US 9,812,752 B2
Flip-chip employing integrated cavity filter, and related components, systems, and methods
John Jong-Hoon Lee, San Diego, CA (US); Young Kyu Song, San Diego, CA (US); Uei-Ming Jow, San Diego, CA (US); Sangjo Choi, San Diego, CA (US); and Xiaonan Zhang, San Diego, CA (US)
Assigned to QUALCOMM Incorporated, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Jul. 25, 2016, as Appl. No. 15/218,626.
Application 15/218,626 is a continuation of application No. 14/853,802, filed on Sep. 14, 2015, granted, now 9,443,810.
Prior Publication US 2017/0077574 A1, Mar. 16, 2017
This patent is subject to a terminal disclaimer.
Int. Cl. H01P 1/20 (2006.01); H01P 7/06 (2006.01); H01L 21/00 (2006.01); H01L 27/15 (2006.01); H01L 23/66 (2006.01); H01L 49/02 (2006.01); H03B 5/18 (2006.01); H01P 1/201 (2006.01); H01P 1/207 (2006.01); H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 23/522 (2006.01); H01L 23/60 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01)
CPC H01P 1/207 (2013.01) [H01L 21/4853 (2013.01); H01L 23/5222 (2013.01); H01L 23/5227 (2013.01); H01L 23/552 (2013.01); H01L 23/60 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H01P 1/201 (2013.01); H01P 7/065 (2013.01); H03B 5/1817 (2013.01); H05K 1/0243 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6666 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/10 (2013.01); H01L 2224/16227 (2013.01); H01P 7/06 (2013.01)] 29 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) comprising:
a semiconductor die comprising a plurality of die layers, the plurality of die layers comprising:
at least one semiconductor layer;
a plurality of interconnect layers for providing interconnections to the at least one semiconductor layer, at least one of the plurality of interconnect layers comprising:
a first transmission line configured to transmit a first electromagnetic (EM) signal through a first signal transmission aperture; and
a second transmission line configured to receive a second EM signal through a second signal transmission aperture; and
a plurality of conductive elements interconnected to at least one of the plurality of interconnect layers, the plurality of conductive elements and at least one of the plurality of die layers defining an interior resonator cavity;
the interior resonator cavity configured to receive the first EM signal from the first transmission line through the first signal transmission aperture, resonate the first EM signal to generate the second EM signal comprising a filtered EM signal of the first EM signal, and couple the second EM signal on the second transmission line through the second signal transmission aperture.