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CPC
COOPERATIVE PATENT CLASSIFICATION
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H01C
RESISTORS
NOTE
-
In this subclass, the term "adjustable" means mechanically adjustable.

Variable resistors, the value of which is changed non-mechanically, e.g. by voltage or temperature, are classified in group H01C 7/00.

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H01C 1/00
Details
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H01C 1/01
.
Mounting; Supporting
H01C 1/012
. .
the base extending along and imparting rigidity or reinforcement to the resistive element (H01C 1/016 takes precedence; the resistive element being formed in two or more coils or loops as a spiral, helical or toroidal winding H01C 3/18, H01C 3/20; the resistive element being formed as one or more layers or coatings on a base H01C 7/00)
H01C 1/014
. .
the resistor being suspended between and being supported by two supporting sections (H01C 1/016 takes precedence)
H01C 1/016
. .
with compensation for resistor expansion or contraction
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H01C 1/02
.
Housing; Enclosing; Embedding; Filling the housing or enclosure
H01C 1/022
. .
the housing or enclosure being openable or separable from the resistive element
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H01C 1/024
. .
the housing or enclosure being hermetically sealed (H01C 1/028, H01C 1/032, H01C 1/034 take precedence)
H01C 1/026
. . .
with gaseous or vacuum spacing between the resistive element and the housing or casing
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H01C 1/028
. .
the resistive element being embedded in insulation with outer enclosing sheath
H01C 1/03
. . .
with powdered insulation
H01C 1/032
. .
plural layers surrounding the resistive element (H01C 1/028 takes precedence)
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H01C 1/034
. .
the housing or enclosure being formed as coating or mold without outer sheath (H01C 1/032 takes precedence)
H01C 1/036
. . .
on wound resistive element
H01C 1/04
.
Arrangements of distinguishing marks, e.g. colour coding
H01C 1/06
.
Electrostatic or electromagnetic shielding arrangements
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H01C 1/08
.
Cooling, heating or ventilating arrangements
H01C 1/082
. .
using forced fluid flow
H01C 1/084
. .
using self-cooling, e.g. fins, heat sinks
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H01C 1/12
.
Arrangements of current collectors
H01C 1/125
. .
of fluid contacts
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H01C 1/14
.
Terminals or tapping points
{
or electrodes
}
 specially adapted for resistors (in general H01R); Arrangements of terminals or tapping points
{
or electrodes
}
 on resistors
H01C 1/1406
. .
{
Terminals or electrodes formed on resistive elements having positive temperature coefficient
}
H01C 1/1413
. .
{
Terminals or electrodes formed on resistive elements having negative temperature coefficient
}
H01C 1/142
. .
the terminals or tapping points being coated on the resistive element
H01C 1/144
. .
the terminals or tapping points being welded or soldered
H01C 1/146
. .
the resistive element surrounding the terminal
H01C 1/148
. .
the terminals embracing or surrounding the resistive element (H01C 1/142 takes precedence)
H01C 1/16
.
Resistor networks not otherwise provided for
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H01C 3/00
Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
H01C 3/005
.
{
Metallic glasses therefor
}
H01C 3/02
.
arranged or constructed for reducing self-induction, capacitance or variation with frequency
H01C 3/04
.
Iron-filament ballast resistors; Other resistors having variable temperature coefficient
H01C 3/06
.
Flexible or folding resistors, whereby such a resistor can be looped or collapsed upon itself
H01C 3/08
.
Dimension or characteristic of resistive element changing gradually or in discrete steps from one terminal to another
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H01C 3/10
.
the resistive element having zig-zag or sinusoidal configuration
H01C 3/12
. .
Lying in one plane
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H01C 3/14
.
the resistive element being formed in two or more coils or loops continuously wound as a spiral, helical or toroidal winding (H01C 3/02 to H01C 3/12 take precedence)
H01C 3/16
. .
including two or more distinct wound elements or two or more winding patterns
H01C 3/18
. .
wound on a flat or ribbon base (H01C 3/16 takes precedence)
H01C 3/20
. .
