US 9,814,160 B2
Side-cooled modular data center
William Slessman, Paradise Valley, AZ (US); and Andreas Zoll, Scottsdale, AZ (US)
Assigned to Baselayer Technology, LLC, Chandler, AZ (US)
Filed by Baselayer Technology, LLC, Phoenix, AZ (US)
Filed on Apr. 27, 2016, as Appl. No. 15/139,590.
Claims priority of provisional application 62/155,901, filed on May 1, 2015.
Prior Publication US 2016/0324036 A1, Nov. 3, 2016
Int. Cl. H05K 7/20 (2006.01); H05K 7/14 (2006.01)
CPC H05K 7/20145 (2013.01) [H05K 7/1497 (2013.01); H05K 7/202 (2013.01); H05K 7/2059 (2013.01); H05K 7/2079 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A modular data center, comprising:
a cooling module comprising a cooling module enclosure and a first cooling unit housed within the cooling module enclosure, the cooling module enclosure comprising a first interface side wall with a first cooling module supply opening that receives a first portion of cooling air from the first cooling unit; and
a data module comprising a data module enclosure for housing data equipment, the data module enclosure comprising a second interface side wall with a first data module supply opening that receives the first portion of the cooling air from the first cooling module supply opening such that the first portion of the cooling air flows into the data module enclosure and removes heat from the data equipment,
wherein the first interface side wall faces the second interface side wall, and
wherein at least portions of the first cooling unit, the first cooling module supply opening, the first data module supply opening, and the data equipment are linearly aligned with one another.