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PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ( details of instruments or comparable details of other apparatus not otherwise provided for G12B; thin-film or thick-film circuits H01L 27/01 , H01L 27/13 ; non-printed means for electric connections to or between printed circuits, {electric connections or line connectors, apparatus or processes for manufacturing, assembling, maintaining or repairing such connections or connectors} H01R; casings for, or constructional details of, particular types of apparatus, see the relevant subclasses; processes involving only a single technical art, e.g. heating, spraying, for which provision exists elsewhere, see the relevant classes)
Definition statement
This subclass/group covers:

Constructional features of

  • electronic circuit boards such as board design, interconnection models, material
  • casings / cabinets of electronic equipment having cooling and EMI shielding specifications
  • machines for mounting electronic components on circuit boards
  • printed circuits structurally associated with non-printed electric components
  • printed connectors
References relevant to classification in this subclass
This subclass/group does not cover:
Thin-film or thick-film circuits
Informative references
Attention is drawn to the following places, which may be of interest for search:
Details of instruments or comparable details of other apparatus not otherwise provided for
Non-printed means for electric connections to or between printed circuits, electric connections or line connectors, apparatus or processes for manufacturing, assembling, maintaining or repairing such connections or connectors
Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Printed circuits
covers all kinds of mechanical constructions of circuits that consist of an insulating base or support carrying the conductor and are combined structurally with the conductor throughout their length, especially in a two-dimensional plane, the conductors of which are secured to the base in a non-dismountable manner, and also covers the processes or apparatus for manufacturing such constructions, e.g. forming the circuit by mechanical or chemical treatment of a conductive foil, paste, or film on an insulating support.
Printed circuits ( assemblies of a plurality of individual semiconductor or solid state devices H01L 25/00 ; devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits, H01L 27/00)
Definition statement
This subclass/group covers:

Details of printed circuit boards [PCBs], use of materials for PCBs, printed elements for electrical connection to or between printed circuits, printed electric components, structural association of two or more PCBs, structural association of PCBs and non-printed electric components.

H05K 1/00 covers mainly structural aspects (incl. layout) of printed circuits and materials for printed circuits. However certain sub-groups of H05K1 cover also the respective manufacturing aspects (e.g. H05K 1/16, H05K 1/185).

Relationship between large subject matter areas

There is no clear boundary between the field of printed circuit boards and other more specific fields, e.g. inductors (H01F), antennas (H01Q), waveguides (H01P), chip cards (G06K 19/07), thin film and thick film circuits (H01L 27/00), other packaging levels (semiconductor packages H01L 21/48, H01L 23/00, H01L 25/00), connectors (H01R) and various electronic components. The materials and methods (deposition, patterning, connection etc) used for manufacture of printed circuit boards have their general fields.

Documents often contain information relevant to several technical fields and have to be circulated for classification in these fields, in particular to H01L (semiconductors) but also the other parts of H05K, H01R (connectors).

References relevant to classification in this group
This subclass/group does not cover:
Electrostatic discharge protection for electric apparatus in general
Screening against electric or magnetic fields
Assemblies of a plurality of individual semiconductor or solid state devices
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance for semiconductor devices
Informative references
Attention is drawn to the following places, which may be of interest for search:
Coupling light guides with opto-electronic components
Devices consisting of a plurality of solid state components formed in or on a common substrate, e.g. integrated circuits, thin-film or thick-film circuits
Emergency protective circuits
Non-printed means for electric connections to or between printed Circuits
Security details of computer components
Handling / Transporting
Handling flexible substrates
Laminating
Cleaning
Drying
Etching polymeric substrates
Laser ablation
Mechanical drilling
Mechanical milling
Slotting, etc.
Details of machining apparatus
Cutting, Punching
Grinding
Abrasive working
Testing, inspection of material
Treatment apparatus for semiconductor components
Designing of the conductive pattern
Electrical testing
Photolithography masks
Photoresists
Photolithography registration
Other lithography
Electrography
Printing forms, e.g. masks
Printing processes
Printing apparatus
Inkjet printing
Selective transfer processes
Patterning by laser ablation
Casting of metals
Metal powder processing
Metal milling
Erosion by electric discharge
Soldering or welding
Grinding, polishing
Abrasive working
Coating by dipping in molten metal
Coating by spraying with molten metal
Coating by physical vapour deposition or sputtering or ion implantation
Coating by chemical deposition
Coating by electroless plating
Coating by decomposition of compounds
Conversion coating of metals
Coating by powder methods
Other coating methods
Coating metal with enamel (glass)
Corrosion protection of metal
Cleaning or degreasing of metal
Electroplating of metal
Electroforming of metal
Anodizing of metal
Electrophoretic coating of metal
Electrolytic etching of metal
Semiconductor packages
Inorganic semiconductor devices
Polymeric semiconductor devices
Thick film or thin film circuits
Printed capacitors
Printed resistors
Printed inductors
Printed antennas
Chip cards
Disk drive suspensions
Touch screens
Liquid crystal displays
Waveguides
Flat cables
Computers
Backplanes
Memory modules
Power conversion
Lighting devices
Receivers / Transceivers (modules)
Telephones
Electro-optical devices comprising optical waveguides
LCD displays
Plasma displays
Circuits for displays
Optical modules
Modules /PCBs having optical waveguides
Cables
Resistors
Inductors
Capacitors
Switches, fuses
Semiconductor devices
Solar cells, Photovoltaic devices
LEDs
Thermoelectric devices
Piezoelectric devices
Batteries, Cells
Waveguides
Antennas
Connectors
Laser devices
Spark gaps, Overvoltage arresters
Electromechanical transducers
Special rules of classification within this group

In this main group, both "invention information" and "additional information" are classified by the appropriate CPC group symbol.

