*****TBD*****

CLASS 216, ETCHING A SUBSTRATE: PROCESSES

2	ETCHING OF SEMICONDUCTOR MATERIAL TO PRODUCE AN ARTICLE HAVING A NONELECTRICAL FUNCTION:

This subclass is indented under the class definition. Process of etching a semiconductive precursor, substrate, or device to produce an article whose function is not related to the conduction of electricity.

(1) Note. This subclass is directed to the manufacture of a semiconductor containing article which has a stated function which is nonelectrical in nature, e.g., pressure diaphragm, spring, or coil, etc.

SEE OR SEARCH CLASS:

438,	Semiconductor Device Manufacturing: Process, for (a) combined processes and (b) unit operation not elsewhere provided for manufacturing a semiconductive electrical substrate or device.

3	FORMING OR TREATING JOSEPHSON JUNCTION ARTICLE:

This subclass is indented under the class definition. Process wherein etching is used in the forming or treating of a superconductive material which is joined in a Josephson Junction containing a pair of superconductive electrodes which are separated by a thin, less conductive portion through which superconductor tunneling may occur.

SEE OR SEARCH CLASS:

257,	Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), subclasses 31+ for a Josephson Junction device.
505,	Superconductor Technology: Apparatus, Material, Process, subclass 329 and subclasses 410+ for the use of high temperature superconductor material in applications, apparatus, and the materials, per se, not provided for elsewhere.

4	FORMING OR TREATING A SIGN OR MATERIAL USEFUL IN A SIGN:

This subclass is indented under the class definition. Process wherein etching is used in the forming or treating of a sign for the display of intelligence by way of symbols or for material useful in preparing a sign.

SEE OR SEARCH THIS CLASS, SUBCLASS:

8,	for forming or treating a cylindrical or tubular article having pattern or design on its surface.

SEE OR SEARCH CLASS:

40,	Card, Picture, or Sign Exhibiting, subclasses 541+ for an illuminated sign.

5	. Sign or material is electroluminescent:

	This subclass is indented under subclass 4. Process wherein the sign or material adiabatically emits light in an electric field.

6	FORMING OR TREATING MATERIAL USEFUL IN A CAPACITOR:

This subclass is indented under the class definition. Process wherein etching is used in the forming or treating of materials that may be used in a device composed of two conductors separated by a dielectric capable of storing electrical energy blocking the flow of direct current to a degree dependent upon the capacitance and the frequency.

SEE OR SEARCH CLASS:

29,	Metal Working, for making special articles as defined in the etching class definition, note subclass 25.03 for electrolytic device making, e.g., capacitor, etc., and subclasses 25.41+ for electric condenser making.
174,	Electricity: Conductors and Insulators, subclass 143 for bushing-type condenser.
361,	Electricity: Electrical Systems and Devices, subclasses 268+ for induction apparatus combined with electrical capacitors, subclasses 271+ for electrostatic capacitors, subclasses 277+ for variable-type electrical capacitors, and subclasses 500+ for electrolytic-type condensers.

7	FORMING OR TREATING FIBROUS ARTICLE OR FIBER REINFORCED COMPOSITE STRUCTURE:

	This subclass is indented under the class definition. Process wherein etching is used in the forming or treating of an article or structure containing fibers.

8	FORMING OR TREATING CYLINDRICAL OR TUBULAR ARTICLE HAVING PATTERN OR DESIGN ON ITS SURFACE:

This subclass is indented under the class definition. Process wherein etching is used in the forming or treating of a cylindrical or tubular article having a pattern or design on the article surface, e.g., pattern roll, etc.

SEE OR SEARCH CLASS:

205,	Electrolysis: Processes, Compositions Used Therein, and Methods of Preparing the Compositions, subclass 118 for electrolytic coating of selected areas.
427,	Coating Processes, subclasses 256+ for nonuniform coating.

9	. Forming or treating an embossing cylinder or tubular article:

	This subclass is indented under subclass 8. Process wherein the cylinder or tubular article has a design or pattern raised in relief above its surface and which is intended to impress the design or pattern on other work.

10	. Forming or treating liquid transfer cylinder or tubular article (e.g. printing roll, etc.):

This subclass is indented under subclass 8. Process wherein the cylinder or tubular article is intended to transfer liquid.

SEE OR SEARCH CLASS:

101,	Printing, subclasses 212+ for rolling contact printing machines.

11	FORMING OR TREATING AN ARTICLE WHOSE FINAL CONFIGURATION HAS A PROJECTION:

This subclass is indented under the class definition. Process wherein etching is used in the forming or treating of an article whose final shape has at least one raised area above the normal planar surface, e.g.; pointer, sound needle, etc.

SEE OR SEARCH CLASS:

438,	Semiconductor Device Manufacturing: Process, subclass 20 for manufacturing an electron emissive device utilizing a semiconductive substrate.
445,	Electric Lamp or Space Discharge Component or Device Manufacturing, subclasses 46+ for making an electrode having a projection.
604,	Surgery, subclasses 187+ for an aspirator syringe or injector.

