US 9,813,802 B2
Resonance damping for audio transducer systems
Shengrong Shi, San Diego, CA (US)
Assigned to Nokia Technologies Oy, Espoo (FI)
Appl. No. 14/432,358
Filed by Nokia Technologies Oy, Espoo (FI)
PCT Filed Oct. 18, 2012, PCT No. PCT/CN2012/083129
§ 371(c)(1), (2) Date Mar. 30, 2015,
PCT Pub. No. WO2014/059638, PCT Pub. Date Apr. 24, 2014.
Prior Publication US 2015/0256922 A1, Sep. 10, 2015
Int. Cl. H04R 1/02 (2006.01); H04R 1/20 (2006.01); H04R 1/28 (2006.01)
CPC H04R 1/20 (2013.01) [H04R 1/2842 (2013.01); H04R 1/2819 (2013.01); H04R 1/2888 (2013.01); H04R 2499/11 (2013.01)] 24 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a speaker system wherein the speaker system comprises:
an audio transducer configured to generate sound;
a housing component of the apparatus comprising one or more sound outlets configured to allow the transmission of sound in a first direction out of the apparatus, a second housing component comprising one or more sound apertures comprising capillaries configured to allow the transmission of sound from the audio transducer in a second direction different from the first direction and through the one or more sound apertures, wherein the audio transducer is located between the one or more sound outlets and the one or more sound apertures; and
an acoustic cavity of the speaker system inside the apparatus being acoustically coupled to the audio transducer using the one or more sound apertures wherein the one or more sound apertures are configured to provide an acoustic damping;
wherein the apparatus comprises at least one processor configured to execute operations of the apparatus.