US 6,774,033 K1 (3,986th)
	Metal stack for local interconnect layer
Mira Ben-Tzur; Dafna Beery; Gorley L. Lau; and Krishnaswamy Ramkumar
Assigned to HD SILICON SOLUTIONS LLC
Trial No. IPR2021-00752, Apr. 23, 2021
Inter Partes Review Certificate for Patent 6,774,033, issued Aug. 10, 2004, Appl. No. 10/287,258, Nov. 4, 2002
Inter Partes Review Certificate issued Jun. 24, 2025