12	FORMING OR TREATING MASK USED FOR ITS NONETCHING FUNCTION (E.G., SHADOW MASK, X-RAY MASK, ETC.):

This subclass is indented under the class definition. Process wherein etching is used in forming or treating a mask whose function is other than as an etch mask or etch resist, e.g., shadow mask, X-ray mask, etc.

SEE OR SEARCH THIS CLASS, SUBCLASS:

41+,	for the masking of a substrate using an etch resist.
56,	for making a porous or perforated article not used for masking.

SEE OR SEARCH CLASS:

378,	X-Ray or Gamma Ray Systems or Devices, subclass 35 for mask used in a nonetching function.
430,	Radiation Imagery Chemistry: Process, Composition, or Product Thereof, subclass 5 for a radiation mask produced by a photos:graphic step.

13	FORMING OR TREATING ELECTRICAL CONDUCTOR ARTICLE (E.G., CIRCUIT, ETC.):

This subclass is indented under the class definition. Process wherein etching is used in the forming or treating of an electrical conductor.

(1) Note. The conductor maybe either a self sustaining conductor or a conductor on a supporting substrate, e.g., a printed circuit, etc.

SEE OR SEARCH CLASS:

205,	Electrolysis: Processes, Compositions Used Therein, and Methods of Preparing the Compositions, subclass 125 where the product is a circuit board or printed circuit.
427,	Coating Processes, subclasses 96.1 through 99.5for a process of coating a substrate to produce an integrated or printed circuit or circuit board.
428,	Stock Material or Miscellaneous Articles, cross-reference art collection 901 for a printed circuit.

14	. Forming or treating lead frame or beam lead:

This subclass is indented under subclass 13. Process directed to the forming or treating of (a) a group of metal leads held together in the proper relationship to permit connection to a semiconductor die (integrated circuit), or (b) an intermediate article of manufacture utilized to produce electrical connecting structure for circuits consisting of a generally flat electrically conductive strap or band section which has been stamped, cut or otherwise deformed, to produce an open encasing structure provided with a plurality of generally rectangular cross-sectional inwardly facing bodies designed to be attached to the circuit in a cantilever fashion.

SEE OR SEARCH CLASS:

29,	Metal Working, subclass 827 for beam lead frame or beam lead device manufacturing including a metal working step.

15	. Forming or treating a crossover:

	This subclass is indented under subclass 13. Process directed to the forming or treating of a circuit where one conductor crosses over another without electrical contact due to the presence of an insulator therebetween.

16	. Forming or treating resistive material:

This subclass is indented under subclass 13. Process directed to the forming or treating of material which is generally used in a circuit containing a conductor, and which material is intended to impede the flow of a steady or fluctuating electrical current passing through the mass by conversion of electrical energy to heat.

SEE OR SEARCH CLASS:

29,	Metal Working, subclass 610.1 for resistor making and subclass 621.1 for electrical strain gauge making.
252,	Compositions, subclasses 500+ for an electrically conductive or emissive composition.
257,	Active Solid-State Devices (e.g., Transistors, Solid-State Diodes), which include resistive materials in their construction.
338,	Electrical Resistors, for electrical resistor structure.

17	. Forming or treating of groove or through hole:

	This subclass is indented under subclass 13. Process directed to forming or treating (a) a depression of relatively small area which is formed partially or completely through an electrical conductor or a substrate supporting an electrical circuit, or (b) an elongated relatively narrow trench which is partially or completely through an electrical conductor or substrate.

18	.. Filling or coating of groove or through hole with a conductor to form an electrical interconnection:

	This subclass is indented under subclass 17. Process directed to filling or coating of groove or through hole with an electrically conductive material so as to provide an electrical interconnection in a circuit.

19	.. Filling or coating of groove or through hole in a conductor with an insulator:

	This subclass is indented under subclass 17. Process directed to filling or coating of groove or through hole with an insulator to thus form an insulated region in or on a conductor.

20	. Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.):

This subclass is indented under subclass 13. Process including a step of adhesively or autogeneously bonding two or more self-sustaining preforms and wherein the final product contains the two or more adhered layers.

(1) Note. A preformed etching mask or resist is not considered as being a preform proper for this subclass if it ultimately to be removed. See subclasses 41+ for etching processes involving a preformed etch mask or resist.

21	. Repairing circuit:

	This subclass is indented under subclass 13. Process directed to the refurbishing, repairing, or recovery of a circuit as to its electrical function.

22	FORMING OR TREATING ARTICLE CONTAINING MAGNETICALLY RESPONSIVE MATERIAL:

This subclass is indented under the class definition. Process wherein etching is used in the forming or treating of an article which contains material therein which is responsive to magnetism.

SEE OR SEARCH CLASS:

29,	Metal Working, subclasses 607+ for the making of permanent magnets and electromagnets.

