US 9,814,129 B2
Printed circuit board and method of fabricating the same
Yong Seok Cho, Seoul (KR); and Chang Sung Kim, Seoul (KR)
Assigned to LG INNOTEK CO., LTD., Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Jun. 16, 2016, as Appl. No. 15/184,511.
Application 15/184,511 is a division of application No. 14/368,198, previously published as PCT/KR2012/006671, filed on Aug. 22, 2012.
Claims priority of application No. 10-2011-0141772 (KR), filed on Dec. 23, 2011.
Prior Publication US 2016/0295684 A1, Oct. 6, 2016
Int. Cl. H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01); H05K 3/28 (2006.01)
CPC H05K 1/0203 (2013.01) [H05K 1/0209 (2013.01); H05K 1/09 (2013.01); H05K 3/4644 (2013.01); H05K 1/0227 (2013.01); H05K 3/28 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09881 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A printed circuit board comprising:
an insulating layer;
a circuit pattern disposed on the insulating layer and formed therein with a first opening section to expose a portion of a top surface of the insulating layer;
a solder resist on a top surface of the circuit pattern and formed therein with a second opening section to expose the portion of the top surface of the insulating layer and the first opening section of the circuit pattern; and
a thermal conductive layer filled in the first opening section and the second opening section,
wherein the thermal conductive layer has a height equal to a sum of a height of the circuit pattern and a height of the solder resist,
wherein a top surface of the thermal conductive layer and a top surface of the solder resist are disposed on a same plane,
wherein the first opening section is not filled with the solder resist,
wherein the thermal conductive layer is not contacted with the top surface of the circuit pattern, and
wherein the solder resist is not contacted with the insulating layer.