US 9,813,790 B1
Microphone package
Rui Zhang, Shenzhen (CN); and Ting Kang, Shenzhen (CN)
Assigned to AAC TECHNOLOGIES PTE. LTD., Singapore (SG)
Filed by Rui Zhang, Shenzhen (CN); and Ting Kang, Shenzhen (CN)
Filed on Jan. 26, 2017, as Appl. No. 15/416,101.
Claims priority of application No. 2016 2 1163372 U (CN), filed on Oct. 25, 2016.
Int. Cl. H04R 1/02 (2006.01); H04R 1/06 (2006.01); H04R 19/04 (2006.01)
CPC H04R 1/028 (2013.01) [H04R 1/06 (2013.01); H04R 19/04 (2013.01); H04R 2201/003 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A microphone package, including:
a housing;
a control circuit chip accommodated in the housing;
a micro-electromechanical chip accommodated in the housing;
a circuit board forming an accommodation space with the housing, and including a substrate, a rigid conductive layer disposed on the substrate and a plurality of conductive pads on the substrate for connecting to the control circuit chip; wherein
the micro-electromechanical chip and the control circuit chip are mounted on the rigid conductive layer, and the rigid conductive layer is provided with a plurality of isolation holes for receiving the conductive pads.