US 9,814,139 B2
Mounting substrate, manufacturing method for the same, and component mounting method
Toshihiko Watanabe, Tokyo (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 15/124,499
Filed by Sony Corporation, Tokyo (JP)
PCT Filed Feb. 27, 2015, PCT No. PCT/JP2015/055785
§ 371(c)(1), (2) Date Sep. 8, 2016,
PCT Pub. No. WO2015/146476, PCT Pub. Date Oct. 1, 2015.
Claims priority of application No. 2014-065302 (JP), filed on Mar. 27, 2014.
Prior Publication US 2017/0019996 A1, Jan. 19, 2017
Int. Cl. H05K 1/16 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 1/03 (2006.01); H01L 33/48 (2010.01)
CPC H05K 1/116 (2013.01) [H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H05K 1/112 (2013.01); H05K 3/0094 (2013.01); H05K 3/3436 (2013.01); H05K 3/3447 (2013.01); H05K 3/3489 (2013.01); H05K 3/4007 (2013.01); H05K 3/42 (2013.01); H01L 33/48 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2924/1531 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 2201/0959 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/09863 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10484 (2013.01); H05K 2203/1383 (2013.01); H05K 2203/1394 (2013.01); Y02P 70/613 (2015.11)] 20 Claims
OG exemplary drawing
 
1. A mounting substrate comprising:
a through-hole configured to be formed in a substrate;
a first land part configured to be formed on a first surface of the substrate and surround the through-hole;
a second land part configured to be formed on a second surface of the substrate opposed to the first surface and surround the through-hole;
a first component attaching part configured to be formed on the first surface of the substrate and be connected to the first land part;
a second component attaching part configured to be formed on the second surface of the substrate and be connected to the second land part;
a conductive layer configured to be formed on an inner wall of the through-hole and communicate the first land part with the second land part; and
a filling member configured to be filled into a part of the through-hole, wherein
a shortest distance allowable value from the center of the first land part to a component is determined on the basis of a volume of a part of the through-hole positioned above a top surface of the filling member on the side of the first land part, a length of a component to be mounted to the first component attaching part, and an inclination of the component to be mounted to the first component attaching part relative to the first surface of the substrate.