Indexing Codes are also attributed to provide additional information when no CPC sub-group exists, i.e. to subdivide subject matter belonging to a sub-group.

{Cooling of mounted components (H05K 1/0272 takes precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Adaptations for fluid transport, e.g. channels, holes
{using means for thermal conduction connection in the thickness direction of the substrate (H05K 1/0207 takes precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
{Electrical arrangements not otherwise provided for ( screening H05K 9/00 ; emergency protective circuits H02H) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Screening
Emergency protective circuits
{Reduction of cross-talk, and noise or electromagnetic interference ( grounding H05K 1/0215) }
References relevant to classification in this group
This subclass/group does not cover:
Grounding
{by printed shielding conductors, ground planes or power plane (H05K 1/0236 takes precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Electromagnetic band-gap structures
{Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines ( coaxially shielded vias H05K 1/0222) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Coaxially shielded vias
{Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors ( balanced signal pairs H05K 1/0245) }
References relevant to classification in this group
This subclass/group does not cover:
Balanced signal pairs
{using auxiliary mounted passive components or auxiliary substances ( printed passive components H05K 1/16) }
References relevant to classification in this group
This subclass/group does not cover:
Incorporating printed electric components, e.g. printed resistor, capacitor, inductor
{Electromagnetic band-gap structures ( conductive planes with an opening or a split H05K 1/0225 , H05K 1/0227) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Conductive planes with an opening or a split
{Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K 1/024 and H05K 1/0243 take precedence; for semiconductor devices H01L 23/66) }
References relevant to classification in this group
This subclass/group does not cover:
Dielectric details, e.g. changing the dielectric material around a transmission line
Printed circuits associated with mounted high frequency components
High frequency adaptations of semiconductor or other solid state devices
Impedance arrangements of semiconductor or other solid state devices
Special rules of classification within this group

Indexing Codes are used to additionally specify how impedance is adjusted, e.g. for change in trace width of differential pair H05K 1/0245.

{Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings (H05K 1/0251 takes precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Impedance arrangements related to vias or transitions between vias and transmission lines
Special rules of classification within this group

The lay-out of the power plane is additionally classified with Indexing Codes, e.g. when slotted H05K 1/0236. Except for H05K 1/0224 because that is the default layout in H05K 1/0253.

{High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ( electrostatic discharge protection for electric apparatus in general H05K 9/0067 , H05K 9/0079) ; Arrangements for regulating voltages or for using plural voltages}
References relevant to classification in this group
This subclass/group does not cover:
Devices for protecting against damage from electrostatic discharge
Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
{High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board (H05K 1/0293 takes precedence ) (H05K1/00E6 takes precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Individual printed conductors which are adapted for modification, e.g. fusible or breakable conductors, printed switches
{Optical details, e.g. printed circuits comprising integral optical means (H05K 1/0269 takes precedence; Coupling light guides with opto-electronic components G02B 6/42) }
References relevant to classification in this group
This subclass/group does not cover:
Marks, test patterns, inspection means or identification means for visual or optical inspection
Coupling light guides with opto-electronic components
{Security details, e.g. tampering prevention or detection ( security details of computer components G06F 21/70) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Security details of computer components
{Bendability or stretchability details ( not used, see subgroups; H05K 1/038 , H05K 3/4691 take precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Textiles
Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
Special rules of classification within this group

Group H05K 1/0277 is not used, subject matter is classified in the subgroups thereof.

{Details of three-dimensional rigid printed circuit boards (H05K 1/119 takes precedence; shaping of the substrate H05K 3/0014) }
References relevant to classification in this group
This subclass/group does not cover:
Details of rigid insulating substrates therefor, e.g. three-dimensional details
Shaping of the substrate
{Programmable, customizable or modifiable circuits ( by programmable non-printed jumper connections H05K 3/222) }
References relevant to classification in this group
This subclass/group does not cover:
Completing of printed circuits by adding non-printed jumper connections
{ Conductive pattern lay-out details not covered by sub groups H05K 1/02 to H05K 1/0295 (H05K 1/11 takes precedence; lay-out adapted to mounted component configuration H05K 1/18) }
References relevant to classification in this group
This subclass/group does not cover:
Printed elements for providing electric connections to or between printed circuits
Lay-out adapted to mounted component configuration

Places in relation to which this group is residual:

Details
Use of materials for the substrate { ( substrates for semiconductor chips H01L 23/00) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Substrates for semiconductor chips
Insulated metal substrate {or other insulated electrically conductive substrate ( thermal coupling of mounted components and metal substrate H05K 1/0204 , H05K 1/021) }
Definition statement
This subclass/group covers:

