US 9,814,145 B2
Methods for manufacturing a Z-directed printed circuit board component having a removable end portion
Keith Bryan Hardin, Lexington, KY (US); Paul Kevin Hall, Lexington, KY (US); Qing Zhang, Lexington, KY (US); and John Thomas Fessler, Lexington, KY (US)
Assigned to Lexmark International, Inc., Lexington, KY (US)
Filed by Lexmark International, Inc., Lexington, KY (US)
Filed on Feb. 25, 2015, as Appl. No. 14/631,192.
Application 14/631,192 is a division of application No. 13/528,129, filed on Jun. 20, 2012, abandoned.
Prior Publication US 2015/0173207 A1, Jun. 18, 2015
Int. Cl. H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/40 (2006.01)
CPC H05K 3/301 (2013.01) [H05K 1/0222 (2013.01); H05K 1/184 (2013.01); H05K 3/306 (2013.01); H05K 3/4046 (2013.01); H05K 1/0231 (2013.01); H05K 1/0233 (2013.01); H05K 1/0251 (2013.01); H05K 1/0298 (2013.01); H05K 2201/09645 (2013.01); H05K 2201/09809 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10893 (2013.01); H05K 2201/10984 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49135 (2015.01)] 5 Claims
OG exemplary drawing
 
1. A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board, comprising:
filling a first cavity having a tapered surface with a body material to form a tapered end portion of the Z-directed component;
providing a first layer of a constraining material on top of the first cavity, the first layer of the constraining material having a second cavity having a width that is smaller than a width of the first cavity;
filling the second cavity with the body material;
providing successive layers of the constraining material on top of the first layer of the constraining material, each of the successive layers of the constraining material having an additional cavity defining an outer shape of a corresponding layer of a main body portion of the Z-directed component;
selectively filling the additional cavities of the successive layers of the constraining material with at least the body material to form the corresponding layers of the main body portion of the Z-directed component;
dissipating the constraining material to release the Z-directed component from the constraining material; and
firing the Z-directed component.