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2 . (1 indent ) Disposition of elements
6 . (1 indent ) Rotating field circuits
7 . (1 indent ) Detectors
8 .. (2 indent ) Magnetoresistive
9 .. (2 indent ) Hall effect
10 .. (2 indent ) Optical
11 . (1 indent ) Generators
12 .. (2 indent ) By splitting
13 . (1 indent ) Plural interacting paths
14 .. (2 indent ) Closed loop
15 ... (3 indent ) Major-minor
16 .. (2 indent ) With switch at interacting point
17 ... (3 indent ) Idler switch
18 .. (2 indent ) Boundary
19 . (1 indent ) Conductor propagation
20 .. (2 indent ) Including A.C. signal
21 .. (2 indent ) Three phase signals
22 . (1 indent ) One's and zero's
23 . (1 indent ) Plural direction propagation
24 .. (2 indent ) Nonsequential
25 . (1 indent ) Velocity
28 .. (2 indent ) Variable
29 . (1 indent ) Strip domain
30 . (1 indent ) In-plane field (nonrotating)
31 . (1 indent ) Different size bubbles
32 . (1 indent ) Multiple magnetic layer
33 . (1 indent ) Magnetic storage material
34 .. (2 indent ) Amorphous
35 . (1 indent ) Guide structure
36 .. (2 indent ) Ion implantation
37 .. (2 indent ) Slots or rails
39 .. (2 indent ) Overlays
40 ... (3 indent ) On opposite sides of storage medium
42 ... (3 indent ) Wedges
43 ... (3 indent ) Chevrons
44 ... (3 indent ) Rectangular bars
185.02 . (1 indent ) Disturbance control
185.03 . (1 indent ) Multiple values (e.g., analog)
185.04 . (1 indent ) Data security
185.05 . (1 indent ) Particular connection
185.06 .. (2 indent ) Segregated columns
185.07 .. (2 indent ) Cross-coupled cell
185.08 .. (2 indent ) With volatile signal storage device
185.09 .. (2 indent ) Error correction (e.g., redundancy, endurance)
185.1 .. (2 indent ) Extended floating gate
185.11 .. (2 indent ) Bank or block architecture
185.12 ... (3 indent ) Parallel row lines (e.g., page mode)
185.13 ... (3 indent ) Global word or bit lines
185.14 .. (2 indent ) Program gate
185.15 ... (3 indent ) Weak inversion injection
185.16 .. (2 indent ) Virtual ground
185.17 .. (2 indent ) Logic connection (e.g., NAND string)
185.18 . (1 indent ) Particular biasing
185.19 .. (2 indent ) Multiple pulses (e.g., ramp)
185.2 .. (2 indent ) Reference signal (e.g., dummy cell)
185.21 ... (3 indent ) Sensing circuitry (e.g., current mirror)
185.22 ... (3 indent ) Verify signal
185.23 .. (2 indent ) Drive circuitry (e.g., word line driver)
185.24 .. (2 indent ) Threshold setting (e.g., conditioning)
185.25 .. (2 indent ) Line charging (e.g., precharge, discharge, refresh)
185.26 .. (2 indent ) Floating electrode (e.g., source, control gate, drain)
185.27 .. (2 indent ) Substrate bias
185.28 .. (2 indent ) Tunnel programming
185.3 ... (3 indent ) Over erasure
185.31 ... (3 indent ) Nonsubstrate discharge
185.32 .... (4 indent ) Radiation erasure
45 ANALOG STORAGE SYSTEMS
46 . (1 indent ) Resistive
47 . (1 indent ) Thermoplastic
48 . (1 indent ) Magnetic
50 . (1 indent ) Magnetic
51 FORMAT OR DISPOSITION OF ELEMENTS
52 HARDWARE FOR STORAGE ELEMENTS
54 . (1 indent ) Ground plane
55 . (1 indent ) Magnetic
56 .. (2 indent ) Spacers
59 .. (2 indent ) Embedded conductor
60 .. (2 indent ) Air gap
61 .. (2 indent ) Hairpin conductor
62 .. (2 indent ) Permanent magnet
63 INTERCONNECTION ARRANGEMENTS
65 . (1 indent ) Ferroelectric
66 . (1 indent ) Magnetic
67 .. (2 indent ) Plural diagonal
69 .. (2 indent ) Crossover
71 . (1 indent ) Negative resistance