Insulated electrically conductive substrates, e.g. insulated metal substrates

Informative references
Attention is drawn to the following places, which may be of interest for search:
Thermal coupling of mounted components and metal substrate
Structural association of two or more printed circuits ( providing electric connection to or between printed circuits H05K 1/11 , H01R 9/09 , H01R 23/68)
Informative references
Attention is drawn to the following places, which may be of interest for search:
Providing electric connection to or between printed circuits
incorporating printed electric components, e.g. printed resistor, capacitor, inductor { ( thick-film or thin-film circuits H01L 27/01 , H01L 27/13) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Thick-film or thin-film circuits
Printed circuits structurally associated with non-printed electric components ( {H05K 1/0201 , H05K 1/023 , H05K 1/0243 , } H05K 1/16 take precedence )
References relevant to classification in this group
This subclass/group does not cover:
Thermal arrangements, e.g. for cooling, heating or preventing overheating
Reduction of cross-talk, and noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
Printed circuits associated with mounted high frequency components
Incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Apparatus or processes for manufacturing printed circuits ( photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general G03F ; involving the manufacture of semiconductor devices H01L)
Definition statement
This subclass/group covers:

General processing of printed circuit boards (PCBs) including processing of insulating substrates and layers for PCBs and processing of conductive layers for PCBs; forming printed elements for providing electric connection to or between printed circuits; manufacturing multilayer printed circuits; manufacturing metal core printed circuits; secondary treatment of PCBs; assembling PCBs with electric components and/or other PCBs.

H05K 3/00 covers mainly manufacturing (apparatuses and process) of printed circuits. However certain sub-groups of H05K 3/00 cover also the respective structural aspects (e.g. H05K 3/303, H05K 3/306) and materials (e.g. H05K 3/386).

Relationship between large subject matter areas

There is no clear boundary between the field of printed circuit boards and other more specific fields, e.g. inductors (H01F), antennas (H01Q), waveguides (H01P), chip cards (G06K 19/07), thin film and thick film circuits (H01L 27/00), other packaging levels (semiconductor packages H01L 21/48, H01L 23/00, H01L 25/00), connectors (H01R) and various electronic components. The materials and methods (deposition, patterning, connection etc) used for manufacture of printed circuit boards have their general fields.

Documents often contain information relevant to several technical fields and have to be circulated for classification in these fields, in particular to H01L (semiconductors) but also the other parts of H05K, H01R (connectors) etc. (see Annex 2).

References relevant to classification in this group
This subclass/group does not cover:
Apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards
Mounting of components
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Connectors for printed circuits
Electrically-conductive connections between two or more conductive members in direct contact using electrically conductive adhesives, in general
Selection of soldering or welding materials proper, i.e. solder compositions per se
Soldering, e.g. brazing, or unsoldering in general
Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
Informative references
Attention is drawn to the following places, which may be of interest for search:
Apparatus for etching in general
Chemical coating of a substrate by decomposition in general
Coating by vacuum evaporation
Covering materials by cathodic sputtering
Covering metals by metal spraying
Discharge devices for covering materials by cathodic sputtering
Electroless plating in general
Electron-beam or ion-beam tubes for localised treatment
Electroplating in general
Etchants in general
Etching masks applied by electrographic, electrophotographic or magnetographic methods in general
Laminates in general
Local etching in general
Machining by laser in general
Non-mechanical removal of metallic material from surfaces
Photomechanical production of textured or patterned surfaces, materials or originals therefor, apparatus specially adapted therefor, in general
Printing apparatus in general
Printing techniques in general
Screens or stencils, manufacturing thereof in general
Working of metal by electro-erosion per se
Special rules of classification within this group

In this main group, both "invention information" and "additional information" are classified by the appropriate CPC group symbol.

Indexing Codes are also attributed to provide additional information when no CPC sub-group exists, i.e. to subdivide subject matter belonging to a sub-group.

{for aligning or positioning of tools relative to the circuit board (H05K 3/4638 , H05K 3/4679 take precedence; for manufacturing assemblages of components H05K 13/0015) }
References relevant to classification in this group
This subclass/group does not cover:
Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Aligning added circuit layers or via connections relative to previous circuit layers
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
{Working of insulating substrates or insulating layers ( making copper-clad substrates H05K 3/022 ; surface treatment for improvement of adhesion H05K 3/381) }
Definition statement
This subclass/group covers:
  • Shaping of the substrate, e.g. by moulding
  • Etching of the substrate by chemical or physical means
  • Mechanical working of the substrate, e.g. drilling or punching
  • After-treatment, e.g. cleaning or desmearing of holes
Informative references
Attention is drawn to the following places, which may be of interest for search:
Making copper-clad substrates
Surface treatment for improvement of adhesion
{Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K 1/0281 takes precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Reinforcement details
{Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K 1/187 , H05K 3/20 and H05K 3/4682 take precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
Applying conductive material to the insulating support by affixing prefabricated conductor pattern
Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
{ Masks not provided for in groups H05K 3/02 to H05K 3/46 , e.g. for photomechanical production of patterned surfaces }
References relevant to classification in this group
This subclass/group does not cover:
Apparatus or processes for manufacturing printed circuits
{ Apparatus for treatments of printed circuits with liquids not provided for in groups H05K 3/02 to H05K 3/46 ; conveyers and holding means therefor ( apparatus specially adapted for manufacturing assemblages of electric components, e.g. printed circuit boards, H05K 13/00) }
References relevant to classification in this group
This subclass/group does not cover:
Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components

