US 9,814,140 B2
Printed circuit board edge connector
Brian Samuel Beaman, Apex, NC (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Apr. 5, 2016, as Appl. No. 15/90,730.
Application 14/106,120 is a division of application No. 12/769,259, filed on Apr. 28, 2010, granted, now 8,677,617, issued on Mar. 25, 2014.
Application 15/090,730 is a continuation of application No. 14/106,120, filed on Dec. 13, 2013, granted, now 9,549,469.
Prior Publication US 2016/0249454 A1, Aug. 25, 2016
Int. Cl. H05K 1/00 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H01R 12/72 (2011.01)
CPC H05K 1/117 (2013.01) [H05K 3/403 (2013.01); H01R 12/721 (2013.01); H05K 2201/09145 (2013.01); H05K 2201/09909 (2013.01); H05K 2201/10863 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49155 (2015.01); Y10T 29/49156 (2015.01)] 4 Claims
OG exemplary drawing
1. A printed circuit board having at least one electrically conductive path, the printed circuit board comprising:
a top surface,
a bottom surface and the printed circuit board having a thickness between the top surface and bottom surface and a thickness midpoint at one half of the thickness,
at least one rounded edge portion having at least a rounded surface portion extending from the top surface to the bottom surface,
a first layer attached to the printed circuit board top surface, rounded edge portion and bottom surface and including at least one opening exposing at least one contact pad located upon the top surface and within the one first layer opening and the opening extending over a portion of the rounded surface portion ending at a point on or before the thickness midpoint, the at least one contact pad electrically connecting a conductive path of the printed circuit board.