US 9,813,161 B2
Method and system for photonic interposer
Mark Peterson, San Diego, CA (US); Greg Young, Irvine, CA (US); and Peter De Dobbelaere, San Diego, CA (US)
Assigned to Luxtera, Inc., Carlsbad, CA (US)
Filed by Luxtera, Inc., Carlsbad, CA (US)
Filed on May 26, 2016, as Appl. No. 15/165,677.
Application 15/165,677 is a continuation of application No. 14/475,484, filed on Sep. 2, 2014, granted, now 9,356,701.
Application 14/475,484 is a continuation of application No. 13/422,776, filed on Mar. 16, 2012, granted, now 8,831,437, issued on Sep. 9, 2014.
Application 13/422,776 is a continuation in part of application No. 12/554,449, filed on Sep. 4, 2009, granted, now 8,877,616, issued on Nov. 4, 2014.
Claims priority of provisional application 61/191,479, filed on Sep. 8, 2008.
Claims priority of provisional application 61/199,353, filed on Nov. 14, 2008.
Claims priority of provisional application 61/516,226, filed on Mar. 30, 2011.
Prior Publication US 2016/0277115 A1, Sep. 22, 2016
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 10/43 (2013.01); H04B 10/70 (2013.01); H04B 10/80 (2013.01); G02B 6/122 (2006.01); G02B 6/12 (2006.01); H01L 23/498 (2006.01); H01L 21/84 (2006.01); H01L 27/12 (2006.01); H01L 25/16 (2006.01)
CPC H04B 10/43 (2013.01) [G02B 6/1225 (2013.01); H01L 21/84 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 25/167 (2013.01); H01L 27/1203 (2013.01); H04B 10/70 (2013.01); H04B 10/801 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12142 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for communication, the method comprising:
in an integrated optical communication system comprising one or more complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer:
receiving one or more continuous wave (CW) optical signals in said silicon photonic interposer from an optical source external to said silicon photonic interposer;
generating a modulated optical signal in said silicon photonic interposer by processing said one or more received CW optical signals based on a first electrical signal received from one of said one or more CMOS electronics die;
generating a second electrical signal in said silicon photonic interposer based on said generated modulated optical signal; and
communicating said second electrical signal to another of said one or more CMOS electronics die.