Places in relation to which this group is residual:

Apparatus or processes for manufacturing printed circuits
{Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K 3/0052 takes precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
De-panelling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
the conductive material being removed chemically or electrolytically, e.g. by photo-etch process { ( Non-mechanical removal of metallic material from surfaces C23F; semi-additive methods H05K 3/108) }
References relevant to classification in this group
This subclass/group does not cover:
Semi-additive methods
Informative references
Attention is drawn to the following places, which may be of interest for search:
Non-mechanical removal of metallic material from surfaces
the conductive material being removed by electric discharge, e.g. by spark erosion { working of metal by electro-erosion per se B23H}
Informative references
Attention is drawn to the following places, which may be of interest for search:
Working of metal by electro-erosion per se
{using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns (printing techniques in general B41M, printing apparatus B41F) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Printing techniques in general
Printing apparatus
using spraying techniques to apply the conductive material {including vapour evaporation; ( covering metals by metal spraying C23C 4/00 ; coating by vacuum evaporation C23C 14/00) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Covering metals by metal spraying
Coating by vacuum evaporation
by cathodic sputtering { ( covering materials by cathodic sputtering C23C 14/34 ; discharge devices therefor H01J 37/34) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Covering materials by cathodic sputtering
Discharge devices therefor
using precipitation techniques to apply the conductive material { ( chemical coating of a substrate by decomposition C23C 18/00) }
Definition statement
This subclass/group covers:
  • Electroless plating
  • Electroplating, e.g. electrodeposition
Informative references
Attention is drawn to the following places, which may be of interest for search:
Chemical coating of a substrate by decomposition
by affixing prefabricated conductor pattern { (H05K 1/187 , H05K 3/046 , H05K 3/4658 , H05K 3/4682 takes precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
Selective transfer or selective detachment of a conductive layer
Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
Secondary treatment of printed circuits { (H05K 3/1283 takes precedence; embedding circuits in grooves by pressure H05K 3/107) }
Definition statement
This subclass/group covers:
  • Completing of printed circuits by adding non-printed jumper connections
  • Correcting or repairing of printed circuits
  • Drying of printed circuits
  • Reinforcing the conductive pattern
  • Cleaning or polishing of the conductive pattern
  • Applying non-metallic protective coatings
References relevant to classification in this group
This subclass/group does not cover:
Embedding circuits in grooves by pressure
After-treatment of the printed patterns, e.g. sintering or curing methods
{Correcting or repairing of printed circuits (H05K 1/0292 , H05K 3/222 , H05K 3/288 , H05K 3/4685 take precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Completing of printed circuits by adding non-printed jumper connections
Programmable, customizable or modifiable circuits
Removal of non-metallic coatings, e.g. for repairing
Reinforcing the conductive pattern { ( by solder coating H05K 3/3457) }
References relevant to classification in this group
This subclass/group does not cover:
By solder coating
Applying non-metallic protective coatings { (H05K 3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K 3/4673) }
References relevant to classification in this group
This subclass/group does not cover:
Apparatus for coating printed circuits using liquid non-metallic coating compositions
Methods for intermediate insulating layers for build-up multilayer circuits
{for encapsulating mounted components (H05K 1/185 takes precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
by soldering { ( soldering or desoldering apparatus H05K 13/04 , B23K 1/00 , B23K 3/00) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Soldering or de-soldering apparatus
Assembling printed circuits with other printed circuits {H05K 7/142 takes precedence }
References relevant to classification in this group
This subclass/group does not cover:
Spacers not being card guides
Special rules of classification within this group

H05K 3/36 relates to the method of assembling at least two printed circuits to form a single entity as a final product, whereas H05K 3/0097 relates to processing two printed circuits at the same time. This implicitly means that after processing, the printed circuits are again separated from one another.

Manufacture insulated metal core circuits {or other insulated electrically conductive core circuits (H05K 3/0058 , H05K 3/4641 , H05K 3/4608 take precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Laminating two or more circuit boards having integrally laminated metal sheets or special power cores
Special circuit board as base or central core comprising an electrically conductive core
Manufacturing multilayer circuits { ( incorporating non-printed electric components in internal layers H05K 1/185) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Incorporating non-printed electric components in internal layers
Casings, cabinets or drawers for electric apparatus ( in general A47B; radio receiver cabinets H04B 1/08 ; television receiver cabinets H04N 5/64 ; { constructional details or arrangements for computers G06F 1/16} )
Definition statement
This subclass/group covers:

Constructional features of electronic housings when the inner electronic arrangement is not described in the document such as:

