US 9,814,135 B2
Printed wiring board and method for manufacturing the same
Takenobu Nakamura, Ogaki (JP)
Assigned to IBIDEN CO., LTD., Ogaki (JP)
Filed by IBIDEN CO., LTD., Ogaki (JP)
Filed on Sep. 12, 2014, as Appl. No. 14/484,675.
Claims priority of application No. 2013-189800 (JP), filed on Sep. 12, 2013.
Prior Publication US 2015/0068791 A1, Mar. 12, 2015
Int. Cl. H05K 1/11 (2006.01); H05K 3/34 (2006.01)
CPC H05K 1/111 (2013.01) [H05K 1/113 (2013.01); H05K 3/3452 (2013.01); H05K 2201/09381 (2013.01); Y02P 70/611 (2015.11); Y10T 29/4916 (2015.01)] 10 Claims
OG exemplary drawing
 
1. A wiring board, comprising:
a substrate;
a plurality of pads formed on an electronic-component mounting surface of the substrate; and
a resin insulation layer covering the electronic-component mounting surface and having a plurality of opening portions such that the plurality of opening portions is exposing the plurality of pads, respectively,
wherein the plurality of pads includes a non-solder mask defined pad having a wiring portion and a non-solder mask defined pad having no wiring portion, and the plurality of opening portions is formed such that the non-solder mask defined pads have exposed conductor areas which have substantially same areas inside the opening portions.