US 9,812,804 B2
Pogo-pins for high speed signaling
Hao-Han Hsu, Portland, OR (US); Yun Ling, Portland, OR (US); and Xiang Li, Portland, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Mar. 27, 2014, as Appl. No. 14/227,009.
Prior Publication US 2015/0280343 A1, Oct. 1, 2015
Int. Cl. G01R 31/20 (2006.01); H01R 13/24 (2006.01); H01R 13/6583 (2011.01); H01R 12/72 (2011.01); H01R 13/453 (2006.01)
CPC H01R 13/2421 (2013.01) [H01R 13/6583 (2013.01); H01R 12/724 (2013.01); H01R 13/4538 (2013.01); H01R 2201/06 (2013.01); Y10T 29/49222 (2015.01)] 18 Claims
OG exemplary drawing
1. An apparatus comprising:
a first component including a contact surface;
a second component including a housing;
a pogo-pin mounted in said housing to make resilient electrical contact with said first component via said contact surface; and
a conductive electromagnetic shield completely surrounding said pogo-pin when making resilient electrical contact with said contact surface and mounted on said housing for telescoping reciprocation into and out of said housing, said shield having an opening that, when resilient electrical contact is made with said surface, contacts said surface to complete an enclosure that completely surrounds said pogo pin, said enclosure including said contact surface, said housing and said shield, such that a totally shielded electrical connection is made between said first and second components.