  • assembling means of the housing parts
  • association means of several housings
  • venting means
  • sealing means
  • interlocking means
  • displaying and controlling means
  • mounting and fixing means
  • handling means
References relevant to classification in this group
This subclass/group does not cover:
Desktop and laptop computer housings
CRT Television housings
Plasma display panels
LCD display panels
Projectors
Mobile phone housings
Receptacles of batteries
Furniture/cabinets
Casings and housings of instrument
Informative references
Attention is drawn to the following places, which may be of interest for search:
Locks and Latches in general
Hinges in general
Handles and grip in general
Details for decorative purposes in mobiles phones
Connectors in general
Sealing in general
Stands and supports for apparatus in general
Electronic boxes of vehicles in general
Electric distribution centers in vehicle in general
Constructional details of record carriers in general
Hermetically-sealed casings { ( specially adapted for small components H05K 5/0095) }
References relevant to classification in this group
This subclass/group does not cover:
Specially adapted for small components
Constructional details common to different types of electric apparatus ( casings, cabinets, drawers H05K 5/00)
Definition statement
This subclass/group covers:
  • constructional features of electronic housings when the inner electronic arrangement is also described,
  • constructional features of standardized electronic cabinets and racks for receiving Printed Circuit Boards (PCB) such as guides, retainers, drawers, plug-in modules;
  • constructional features of Servers, Data Center Rooms, 19-inch computer racks such as mounting means of blades within cabinets, cable management, power distribution, mobile data centers arranged in shipping containers;
  • constructional features of industrial controllers such as PLCs;
  • cooling features of electronic housings,
  • cooling features of standardized electronic cabinets and racks for receiving Printed Circuit Boards (PCB);
  • cooling features of Servers, Data Center Rooms, 19-inch computer racks;
  • cooling features of power electronics, such as inverters;
  • cooling features of vehicle control units;
  • cooling features of display panels;
  • cooling features of outdoor telecommunication equipments, such as base stations.
References relevant to classification in this group
This subclass/group does not cover:
Inner arrangements of desktop and laptop computers
Cooling arrangements of desktop and laptop computers
CPU cooling; Cooling of electronic components not using the housing for the heat transfer
Constructional details of optoelectronic equipments
Cooling of batteries
Constructional details of Hard disk drives
Constructional details of record carriers
Program control systems PLC without constructional details
Bus systems and interfaces of computers
Telecommunication distribution frames and equipments
Informative references
Attention is drawn to the following places, which may be of interest for search:
Stacked arrangements of semiconductor devices
Blowers and fans in general
Cooling tubular elements with fins for cooling
Cooling element with means for increasing heat exchange area
Plug-in assemblages of components, {e.g. IC sockets ( for connection on printed circuit board H01R 23/6806) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
IC sockets for connection on printed circuit board
Resilient or clamping means for holding component to structure ( holding two-part couplings together H01R 13/00)
Informative references
Attention is drawn to the following places, which may be of interest for search:
Holding two-part couplings together
Mounting supporting structure in casing or on frame or rack { (H05K 7/18 takes precedence; test adapters G01R 31/2808) }
References relevant to classification in this group
This subclass/group does not cover:
Construction of rack or frame
Informative references
Attention is drawn to the following places, which may be of interest for search:
Test adapters
Modifications to facilitate cooling, ventilating, or heating { ( of printed circuits H05K 1/0201 ; of resistors H01C; of capacitors H01G; of individual semiconductor components H01L 23/34 , H01L 31/024 ; of LEDs H01L 33/64 ; of personal computers G06F 1/20) }
Definition statement
This subclass/group covers:

Arrangements for cooling, ventilating or heating of electric apparatus by:

  • using a gaseous coolant in electronic enclosures
  • using a liquid coolant without phase change in electronic enclosures
  • using a liquid coolant with phase change in electronic enclosures
  • heat transfer by conduction from the heat generating element to a dissipating body
Informative references
Attention is drawn to the following places, which may be of interest for search:
Cooling, ventilating, or heating of printed circuits
Cooling, ventilating, or heating of resistors
Cooling, ventilating, or heating of capacitors
Cooling, ventilating, or heating of individual semiconductor components
Cooling, ventilating, or heating of LEDs
Cooling, ventilating, or heating of personal computers
Screening of apparatus or components against electric or magnetic fields ( devices for absorbing radiation from an aerial H01Q 17/00 ; { screening of semiconductor devices H01L 24/00 , H01L 23/58 ; screening structurally associated with dynamo-electric machines H02K 11/00 ; shielding against nuclear radiation G21F} )
Definition statement
This subclass/group covers:
  • screening of electronic equipments against magnetic and electromagnetic fields, transient and electrostatic discharges and shielding features applied to rooms or buildings protecting against external electromagnetic interference;
  • shielded electronic casings achieving electromagnetic compatibility;
  • shielding features of electronic equipments having standardized dimensions, such as 19-inch racks;
  • constructional features of transient suppressors;
  • protection of electronic apparatuses against Electrostatic Discharge (ESD);
  • shielding materials achieving electromagnetic compatibility of electronic apparatuses.
References relevant to classification in this group
This subclass/group does not cover:
Screening of human body against electromagnetic influences
Anechoic chambers
Shielding of Nuclear magnetic Resonance devices
Grounding and RFI shielding of Desktop and laptop computers
Screening against nuclear radiation
Magnetic shielding of transformers
Device for absorbing radiation from aerial
Screening of semiconductor devices
Screening of dynamo-electric machines
Informative references
Attention is drawn to the following places, which may be of interest for search:
Prevention of electrostatic charge in general
Conductive materials in general
Magnetic materials in general
RFI Filter construction
Arrangements for improving the operating reliability of electronic equipment, e.g. by providing a similar standby unit
Special rules of classification within this group

This IPC group is not used in CPC for classification.

