US 9,814,097 B2
Baking apparatus for priming substrate
Chien-Hung Wang, Toufen Township (TW); Ren-Jyh Leu, Hsinchu (TW); Shang-Wern Chang, Zhubei (TW); and Heng-Hsin Liu, New Taipei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Apr. 14, 2014, as Appl. No. 14/252,578.
Prior Publication US 2015/0296563 A1, Oct. 15, 2015
Int. Cl. H05B 3/06 (2006.01); H05B 1/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H05B 1/0233 (2013.01) [H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/6875 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A baking apparatus for priming a substrate, comprising:
a chamber;
a hot plate in the chamber, configured to bake the substrate on the hot plate; and
a barrier element between the substrate and the hot plate, wherein the barrier element comprises a central portion and a peripheral portion laterally surrounding the central portion, and the central portion of the barrier element is not in contact with the substrate, and the peripheral portion of the barrier element is configured to be in contact with a side surface of the substrate and the hot plate, but not in contact with a lower surface of the substrate, so as to prevent contamination on the lower surface of the substrate, wherein the barrier element is made of polyimide or silicone.