during the reaction, with a concurrent rise in pH, forming a complex mixture consisting largely of hydrated basic chromium chromate and hydrous oxides of both chromium and the basis metal. The typical substrate metals to which a chromate conversion coating is applicable are Al, Cd, Cu, Mg, Ag and Zn. Processes are known for Sn as well.

Processes of anodic chromating wherein the coating formed is a mixture of a chromate and an oxide of the coated metal.

Articles obtained by such processes.

The classification in C25D 11/38 implies a surface reaction.

If the metal of the substrate does explicitly not contribute to the formation of the coating, and no material of the surface is eventually present in the coating formed, such a "pure" precipitation process is classified in any of the subgroups C25D 9/04 - C25D 9/12, not in C25D 11/38.

In case of doubt as to the contribution of the metal of the surface to the formation of the coating, the process is classified in C25D 11/38 in combination with anyone of the subgroups C25D 9/04 - C25D 9/12.

Cathodic chromating, i.e. cathodic chromate treatment, of steel substrates is classified in C25D 9/10.

Processes wherein charged particles or molecules suspended or dissolved in a liquid medium, possibly forming a colloid, migrate under the influence of an electric field and are deposited onto an electrode by coagulation.

Looping references between C09D 5/44 and C25D 13/00 have been identified. Until this inconsistency is resolved, the current classification practice in CPC is as follows:

Coatings compositions comprising polymers or additives for electrophoratic processes are classified in C09D 5/44 and subsubgroups.

Electrophoretic coating characterised by the process comprising inorganic material or organic material not being polymers or non polymerisable compounds are classified in C25D 13/00 and subgroups.

The electrophoretic deposition of low molecular weight organic compounds, i.e. non polymeric and non polymerizable compounds.

Compositions for electrophoretic coating of polymers are classified in C09D 5/44 and subgroups.

Since the bath compositions for the electrophoretic deposition of polymers are already classified under C09D 5/44, the classification in C25D 13/04 is restricted to low molecular weight organic compounds.

Electrografting is classified in C25D 9/02.

Articles coated by electrophoretic deposition.

Electrophoretic processes using a modulated, pulsed or reversing current, including dielelectrophoretic processes.

C25D 13/18 is also used to classify dielectrophoretic deposition processes although the latter are not electrophoretic processes.

Equipment and processes for servicing and operating; covering aspects such as heating, cooling, filtering, agitating and process control.

Apparatus specially adapted for the electrophoretic coating process.

Multistep processes.

Details of processes of electrophoretic coating with polymers not classified elsewhere.

The coated products obtained by such processes.

Processes involving the formation of a matrix containing supplemental embedded substances (see the definition of C25D 15/00) wherein said supplemental substances are not only passively entrapped in the matrix but are actively involved in an electrophoretic or electrolytic deposition process, e.g. processes wherein the formation of the matrix by electroplating and the migration of the supplemental substances to the cathode by electrophoresis take place concomitantly.

The coated articles obtained by such processes.

Constructional parts, or assemblies thereof, of cells for electrolytic coating.

Electrolytic coating plants.

Electrolytic coating plants are classified in C25D 17/00.

See the special rules of classification within C25D 7/0607, C25D 7/0614 and C25D 11/005.

Apparatus specially adapted for electrolytically coating wafers, such as fountain platers, plating jigs for wafers, etc.

Means such as membranes or diaphrams for dividing the plating cell into a plurality of regions having different bath compositions, e.g. anolyte chamber and catholyte chamber.

Current shielding devices are classified in C25D 17/008.

Electroplating of strips or foils in cells comprising a diaphragm are classified in C25D 7/065.

Means for electrically contacting the substrate, e.g. electrodes, pins, brushes, etc., e.g. ensuring a uniform current supply to the substrate.

Electroplating of strips or foils in cells comprising conducting rolls are classified in C25D 7/0657.

Means made of a conductive material in contact with the plating bath, showing an electric potential, thereby modifying the electric field and the current density field in the plating bath.

Those means are often electrically connected to a power supply, as in the case of thief electrodes, auxiliary electrodes, etc., but not necessarily, as in the case of bipolar electrodes.

The current directing device conducts current density lines, contrary to the current shielding device in the sense of C25D 17/008, which acts as an obstacle.

Current contacting devices are classified in C25D 17/005.

Current shielding devices are classified in C25D 17/008.

Shielding means, not connected to an electric circuit, for modifying the current density field in the electroplating cell and the current density distribution over the substrate surface, e.g. "diaphragms", "screens", "shields", virtual anodes, for example, to avoid edge effects, etc.

Insulating spacers for avoiding short-circuits and arcing between the substrate and the counter-electrode.

The current shielding device influences the current density field in the plating bath by constituting an obstacle to the current lines in a first region, which normally implies concentrating the current lines in a second region.

The current shielding device is not necessarily made of a dielectric material, but should it be made of a conductive material, it should not act as a current conducting device in the sense of C25D 17/007.

An electrolyte flow directing device (e.g. baffle, damping device, hydrodynamic diffuser, etc.) placed between anode and cathode and aiming at modifying the hydrodynamics of the cell, will normally influence the electric current density distribution as well as the hydrodynamics and is as such also considered as a current insulating device.

Cell separation using membranes or diaphragms is classified in C25D 17/002.

Current directing devices are classified in C25D 17/007.

Electroplating of selected surface areas using masking means is classified in C25D 5/022.

Electrolyte flow directing devices are classified in C25D 17/008 in combination with C25D 5/08 (moving electrolyte).

Tanks characterized by their construction material, their shape or by integrated equipment, e.g. sealing devices, windows, integrated cooling or heating devices, etc.

Racks, for supporting, not suspending.

Counter-electrodes, auxiliary electrodes, thief electrodes, including aspects relating to their composition.

Certain working electrodes, such as rotating electrodes used in laboratories, while not being counter-electrodes, can be nevertheless classified in C25D 17/10.

Anodes of cells for electroplating strips or foils are classified in C25D 7/0657.

Electrodes serving for electrically contacting the substrate are classified in C25D 17/005.

The biased substrate to be electrolytically coated is classified in C25D 7/00.

Processes and apparatus for electrolytic production or recovery of metals and alloys from solutions or melts are classified in C25C

Processes and apparatuses for electrochemical removal of materials from object, e.g. etching, polishing, brightening are classified in C25F.

Processes and equipment for the removal of gases or vapours emanating from the electrolytic coating bath, e.g. using a suction hood.

Processes and equipment for filtering particles, not ions.

Processes and equipment for moving vigorously the aqueous solution for electrolytic coating or for displacing the supports of the article to be treated.

Processes and equipment (architectures, mechanisms and algorithms) for maintaining the output of the electrolytic coating process within a desired range, using open-loop or feedback control. Control and regulation implies that an action is taken during the electrolytic coating process, which results in the modification of a process variable.

Processes and equipment (architectures, mechanisms and algorithms) for maintaining the composition of the electrolyte within a desired range during the electrolytic coating process.

Processes and equipment for replenishing and/or purifying spent solutions.

The regeneration can be carried out continuously (using e.g. circulation loops) or in the batch mode.

Regenerations of process solutions by ion exchange, filtering ions, not particles