US 9,812,628 B2
Light emitting device package
Su Jung Jung, Seoul (KR); Byung Mok Kim, Seoul (KR); Young Jun Cho, Seoul (KR); and Seo Yeon Kwon, Seoul (KR)
Assigned to LG INNOTEK CO., LTD, Seoul (KR)
Filed by LG INNOTEK CO., LTD., Seoul (KR)
Filed on Dec. 29, 2015, as Appl. No. 14/982,013.
Application 14/982,013 is a continuation of application No. 14/493,833, filed on Sep. 23, 2014, granted, now 9,257,626.
Application 14/493,833 is a continuation of application No. 13/595,398, filed on Aug. 27, 2012, granted, now 8,872,414, issued on Oct. 28, 2014.
Claims priority of application No. 10-2011-0085442 (KR), filed on Aug. 26, 2011.
Prior Publication US 2016/0133810 A1, May 12, 2016
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 33/64 (2010.01); H01L 33/32 (2010.01); H01L 33/56 (2010.01); H01L 25/16 (2006.01); H01L 33/40 (2010.01); H01L 33/50 (2010.01); H01L 33/06 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01); H01L 23/00 (2006.01)
CPC H01L 33/64 (2013.01) [H01L 25/167 (2013.01); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/405 (2013.01); H01L 33/483 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 24/73 (2013.01); H01L 33/642 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A light emitting device package comprising:
a package body has a cavity;
a lead frame disposed in the cavity;
a heat radiating member disposed under the cavity;
a light emitting device disposed on the heat radiating member;
a bonding member disposed between the light emitting device and the heat radiating member; and
a bonding member fixing part disposed in the cavity and covering a side surface of the bonding member and a side surface of the light emitting device,
wherein the bonding member fixing part forms the bottom of the cavity,
wherein the heat radiating member has an extension part and the extension part vertically overlaps with the lead frame.