US 9,812,666 B2
Organic light emitting display device and method for manufacturing the same
HongDae Shin, Gyeonggi-do (KR)
Assigned to LG Display Co., Ltd., Seoul (KR)
Filed by LG Display Co., Ltd., Seoul (KR)
Filed on May 29, 2015, as Appl. No. 14/724,983.
Claims priority of application No. 10-2014-0100808 (KR), filed on Aug. 6, 2014.
Prior Publication US 2016/0043344 A1, Feb. 11, 2016
Int. Cl. H01L 51/52 (2006.01); H01L 27/32 (2006.01); H01L 25/16 (2006.01); H05K 1/14 (2006.01)
CPC H01L 51/5246 (2013.01) [H01L 25/167 (2013.01); H01L 27/3276 (2013.01); H01L 51/5243 (2013.01); H01L 51/5237 (2013.01); H01L 2251/558 (2013.01); H01L 2924/0002 (2013.01); H05K 1/147 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10681 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An organic light-emitting display device, comprising:
an organic light-emitting element on a first substrate;
an encapsulation unit covering the organic light-emitting element;
a metal substrate on the encapsulation unit;
a structure in which a driving film, having a driving chip mounted thereon, is connected to a pad unit on the first substrate and to not be protruded further than the first substrate;
wherein the encapsulation unit extends from a bottom surface of the metal substrate to a portion of a top surface of the metal substrate, so that a portion of the encapsulation unit is disposed between the metal substrate and the driving film which is in contact with the portion of the encapsulation unit, thereby reducing damage to the driving film caused by the metal substrate,
wherein the metal substrate is inclined in a reverse-taper shape in which an area of the top surface of the metal substrate is greater than an area of the bottom surface of the metal substrate and the encapsulation unit is formed along the metal substrate.