23	FORMING OR TREATING ARTICLE CONTAINING A LIQUID CRYSTAL MATERIAL:

This subclass is indented under the class definition. Process wherein etching is used in the forming or treating of an article which contains an ordered liquid, i.e., liquid crystal.

SEE OR SEARCH CLASS:

252,	Compositions, subclasses 299.01+ for liquid crystal compositions.
428,	Stock Material or Miscellaneous Articles, subclass 1 for liquid crystal containing stock material.
438,	Semiconductor Device Manufacturing: Process, subclass 30 for manufacturing a liquid crystal display device utilizing a semiconductive substrate having an electrical device formed therein or thereon.

24	FORMING OR TREATING OPTICAL ARTICLE:

This subclass is indented under the class definition. Process wherein etching is used in forming or treating of an article which is either responsive to light, e.g., visible, UV, etc. or which is intended to transmit, modify, or otherwise alter light, e.g., visible, UV, etc.

SEE OR SEARCH CLASS:

65,	Glass Manufacturing, subclasses 37+ for lens making.
264,	Plastic and Nonmetallic Article Shaping or Treating: Processes, subclasses 1.1+ for optical article shaping or treating.
430,	Radiation Imagery Chemistry: Process, Composition, or Product Thereof, subclass 321 for optical device manufacturing using an imaging technique.

25	. Phosphor screen:

This subclass is indented under subclass 24. Process wherein the optical article is a screen containing phosphor elements, these elements phosphorescing (continuous emission of light) when stimulated by an external energy source which is usually radiation.

SEE OR SEARCH CLASS:

250,	Radiant Energy, subclasses 458.1+ for luminophor irradiation, and subclasses 483.1+ for luminescent device.
252,	Compositions, subclass 301.16 for an organic luminescent material containing composition, subclass 301.4 for an inorganic luminescent composition.
313,	Electric Lamp and Discharge Devices, subclasses 525+ for a device containing a phosphor screen.

26	. Lens:

	This subclass is indented under subclass 24. Process wherein the optical article contains transparent material which converges or diverges light by refraction.

27	FORMING OR TREATING THERMAL INK JET ARTICLE (E.G., PRINT HEAD, LIQUID JET RECORDING HEAD, ETC.):

This subclass is indented under the class definition. Process wherein etching is used in the forming or treating of an article whose ultimate use is to expel an ink droplet, and in which the ink droplet is produced by the action of thermal energy to form a propelling vapor.

SEE OR SEARCH CLASS:

346,	Recorders, subclass 1.1 for processes of using thermal ink jet devices, subclass 75 for the use of a gas blast against a receiver in printing.
438,	Semiconductor Device Manufacturing: Process, subclass 21 for manufacturing an electrical device controlled printhead utilizing a semiconductive substrate having an electrical device formed therein or thereon.

28	FORMING OR TREATING AN ORNAMENTED ARTICLE:

This subclass is indented under the class definition. Process wherein etching is used in the forming or treating of an article, which article possesses an effect which is intended to be decorative in nature, and which effect possess little or no utilitarian function or character, and wherein the article itself may or may not possess some form of utility.

SEE OR SEARCH CLASS:

63,	Jewelry, for ornamented jewelry.

29	. Wood surface treated or wood grain produced:

	This subclass is indented under subclass 28. Process wherein the treating is performed on the surface of a wood product to produce a decorative wood product, or wherein a nonwood product is treated to produce a wood grain appearance.

30	. Treating stone (e.g., marble, etc.):

	This subclass is indented under subclass 28. Process wherein stone is treated, to produce a decorative effect thereon, e.g., marble, etc.

31	. Treating glass (e.g., mirror, etc.):

This subclass is indented under subclass 28. Process wherein glass is treated to produce a decorative effect thereon, e.g., mirror, etc.

SEE OR SEARCH THIS CLASS, SUBCLASS:

80,	for etching of a silicon containing glass by a gas phase etchant.
97,	for etching of glass by nonliquid phase etchant.
99,	for etching of a silicon containing substrate by a nonliquid phase etchant.

SEE OR SEARCH CLASS:

65,	Glass Manufacturing, subclass 31 for etching or leaching of glass preform in combination with a glass manufacturing step.

32	. Treating elemental metal or alloy thereof:

	This subclass is indented under subclass 28. Process wherein metal or an thereof is treated to produce a decorative effect thereon.

33	ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.):

This subclass is indented under the class definition. Process s including the step of adhesively or autogenously bonding two or more self sustaining preforms.

(1) Note. A preformed etching mask or resist is not considered as being a preform proper for this subclass if it is ultimately to be removed. See subclasses 41+ for etching processes involving a preformed etch mask or resist.

