US 7,126,214 K1 (3,892nd)
	Reconfigurable processor module comprising hybrid stacked integrated circuit die elements
Jon M. Huppenthal; and D. James Guzy
Assigned to ARBOR GLOBAL STRATEGIES, LLC
Trial No. IPR2020-01567, Sep. 4, 2020
Trial No. IPR2021-00735, Apr. 5, 2021
Inter Partes Review Certificate for Patent 7,126,214, issued Oct. 24, 2006, Appl. No. 10/802,067, Mar. 16, 2004
Inter Partes Review Certificate issued Feb. 24, 2025