US 9,813,594 B2
Photon-drive fingerprint identification module
Jen-Chieh Wu, Hsinchu (TW); and Chun-Lang Hung, Taichung (TW)
Assigned to Gingy Technology Inc., Hsinchu (TW)
Filed by Gingy Technology Inc., Hsinchu (TW)
Filed on Apr. 29, 2015, as Appl. No. 14/700,104.
Claims priority of application No. 104102836 A (TW), filed on Jan. 28, 2015.
Prior Publication US 2016/0219195 A1, Jul. 28, 2016
Int. Cl. G06K 9/74 (2006.01); H04N 5/225 (2006.01); G06K 9/00 (2006.01); G06K 9/20 (2006.01)
CPC H04N 5/2252 (2013.01) [G06K 9/0004 (2013.01); G06K 9/00013 (2013.01); G06K 9/00033 (2013.01); G06K 9/00087 (2013.01); G06K 9/209 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A photon-drive fingerprint identification module, configured to detect a fingerprint of a finger, the photon-drive fingerprint identification module comprising:
at least a light emitting unit, configured to emit a detecting light to the finger, wherein the finger and the fingerprint reflect the detecting light and turn the detecting light into a signal light; and
a light detecting semiconductor array, comprising a plurality of light detecting semiconductor units arranged in an array, wherein the light detecting semiconductor units are configured to receive the signal light reflected by the finger and generate a plurality of electric signals, each of the light detecting semiconductor units sequentially comprises an antireflection structure, a first type doped semiconductor layer and a second type doped semiconductor layer from a side close to the finger, wherein the first type doped semiconductor layer is stacked between the antireflection structure and the second type doped semiconductor layer, and the antireflection structure is disposed at a surface of the first type doped semiconductor layer.