(2) Note. Processes appropriate for this subclass require the forming of intended composite materials having two or more layers and wherein the final intended material is a composite having two or more layers. A multilayered substrate as a preform without the claimed forming of the multilayers by adhesive or autogenous bonding is not appropriate herein unless a self-sustaining preform is bonded thereto and remains with the multilayered substrate. Removing the self-sustaining preform (etch mask or resist) after the etching process results in a product which does not meet the required parameters for this subclass.

SEE OR SEARCH CLASS:

29,	Metal Working, for mechanical assembly combined with etching of special articles.
156,	Adhesive Bonding and Miscellaneous Chemical Manufacture, for adhesive bonding or laminating without etching.

34	. Etching improves or promotes adherence of preforms being bonded:

This subclass is indented under subclass 33. Process wherein etching is used to improve or promote adherence or bonding between two or more preforms.

(1) Note. Included herein is the use of etching to improve or promote the adherence of an adhesive and a preform.

35	.. Bonding of preform of metal or an alloy thereof to a preform of a nonmetal:

	This subclass is indented under subclass 34. Process of improving or promoting the adherence or bonding of a preform of metal or an alloy thereof to a nonmetal preform.

36	. Removing at least one of the self-sustaining preforms or a portion thereof:

This subclass is indented under subclass 33. Process wherein a delamination occurs between any two or more laminated preforms.

(1) Note. The preform or portion delaminated may be the same or different from the preform bonded initially. An example of a different preform is one which has been chemically treated after it has been united and then removed.

37	ETCHING AND COATING OCCUR IN THE SAME PROCESSING CHAMBER:

This subclass is indented under the class definition. Process wherein etching and coating occur in the same vessel.

SEE OR SEARCH CLASS:

427,	Coating Processes, for etching used to perfect a coating operation.

38	PLANARIZING A NONPLANAR SURFACE:

This subclass is indented under the class definition. Process directed to the smoothing or leveling of a surface.

(1) Note. The planarizing may include the use of a planarizing coating layer.

39	FORMING GROOVE OR HOLE IN A SUBSTRATE WHICH IS SUBSEQUENTLY FILLED OR COATED:

	This subclass is indented under the class definition. Process directed to the filling or coating of a groove or hole in a substrate after the groove or hole is formed.

40	FORMING PATTERN USING LIFT OFF TECHNIQUE:

This subclass is indented under the class definition. Process directed to placing a mask on a substrate, coating, or depositing material over the mask and substrate, then removing the mask to remove the deposited layer on the mask, thus leaving the deposited layer in a pattern where the mask was not present, and etching using the pattern as a mask.

(1) Note. Any means of removal may be used to include dissolution.

41	MASKING OF A SUBSTRATE USING MATERIAL RESISTANT TO AN ETCHANT (I.E., ETCH RESIST):

This subclass is indented under the class definition. Process directed to using a patterned material which is resistant to the etchant.

(1) Note. This subclass rather than subclass 49 and subclass 51 specifically provides for etch resistant material where the disclosure of the patent is silent as to whether the material is organic or inorganic in nature.

SEE OR SEARCH THIS CLASS, SUBCLASS:

56,	for making a porous or perforated article having a nonmasking function.

SEE OR SEARCH CLASS:

430,	Radiation Imagery Chemistry: Process, Composition, or Product Thereof, subclass 5 for a radiation mask.

42	. Resist material applied in particulate form or spray:

	This subclass is indented under subclass 41. Process wherein the masking is applied by a coating process involving the application of particulate material or by a spray coating procedure.

43	. Adhesively bonding resist to substrate:

This subclass is indented under subclass 41. Process wherein the masking is applied by adhesively bonding a self-sustaining patterned resist to a substrate.

SEE OR SEARCH CLASS:

156,	Adhesive Bonding and Miscellaneous Chemical Manufacture, for production of bonded materials.

44	. Mechanically forming pattern into a resist:

This subclass is indented under subclass 41. Process directed to the forming of a pattern into the etch resist by mechanical means, e.g., cutting, punching, scribing using a stylus, etc.

SEE OR SEARCH THIS CLASS, SUBCLASS:

52+,	for a separate step of mechanically shaping, deforming, or abrading of a substrate.

45	. Mask is reusable (i.e., stencil):

	This subclass is indented under subclass 41. Process using a prefabricated stencil or mask which may be reused in the subsequent etching of another substrate.

46	. Masking of sidewall:

	This subclass is indented under subclass 41. Process of using masking on a side wall of a substrate to prevent or direct etching.

47	. Mask is multilayer resist:

	This subclass is indented under subclass 41. Process of using an etch resist comprising plural layers.

48	. Mask is exposed to nonimaging radiation:

This subclass is indented under subclass 41. Process of exposing the etch resist to nonimaging radiation, e.g., U.V. light, laser beam, etc.

