US 9,814,131 B2
Interconnection substrate
Yusuke Uemichi, Sakura (JP)
Assigned to FUJIKURA LTD., Koto-ku, Tokyo (JP)
Filed by FUJIKURA LTD., Koto-ku, Tokyo (JP)
Filed on Dec. 29, 2014, as Appl. No. 14/584,471.
Application 14/584,471 is a continuation of application No. PCT/JP2013/073665, filed on Sep. 3, 2013.
Claims priority of application No. 2012-197388 (JP), filed on Sep. 7, 2012.
Prior Publication US 2015/0107888 A1, Apr. 23, 2015
Int. Cl. H01B 17/16 (2006.01); H05K 1/02 (2006.01); H04L 25/02 (2006.01); H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/44 (2006.01)
CPC H05K 1/0251 (2013.01) [H04L 25/0272 (2013.01); H05K 1/0216 (2013.01); H05K 1/0245 (2013.01); H05K 1/115 (2013.01); H05K 3/4038 (2013.01); H05K 3/445 (2013.01); H05K 2201/09854 (2013.01); Y10T 29/49165 (2015.01)] 5 Claims
OG exemplary drawing
 
1. An interconnection substrate, comprising:
a substrate having a first surface and a second surface opposite the first surface;
a thermal relaxation resin provided on the first surface; and
a transmission line including two parallel surface wirings formed on the thermal relaxation resin and two parallel through-hole interconnections, the two parallel through-hole interconnections being exposed to the first and second surfaces and being formed inside the substrate, and one of the two parallel through-hole interconnections being electrically connected to one of the two surface wirings and an other of the two parallel through-hole interconnections being electrically connected to an other of the two surface wirings, wherein
at least one of the two through-hole interconnections includes a narrow portion having a smaller diameter than a diameter of the through-hole interconnection in the first surface and a diameter of the through-hole interconnection in the second surface, and
the two surface wirings are connected to respective through-hole interconnections through a pitch adjusting portion configured to adjust each wiring pitch.