CPC Definition - Subclass C09G
This place covers:
- Polishing compositions containing abrasives or grinding agents as well as polishing compositions based on aqueous dispersions, such as chemical mechanical polishing slurries for polishing semi conductors.
- Polishing compositions based on wax -this includes compositions based on mixtures of wax and natural or synthetic resins- and polishing compositions based on non-waxy substances, e. g. natural or synthetic resins.
- Ski waxes
This place does not cover:
Coating compositions based on oil, fats or waxes or derivatives thereof | |
Coating compositions based on natural resins or derivatives thereof | |
French polish | |
Detergents | |
Cleaning compositions for semi conductor devices |
Attention is drawn to the following places, which may be of interest for search:
Grinding; Polishing machines and processes | |
Compositions of macromolecular compounds | |
Compositions of oils, fats or waxes or derivatives thereof | |
Compositions of natural resins or derivatives thereof | |
Abrasive powders, suspension and pastes for polishing | |
Chemical polishing of metals | |
Cleaning or de-greasing of metallic material by chemical methods | |
Mirror polishing of wafers | |
Manufacture of semiconductor devices, polishing | |
Manufacture of semiconductor devices, chemical mechanical polishing | |
Manufacture of semiconductor devices, planarisation of the insulating layers | |
Manufacture of semiconductor devices, deposition of non-insulating layers on insulating layers, chemical mechanical polishing thereof | |
Manufacture of semiconductor devices, planarisation of conductors |
In patent documents, the following abbreviations are often used:
CMP | Chemical Mechanical Polishing |
This place covers:
Polishing compositions containing abrasives or grinding agents; aqueous compositions and other polishing compositions based on wax or on non-waxy substances.
This place does not cover:
French polish | |
Abrasives as such | |
Detergents |
Attention is drawn to the following places, which may be of interest for search:
Abrasive powders, suspension and pastes for polishing | |
Manufacture of semiconductor devices, polishing | |
Manufacture of semiconductor devices, chemical mechanical polishing | |
Manufacture of semiconductor devices, dielectric removal step | |
Manufacture of semiconductor devices, deposition of non-insulating layers on insulating layers, chemical mechanical polishing thereof | |
Manufacture of semiconductor devices, planarisation of conductors |
In this place, the following terms or expressions are used with the meaning indicated:
CMP | Chemical Mechanical Polishing |
This place covers:
Ski waxes.
Attention is drawn to the following places, which may be of interest for search:
Apparatus for waxing or dewaxing |