CPC Definition - Subclass C09G

Last Updated Version: 2016.11
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES
Definition statement

This place covers:

  • Polishing compositions containing abrasives or grinding agents as well as polishing compositions based on aqueous dispersions, such as chemical mechanical polishing slurries for polishing semi conductors.
  • Polishing compositions based on wax -this includes compositions based on mixtures of wax and natural or synthetic resins- and polishing compositions based on non-waxy substances, e. g. natural or synthetic resins.
  • Ski waxes
References
Limiting references

This place does not cover:

Coating compositions based on oil, fats or waxes or derivatives thereof

C09D 191/00

Coating compositions based on natural resins or derivatives thereof

C09D 193/00

French polish

C09F 11/00

Detergents

C11D

Cleaning compositions for semi conductor devices

H01L 21/02041

Informative references

Attention is drawn to the following places, which may be of interest for search:

Grinding; Polishing machines and processes

B24B

Compositions of macromolecular compounds

C08L

Compositions of oils, fats or waxes or derivatives thereof

C08L 91/00

Compositions of natural resins or derivatives thereof

C08L 93/00

Abrasive powders, suspension and pastes for polishing

C09K 3/1454

Chemical polishing of metals

C23F

Cleaning or de-greasing of metallic material by chemical methods

C23G

Mirror polishing of wafers

H01L 21/02024

Manufacture of semiconductor devices, polishing

H01L 21/304

Manufacture of semiconductor devices, chemical mechanical polishing

H01L 21/30625

Manufacture of semiconductor devices, planarisation of the insulating layers

H01L 21/31051

Manufacture of semiconductor devices, deposition of non-insulating layers on insulating layers, chemical mechanical polishing thereof

H01L 21/3212

Manufacture of semiconductor devices, planarisation of conductors

H01L 21/7684

Synonyms and Keywords

In patent documents, the following abbreviations are often used:

CMP

Chemical Mechanical Polishing

Polishing compositions (French polish C09F 11/00; detergents C11D)
Definition statement

This place covers:

Polishing compositions containing abrasives or grinding agents; aqueous compositions and other polishing compositions based on wax or on non-waxy substances.

References
Limiting references

This place does not cover:

French polish

C09F 11/00

Abrasives as such

C09K 3/14

Detergents

C11D

Informative references

Attention is drawn to the following places, which may be of interest for search:

Abrasive powders, suspension and pastes for polishing

C09K 3/1463

Manufacture of semiconductor devices, polishing

H01L 21/304

Manufacture of semiconductor devices, chemical mechanical polishing

H01L 21/30625

Manufacture of semiconductor devices, dielectric removal step

H01L 21/31053

Manufacture of semiconductor devices, deposition of non-insulating layers on insulating layers, chemical mechanical polishing thereof

H01L 21/3212

Manufacture of semiconductor devices, planarisation of conductors

H01L 21/7684

Special rules of classification

Abrasive free Chemical Mechanical Polishing (CMP) compositions are classified in C09G 1/04. All other CMP compositions are classified in C09G 1/02.

Glossary of terms

In this place, the following terms or expressions are used with the meaning indicated:

CMP

Chemical Mechanical Polishing

Ski waxes
Definition statement

This place covers:

Ski waxes.

References
Informative references

Attention is drawn to the following places, which may be of interest for search:

Apparatus for waxing or dewaxing

A63C 11/08