US 9,814,137 B2
Wiring board and method of manufacturing same
Ryota Asai, Kyoto (JP)
Assigned to Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Apr. 22, 2016, as Appl. No. 15/135,638.
Application 15/135,638 is a continuation of application No. PCT/JP2014/074616, filed on Sep. 18, 2014.
Claims priority of application No. 2013-221127 (JP), filed on Oct. 24, 2013.
Prior Publication US 2016/0242286 A1, Aug. 18, 2016
Int. Cl. H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/28 (2006.01); H05K 3/24 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/10 (2006.01)
CPC H05K 1/115 (2013.01) [H05K 1/0298 (2013.01); H05K 1/0306 (2013.01); H05K 1/038 (2013.01); H05K 1/09 (2013.01); H05K 3/108 (2013.01); H05K 3/244 (2013.01); H05K 3/28 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0391 (2013.01); H05K 2201/099 (2013.01); H05K 2201/09909 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A wiring board comprising:
an insulating layer;
a base electrode layer layered upon a predetermined region of one primary surface of the insulating layer;
an insulating covering layer layered upon the one primary surface of the insulating layer in a state covering at least part of an edge portion of the base electrode layer; and
a surface electrode layer plated on an exposed portion of the base electrode layer that is not covered by the insulating covering layer,
wherein the covered portion of the base electrode layer covered by the insulating covering layer is formed so as to be thinner than the exposed portion,
wherein the covered portion of the base electrode layer has a pattern that is T-shaped when viewed in plan view; and
a leg portion of the T-shaped pattern is connected to an edge portion of the exposed portion.