72 . (1 indent ) Transistors or diodes
74 . (1 indent ) Magnetic
75 . (1 indent ) Stepwise
76 . (1 indent ) Delay lines
77 . (1 indent ) Plural paths
78 PLURAL SHIFT REGISTER MEMORY DEVICES
80 MAGNETIC SHIFT REGISTERS
81 . (1 indent ) Bidirectional
82 . (1 indent ) Two cells per bit
83 . (1 indent ) SiPo/PiSo
84 . (1 indent ) Core in transfer loop
85 . (1 indent ) Continuous
86 .. (2 indent ) Plated wire
87 . (1 indent ) Thin film
88 .. (2 indent ) Domain tip
90 . (1 indent ) Multiaperture cell
92 .. (2 indent ) With other type core
93 . (1 indent ) Including delay means
94 READ ONLY SYSTEMS (I.E.. SEMIPERMANENT)
95 . (1 indent ) With override (i.e., latent images)
97 . (1 indent ) Magnetic
98 .. (2 indent ) Random core
99 .. (2 indent ) Random wiring
100 . (1 indent ) Resistive
101 . (1 indent ) Inductive
102 . (1 indent ) Capacitative
103 . (1 indent ) Semiconductive
104 .. (2 indent ) Transistors
105 .. (2 indent ) Diodes
107 . (1 indent ) Chemical fluids
108 . (1 indent ) Liquid crystal
109 . (1 indent ) Photoconductive and ferroelectric
110 . (1 indent ) Electroluminescent and photoconductive
111 . (1 indent ) Electroluminescent
112 . (1 indent ) Photoconductive
113 . (1 indent ) Amorphous
114 . (1 indent ) Semiconductive
115 .. (2 indent ) Diodes
117 . (1 indent ) Ferroelectric
118 . (1 indent ) Electron beam
119 . (1 indent ) Color centers
121 . (1 indent ) Polarization
122 .. (2 indent ) Magneto-optical
123 . (1 indent ) Bragg cells
124 . (1 indent ) Diffraction
125 .. (2 indent ) Holograms
126 . (1 indent ) Thermoplastic
127 . (1 indent ) Transparency
128 . (1 indent ) Electron beams
129 SYSTEMS USING PARTICULAR ELEMENT
130 . (1 indent ) Three-dimensional magnetic array
131 . (1 indent ) Two magnetic cells per bit
132 . (1 indent ) Different size cores
133 . (1 indent ) Cells of diverse coercivity
134 . (1 indent ) Continuous cells
135 .. (2 indent ) Elongated or bar-shaped cell
136 ... (3 indent ) Twisters
137 ... (3 indent ) Tubular
138 ... (3 indent ) Chain
139 ... (3 indent ) Plated wire
140 . (1 indent ) Multiaperture cell
141 .. (2 indent ) Aperture plate
142 .. (2 indent ) Aperture with transverse axis
144 .. (2 indent ) Same size apertures
145 . (1 indent ) Ferroelectric
146 . (1 indent ) Electrets
147 . (1 indent ) Persistent internal polarization (PIP)
148 . (1 indent ) Resistive
149 . (1 indent ) Capacitors
150 .. (2 indent ) Inherent
151 . (1 indent ) Molecular or atomic
152 .. (2 indent ) Nuclear induction or spin echo
153 . (1 indent ) Electrochemical
154 . (1 indent ) Flip-flop (electrical)
155 .. (2 indent ) Plural emitter or collector
156 .. (2 indent ) Complementary
157 . (1 indent ) Magnetostrictive or piezoelectric
158 . (1 indent ) Magnetoresistive
159 . (1 indent ) Negative resistance
160 . (1 indent ) Superconductive
161 .. (2 indent ) Thin film
162 .. (2 indent ) Josephson
163 . (1 indent ) Amorphous (electrical)
164 . (1 indent ) Electrical contacts
165 .. (2 indent ) Coherer
167 . (1 indent ) Simulating biological cells
168 . (1 indent ) Ternary
169 . (1 indent ) Gunn effect
170 . (1 indent ) Hall effect
171 . (1 indent ) Magnetic thin film
172 .. (2 indent ) Isotropic
173 .. (2 indent ) Multiple magnetic storage layers
174 . (1 indent ) Semiconductive
175 .. (2 indent ) Diodes
176 .. (2 indent ) Silicon on sapphire (SOS)
177 .. (2 indent ) Bioplar and FET
