US 9,813,595 B2
Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same
Shigeru Tago, Nagaokakyo (JP); Hirofumi Shinagawa, Nagaokakyo (JP); Jerry Hsieh, Nagaokakyo (JP); Satoshi Sasaki, Nagaokakyo (JP); Jun Sasaki, Nagaokakyo (JP); Nobuo Ikemoto, Nagaokakyo (JP); and Yuki Wakabayashi, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu (JP)
Filed on Aug. 31, 2015, as Appl. No. 14/840,103.
Application 14/840,103 is a continuation of application No. PCT/JP2014/055912, filed on Mar. 7, 2014.
Claims priority of application No. 2013-044844 (JP), filed on Mar. 7, 2013; application No. 2013-114136 (JP), filed on May 30, 2013; and application No. PCT/JP2014/052026 (WO), filed on Jan. 30, 2014.
Prior Publication US 2015/0373238 A1, Dec. 24, 2015
Int. Cl. H04N 5/225 (2006.01)
CPC H04N 5/2253 (2013.01) [H04N 5/2254 (2013.01); H04N 5/2257 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A camera module comprising:
a multilayer base body with a flat film configuration, and including a plurality of flexible base material layers;
an image sensor IC including a light receiving element;
a lens unit that condenses light to the light receiving element;
peripheral circuit components that are connected to the image sensor IC and the lens unit; and
a connector element configured to provide connection to outside; wherein
the multilayer base body includes a first mounting portion, a second mounting portion, and a connecting portion interconnecting the first mounting portion and the second mounting portion, integrated together when looked at in a plan view;
the multilayer base body includes a cavity in a first principal surface of the first mounting portion, and a penetration hole that penetrates from an inner bottom surface of the cavity to a second principal surface of the first mounting portion;
the image sensor IC is arranged in the cavity with the light receiving element directed toward the second principal surface of the first mounting portion;
the lens unit is arranged at a second principal surface side of the multilayer base body to be optically coupled to the light receiving element through the penetration hole;
at least one of the peripheral circuit components is incorporated in a portion of the plurality of flexible base material layers of the first mounting portion of the multilayer base body;
the portion of the plurality of flexible base material layers of the first mounting portion defines a sidewall of the cavity;
each of the plurality of flexible base material layers in the portion are made of the same material;
the connector element is arranged in the second mounting portion; and
the first mounting portion is thicker than the connecting portion.