US 9,812,629 B2
Thermoelectric conversion structure and its use in heat dissipation device
Hsiao-Hsuan Hsu, Taipei (TW); Chun-Hu Cheng, Tainan (TW); Ya-Wen Chou, Zhubei (TW); and Yu-Li Lin, Chiayi (TW)
Assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed by INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu (TW)
Filed on Mar. 18, 2013, as Appl. No. 13/846,211.
Claims priority of application No. 101125414 A (TW), filed on Jul. 13, 2012; and application No. 101144037 A (TW), filed on Nov. 23, 2012.
Prior Publication US 2014/0014152 A1, Jan. 16, 2014
Int. Cl. H01L 35/30 (2006.01); H01L 35/08 (2006.01); B82Y 30/00 (2011.01)
CPC H01L 35/30 (2013.01) [H01L 35/08 (2013.01); B82Y 30/00 (2013.01); Y10S 977/734 (2013.01); Y10S 977/742 (2013.01); Y10S 977/762 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A thermoelectric conversion structure, comprising:
a thermoelectric element which includes a first end and a second end opposite to each other;
a first electrode which is located at the first end of the thermoelectric element; and
an electrically conductive heat-blocking layer which is between the thermoelectric element and the first electrode and directly contacts the first end of the thermoelectric element, wherein the range of the thickness ratio of the thermoelectric element to the electrically conductive heat-blocking layer is 100 to 10000;
a second electrode, which is located at the second end of the thermoelectric element; and
an electrically conductive heat-dissipating layer, which is between the thermoelectric element and the second electrode and directly contacts the second end of the thermoelectric element,
wherein materials of the electrically conductive heat-blocking layer and the electrically conductive heat-dissipating layer respectively directly contacting the first end and the second end of the thermoelectric element are different, a thermal conductivity of the electrically conductive heat-dissipating layer is greater than 300 W/mK, and a thermal conductivity of the electrically conductive heat-blocking layer is less than 0.1 W/mK.