US 9,814,162 B2
Data center micro-module and data center formed by micro-modules
Liwei Zhu, Shenzhen (CN); Dianlin Li, Shenzhen (CN); Xiaowei Yang, Shenzhen (CN); Hua Zhu, Shenzhen (CN); and Wenpeng Xu, Shenzhen (CN)
Assigned to TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED, Shenzhen, Guangdong Province (CN)
Filed by Tencent Technology (Shenzhen) Company Limited, Shenzhen (CN)
Filed on Apr. 9, 2015, as Appl. No. 14/682,972.
Application 14/682,972 is a continuation of application No. PCT/CN2013/085174, filed on Oct. 14, 2013.
Claims priority of application No. 2012 1 0388782 (CN), filed on Oct. 15, 2012.
Prior Publication US 2015/0359144 A1, Dec. 10, 2015
Int. Cl. H05K 7/20 (2006.01); G06F 1/30 (2006.01); G06F 1/18 (2006.01); H05K 7/14 (2006.01)
CPC H05K 7/20736 (2013.01) [G06F 1/181 (2013.01); G06F 1/305 (2013.01); H05K 7/1497 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A data center, assembled by a plurality of data center micro-modules including a first data center micro-module enclosed in a first enclosure, a second data center micro-module enclosed in a second enclosure, and a third data center micro-module enclosed in a third enclosure, the plurality of data center micro-modules being connected to each other by using a cable wherein:
the first data center micro-module enclosed in the first enclosure comprises a first computing server that comprises a network core switch, a firewall and a security server, and a first cooling system that is configured to provide cooling for the first computing server using a combination of air conditioners and air deflectors;
the second data center micro-module enclosed in the second enclosure comprises a second computing server configured to accomplish user access and data caching, and a second cooling system that is configured to provide cooling for the second computing server using a respective plurality of air conditioner without using any air deflectors;
the third data center micro-module enclosed in the third enclosure comprises a third computing server configured as a storage server, and a third cooling system that is configured to provide cooling for the third computing server using a respective plurality of air conditioner without using any air deflectors; and
the second cooling system is configured to provides enhanced cooling compared to the first cooling system without using any air deflectors, while the third cooling system is configured to provide reduced cooling compared to the first cooling system without using any air deflectors.