Combination of a radio or television receiver with apparatus having a different main function { ( combined with clocks G04B 47/00 ; controlled by a clock G04C 21/28) }
Special rules of classification within this group

This IPC group is not used in CPC for classification

Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
Definition statement
This subclass/group covers:

Apparatus and methods for placing components onto the printed circuit boards.

References relevant to classification in this group
This subclass/group does not cover:
Manufacture of printed circuit boards
Assembling printed circuits with electric components
Apparatus and methods for soldering
Manufacture or treatments of solid state devices
Informative references
Attention is drawn to the following places, which may be of interest for search:
Manipulators
Packaging, Packing or unpacking
Special rules of classification within this group

These groups only concern bare printed circuit boards and not circuit boards already fitted in an apparatus (thus no displays, no hard disks etc)

Synonyms and Keywords
PCB
Printed Circuit Board
Substrate
Printed Circuit Board
{using handtools ( for mounting on a circuit board H05K 13/0447) }
Definition statement
This subclass/group covers:

Hand-tools specially adapted for adjusting assemblages of electric components

References relevant to classification in this group
This subclass/group does not cover:
Hand-tools for mounting electric components on a circuit board
{Orientation; Alignment; Positioning}
Definition statement
This subclass/group covers:

orientation, alignment and positioning only of the printed circuit boards

References relevant to classification in this group
This subclass/group does not cover:
Orientation, alignment and positioning of the printed circuit boards for testing
{Making assemblies of electric components, e.g. modules (H05K 13/04 take precedence ) }
References relevant to classification in this group
This subclass/group does not cover:
Mounted modules or finished printed circuit boards in casings, drawers or apparatus
Mounting of components, e.g. of leadless components
{Placing of components on belts holding the terminals}
Definition statement
This subclass/group covers:

preparing the components before delivering to mounting machines by grouping the components for batch mounting

Informative references
Attention is drawn to the following places, which may be of interest for search:
Attaching a series of articles, e.g. small electrical components, to a continuous web
Special rules of classification within this group

Only concerns filling of belts as a separate operation

{placing the components in a predetermined order}
Definition statement
This subclass/group covers:

Filling of belts according to the mounting order of different types of components.

Informative references
Attention is drawn to the following places, which may be of interest for search:
Attaching a series of articles, e.g. small electrical components, to a continuous web
Special rules of classification within this group

Must concern different type of components

Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Belt
continuous web holding the components in order to be delivered in rolls to the mounting machines
{Encapsulation of electrical assemblies in resins ( hermetically-sealed casings H05K 5/06) }
Informative references
Attention is drawn to the following places, which may be of interest for search:
Encapsulations into casings
Special rules of classification within this group

This group is not used.

{Means for helping with the manual mounting of components, e.g. special tables, light spots indicating the place for mounting ( handtools H05K 13/0447) }
Definition statement
This subclass/group covers:

Manual mounting posts for components on PCB

Informative references
Attention is drawn to the following places, which may be of interest for search:
Hand-tools for mounting electric components on a circuit board
{Tools for holding the circuit boards during processing; handling transport of printed circuit boards}
Definition statement
This subclass/group covers:

Provision for displacing printed circuit boards [PCB] between machines or for displacing PCBs inside mounting machines

Gripping PCBs for transport or conveyance

Informative references
Attention is drawn to the following places, which may be of interest for search:
Transport of articles, e.g. conveyors
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof
Special rules of classification within this group

Documents must include movement of printed circuit board

{Holders for printed circuit boards}
Definition statement
This subclass/group covers:

Fixation of printed circuit boards inside mounting machines

References relevant to classification in this group
This subclass/group does not cover:
Fixation of printed circuit boards in testing machines
Special rules of classification within this group

Printed circuit board must be static relative to holder.

Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Chuck
Holder, usually using vacuum
{Straightening or aligning terminal leads of pins mounted on boards, during transport of the boards ( during the mounting operation, after fitting components on the board H05K 13/0473) }
Definition statement
This subclass/group covers:

Transport of boards temporary fitted with components before definitive fixation, e.g. soldering.

Informative references
Attention is drawn to the following places, which may be of interest for search:
Straightening or aligning terminal leads of pins mounted on boards, during the mounting operation, after fitting components on the board
Special rules of classification within this group

Components are not definitively fixed.

{Containers and magazines for components, e.g. tube-like magazines}
Definition statement
This subclass/group covers:

Any type of container for delivering components to mounting machines and manufacture thereof

Details of component tubes, trays or belts.

