CPC Definition - Subclass C09G
This place covers:
- Polishing compositions containing abrasives or grinding agents as well as polishing compositions based on aqueous dispersions.
- Polishing compositions based on wax. This includes compositions based on mixtures of wax and natural or synthetic resins.
- Polishing compositions based on non-waxy substances, e.g. natural or synthetic resins.
- Ski waxes.
Subjects classified in subclass C09G are characterised by compositions that are used for polishing.
Subjects classified in subclass C08L are not necessarily used for polishing.
Subjects are classified in subclass C11D only when a significant amount of a detergent is present in a mixture. In all other cases (e.g. with a detergent as an auxiliary material) subjects are classified according to their use as polishing compositions.
Subclasses C23F and C23G are for chemical polishing and chemical cleaning procedures, but compositions used for polishing are not considered.
Class H10 consider a treatment step in the production of semiconductor devices. Methods, machines as well as compositions like Chemical Mechanical Polishing (hereinafter referred to as "CMP") slurries are classified in class H10.
In a predominant number of cases CMP slurries are used in a semiconductor manufacturing step.
CMP compositions used for polishing semiconductor devices are classified in group H10P 52/00.
CMP compositions used for polishing devices other than semiconductor devices, e.g. optical devices such as lenses, are classified in subclass C09G.
This place does not cover:
Coating compositions based on oil, fats or waxes or derivatives thereof | |
Coating compositions based on natural resins or derivatives thereof | |
French polish | |
Detergents | |
Cleaning compositions for semi conductor devices |
Attention is drawn to the following places, which may be of interest for search:
Grinding; Polishing machines and processes | |
Compositions of macromolecular compounds | |
Compositions of oils, fats or waxes or derivatives thereof | |
Compositions of natural resins or derivatives thereof | |
Abrasive powders, suspension and pastes for polishing | |
Chemical polishing of metals | |
Cleaning or de-greasing of metallic material by chemical methods | |
Etching of semiconductor wafers or parts of semiconductor or solid-state devices | |
Grinding, lapping or polishing of semiconductor wafers or parts of semiconductor or solid-state devices | |
Chemomechanical polishing of semiconductor materials | |
Chemomechanical polishing of conductive or resistive materials | |
Preparing bulk and homogeneous wafers by polishing | |
Planarisation of inorganic insulating materials | |
Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation |
In patent documents, the following abbreviations are often used:
CMP | Chemical Mechanical Polishing |
This place covers:
Polishing compositions containing abrasives or grinding agents; aqueous compositions and other polishing compositions based on wax or on non-waxy substances.
This place does not cover:
French polish | |
Abrasives as such | |
Detergents |
Attention is drawn to the following places, which may be of interest for search:
Abrasive powders, suspension and pastes for polishing | |
Manufacture of semiconductor devices, polishing | |
Manufacture of semiconductor devices, chemical mechanical polishing | |
Manufacture of semiconductor devices, deposition of non-insulating layers on insulating layers, chemical mechanical polishing thereof | |
Manufacture of semiconductor devices, dielectric removal step | |
Manufacture of semiconductor devices, planarisation of conductors |
In this place, the following terms or expressions are used with the meaning indicated:
CMP | Chemical Mechanical Polishing |
This place covers:
Ski waxes.
Attention is drawn to the following places, which may be of interest for search:
Apparatus for waxing or dewaxing |