US 9,813,093 B2
Broadcast signal receiving apparatus and multi-layer printed circuit board
Hyun-Jun Kim, Seoul (KR); Sung-soo Lee, Suwon-si (KR); Hwan-sun Hong, Suwon-si (KR); Ja-hun Lee, Hwaseong-si (KR); and Cheol-hee Lee, Yongin-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Jun. 10, 2016, as Appl. No. 15/179,157.
Claims priority of application No. 10-2015-0082024 (KR), filed on Jun. 10, 2015.
Prior Publication US 2016/0365882 A1, Dec. 15, 2016
Int. Cl. H04B 1/10 (2006.01); H04B 1/16 (2006.01)
CPC H04B 1/109 (2013.01) [H04B 1/16 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A broadcast signal receiving apparatus comprising:
a multi-layer printed circuit board comprising a transmission line configured to connect with at least one component mounted on the multi-layer printed circuit board, the at least one component being configured to process a broadcast signal received from an outside of the apparatus through a cable,
wherein a signal line for receiving the broadcast signal is at least partially provided on an inner layer of the multi-layer printed circuit board,
wherein an impedance of the inner layer where the signal line is provided is a predetermined reference value configured to decrease distortion of the broadcast signal due to interference with an external signal.