US 9,812,768 B2
Antenna device and manufacturing method thereof
Byeong-Hwan Youm, Suwon-si (KR); Gi-Uk Gang, Suwon-si (KR); Kyung-Bin Kim, Hwaseong-si (KR); Seung-Hwan Kim, Seoul (KR); Austin Kim, Seongnam-si (KR); and Joon-Ho Byun, Seongnam-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-do (KR)
Filed on Sep. 11, 2015, as Appl. No. 14/851,580.
Claims priority of application No. 10-2014-0121215 (KR), filed on Sep. 12, 2014.
Prior Publication US 2016/0079663 A1, Mar. 17, 2016
Int. Cl. H01Q 1/24 (2006.01); H01Q 1/40 (2006.01); B29C 45/16 (2006.01); B29K 69/00 (2006.01); B29L 31/34 (2006.01); H04M 1/02 (2006.01)
CPC H01Q 1/40 (2013.01) [B29C 45/1671 (2013.01); H01Q 1/243 (2013.01); B29C 2045/1673 (2013.01); B29K 2069/00 (2013.01); B29K 2995/0025 (2013.01); B29K 2995/0026 (2013.01); B29L 2031/3437 (2013.01); B29L 2031/3456 (2013.01); B29L 2031/3481 (2013.01); H04M 1/026 (2013.01)] 10 Claims
OG exemplary drawing
 
1. An antenna device comprising:
a base member;
an antenna that is attached to the base member; and
a cover member that is attached to surround at least a part of the base member and at least a part of the antenna,
wherein a first part of the base member that is attached to the cover member has a melting temperature equal to or lower than that of the cover member, and
a second part of the base member to which the antenna is attached has a higher melting temperature than the cover member.