SEE OR SEARCH THIS CLASS, SUBCLASS:

62,	for altering of the etchability of a substrate by irradiation, ion implantation, alloying, diffusing, or chemically reacting the substrate during gas phase etching.
63+,	for gas phase etching with application of energy to the substrate being etched, e.g., ultrasonic, substrate heating, radiation, plasma, ion beam, etc.
87,	for altering of the etchability of a substrate during liquid phase etching by treatment with high energy radiation, alloying, diffusion, or chemically reacting.
94,	for liquid phase etching with high energy irradiation, e.g., laser, e-beam, or ion beam, etc.

SEE OR SEARCH CLASS:

430,	Radiation Imagery Chemistry: Process, Composition, or Product Thereof, for the production of an image formed by use of radiation or light combined with etching.

49	. Mask resist contains organic compound:

This subclass is indented under subclass 41. Process wherein the resist material contains an organic compound.

(1) Note. See Glossary for a definition of the term Organic.

(2) Note. See subclass 41 for masking material where the patent disclosure is silent as to its chemical nature.

50	.. Mask resist contains a color imparting agent:

	This subclass is indented under subclass 49. Process wherein the organic resist further contains a material expressly added for imparting color to the resist.

51	. Mask resist contains inorganic material:

This subclass is indented under subclass 41. Process wherein the resist material is inorganic and includes material in an elemental state.

(1) Note. See Glossary for a definition of the term Inorganic.

SEE OR SEARCH THIS CLASS, SUBCLASS:

41,	for masking material where the patent disclosure is silent as to its chemical nature.

52	MECHANICALLY SHAPING, DEFORMING, OR ABRADING OF SUBSTRATE:

This subclass is indented under the class definition. Process including a step of subjecting a substrate to physical force of sufficient magnitude to cause permanent distortion thereof or removal of material therefrom.

(1) Note. Included herein, e.g., are embossing, bending, abrading, cutting, breaking, etc.

(2) Note. For the line between this class and the metal working classes wherein a step of metal working is included, see Lines With Other Classes And Within This Class in this class (216).

53	. Nongaseous phase etching:

This subclass is indented under subclass 52. Process wherein the etchant is employed in a nongaseous phase.

(1) Note. Most of the patents herein are to the use of a liquid etchant. See the Glossary for a definition of the term Liquid.

54	PATTERN OR DESIGN APPLIED BY TRANSFER:

	This subclass is indented under the class definition. Process wherein a separately existing pattern or design is temporarily adhered to a carrier and this pattern or design is transferred to a substrate.

55	HEATING OR BAKING OF SUBSTRATE PRIOR TO ETCHING TO CHANGE THE CHEMICAL PROPERTIES OF SUBSTRATE TOWARD THE ETCHANT:

This subclass is indented under the class definition. Process wherein the chemical properties of a substrate toward an etchant are altered by contacting the substrate prior to etching with a source of heat, e.g., alloying, curing, annealing, etc.

SEE OR SEARCH CLASS:

65,	Glass Manufacturing, subclasses 117+ for annealing of glass preform.

56	ETCHING TO PRODUCE POROUS OR PERFORATED ARTICLE:

This subclass is indented under the class definition. Process wherein the action of the etchant produces relatively small holes or channels throughout a substrate.

SEE OR SEARCH THIS CLASS, SUBCLASS:

12,	for forming a mask used for a nonetching function.

SEE OR SEARCH CLASS:

106,	Compositions: Coating or Plastic, subclass 122 for pore forming.
521,	Synthetic Resins or Natural Rubbers, subclasses 50+ for cellular products or processes of preparing a cellular product.

57	GAS PHASE AND NONGASEOUS PHASE ETCHING ON THE SAME SUBSTRATE:

This subclass is indented under the class definition. Process involving etching a substrate with a plurality of etchants and wherein at least one of the etchants is in a nongaseous phase and at least one of the etchants is in the gas phase.

(1) Note. See the Glossary for a definition of the term Gas.

(2) Note. Most of the patents relating to nongaseous etching involve a liquid etchant. See the Glossary for a definition of the term liquid.

SEE OR SEARCH THIS CLASS, SUBCLASS:

58,	for gas phase etching.
83,	for nongaseous phase etching

58	GAS PHASE ETCHING OF SUBSTRATE:

This subclass is indented under the class definition. Process wherein the etchant is in a gaseous state when it contacts the substrate.

(1) Note. See Glossary for a definition of the term Gas.

(2) Note. This and indented subclasses include etching employing ionized gas with approximately equal numbers of positive ions and electrons so the mixture is highly conductive and affected by magnetic fields, i.e., plasma.

59	. With measuring, testing, or inspecting:

This subclass is indented under subclass 58. Process including the step of visually, chemically, or physically determining or measuring a variable condition or property of the substrate or the etching process.

(1) Note. Included here under is a process of monitoring or controlling the etching process in response to a sensed condition.

SEE OR SEARCH THIS CLASS, SUBCLASS:

84+,	for measuring, testing, inspecting, monitoring or controlling of a nongaseous phase etching process.

SEE OR SEARCH CLASS:

445,	Electric Lamp or Space Discharge Component or Device Manufacturing, subclass 3 for testing or adjusting.