References relevant to classification in this group
This subclass/group does not cover:
Filling of containers
Use of said containers in mounting machines
Informative references
Attention is drawn to the following places, which may be of interest for search:
Containers for storage or transport
Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Stick
tube-like container
{Treatment of the terminal leads as a seperate operation ( during transport H05K 13/0076 , H05K 13/023 ; during mounting H05K 13/04) }
Definition statement
This subclass/group covers:

Preparing leads of components before bringing to mounting machines

Special separate machines for lead treatment.

References relevant to classification in this group
This subclass/group does not cover:
Treatment of the terminal leads as a separate operation during transport
Treatment of leads after fitting in printed circuit boards
Special rules of classification within this group

Must be a separate machine.

Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Clinching
bending of leads
Feeding of components ( in general B65G)
Definition statement
This subclass/group covers:

Feeding of components to containers before fitting said container to machines, e.g. filling or refilling of containers

References relevant to classification in this group
This subclass/group does not cover:
Emptying of containers by the mounting machine itself
Informative references
Attention is drawn to the following places, which may be of interest for search:
Feeding of components in general
{Loading or unloading of containers (H05K 13/028 takes precedence ) }
Definition statement
This subclass/group covers:

Loading or unloading containers with components, the containers not being in use by the mounting machine.

References relevant to classification in this group
This subclass/group does not cover:
Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
Special rules of classification within this group

Do not classify here documents concerning pick and place in the mounting machine

{with orientation of the elements ( orientation while mounting H05K 13/0413 ; in general B23P 19/00) }
Definition statement
This subclass/group covers:

Giving orientation to components before feeding into containers

References relevant to classification in this group
This subclass/group does not cover:
Orientation of components during mounting
Informative references
Attention is drawn to the following places, which may be of interest for search:
Orientation in general
{with bending or straightening of the terminal leads ( bending and cutting after the mounting on a p.c. board H05K 13/0473) }
Definition statement
This subclass/group covers:

Feeding of components with bending or straightening of the terminal leads, e.g. in order to fit into containers

References relevant to classification in this group
This subclass/group does not cover:
Treatment of leads after fitting component into printed circuit boards
Informative references
Attention is drawn to the following places, which may be of interest for search:
Treatment of the terminal leads as a separate operation (not during transport)
Special rules of classification within this group

Not during or after mounting of component.

{Straightening or aligning terminal leads}
Definition statement
This subclass/group covers:

Straightening or aligning leads during the feeding

{of components having oppositely extending terminal leads}
Definition statement
This subclass/group covers:

Straightening or aligning leads of e.g. resistors

{of components having terminal leads in side by side relationship, e.g. using combing elements}
Definition statement
This subclass/group covers:

Straightening or aligning lead of chips.

Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Dual in line
chip with two rows of parallel leads
{Fluid transport of components}
Definition statement
This subclass/group covers:

Transport of components using fluids, e.g. jets of air, water.

{Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields}
Definition statement
This subclass/group covers:

Feeding bulk components simultaneously to containers

Informative references
Attention is drawn to the following places, which may be of interest for search:
Orientation of the elements
{Feeding axial lead components, e.g. using vibrating bowls, magnetic fields (H05K 13/022 takes precedence ) }
Definition statement
This subclass/group covers:

Feeding bulk axial components to containers.

References relevant to classification in this group
This subclass/group does not cover:
Orientation of the elements
Mounting of components {e.g. of leadless components}
Definition statement
This subclass/group covers:

Mounting machines for components on printed circuit boards.

Attaching containers to mounting machines for components delivery.

References relevant to classification in this group
This subclass/group does not cover:
Assembling printed circuits with electric components
Informative references
Attention is drawn to the following places, which may be of interest for search:
Manipulators
{pick and place heads or apparatus, e.g. with jaws}
Definition statement
This subclass/group covers:

Pick-and-place-heads for picking components out of a container and placing them on a printed circuit board using gripping devices.

References relevant to classification in this group
This subclass/group does not cover:
Vacuum grippers
Informative references
Attention is drawn to the following places, which may be of interest for search:
Manipulators
Special rules of classification within this group

Orientation while holding component is not classified here

Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Jaws
gripping device having means moving towards each other for pinching component
{incorporating a sucking device (H05K 13/0413 takes precedence ) }
Definition statement
This subclass/group covers:

Pick-and-place-heads for picking components out of a container and placing them on a printed circuit board by suction, e.g. using vacuum.

References relevant to classification in this group
This subclass/group does not cover:
Gripping devices
Informative references
Attention is drawn to the following places, which may be of interest for search:
Manipulators
Special rules of classification within this group

Orientation while holding component is not classified here

Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Nozzle
vacuum or air suction device
{with orientation of the component while holding it ( orientation while feeding H05K 13/022) }
Definition statement
This subclass/group covers:

Orientation of component held by mounting head just before or during mounting.

Mechanical and vacuum holders for components with orientation provisions.

Vision devices for orientation or correct placing of components.

