US D801,624 S
Heat pack
Veronica M. Zsolcsak, Newburyport, MA (US); Micha Eizen, Lake Forest, CA (US); Thomas John William Bayes, Rothwell (GB); and Ian Nicholson Whitehead, Concord, MA (US)
Assigned to Schawbel Technologies LLC, Burlington, MA (US)
Filed by Schawbel Technologies LLC, Burlington, MA (US)
Filed on Jun. 30, 2017, as Appl. No. 29/609,460.
Application 29/609,460 is a division of application No. 29/533,210, filed on Jul. 15, 2015, granted, now D794813.
Term of patent 15 Years
LOC (10) Cl. 24 - 04
U.S. Cl. D 2—206
OG exemplary drawing
 
The ornamental design for a heat pack, as shown and described.