US 9,814,166 B2
Method of manufacturing electronic package module
Jen-Chun Chen, Nantou County (TW); Tsung-Jung Cheng, Nantou County (TW); and Chia-Cheng Liu, Nantou County (TW)
Assigned to UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD., Shanghai (CN)
Filed by UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI) CO., LTD., Shanghai (CN)
Filed on Jul. 31, 2013, as Appl. No. 13/955,149.
Prior Publication US 2015/0035201 A1, Feb. 5, 2015
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 21/56 (2006.01); H05K 9/00 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 27/146 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01)
CPC H05K 9/0024 (2013.01) [H01L 21/56 (2013.01); H01L 23/3114 (2013.01); H01L 23/552 (2013.01); H01L 24/02 (2013.01); H01L 27/14618 (2013.01); H05K 3/288 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0224 (2013.01); H05K 2201/0707 (2013.01); H05K 2201/1056 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1105 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A method of manufacturing an electronic package module, comprising:
providing a circuit substrate comprising:
a mountable surface;
at least one ground pad on the mountable surface; and
at least one patterned predetermined region defined on the mountable surface;
mounting at least one electronic component on at least one portion of the mountable surface other than the predetermined region;
attaching at least one tape in the patterned predetermined region conforming to the shape of the patterned predetermined region;
forming a molding over the mountable surface, wherein the molding covers the tape and the at least one electronic component;
removing the molding formed on the patterned predetermined region;
forming an electromagnetic shielding layer over the molding to electrically connect to the ground pad; and
removing the tape, wherein removing the tape comprises providing heat to facilitate the removal of the tape,
wherein after removing the tape, the method further comprises:
mounting at least one optical component in the predetermined region.