178 .. (2 indent ) Ion implantation
179 .. (2 indent ) Plural emitter or collector
180 .. (2 indent ) Four layer devices
181 .. (2 indent ) Complementary conductivity
182 .. (2 indent ) Insulated gate devices
183 ... (3 indent ) Charge coupled
184 ... (3 indent ) Variable threshold
186 .. (2 indent ) Single device per bit
187 .. (2 indent ) Three devices per bit
188 .. (2 indent ) Four or more devices per bit
189.02 . (1 indent ) Multiplexing
189.03 . (1 indent ) Plural use of terminal
189.04 . (1 indent ) Simultaneous operations (e.g., read/write)
189.05 . (1 indent ) Having particular data buffer or latch
189.06 . (1 indent ) Including signal clamping
189.07 . (1 indent ) Including signal comparison
189.08 . (1 indent ) Including specified plural element logic arrangement
189.09 . (1 indent ) Including reference or bias voltage generator
189.11 . (1 indent ) Including level shift or pull-up circuit
189.12 . (1 indent ) With shift register
190 . (1 indent ) For complementary information
191 . (1 indent ) Signals
192 .. (2 indent ) Radio frequency
193 .. (2 indent ) Strobe
195 .. (2 indent ) Inhibit
196 ... (3 indent ) Sense/inhibit
197 .. (2 indent ) Microwave
198 .. (2 indent ) Transmission
199 .. (2 indent ) Coincident A.C. signal with pulse
200 . (1 indent ) Bad bit
201 . (1 indent ) Testing
202 . (1 indent ) Complementing/balancing
203 . (1 indent ) Precharge
204 . (1 indent ) Accelerating charge or discharge
205 . (1 indent ) Flip-flop used for sensing
206 . (1 indent ) Noise suppression
207 .. (2 indent ) Differential sensing
208 ... (3 indent ) Semiconductors
209 ... (3 indent ) Magnetic
210 .... (4 indent ) Reference or dummy element
211 .. (2 indent ) Temperature compensation
212 ... (3 indent ) Semiconductor
213 ... (3 indent ) Magnetic
214 .. (2 indent ) Particular wiring
215 . (1 indent ) Optical
216 .. (2 indent ) Holographic
217 . (1 indent ) Electron beam
219 . (1 indent ) SiPo/PiSo
220 . (1 indent ) Parallel read/write
221 . (1 indent ) Serial read/write
222 . (1 indent ) Data refresh
224 . (1 indent ) Eddy current
225 . (1 indent ) Minor loop
225.5 . (1 indent ) Including magnetic element
225.6 . (1 indent ) Having bipolar circuit element
225.7 . (1 indent ) Having fuse element
227 . (1 indent ) Conservation of power
228 . (1 indent ) Data preservation
229 .. (2 indent ) Standby power
230.02 . (1 indent ) Multiplexing
230.03 . (1 indent ) Plural blocks or banks
230.04 .. (2 indent ) Alternate addressing (e.g., even/odd)
230.05 . (1 indent ) Multiple port access
230.06 . (1 indent ) Particular decoder or driver circuit
230.07 .. (2 indent ) Including magnetic element
230.08 . (1 indent ) Including particular address buffer or latch circuit arrangement
230.09 . (1 indent ) Combined random and sequential addressing
231 . (1 indent ) Using selective matrix
232 .. (2 indent ) Magnetic
233 . (1 indent ) Sync/clocking
233.5 .. (2 indent ) Transition detection
234 . (1 indent ) Optical
235 .. (2 indent ) Page memories
236 . (1 indent ) Counting
237 . (1 indent ) Electron beam
238 . (1 indent ) Cartesian memories
238.5 . (1 indent ) Byte or page addressing
239 . (1 indent ) Sequential
240 .. (2 indent ) Using shift register
241 .. (2 indent ) Detectors
242 . (1 indent ) Current steering
243.5 . (1 indent ) Including magnetic element
FOR000 CLASS-RELATED FOREIGN DOCUMENTS
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