US 9,813,152 B2
Method and system for optoelectronics transceivers integrated on a CMOS chip
Thierry Pinguet, Cardiff-by-the-Sea, CA (US); Steffen Gloeckner, San Diego, CA (US); Sherif Abdalla, Carlsbad, CA (US); Sina Mirsaidi, San Diego, CA (US); Peter De Dobbelaere, San Diego, CA (US); and Lawrence C. Gunn, III, Encinitas, CA (US)
Assigned to Luxtera, Inc., Carlsbad, CA (US)
Filed by Thierry Pinguet, Cardiff-by-the-Sea, CA (US); Steffen Gloeckner, San Diego, CA (US); Sherif Abdalla, Carlsbad, CA (US); Sina Mirsaidi, San Diego, CA (US); Peter De Dobbelaere, San Diego, CA (US); and Lawrence C. Gunn, III, Encinitas, CA (US)
Filed on Sep. 30, 2008, as Appl. No. 12/241,961.
Application 12/241,961 is a continuation in part of application No. 11/611,084, filed on Dec. 14, 2006, granted, now 7,773,836.
Application 11/611,084 is a continuation in part of application No. 10/758,561, filed on Jan. 14, 2004, granted, now 7,251,386.
Application 10/758,561 is a continuation in part of application No. 10/799,040, filed on Mar. 11, 2004, granted, now 7,162,124.
Application 10/799,040 is a continuation in part of application No. 10/917,204, filed on Aug. 11, 2004, granted, now 7,116,853.
Application 10/917,204 is a continuation in part of application No. 11/384,019, filed on Mar. 17, 2006, granted, now 7,298,945.
Claims priority of provisional application 61/057,127, filed on May 29, 2008.
Claims priority of provisional application 60/997,298, filed on Oct. 2, 2007.
Claims priority of provisional application 60/750,488, filed on Dec. 14, 2005.
Prior Publication US 2009/0022500 A1, Jan. 22, 2009
Prior Publication US 2013/0094865 A9, Apr. 18, 2013
Int. Cl. H04B 10/25 (2013.01); G02B 6/122 (2006.01); G02B 6/124 (2006.01); G02B 6/43 (2006.01); G02B 6/42 (2006.01)
CPC H04B 10/25 (2013.01) [G02B 6/124 (2013.01); G02B 6/1228 (2013.01); G02B 6/43 (2013.01); G02B 6/4214 (2013.01)] 26 Claims
OG exemplary drawing
 
1. A method for processing signals, the method comprising:in a CMOS chip comprising photonics devices and electronics devices that were fabricated using a CMOS process,
receiving optical signals from one or more optical fibers via optical couplers on a top surface of said CMOS chip;
converting said optical signals to electrical signals via one or more photodetectors integrated in said CMOS chip;
processing said electrical signals using circuitry in said CMOS chip;
receiving a continuous-wave (CW) optical signal from a laser source via optical couplers on said top surface of said CMOS chip;
modulating said received CW optical signal using one or more optical modulators integrated in said CMOS chip;
receiving electrical signals from circuitry in said CMOS chip;
driving said one or more optical modulators using said received electrical signals; and
communicating said modulated optical signal out of said top surface of said CMOS chip into one or more optical fibers via one or more optical couplers integrated in said CMOS chip.