US 9,814,142 B1
Electronic devices wire bonded to substrate through an adhesive layer and method of making the same
David Neuman, Randolph, MN (US); and Scott Lindblad, Lakeville, MN (US)
Assigned to Automated Assembly Corporation, Lakeville, MN (US)
Filed by AUTOMATED ASSEMBLY CORPORATION, Lakeville, MN (US)
Filed on Jun. 24, 2015, as Appl. No. 14/749,214.
Int. Cl. H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01); H05K 3/00 (2006.01)
CPC H05K 1/189 (2013.01) [H05K 1/0313 (2013.01); H05K 1/0393 (2013.01); H05K 1/181 (2013.01); H05K 3/0026 (2013.01); H05K 3/305 (2013.01); H05K 3/341 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/049 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A circuit arrangement, comprising:
a substrate having first bond pads coupled to a pattern of conductors, wherein the first bond pads and the pattern of conductors are disposed on a first surface of the substrate;
a first layer of adhesive disposed directly on the first surface of the substrate and the pattern of conductors, the first layer of adhesive having openings at the first bond pads, opposing first and second surfaces, and the openings extending from the first surface of the first layer of adhesive to the second surface of the first layer of adhesive;
an electronic device having opposing first and second surfaces, the electronic device attached to the first surface of the substrate by the first surface of the electronic device in contact with the first layer of adhesive, and the second surface of the electronic device having second bond pads;
bond wires connected at the first bond pads through the openings in the first layer of adhesive and connected at the second bond pads, wherein portions of the bond wires are disposed directly on the first layer of adhesive; and
a second layer of adhesive disposed directly on the electronic device, bond wires, and first layer of adhesive and covering the openings in the first layer of adhesive.