wound on cylindrical or prismatic base (H01C 3/16 takes precedence)
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H01C 7/00
Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material (consisting of loose powdered or granular material H01C 8/00;
{
measuring deformation in a solid state using the change in resistance formed by printed-circuit technique G01B 7/20; insulating materials H01B 3/00; passive thin-film or thick-film semiconductor or solid state devices H01L 27/00; resistors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor H01L 28/20
}
; resistors with a potential-jump barrier or surface barrier, e.g. field effect resistors H01L 29/00; semiconductor devices sensitive to electro-magnetic or corpuscular radiation, e.g. photoresistors, H01L 31/00; devices using superconductivity H01L 39/00; devices using galvanomagnetic or similar magnetic effects, e.g. magnetic-field-controlled resistors, H01L 43/00; solid state devices for rectifying, amplifying, oscillating or switching without a potential-jump barrier or surface barrier H01L 45/00; bulk negative resistance effect devices H01L 47/00;
{
ohmic resistance heating H05B 3/00; printed circuits H05K
}
) [m1112]
H01C 7/001
.
{
Mass resistors
}
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H01C 7/003
.
{
Thick film resistors
}
H01C 7/005
. .
{
Polymer thick films
}
H01C 7/006
.
{
Thin film resistors
}
H01C 7/008
.
{
Thermistors (H01C 7/02 to H01C 7/06 take precedence)
}
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H01C 7/02
.
having positive temperature coefficient
{
(ceramics C04B)
}
H01C 7/021
. .
{
formed as one or more layers or coatings
}
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H01C 7/022
. .
{
mainly consisting of non-metallic substances (H01C 7/021 takes precedence)
}
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H01C 7/023
. . .
{
containing oxides or oxidic compounds, e.g. ferrites
}
H01C 7/025
. . . .
{
Perowskites, e.g. titanates
}
H01C 7/026
. . . .
{
Vanadium oxides or oxidic compounds, e.g. VOx
}
H01C 7/027
. .
{
consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
}
H01C 7/028
. .
{
consisting of organic substances
}
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H01C 7/04
.
having negative temperature coefficient
{
(thermometers using resistive elements G01K 7/16)
}
H01C 7/041
. .
{
formed as one or more layers or coatings
}
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H01C 7/042
. .
{
mainly consisting of inorganic non-metallic substances (H01C 7/041 takes precedence)
}
NOTE
-
In groups H01C 7/043 to H01C 7/049, in the absence of an indication to the contrary, classification is made in the last appropriate place

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H01C 7/043
. . .
{
Oxides or oxidic compounds
}
H01C 7/044
. . . .
{
Zinc or cadmium oxide
}
H01C 7/045
. . . .
{
Perowskites, e.g. titanates
}
H01C 7/046
. . . .
{
Iron oxides or ferrites
}
H01C 7/047
. . . .
{
Vanadium oxides or oxidic compounds, e.g. VOx
}
H01C 7/048
. . .
{
Carbon or carbides
}
H01C 7/049
. .
{
mainly consisting of organic or organo-metal substances (H01C 7/041 takes precedence)
}
H01C 7/06
.
including means to minimise changes in resistance with changes in temperature
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H01C 7/10
.
voltage responsive, i.e. varistors
H01C 7/1006
. .
{
Thick film varistors
}
H01C 7/1013
. .
{
Thin film varistors
}
H01C 7/102
. .
Varistor boundary, e.g. surface layers (H01C 7/12 takes precedence)
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H01C 7/105
. .
Varistor cores (H01C 7/12 takes precedence)
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H01C 7/108
. . .
Metal oxide
H01C 7/112
. . . .
ZnO type
H01C 7/115
. . . .
Titanium dioxide- or titanate type
H01C 7/118
. . .
Carbide, e.g. SiC type
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H01C 7/12
. .
Overvoltage protection resistors
{
(series resistors structurally associated with spark gaps H01T 1/16)
}
H01C 7/123
. . .
{
Arrangements for improving potential distribution
}
H01C 7/126
. . .
{
Means for protecting against excessive pressure or for disconnecting in case of failure
}
H01C 7/13
.
current responsive
NOTE
-
Groups H01C 7/02 to H01C 7/13 take precedence over groups H01C 7/18 to H01C 7/22.

H01C 7/18
.
comprising a plurality of layers stacked between terminals
H01C 7/20
.
the resistive layer or coating being tapered
H01C 7/22
.
Elongated resistive element being bent or curved, e.g. sinusoidal, helical
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H01C 8/00
Non-adjustable resistors consisting of loose powdered or granular conducting, or powdered or granular semi-conducting material
H01C 8/02
.
