US 9,813,043 B2
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods
Chengjie Zuo, Santee, CA (US); Daeik D. Kim, Del Mar, CA (US); Je-Hsiung Lan, San Diego, CA (US); Jonghae Kim, San Diego, CA (US); Mario Francisco Velez, San Diego, CA (US); Changhan Yun, San Diego, CA (US); David F. Berdy, San Diego, CA (US); Robert P. Mikulka, Oceanside, CA (US); Matthew M. Nowak, San Diego, CA (US); Xiangdong Zhang, Westford, MA (US); and Puay H. See, San Diego, CA (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Mar. 24, 2016, as Appl. No. 15/79,789.
Application 15/079,789 is a continuation of application No. 13/887,568, filed on May 6, 2013.
Prior Publication US 2016/0204758 A1, Jul. 14, 2016
Int. Cl. H03H 7/46 (2006.01); H03H 3/00 (2006.01); H03H 7/01 (2006.01)
CPC H03H 7/461 (2013.01) [H03H 3/00 (2013.01); H03H 7/0115 (2013.01); H03H 7/463 (2013.01); Y10T 29/49016 (2015.01)] 23 Claims
OG exemplary drawing
 
1. A three-dimensional (3D) integrated circuit (IC) (3DIC), comprising a tunable diplexer comprising:
a first tier comprising a first substrate and at least one through substrate via inductor formed in the first substrate; and
a second tier comprising a second substrate and at least one varactor coupled to the at least one through substrate via inductor,
the at least one through substrate via inductor and the at least one varactor collectively forming the tunable diplexer.