US 9,814,134 B2
Elastic flexible substrate and manufacturing method thereof
Daisuke Wakuda, Osaka (JP); Tetsuyoshi Ogura, Osaka (JP); and Takashi Matsumoto, Osaka (JP)
Assigned to PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka (JP)
Filed by Panasonic Intellectual Property Management Co., Ltd., Osaka (JP)
Filed on Feb. 20, 2015, as Appl. No. 14/626,935.
Claims priority of application No. 2014-073566 (JP), filed on Mar. 31, 2014.
Prior Publication US 2015/0282294 A1, Oct. 1, 2015
Int. Cl. H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01)
CPC H05K 1/028 (2013.01) [H05K 1/0274 (2013.01); H05K 1/115 (2013.01); H05K 1/118 (2013.01); H05K 1/181 (2013.01); H05K 3/103 (2013.01); H05K 1/189 (2013.01); Y10T 29/49162 (2015.01)] 18 Claims
OG exemplary drawing
 
1. An elastic flexible substrate comprising:
a base made of insulating material, the insulating base having a first insulating film and a second insulating film, and
a plurality of wires, each of which is disposed on one of the first insulating film or the second insulating film,
wherein:
the first insulating film and the second insulating film have a plurality of bonding portions where the first insulating film and the second insulating film are surface-bonded to one another,
each of the plurality of wires being disposed in at least one of the plurality of bonding portions;
a plurality of openings are formed by the first insulating film, the second insulating film and the bonding portions, each of the plurality of openings being wholly enclosed by the first insulating film, the second insulating film and the bonding portions when viewed in plan, and
two of the plurality of wires are electrically connected in the bonding portions.