US 9,814,138 B2
Wiring substrate
Kyota Yamamura, Nagano (JP)
Assigned to Shinko Electric Industries Co., Ltd., (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, Nagano-ken (JP)
Filed on Nov. 18, 2016, as Appl. No. 15/355,757.
Claims priority of application No. 2015-229511 (JP), filed on Nov. 25, 2015.
Prior Publication US 2017/0150603 A1, May 25, 2017
Int. Cl. H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 3/42 (2006.01); H05K 3/06 (2006.01); H05K 3/22 (2006.01)
CPC H05K 1/115 (2013.01) [H05K 1/09 (2013.01); H05K 3/06 (2013.01); H05K 3/061 (2013.01); H05K 3/227 (2013.01); H05K 3/423 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A wiring substrate comprising:
a first wiring layer;
a first insulation layer covering the first wiring layer and including a via hole that exposes a portion of an upper surface of the first wiring layer; and
a second wiring layer including a wiring pattern and a via, wherein the wiring pattern is formed on an upper surface of the first insulation layer, and the via is formed in the via hole to electrically connect the wiring pattern and the first wiring layer, wherein
the via includes
a via seed layer formed on a wall surface of the first insulation layer that defines the via hole, and
a filled portion formed in the via hole in which the via seed layer is formed, wherein the via hole is filled with the filled portion,
the wiring pattern includes
a wiring seed layer formed on the upper surface of the first insulation layer, and
a pattern layer formed on the wiring seed layer, wherein the pattern layer covers both of the wiring seed layer and the filled portion of the via,
the via seed layer is formed from a metal material that acts to adsorb a plating enhancement agent which enhances formation of the filled portion and the pattern layer in an electrolytic plating solution, and
the wiring seed layer is formed from a metal material that does not act to adsorb the plating enhancement agent as compared to the via seed layer.