US 9,812,989 B1
Isolated power transfer device
Timothy J. Dupuis, Austin, TX (US)
Assigned to Silicon Laboratories Inc., Austin, TX (US)
Filed by Silicon Laboratories Inc., Austin, TX (US)
Filed on Sep. 20, 2016, as Appl. No. 15/270,470.
Int. Cl. H02M 7/537 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 23/66 (2006.01); H01L 21/48 (2006.01); H01L 25/00 (2006.01); H03F 3/195 (2006.01); H03F 3/213 (2006.01); G01R 19/18 (2006.01)
CPC H02M 7/537 (2013.01) [G01R 19/18 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49844 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H01L 2223/665 (2013.01); H01L 2223/6616 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/14253 (2013.01); H03F 2200/451 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
an integrated circuit package comprising:
a multi-layer substrate;
a first conductive coil formed using the multi-layer substrate; and
a second conductive coil formed using the multi-layer substrate, the second conductive coil being inductively coupled to the first conductive coil and electrically isolated from the first conductive coil;
a first integrated circuit die held by the integrated circuit package and electrically coupled to the first conductive coil; and
a second integrated circuit die held by the integrated circuit package, the second integrated circuit die being electrically coupled to the second conductive coil and electrically isolated from the first integrated circuit die,
wherein the first conductive coil is configured to transfer power via the second conductive coil from the first integrated circuit die to the second integrated circuit die.