60	.. By optical means or of an optical property:

	This subclass is indented under subclass 59. Process where the test is performed optically or determines an optical property, e.g., reflectance, etc.

61	.. By electrical means or of an electrical property:

	This subclass is indented under subclass 59. Process where the test is performed electrically or determines an electrical property, e.g. resistance, etc.

62	. Irradiating, ion implanting, alloying, diffusing, or chemically reacting the substrate prior to etching to change properties of substrate toward the etchant:

This subclass is indented under subclass 58. Process wherein a substrate is altered by contacting prior to etching with a material or irradiation which (a) forms an alloy, (b) diffuses into, or (c) chemically reacts with the substrate, or causes a chemical reaction within the substrate to alter the effect of the etchant on the substrate or any part thereof.

SEE OR SEARCH THIS CLASS, SUBCLASS:

87,	for altering of the etchability of a substrate before nongaseous phase etching by treatment with high energy radiation, alloying, diffusing, or chemically reacting.

SEE OR SEARCH CLASS:

438,	Semiconductor Device Manufacturing: Process, subclass 705 for processes of altering the etchability of a semiconductor substrate prior to chemical etching for manufacturing a semiconductive electrical substrate or device; see the search notes thereunder.

63	. Application of energy to the gaseous etchant or to the substrate being etched:

This subclass is indented under subclass 58. Process directed to the application of energy to the gaseous etchant or to the substrate being etched, e.g., Ultrasonic substrate heating, radiation, plasma, ion beam, etc.

SEE OR SEARCH THIS CLASS, SUBCLASS:

73,	for preparing etching vapor by evaporation, boiling, or sublimation.
87,	altering of the etchability of a substrate prior to nongaseous phase etching by the use irradiation, ion implantation, alloying, diffusing, or chemically reacting.
94,	for nongaseous phase etching using high energy irradiation, e.g., laser, e-beam, or ion beam, etc.

64	.. Etchant is devoid of chlorocarbon or fluorocarbon compound (e.g., C.F.C., etc.):

This subclass is indented under subclass 58. Process wherein the etchant is devoid of a compound containing at least one chlorine and/or fluorine atom and at least one carbon atom.

(1) Note. This subclass requires that all of of the etching materials recited be devoid of the a chlorocarbon or flurocarbon carbon (etching mixtures). Also excluded are multistep processes wherein one of etching steps uses a chlorocarbon or fluorocarbon compound. See appropriate subclasses below for etching processes using etchants excluded from this subclass.

65	.. Using laser:

This subclass is indented under subclass 63. Process wherein the energy source is a laser.

(1) Note. Either visible or invisible laser may be used in this etching process.

SEE OR SEARCH CLASS:

522,	Synthetic Resins or Natural Rubbers, subclass 2 for forming or modifying a solid polymer by laser, or compositions therefor.

66	.. Using ion beam, ultraviolet, or visible light:

	This subclass is indented under subclass 63. Process wherein the energy source is an ion beam, ultraviolet, or visible light.

67	.. Using plasma:

This subclass is indented under subclass 63. Process wherein the energy source is a plasma.

(1) Note. See Glossary for a definition of the term Plasma.

68	... Using coil to generate the plasma:

	This subclass is indented under subclass 67. Process wherein a plasma is produced by the use of a coil, e.g., external induction coil, etc.

69	... Using microwave to generate the plasma:

	This subclass is indented under subclass 67. Process wherein the plasma is produced by the use of microwaves.

70	.... Magnetically enhancing the plasma:

This subclass is indented under subclass 69. Process where the plasma is intensified by the use of a magnetic field.

(1) Note. The magnetic field establishes a resonant motion of the electrons in the chamber.

71	... Specific configuration of electrodes to generate the plasma:

	This subclass is indented under subclass 67. Process wherein the plasma is produced using electrodes which are in a specific enumerated configuration in relation to each other.

72	. Etching a multiple layered substrate where the etching condition used produces a different etching rate or characteristic between at least two of the layers of the substrate:

	This subclass is indented under subclass 58. Process involving the etching of a multilayered substrate, using a single etching step, where the process parameters used causes a difference of the etching rate or characteristic in at least two different layers of the substrate.

73	. Etching vapor produced by evaporation, boiling, or sublimation:

	This subclass is indented under subclass 58. Process wherein the etching process includes the formation of the etchant vapor by the evaporating or boiling of a liquid, or is directly produced from a solid without the formation of a liquid phase.

74	. Etching inorganic substrate:

This subclass is indented under subclass 58. Process wherein the etching step is performed on an inorganic substrate and may include elemental material.

(1) Note. See Glossary for what is meant by the term Inorganic.

75	.. Substrate contains elemental metal, alloy thereof, or metal compound:

This subclass is indented under subclass 74. Process wherein the substrate contains metal in elemental, alloy, or compound form.

