| CPC H04N 23/63 (2023.01) [A61B 1/00009 (2013.01); A61B 1/00016 (2013.01); A61B 1/00032 (2013.01); A61B 1/00034 (2013.01); A61B 1/00045 (2013.01); A61B 1/00048 (2013.01); A61B 1/00135 (2013.01); A61B 1/00163 (2013.01); A61B 1/005 (2013.01); A61B 1/045 (2013.01); A61B 1/05 (2013.01); G06F 1/1616 (2013.01); G06F 1/1626 (2013.01); G06F 1/1647 (2013.01); G06F 1/1649 (2013.01); G06F 1/1671 (2013.01); G06F 1/1686 (2013.01); G06F 1/1698 (2013.01); H01L 25/167 (2013.01); H04N 7/142 (2013.01); H04N 23/51 (2023.01); H04N 23/531 (2023.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); H04N 25/77 (2023.01); H04N 25/7795 (2023.01); A61B 1/0051 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/3011 (2013.01); H04N 23/555 (2023.01)] |

| AS A RESULT OF REEXAMINATION, IT HAS BEEN DETERMINED THAT: |
| Claims 1, 5, 11, 33, 34, 58 and 64 are cancelled. |
| Claims 2-4, 6-10, 12-32, 35-57, 59-63 and 65-75 were not reexamined. |
|
2. A device, as claimed in claim 1, wherein:
said first circuit board is placed adjacent said image sensor within said camera module.
|