US 9,812,635 B2
Method of manufacturing ultrasound probe
Gil-ju Jin, Gangwon-do (KR); and Jung-lim Park, Gangwon-do (KR)
Assigned to SAMSUNG MEDISON CO., LTD., Hongcheon-Gun, Gangwon-Do (KR)
Filed by SAMSUNG MEDISON CO., LTD., Gangwon-Do (JP)
Filed on Jan. 28, 2015, as Appl. No. 14/607,884.
Claims priority of application No. 10-2014-0025678 (KR), filed on Mar. 4, 2014.
Prior Publication US 2015/0250452 A1, Sep. 10, 2015
Int. Cl. H01L 41/31 (2013.01); H01L 41/22 (2013.01); A61B 8/14 (2006.01); H01L 41/25 (2013.01); H01L 41/311 (2013.01); H01L 41/29 (2013.01); B06B 1/06 (2006.01); A61B 8/00 (2006.01); H01L 41/27 (2013.01)
CPC H01L 41/31 (2013.01) [A61B 8/14 (2013.01); A61B 8/4483 (2013.01); B06B 1/0622 (2013.01); H01L 41/22 (2013.01); H01L 41/25 (2013.01); H01L 41/27 (2013.01); H01L 41/29 (2013.01); H01L 41/311 (2013.01); Y10T 29/42 (2015.01)] 18 Claims
OG exemplary drawing
1. A method of manufacturing an ultrasound probe, the method comprising:
preparing a backing layer having first and second surfaces with different heights due to forming a groove in the backing layer, wherein first and second electrodes are exposed on the first and second surfaces of the backing layer, respectively;
forming a third electrode that is in contact with the first electrode;
forming a base piezoelectric unit on the third electrode, the base piezoelectric unit including a piezoelectric layer;
forming a piezoelectric unit by removing an upper region of the base piezoelectric unit such that an upper surface of the piezoelectric unit is at a same level as the second surface of the backing layer; and
forming a fourth electrode on the second surface of the backing layer and the upper surface of the piezoelectric unit.