US 9,812,842 B2
Hybrid optical source with optical proximity coupling provided by an external reflector
Ivan Shubin, San Diego, CA (US); Xuezhe Zheng, San Diego, CA (US); Jin Yao, San Diego, CA (US); Jin-Hyoung Lee, San Diego, CA (US); Jock T. Bovington, La Jolla, CA (US); Shiyun Lin, San Diego, CA (US); and Ashok V. Krishnamoorthy, San Diego, CA (US)
Assigned to Oracle International Corporation, Redwood Shores, CA (US)
Filed by Oracle International Corporation, Redwood Shores, CA (US)
Filed on Jun. 22, 2016, as Appl. No. 15/189,598.
Claims priority of provisional application 62/321,386, filed on Apr. 12, 2016.
Prior Publication US 2017/0294760 A1, Oct. 12, 2017
Int. Cl. H01S 3/08 (2006.01); H01S 5/026 (2006.01); H01S 5/30 (2006.01); H01S 5/12 (2006.01); H01S 5/02 (2006.01); H01S 5/10 (2006.01); H01S 5/022 (2006.01); H01S 5/14 (2006.01)
CPC H01S 5/026 (2013.01) [H01S 5/0201 (2013.01); H01S 5/021 (2013.01); H01S 5/0202 (2013.01); H01S 5/0228 (2013.01); H01S 5/1014 (2013.01); H01S 5/1028 (2013.01); H01S 5/12 (2013.01); H01S 5/14 (2013.01); H01S 5/141 (2013.01); H01S 5/3013 (2013.01); H01S 5/1092 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A hybrid optical source, comprising:
an optical gain chip including an optical gain material that provides an optical signal;
an optical reflector chip including an optical reflector that is optically coupled to the optical gain chip to reflect the optical signal; and
a semiconductor-on-insulator (SOI) chip optically coupled to the optical reflector, wherein the SOI chip includes a semiconductor layer having a planarized surface facing the semiconductor reflector, wherein the semiconductor layer includes,
an optical coupler to redirect the optical signal to and from the planarized surface of the semiconductor layer, and
an optical waveguide to convey the optical signal from the optical coupler; and
wherein when the optical gain chip, the optical reflector chip and the SOI chip are assembled, a height of the optical gain material in the optical gain chip is referenced against the planarized surface of the semiconductor layer, a height of the optical reflector in the optical reflector chip is referenced against the planarized surface of the semiconductor layer, and the optical reflector is aligned with the optical coupler, so that the optical signal emanating from the optical gain material reflects off of the optical reflector and into the optical coupler.