Includes camera looking at the PC boards before mounting

References relevant to classification in this group
This subclass/group does not cover:
Orientation while feeding
Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Vision system
camera
{Feeding with belts}
Definition statement
This subclass/group covers:

Mounting machines with components delivery via belts.

Fastening of belt containers and methods of picking up of components by mounting head.

Special rules of classification within this group

Presence of belts. Control of components correctness in position or quality

Synonyms and Keywords
Blister
component belt in rolls
{with treatment of the terminal leads ( bending and cutting after fitting on a circuit board H05K 13/0473) }
Definition statement
This subclass/group covers:

Treatment of leads during or after picking up.

Informative references
Attention is drawn to the following places, which may be of interest for search:
Feeding one by one by other means than belts
Bending and cutting after fitting on a circuit board
{for components being oppositely extending terminal leads (H05K 13/0421 takes precedence ) }
Definition statement
This subclass/group covers:

For resistor type components.

References relevant to classification in this group
This subclass/group does not cover:
Treatment of the terminal leads (bending and cutting after fitting on a circuit board
{Feeding one by one by other means than belts}
Definition statement
This subclass/group covers:

Delivery of single components by other type of containers.

{with containers}
Definition statement
This subclass/group covers:

Delivery with containers, e.g. trays.

References relevant to classification in this group
This subclass/group does not cover:
Components belts
{incorporating means for treating the terminal leads only before insertion}
Definition statement
This subclass/group covers:

Treatment of leads before insertion.

{incorporating means for treating the terminal leads before and after insertion or only after insertion}
Definition statement
This subclass/group covers:

Treatment of leads before and/or only after insertion.

{different components being guided to the same mounting place}
Definition statement
This subclass/group covers:

Mounting machine for several types of components.

Mounting of different type of components to the same mounting place.

Multi nozzle machines

Machines with several holders for pc boards

Special rules of classification within this group

Multiple work tables and multiple heads, e.g. revolver heads, are classified here

Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
Revolver head
turning multiple head with multiple nozzles or grippers
{simultaneously punching the circuit board}
Definition statement
This subclass/group covers:

Mounting machines including hole puncher

References relevant to classification in this group
This subclass/group does not cover:
Hole shaping and details of holes
{Surface mounting ( surface mounted components H05K 3/341) }
Definition statement
This subclass/group covers:

Methods and apparatus for surface mounting electric components in general

References relevant to classification in this group
This subclass/group does not cover:
Details of fixation between component and PCB
Surface mounted components
Glossary of terms
In this subclass/group, the following terms (or expressions) are used with the meaning indicated:
SMD
Surface mounted device
{by soldering (H05K 13/0469 takes precedence; soldering apparatus in general B23K) }
Definition statement
This subclass/group covers:

Soldering machines of surface mounted components

References relevant to classification in this group
This subclass/group does not cover:
Reflow soldering apparatus and process; Soldering process per se
Details of processes for soldering surface mounted components on printed circuit boards
Informative references
Attention is drawn to the following places, which may be of interest for search:
Surface mounting on PCBs by soldering
Surface mounting by applying a glue or viscous material
{by applying a glue or viscous material}
Definition statement
This subclass/group covers:

Use of glue or viscous material with dispenser nozzles.

References relevant to classification in this group
This subclass/group does not cover:
Details of glue fixation between component and PC board
{Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board ( during transport H05K 13/0076) }
Definition statement
This subclass/group covers:

Treatment of leads after insertion out of mounting process

References relevant to classification in this group
This subclass/group does not cover:
Cutting and clinching the terminal ends of the leads after they are fitted on a circuit board during transport
{Simultaneously mounting of different components}
Definition statement
This subclass/group covers:

simultaneous mounting of different components placed on PC board at the same moment.

{using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached}
Definition statement
This subclass/group covers:

Simultaneous mounting of different components being arranged beforehand in preset positions.

Templates, trays and special multi heads.

{Replacement and removal of components}
Definition statement
This subclass/group covers:

Method and apparatus for taking off or replacing misplaced components

Special rules of classification within this group

No recycling.

May include a de-soldering device

{Hand tools therefor}
Definition statement
This subclass/group covers:

Hand tools for repairing printed circuit boards or exchanging components.

Special rules of classification within this group

No recycling.

{having a plurality of work-stations}
Definition statement
This subclass/group covers:

Arrangements of mounting machines in clusters or lines

Wiring by machine
Definition statement
This subclass/group covers:

Placing of wires on or in printed circuit boards by machines; machines therefor.

References relevant to classification in this group
This subclass/group does not cover:
Multiplex wire bundles for vehicles
{Accessories therefor, e.g. light spots}
Definition statement
This subclass/group covers:

Accessories for wiring, e.g. special tables or light spots.

Monitoring manufacture of assemblages
Definition statement
This subclass/group covers:

Control or planning of manufacturing processes of assemblages, e.g. of processes for mounting components on printed circuit boards

Control of apparatuses therefor

Planning of production facility and apparatus layout

Vision control after placing of components.

References relevant to classification in this group
This subclass/group does not cover:
Electrical control of finished printed circuit boards
This page is owned by Office of Patent Classification.
Last Modified: 10/11/2013