Coherers or like imperfect resistors for detecting electromagnetic waves
H01C 8/04
.
Overvoltage protection resistors; Arresters
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H01C 10/00
Adjustable resistors
H01C 10/005
.
{
Surface mountable, e.g. chip trimmer potentiometer
}
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H01C 10/02
.
Liquid resistors
H01C 10/025
. .
{
Electrochemical variable resistors (trimming resistors by electrolytic treatment H01C 17/2412, H01C 17/262)
}
H01C 10/04
.
with specified mathematical relationship between movement of resistor actuating means and value of resistance, other than direct proportional relationship
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H01C 10/06
.
adjustable by short-circuiting different amounts of the resistive element
H01C 10/08
. .
with intervening conducting structure between the resistive element and the short-circuiting means, e.g. taps
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H01C 10/10
.
adjustable by mechanical pressure of force
H01C 10/103
. .
{
by using means responding to magnetic or electric fields, e.g. by addition of magnetisable or piezoelectric particles to the resistive material, or by an electromagnetic actuator
}
H01C 10/106
. .
{
on resistive material dispersed in an elastic material (H01C 10/103 and H01C 10/12 take precedence; for electric switches H01H1/02B)
}
H01C 10/12
. .
by changing surface pressure between resistive masses or resistive and conductive masses, e.g. pile type
H01C 10/14
.
adjustable by auxiliary driving means
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H01C 10/16
.
including plural resistive elements
H01C 10/18
. .
including coarse and fine resistive elements
H01C 10/20
. .
Contact structure or movable resistive elements being ganged
H01C 10/22
.
resistive element dimensions changing gradually in one direction, e.g. tapered resistive element (H01C 10/04 takes precedence)
H01C 10/23
.
resistive element dimensions changing in a series of discrete, progressive steps
H01C 10/24
.
the contact moving along turns of a helical resistive element, or vica versa
H01C 10/26
.
resistive element moving (H01C 10/16, H01C 10/24 take precedence)
NOTE
-
Groups H01C 10/02 to H01C 10/26 take precedence over groups H01C 10/28 to H01C 10/50.

H01C 10/28
.
the contact rocking or rolling along resistive element or taps
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H01C 10/30
.
the contact sliding along resistive element
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H01C 10/301
. .
{
consisting of a wire wound resistor
}
H01C 10/303
. . .
{
the resistor being coated, e.g. lubricated, conductive plastic coated, i.e. hybrid potentiometer
}
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H01C 10/305
. .
{
consisting of a thick film
}
H01C 10/306
. . .
{
Polymer thick film, i.e. PTF
}
H01C 10/308
. .
{
consisting of a thin film
}
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H01C 10/32
. .
the contact moving in an arcuate path
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H01C 10/34
. . .
the contact or the associated conducting structure riding on collector formed as a ring or portion thereof
H01C 10/345
. . . .
{
the collector and resistive track being situated in 2 parallel planes
}
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H01C 10/36
. . .
structurally combined with switching arrangements
H01C 10/363
. . . .
{
by axial movement of the spindle, e.g. pull-push switch (H01C 10/366 takes precedence)
}
H01C 10/366
. . . .
{
using an electromagnetic actuator
}
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H01C 10/38
. .
the contact moving along a straight path
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H01C 10/40
. . .
screw operated
H01C 10/42
. . . .
the contact bridging and sliding along resistive element and parallel conducting bar or collector
H01C 10/44
. . .
the contact bridging and sliding along resistive element and parallel conducting bar or collector (H01C 10/42 takes precedence)
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H01C 10/46
.
Arrangements of fixed resistors with intervening connectors, e.g. taps (H01C 10/28, H01C 10/30 take precedence)
H01C 10/48
. .
including contact movable in an arcuate path
H01C 10/50
.
structurally combined with switching arrangements (H01C 10/36 takes precedence)
H01C 11/00
Non-adjustable liquid resistors
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H01C 13/00
Resistors not provided for elsewhere
H01C 13/02
.
Structural combinations of resistors (impedance networks per se H03H)
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H01C 17/00
Apparatus or processes specially adapted for manufacturing resistors (providing fillings for housings or enclosures H01C 1/02; reducing insulation surrounding a resistor to powder H01C 1/03; manufacture of thermally variable resistors H01C 7/02, H01C 7/04)
H01C 17/003
.