SEE OR SEARCH THIS CLASS, SUBCLASS:

100+,

for nongaseous phase etching of an elemental metal, alloy, or metal compound containing substrate.

76	... Etching of substrate containing at least one compound having at least one oxygen atom and at least one metal atom:

This subclass is indented under subclass 75. Process wherein the material etched contains a compound having at least one metal atom and at least one oxygen atom, e.g., indium titanium oxide (I.T.O.), a ceramic oxide, etc.

(1) Note. The metal oxygen compound may also contain other elements.

77	... Etching of substrate containing elemental aluminum, or an alloy or compound thereof:

	This subclass is indented under subclass 75. Process wherein the material to be etched contains elemental aluminum or an alloy thereof, or a compound containing aluminum.

78	... Etching of substrate containing elemental copper, or an alloy or compound thereof:

	This subclass is indented under subclass 75. Process wherein the material to be etched contains elemental copper or an alloy thereof, or a compound containing copper.

79	.. Etching silicon containing substrate:

This subclass is indented under subclass 74. Process wherein the material to be etched contains silicon in either elemental or combined form.

SEE OR SEARCH THIS CLASS, SUBCLASS:

97+,	for nongaseous phase etching of glass.
99,	for nongaseous phase etching of a silicon containing substrate.

SEE OR SEARCH CLASS:

438,	Semiconductor Device Manufacturing: Process, for (a) combined processes and (b) unit operation not elsewhere provided for manufacturing a semiconductive electrical substrate or device.

80	... Silicon containing substrate is glass:

This subclass is indented under subclass 79. Process wherein the material is composed of glass.

(1) Note. See Glossary for a definition of the term Glass.

SEE OR SEARCH CLASS:

65,	Glass Manufacturing, subclass 31 for etching or leaching of a glass preform, made by a Class 65 glass manufacturing method, e.g., molding, shaping, etc. of the glass in a plastic or softened state by heating, subclass 61 for wearing away of surface material, e.g., abrading or grinding, etc.

81	.. Etching elemental carbon containing substrate:

	This subclass is indented under subclass 74. Process wherein the material to be etched contains elemental carbon in any of its allotropic forms, e.g., diamond, etc.

83	NONGASEOUS PHASE ETCHING OF SUBSTRATE:

This subclass is indented under the class definition. Process the ... wherein the etchant used is employed in a nongaseous phase:

(1) Note. Most of the patents found in this subclass involve liquid phase etching processes. See Glossary for a definition of the term Liquid.

84	. With measuring, testing, or inspecting:

This subclass is indented under subclass 83. Process including the step of visually, chemically, or physically determining or measuring a variable condition or property of the substrate or the etching process.

(1) Note. Included hereunder is a process of monitoring or controlling the etching process in response to a sensed condition.

SEE OR SEARCH THIS CLASS, SUBCLASS:

59,	for measuring testing, inspecting, monitoring, or controlling of gas phase etching.
93,	for recycling, regenerating, or rejuvenating an etchant including a testing, measuring, inspecting, monitoring, or controlling step.

SEE OR SEARCH CLASS:

445,	Electric Lamp or Space Discharge Component or Device Manufacturing, subclass 3 for testing or adjusting.

85	.. By optical means or of an optical property:

	This subclass is indented under subclass 84. Process where the test is performed optically or determines an optical property, e.g., reflectance, etc.

86	.. By electrical means or of an electrical property:

	This subclass is indented under subclass 84. Process where the test is performed electrically or determines an electrical property, e.g., resistance, etc.

87	. Irradiating, ion implanting, alloying, diffusing, or chemically reacting the substrate prior to etching to change properties of substrate toward the etchant:

This subclass is indented under subclass 83. Process wherein a substrate is altered by contacting prior to etching with a material or irradiation which (a) forms an alloy, (b) diffuses into, or (c) chemically reacts with the substrate, or causes a chemical reaction within the substrate to alter the effect of the etchant on the substrate or any part thereof.

SEE OR SEARCH THIS CLASS, SUBCLASS:

94,	nongaseous phase etching using high energy irradiation, e.g., laser, electron-beam, ion beam, etc., where the substrate is not modified by irradiation prior to etching.

SEE OR SEARCH CLASS:

438,	Semiconductor Device Manufacturing: Process, subclass 705 for processes of altering the etchability of a semiconductor substrate prior the chemical etching for manufacturing a semiconductive electrical substrate or device; see the search notes thereunder.

88	. Using film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.):

This subclass is indented under subclass 83. Process in which the etching occurs at the interface at a film between the substrate and a conforming surface with relative motion between the substrate and the conforming surface.

SEE OR SEARCH CLASS:

438,	Semiconductor Device Manufacturing: Process, subclasses 691+ for chemical-mechanical polishing processes for manufacturing a semiconductive electrical substrate or device.

89	.. Etchant contains solid particle (e.g., abrasive for polishing, etc.):

	This subclass is indented under subclass 88. Process wherein the etchant also contains solid particles.

