US 9,814,136 B2
Wiring board, mounting structure equipped with the wiring board, and method for manufacturing wiring board
Katsura Hayashi, Kyoto (JP); and Keisaku Matsumoto, Kyoto (JP)
Assigned to KYOCERA CORPORATION, Kyoto-shi, Kyoto (JP)
Appl. No. 14/417,592
Filed by KYOCERA Corporation, Kyoto-shi, Kyoto (JP)
PCT Filed Jul. 25, 2013, PCT No. PCT/JP2013/070173
§ 371(c)(1), (2) Date Jan. 27, 2015,
PCT Pub. No. WO2014/021186, PCT Pub. Date Feb. 6, 2014.
Claims priority of application No. 2012-171186 (JP), filed on Aug. 1, 2012; and application No. 2012-198256 (JP), filed on Sep. 10, 2012.
Prior Publication US 2015/0305154 A1, Oct. 22, 2015
Int. Cl. H05K 1/00 (2006.01); H05K 1/11 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H01L 23/14 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01)
CPC H05K 1/112 (2013.01) [H01L 23/145 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H05K 1/0298 (2013.01); H05K 1/181 (2013.01); H05K 3/4602 (2013.01); H05K 3/4655 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15174 (2013.01); H05K 2201/0175 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/029 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0269 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A wiring board, comprising:
a core substrate;
the core substrate including a base body and a first electrically-conductive layer disposed on a main surface of the base body,
the base body including a resin portion, a base material covered with the resin portion, and a plurality of inorganic insulating particles dispersed in the resin portion,
the base body having a first layer region including the base material, and a second layer region located on a main surface of the first layer region, and the second layer region being in contact with the first electrically-conductive layer and the second layer region being disposed between the first layer region and the first electrically-conductive layer,
the plurality of inorganic insulating particles including a plurality of first inorganic insulating particles contained in the first layer region, and a plurality of second inorganic insulating particles contained in the second layer region,
a content rate of the first inorganic insulating particles in the first layer region being lower than a content rate of the second inorganic insulating particles in the second layer region,
wherein an average particle size of the plurality of second inorganic insulating particles is greater than an average particle size of the plurality of first inorganic insulating particles.