{
using lithography, e.g. photolithography (lithographic compositions and processing in general G03F)
}
H01C 17/006
.
{
adapted for manufacturing resistor chips
}
H01C 17/02
.
adapted for manufacturing resistors with envelope or housing
H01C 17/04
.
adapted for winding the resistive element
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H01C 17/06
.
adapted for coating resistive material on a base
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H01C 17/065
. .
by thick film techniques, e.g. serigraphy
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H01C 17/06506
. . .
{
Precursor compositions therefor, e.g. pastes, inks, glass frits
}
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H01C 17/06513
. . . .
{
characterised by the resistive component
}
H01C 17/0652
. . . . .
{
containing carbon or carbides
}
H01C 17/06526
. . . . .
{
composed of metals
}
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H01C 17/06533
. . . . .
{
composed of oxides
}
H01C 17/0654
. . . . . .
{
Oxides of the platinum group
}
H01C 17/06546
. . . . . .
{
Oxides of zinc or cadmium
}
H01C 17/06553
. . . . .
{
composed of a combination of metals and oxides
}
H01C 17/0656
. . . . .
{
composed of silicides (H01C 17/0652 takes precedence)
}
H01C 17/06566
. . . . .
{
composed of borides (H01C 17/0652 takes precedence)
}
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H01C 17/06573
. . . .
{
characterised by the permanent binder
}
H01C 17/0658
. . . . .
{
composed of inorganic material
}
H01C 17/06586
. . . . .
{
composed of organic material
}
H01C 17/06593
. . . .
{
characterised by the temporary binder
}
H01C 17/07
. .
by resistor foil bonding, e.g. cladding
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H01C 17/075
. .
by thin film techniques
{
(H01C 17/20 takes precedence)
}
H01C 17/08
. . .
by vapour deposition
H01C 17/10
. . .
by flame spraying
H01C 17/12
. . .
by sputtering
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H01C 17/14
. . .
by chemical deposition
H01C 17/16
. . . .
using electric current
H01C 17/18
. . . .
without using electric current
H01C 17/20
. .
by pyrolytic processes
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H01C 17/22
.
adapted for trimming
H01C 17/23
. .
by opening or closing resistor geometric tracks of predetermined resistive values,
{
e.g. snapistors
}
H01C 17/232
. .
Adjusting the temperature coefficient; Adjusting value of resistance by adjusting temperature coefficient of resistance
H01C 17/235
. .
Initial adjustment of potentiometer parts for calibration
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H01C 17/24
. .
by removing or adding resistive material (H01C 17/23, H01C 17/232, H01C 17/235 take precedence)
H01C 17/2404
. . .
{
by charged particle impact e.g. by electron or ion beam milling, sputtering, plasma etching
}
H01C 17/2408
. . .
{
by pulsed voltage erosion, e.g. spark erosion
}
H01C 17/2412
. . .
{
by electrolytic treatment e.g. electroplating (for anodic oxydation H01C 17/262)
}
H01C 17/2416
. . .
{
by chemical etching
}
H01C 17/242
. . .
by laser
{
(trimming by laser in general B23K 26/0003)
}
H01C 17/245
. . .
by mechanical means, e.g. sand blasting, cutting, ultrasonic treatment
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H01C 17/26
. .
by converting resistive material
H01C 17/262
. . .
{
by electrolytic treatment, e.g. anodic oxydation
}
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H01C 17/265
. . .
{
by chemical or thermal treatment, e.g. oxydation, reduction, annealing (etching H01C 17/2416)
}
H01C 17/267
. . . .
{
by passage of voltage pulses or electric current
}
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H01C 17/28
.
adapted for applying terminals
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H01C 17/281
. .
{
by thick film techniques
}
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H01C 17/283
. . .
{
Precursor compositions therefor, e.g. pastes, inks, glass frits
}
H01C 17/285
. . . .
{
applied to zinc or cadmium oxide resistors
}
H01C 17/286
. . . .
{
applied to TiO2 or titanate resistors
}
H01C 17/288
. .
{
by thin film techniques
}
H01C 17/30
.
adapted for baking
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Last Modified: 04/16/2013 4:31:16 PM