90	. Relative movement between the substrate and a confined pool of etchant:

This subclass is indented under subclass 83. Process including the step of causing a relative motion between a substrate being etched and an etchant which is confined in a container, (e.g., dipping, ultrasonic vibrating., etc.):

(1) Note. The substrate being etched may also serve as the container.

(2) Note. Boiling a liquid etchant is not considered sufficient for this subclass without disclosure that it is boiled to establish relative motion.

91	.. Rotating, repeated dipping, or advancing movement of substrate:

	This subclass is indented under subclass 90. Process wherein the substrate is (a) rotated with respect to the pool of etchant, (b) repeatedly dipped into and removed from the same pool of etchant, or (c) moved through a pool of etchant.

92	. Projecting etchant against a moving substrate or controlling the angle or pattern projection of the etchant or controlling the angle or pattern of movement of the substrate:

	This subclass is indented under subclass 83. Process wherein an etchant is transported through space by mechanical force and (a) brought into contact with a substrate while the substrate is in motion, (b) the etchant or substrate is transported at a predetermined angle, or (c) the etchant or substrate is transported in a particular pattern.

93	. Recycling, regenerating, or rejuvenating etchant:

This subclass is indented under subclass 83. Process which includes the steps of reconstituing or reusing an etchant.

(1) Note. Removal of etchant from an etching bath and its return to an etching bath is considered recycling for this subclass.

94	. Etching using radiation (e.g., laser, electron-beam, ion-beam, etc.):

	This subclass is indented under subclass 83. Process wherein radiation is used separately or simultaneously during etching.

95	. Substrate is multilayered:

This subclass is indented under subclass 83. Process wherein the substrate is plural layered.

(1) Note. The presence of a resist layer whose sole function is to protect some part of the substrate from etchant will not be considered sufficient to make the substrate plural-layered if it is to be removed.

96	. Etching inorganic substrate:

This subclass is indented under subclass 83. Process wherein at least one of layers of the substrate contains inorganic material.

(1) Note. See Glossary for a definition of the term Inorganic.

97	.. Substrate is glass:

This subclass is indented under subclass 96. Process wherein at least one of the layers of the substrate contains glass material.

(1) Note. See Glossary for a definition of the term Glass.

SEE OR SEARCH CLASS:

65,	Glass Manufacturing, subclass 31 for etching or leaching of glass preform, during manufacturing of a glass preform as per Class 65 definition.

98	... Frosting glass:

	This subclass is indented under subclass 97. Process of producing a frost like opaque surface on the glass by etching.

99	.. Substrate contains silicon or silicon compound:

This subclass is indented under subclass 96. Process wherein the substrate contains silicon in either elemental form or combined form.

SEE OR SEARCH CLASS:

438,	Semiconductor Device Manufacturing: Process, for (a) combined processes and (b) unit operation not elsewhere provided for manufacturing a semiconductive electrical substrate or device.

100	.. Substrate contains elemental metal, alloy thereof, or metal compound:

	This subclass is indented under subclass 96. Process wherein the substrate contains metal in elemental, alloy, or compound form.

101	... Etching of a compound containing at least one oxygen atom and at least one metal atom:

This subclass is indented under subclass 100. Process wherein the substrate etched contains a compound having at least one metal atom and at least one oxygen atom, e.g., indium titanium oxide (I.T.O.), a ceramic oxide, etc.

(1) Note. The substrate may also contain other elements.

102	... Metal is elemental aluminum, an alloy, or compound thereof:

	This subclass is indented under subclass 100. Process wherein the substrate etched contains elemental aluminum, its alloys, or a compound thereof.

103	.... Etchant contains acid:

This subclass is indented under subclass 102. Process wherein the substrate is etched with H+ ion producing or containing material.

(1) Note. See Glossary for a definition of the term Acid.

104	..... Etchant contains fluoride ion:

	This subclass is indented under subclass 103. Process wherein the etchant contains fluoride ion.

105	... Metal is elemental copper, an alloy, or compound thereof:

	This subclass is indented under subclass 100. Process wherein the substrate etched contains elemental copper, its alloys, or a compound thereof.

106	.... Etchant contains acid:

This subclass is indented under subclass 105. Process wherein the substrate is etched with H+ ion producing or containing material.

(1) Note. See Glossary for a definition of the term Acid.

107	..... Etchant contains fluoride ion:

	This subclass is indented under subclass 106. Process wherein the etchant contains fluoride ion.

108	... Etchant contains acid:

This subclass is indented under subclass 100. Process wherein the substrate is etched with H+ ion producing or containing material.

(1) Note. See Glossary for a definition of the term Acid.

109	.... Etchant contains fluoride ion:

	This subclass is indented under subclass 108. Process wherein the etchant contains fluoride ion.

FOR000

CLASS-RELATED FOREIGN DOCUMENTS

	This subclass has no definition.